Detailed Description
In the drawings, the thickness of layers, films, panels, regions, etc. have been exaggerated for clarity. Like reference numerals refer to like elements throughout the specification. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Further, "electrically connected" or "coupled" may mean that there are additional elements between the elements.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "first element," "component," "region," "layer" or "portion" discussed below could be termed a second element, component, region, layer or portion without departing from the teachings herein.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1A is a schematic top view and a partially enlarged boundary region of a first substrate and a second substrate according to an embodiment of the invention. Fig. 1B is a schematic top view and a partially enlarged boundary region of a display panel according to an embodiment of the invention. Fig. 1A to 1B schematically show only some components for convenience of explanation and observation, and the number and size of the components are not limited by the drawings. FIG. 1C is a schematic cross-sectional view of the display panel shown in FIG. 1B along the section line A-A'. Referring to fig. 1A, fig. 1B and fig. 1C, in the present embodiment, a display panel 10 (shown in fig. 1B) includes a first substrate 110, a second substrate 120, a plurality of first pads 140, a plurality of second pads 160 and a plurality of light emitting devices 200. The second substrate 120 is connected to the first substrate 110 to define the boundary region 12. The boundary region 12 includes a first boundary region 12A on the first substrate 110 and a second boundary region 12B on the second substrate 120.
In the present embodiment, as shown in fig. 1A, the first substrate 110 and the second substrate 120 separated from each other may be spliced into the display panel 10 (shown in fig. 1B). The first substrate 110 and the second substrate 120 are respectively provided with a plurality of light emitting elements 200. As shown in fig. 1B, the first substrate 110 and the second substrate 120 may be arranged side by side to splice the display panel 10. The boundary region 12 can be defined at the interface between the first substrate 110 and the second substrate 120.
Referring to fig. 1A and fig. 1B, in the present embodiment, the boundary region 12 includes a first boundary region 12A and a second boundary region 12B separated by a splicing line L. For example, the joint line L is the boundary between the first substrate 110 and the second substrate 120. In the present embodiment, the first boundary region 12A of the first substrate 110 is adjacent to the second boundary region 12B of the second substrate 120. The materials of the first substrate 110 and the second substrate 120 include glass, quartz, organic polymer, or other suitable materials, but the invention is not limited thereto. In other embodiments, the present invention may optionally include an active device layer having a plurality of Thin Film Transistors (TFTs), passive devices (passive devices) or corresponding conductive lines (e.g., scan lines, data lines or other similar signal lines) electrically connected to the light emitting device 200, but the present invention is not limited thereto. The thin film transistor is, for example, a low temperature polysilicon thin film transistor (LTPS) or an amorphous silicon thin film transistor (a-Si), but the invention is not limited thereto.
In the embodiment, the first pads 140 and the second pads 160 are disposed on the first substrate 110 and the second substrate 120. For example, a portion of the first pads 140 is located in one of the first boundary region 12A or the second boundary region 12B, and a portion of the first pads 140 is located outside the first boundary region 12A or the second boundary region 12B. A portion of the second pads 160 is located in the other of the first boundary region 12A or the second boundary region 12B, and a portion of the second pads 160 is located outside the first boundary region 12A or the second boundary region 12B. In the embodiment, a portion of the first pads 140 is located in the first boundary region 12A of the first substrate 110, and a portion of the second pads 160 is located in the second boundary region 12B of the second substrate 120 for illustration, but the invention is not limited thereto.
In the embodiment, the first pads 140 outside the boundary region 12 are disposed corresponding to the second pads 160. For example, the first pads 140 are electrically connected to each other to correspond to the second pads 160, and the second pads 160 are electrically independent from each other. For the sake of conductivity, the first pads 140 and the second pads 160 are usually made of metal, but the invention is not limited thereto. In other embodiments, the first pads 140 and the second pads 160 may also be made of other conductive materials, such as: an alloy, a nitride of a metal material, an oxide of a metal material, an oxynitride of a metal material, or a stacked layer of a metal material and other conductive materials.
In the present embodiment, a plurality of light emitting elements 200 are disposed on the first substrate 110 and the second substrate 200. The light emitting elements 200 are electrically connected to the first pads 140 and the second pads 160, respectively. The light emitting element 200 is, for example, a Light Emitting Diode (LED), and includes an Organic Light Emitting Diode (OLED), a micro light emitting diode (micro LED), a sub-millimeter light emitting diode (mini LED), and a quantum dot light emitting diode (quantum dot). The present embodiment is described by taking a micro light emitting diode as an example, but the invention is not limited thereto.
In the present embodiment, as shown in fig. 1A, fig. 1B and fig. 1C, each of the light emitting devices 200 includes a first semiconductor layer 210 electrically connected to a first electrode 212, a second semiconductor layer 220 electrically connected to a second electrode 222, and a light emitting layer 230 located between the first semiconductor layer 210 and the second semiconductor layer 220. In the present embodiment, one of the first semiconductor layer 210 and the second semiconductor layer 220 is an N-type doped semiconductor, and the other is a P-type doped semiconductor. The light emitting layer 230 is, for example, a Single Quantum Well (SQW) layer or a Multiple Quantum Well (MQW) layer, and in some embodiments, the material of the light emitting layer 230 includes, for example, gallium nitride (GaN), indium gallium nitride (InGaN), gallium arsenide (GaAs), aluminum gallium indium phosphide (AlGaInP), indium aluminum gallium arsenide (inalgas), or other materials composed of IIIA and VA elements, or other suitable materials, but the invention is not limited thereto.
In the present embodiment, the first electrode 212 of the light emitting device 200 is electrically connected to the first pad 140, and the second electrode 222 is electrically connected to the second pad 160. Under the above design, the light emitting device 200 is electrically connected to the corresponding first pad 140 and the second pad to receive the corresponding voltage or signal.
It should be noted that in the present embodiment, since the first bonding pads 140 are disposed in the first boundary region 12A of the first substrate 110 and the second bonding pads 160 are disposed in the second boundary region 12B of the second substrate 120, after the first substrate 110 is mounted on the second substrate 120, the defined boundary region 12 includes the first bonding pads 140 in the first boundary region 12A and the second bonding pads 160 in the second boundary region 12B. Therefore, the first substrate 110 and the second substrate 120 after being spliced have a plurality of second pads 160 corresponding to the first pads 140 at the boundary. With the above design, referring to fig. 1A and fig. 1B, a plurality of light emitting devices 200 may be disposed in the boundary region 12 of the display panel 10 and electrically connected to the first pads 140 and the second pads 160, respectively. For example, the light emitting element 200 located in the boundary region 12 crosses over from the first boundary region 12A to the second boundary region 12B. In other words, after the first substrate 110 is bonded to the second substrate 120, a plurality of light emitting elements 200 may be additionally disposed along the bonding line L in the boundary region 12, and the light emitting elements 200 cross the bonding line L to be electrically connected to the first pads 140 of the first substrate 110 and the second pads 160 of the second substrate 120, respectively. Thus, compared to the conventional discontinuous display frame at the boundary between the adjacent display panels, the display panel 10 of the present embodiment can avoid the discontinuity of the display frame and improve the display quality by the light emitting elements 200 located in the boundary region 12.
Referring to fig. 1A, fig. 1B and fig. 1C, in the present embodiment, the display panel 10 further includes a plurality of adhesive layers 300. The adhesive layers 300 are separated from each other to bond the light emitting devices 200 to the first substrate 110 or the second substrate 120. For example, as shown in fig. 1C, the adhesive layer 300 may be disposed between the first pads 140 and the second pads 160, fix the light emitting device 200 to the first substrate 110 or the second substrate 120, and electrically connect to the first pads 140 and the second pads 160. In some embodiments, a laminate (not shown) of a flexible substrate and an adhesive layer may be optionally included between the light emitting device 200 and the pads 140 and 160, but the invention is not limited thereto.
In addition, the adhesive layers 300 in the boundary region 12 may also be disposed at the boundary between the first substrate 110 and the second substrate 120 and/or on the splicing line L, and the adhesive layers 300 are separated from each other. Thus, the adhesive layer 300 can fix the light emitting element in the boundary region 12, and can also provide a bonding force between the first substrate 110 and the second substrate 120, thereby improving the reliability of the display panel 10. In other embodiments, the adhesive layer 300 may also be located between the first substrate 110 and the second substrate 120 to further improve the bonding force between the first substrate 110 and the second substrate 120.
In short, since the display panel of the embodiment can dispose the first pads 140 and the second pads 160 in the boundary region 12 where the first substrate 110 and the second substrate 120 are joined, the light emitting device 200 can be electrically connected to the first pads 140 of the first substrate 110 and the second pads 160 of the second substrate 120. Therefore, the light emitting device 200 can provide a display function at the boundary between the first substrate 110 and the second substrate 120, thereby avoiding discontinuity of a display image and improving display quality.
It should be noted that, in the following embodiments, the reference numerals and partial contents of the elements in the foregoing embodiments are used, wherein the same reference numerals are used to indicate the same or similar elements, and the description of the portions with the same technical contents omitted may refer to the foregoing embodiments, and the description in the following embodiments is not repeated.
Fig. 2 is a partially enlarged schematic view illustrating a boundary region of a display panel according to another embodiment of the present invention. Referring to fig. 1B and fig. 2, the display panel 10A of the present embodiment is similar to the display panel 10 of fig. 1B, and the main differences are: the adhesive layers 300A further include a plurality of connection portions 320. The connecting portions 320 are disposed between the adhesive layers 300A to connect the corresponding adhesive layers 300A. Specifically, the adhesive layer 300A and the connection portion 320 may be regarded as an integral structure. Thus, the bonding force between the adhesive layer 300A and the first substrate 110 or the second substrate 120 can be further improved to reduce the probability of peeling and improve the reliability. In addition, the connection portion 320 located in the boundary region 12 covers the first substrate 110 and the second substrate 120. In other words, the connection portion 320 may be located at the boundary between the first substrate 110 and the second substrate 120 to cover and join the first substrate 110 and the second substrate. Under the above configuration, the connection portion 320 may further provide a bonding force between the first substrate 110 and the second substrate 120, so as to improve the reliability of the display panel 10A.
Fig. 3A is a perspective view of a light emitting junction structure according to an embodiment of the invention. Fig. 3B is a schematic top view and a schematic partial enlarged view of a border area of a display panel according to another embodiment of the invention, and fig. 3B only schematically illustrates some components for convenience of illustration and observation, and actually the number and size of the components are not limited by the drawings. FIG. 3C is a cross-sectional view of the display panel of FIG. 3B along line B-B' according to the present invention. Referring to fig. 1B and fig. 3B, a display panel 10B of the present embodiment is similar to the display panel 10 of fig. 1B, and the main difference is: in this embodiment, the light-emitting junction structure 400 is used to replace the adhesive layer 300 and the light-emitting device 200 formed separately. In the above embodiment, the light emitting device 200 is bonded to the first pads 140 and the second pads 160 by disposing the adhesive layer 300 in the boundary region 12. In the present embodiment, the step of respectively disposing the adhesive layer 300 and the light emitting element 200 can be replaced by the preformed light emitting junction structure 400. The following will be briefly described by taking as an example the case where the light emitting junction structure 400 is provided in the boundary region 12.
Referring to fig. 3A, the light emitting bonding structure 400 includes a flexible substrate 420, a bonding layer 440 disposed on the flexible substrate 420, and a plurality of light emitting devices 200 disposed on the bonding layer 440. In the present embodiment, the manufacturing method of the light emitting junction structure 400 is, for example, to form the flexible substrate 420 on the temporary carrier 410. Next, a bonding layer 440 is formed on the flexible substrate 420, and the light emitting device 200 is fixed on the bonding layer 440. Then, the flexible substrate 420 and the bonding layer 440 are cut to separate the plurality of light-emitting bonding structures 400. Finally, the light emitting bonding structure 400 is separated from the temporary carrier 410. In the present embodiment, the material of the flexible substrate 420 includes Polyimide (PI), but the invention is not limited thereto. In the present embodiment, the light-emitting bonding structure 400 is, for example, a stripe shape, and is disposed on the substrates 110 and 120 along the splicing line L in the subsequent steps, but the invention is not limited thereto.
Referring to fig. 3B and 3C, after the first substrate 110 is mounted to the second substrate 120, the light-emitting bonding structure 400 is disposed in the boundary region 12 to simultaneously fix the first substrate 110 to the second substrate 120 and dispose the light-emitting device 200 in the boundary region 12. In the present embodiment, the light emitting junction structure 400 is located in the boundary region 12 and covers the first substrate 110 and the second substrate 120. For example, the light emitting bonding structure 400 is disposed on the stitching line L of the first substrate 110 and the second substrate 120 and contacts the first substrate 110 and the second substrate 120 simultaneously. Under the above arrangement, the light emitting device 200 can be pre-transferred to the flexible substrate 420, and then transferred from the flexible substrate 420 to the adhesive layer 300 to be bonded to the substrates 110 and 120. Therefore, a plurality of light emitting elements 200 can be provided in one transfer process. Therefore, the manufacturing process can be simplified and the manufacturing cost can be saved. In addition, the light emitting device 200 can provide a display function at the interface between the first substrate 110 and the second substrate 120, thereby avoiding discontinuity of a display image and improving display quality.
In some embodiments, the light emitting junction structure 400 may be directly disposed in the boundary region 12, but the invention is not limited thereto. In some embodiments, the adhesive layer 300 may be disposed in the boundary region 12, and then the light-emitting bonding structure 400 is disposed on the adhesive layer 300, so as to further enhance the bonding force between the light-emitting bonding structure 400 and the substrates 110 and 120.
Fig. 4A is a partially enlarged schematic view of a display panel according to another embodiment of the present invention, and fig. 4A schematically illustrates only a part of the display panel for convenience of illustration and observation. Referring to fig. 1B and fig. 4A, a display panel 10' of the present embodiment is similar to the display panel 10 of fig. 1B, and the main differences are: the display panel 10' includes a plurality of connecting wires 500 for electrically connecting the light emitting devices 200 to the first pads 140 and the second pads 160. Since the connecting wires 500 completely cover the first and second electrodes of the light emitting device 200 in a plan view, the first and second electrodes are not shown in fig. 4A. In the present embodiment, the plurality of connection wires 500 of the display panel 10' electrically connect the first pads 140 to the first electrodes (as shown in fig. 4B) or electrically connect the second pads 160 to the second electrodes (as shown in fig. 4B), respectively. For the sake of conductivity, the connecting wires 500 are generally made of metal, but the invention is not limited thereto. In other embodiments, other conductive materials may be used for the connection wires 500, such as: an alloy, a nitride of a metal material, an oxide of a metal material, an oxynitride of a metal material, or a stacked layer of a metal material and other conductive materials. Thus, the display panel 10' can achieve similar technical effects as the above embodiments.
Fig. 4B is a partially enlarged schematic view of a display panel according to still another embodiment of the present invention, and fig. 4B schematically illustrates only some of the components for convenience of illustration and observation. Referring to fig. 4A and 4B, a display panel 10C of the present embodiment is similar to the display panel 10' of fig. 4A, and the main differences are: the axis of any two light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 is parallel to the extending direction of the splicing line L. In the embodiment, the axes of any two of the plurality of light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 are parallel to each other, but the invention is not limited thereto. The plurality of connecting wires 500 electrically connect the first pads 140 to the first electrodes 212 and the second pads 160 to the second electrodes 222, respectively. Thus, the display panel 10C can achieve similar technical effects as the above embodiments.
Fig. 4C is a partially enlarged schematic view of a display panel according to still another embodiment of the invention, and fig. 4C schematically illustrates only a part of the display panel for convenience of illustration and observation. Referring to fig. 4A and 4C, the display panel 10D of the present embodiment is similar to the display panel 10' of fig. 4A, and the main differences are: the axes of any two of the plurality of light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 are staggered with respect to each other. In the present embodiment, the axis of one of the two light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 is parallel to the stitching line L. The axis of the other of the two light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 is perpendicular to and intersects the splicing line L, but the invention is not limited thereto. In other embodiments, the axis of any one of the light emitting elements 200 extending from the first semiconductor layer 210 to the second semiconductor layer 220 may also intersect the stitching line L at any angle. Thus, the display panel 10D can achieve similar technical effects as the above-described embodiments.
Fig. 5A is a schematic top view illustrating a first substrate and a second substrate according to another embodiment of the invention. Fig. 5B is a partially enlarged schematic view of a boundary region of a display panel according to another embodiment of the invention, and fig. 5A and 5B only schematically show some components for convenience of illustration and observation. Referring to fig. 1B and fig. 5B, the first pad 140A of the present embodiment is similar to the first pad 140 of fig. 1B, and the main difference is: compared to the first pads 140 in fig. 1B, the width of the first pads 140A in this embodiment is larger. A portion of the first pads 140A in the boundary region 12 are electrically connected to the second pads 160 in the boundary region 12 and the second pads 160 outside the boundary region 12, respectively. For example, as shown in fig. 5A, before the first substrate 110 is bonded to the second substrate 120, the first pads 140A in the first boundary region 12A extend to the outside of the first boundary region 12A and correspond to the second pads 160 outside the first boundary region 12A. The first pads 140A can be electrically connected to the second pads 160 outside the first border area 12A through the light emitting device 200.
After the first substrate 110 is bonded to the second substrate 120, a portion of the first pads 140A in the first boundary area 12A may correspond to the second pads 160 in the second boundary area 12B, and the first pads 140A in the first boundary area 12A are electrically connected to the second pads 160 in the second boundary area 12B through the light emitting device 200 disposed in the boundary area 12. Under the above configuration, the light emitting device 200 in the boundary region 12 and the light emitting device 200 outside the boundary region 12 can share the first pad 140A. Therefore, the margin for arranging the connecting pad can be increased, the manufacturing process can be simplified, and the manufacturing cost can be saved.
Fig. 6 is a schematic top view illustrating a display panel according to an embodiment of the invention. Referring to fig. 6, in the present embodiment, the plurality of first substrates 110 and the plurality of second substrates 120 can be spliced into the display panel 10F in any number and direction. For example, the plurality of first substrates 110 and the plurality of second substrates 120 may be joined in any direction or on any side to define the boundary region 12. In the present embodiment, the plurality of light emitting elements 200 are disposed on the first substrate 110 and the second substrate 120 and in the boundary region 12 in an array manner. Thus, compared to the existing tiled display panel having a discontinuous display screen at the boundary between adjacent display panels, the display panel 10F of the present embodiment can avoid the discontinuity of the display screen and improve the display quality by disposing a plurality of light emitting elements 200 in the boundary region 12. In addition, in the embodiment, the first pads and the second pads (not shown) are disposed in the boundary region 12, and the first substrate 110 and the second substrate 120 can be spliced at any long side or short side without being limited by the directions of the substrates 110 and 120 or the light emitting device 200. Under the above arrangement, the display panel 10F can be spliced into any shape according to the user's requirement, so as to improve the splicing margin. The display panel 10F of the present embodiment has a rectangular, polygonal or irregular shape, but the invention is not limited thereto.
In summary, in the display panel according to the embodiment of the invention, the first pads and the second pads can be disposed in the boundary region where the first substrate and the second substrate are spliced, and the light emitting elements can be electrically connected to the first pads of the first substrate and the second pads of the second substrate. Therefore, the light-emitting element can provide a display function at the junction of the first substrate and the second substrate, thereby avoiding discontinuity of a display picture and improving display quality. In addition, the adhesive layer can provide bonding force between the light emitting element and the substrate, and can further provide bonding force between the first substrate and the second substrate, so as to improve the reliability of the display panel. In addition, the arrangement mode of the first connecting pads and the second connecting pads can improve the arrangement margin of the connecting pads, and the first substrate and the second substrate can be spliced in any direction or any edge, so that the splicing margin is further improved.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.