CN109913856A - A kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel - Google Patents
A kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel Download PDFInfo
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- CN109913856A CN109913856A CN201910335166.1A CN201910335166A CN109913856A CN 109913856 A CN109913856 A CN 109913856A CN 201910335166 A CN201910335166 A CN 201910335166A CN 109913856 A CN109913856 A CN 109913856A
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- 230000002209 hydrophobic effect Effects 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000012528 membrane Substances 0.000 title claims abstract description 35
- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 47
- 238000012805 post-processing Methods 0.000 claims abstract description 14
- 238000002203 pretreatment Methods 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 150000001721 carbon Chemical group 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 239000007888 film coating Substances 0.000 abstract description 7
- 238000009501 film coating Methods 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 5
- 229910052731 fluorine Inorganic materials 0.000 abstract description 5
- 239000011737 fluorine Substances 0.000 abstract description 5
- 239000002912 waste gas Substances 0.000 abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 238000002955 isolation Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract description 4
- 230000002688 persistence Effects 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 23
- 238000012360 testing method Methods 0.000 description 7
- 239000005416 organic matter Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 1
- -1 Octadecyl trichlorosilane alkane Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
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- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
, pre-treatment the invention discloses a kind of methods of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel, comprising the following steps: (1);(2), it activates;(3), the plated film under stable vacuum degree;(4), vacuum breaker in reaction chamber obtains the device that microchannel is deposited with hydrophobic membrane.The present invention does not generate waste gas containing fluoride using floride-free hydrophobic material in process of production, also overflows without fluorine material, environmentally friendly, and environmental issue is not present;It keeps stable film coating environment to be conducive to film layer effectively to adhere to and closs packing, improves film quality, film layer is stronger in microchannel inner surface adventitious deposit, ensure that the persistence of hydrophobic performance;With pre-treatment and post-processing step, guarantee substrate surface clean dried before plated film, is conducive to improve film quality;Post-processing then guarantees oxygen and moisture in sample isolation air, and it is contaminated to avoid film layer well.
Description
Technical field
The present invention relates in plasma reinforced chemical vapour deposition coating technique field more particularly to a kind of microchannel etc. from
The method of son enhancing chemical vapor deposition hydrophobic membrane.
Background technique
Runner in micro-fluidic chip is excessively small, and the height and depth in fluid channel hole are less than 05mm, fluid channel inner surface
Usually it is modified processing.Micro-fluidic chip applied to medical treatment can form Water-In-Oil drop in application, and this requires miniflows
Road inner surface has hydrophobicity.
The hydrophobic modified method of the open fluid channel of patent 201711446337.5, passes through low-temp low-pressure corona treatment
To apply internal fluid channel surface hydrophobic nano plated film, low-temp low-pressure corona treatment uses vacuum degree high undercut repeatedly
The mode changed carries out.This coating process has the disadvantage that
(1) coating process vacuum degree height converts repeatedly, is easy to make in reaction cavity that film coating environment is unstable, each is followed
Ring is likely to generate different effects, it is possible to will affect the quality of film layer after plated film;
(2) vacuum degree height converts repeatedly, and when change point, it is unstable that plasma glow discharge is easy to happen flashing
The problem of, and it is short in the change point residence time, therefore effectively plated film time is relatively limited, causes since aura is unstable
The reaction of ion bombardment reaction gas may be insufficient;
(3) vacuum degree height converts repeatedly, short in change point stop plated film time, is unfavorable for the deposition quality in microchannel
The nanometer film layer stablize, being firmly combined;
(4) vacuum degree height converts repeatedly, all there are certain requirements to device program design and operator, makes coating process
It is complicated;
(5) technique using fluorine-containing Coating Materials, in coating operation, what which was difficult to avoid that is dispersed into sky
In gas, waste gas containing fluoride is generated in vacuum, there are environmental issues.
Summary of the invention
It is an object of the invention to propose a kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel, tool
Have the characteristics that environmentally friendly, simple process, film quality are good.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel, comprising the following steps:
(1), pre-treatment pre-treatment: is carried out to the device with microchannel;
(2), it activates: microchannel surface being activated using plasma gas in reaction chamber;
(3), plated film: the hydrophobic material of vaporization enters reaction chamber, and vacuum degree maintains fixed numerical value in reaction chamber, passes through
Plasma reinforced chemical vapour deposition method makes the hydrophobic material be deposited as hydrophobic membrane in microchannel;
(4), vacuum breaker in reaction chamber obtains the device that microchannel is deposited with hydrophobic membrane.
Further, the chemical general formula of hydrophobic material is R-Si- (ORX)3;Wherein ,-R is more carbon chain alkyls, carbon atom number
Measure 3-16;-RXFor-Cl ,-CH3、-C2H5It is one of or a variety of.
Further, in step (2), (3) and (4), one end of reaction chamber has gas feed, and the opposite other end is to take out
Vacuum outlet makes gas one-way flow in the reactor chamber.
Further, in step (3), the power that radio-frequency power supply provides is in 200-800W, and 40-60 DEG C of coating temperature, vacuum
Any definite value being maintained within the scope of 0.01-0.2mbar is spent, reaction 10-60min is maintained.
Further, hydrophobic material vaporizes in Heating Cup, and hydrophobic material is 0.5-5ul/s in the additional amount of Heating Cup, adds
The heating temperature of hot cup is 75-120 DEG C.
Further, in step (4), the vacuum breaker time is 1-5min.
Further, in step (1), device is dried into 20-45min under constant-temperature constant-humidity environment, the temperature 45 of the environment
DEG C and humidity 5%.
Further, in step (2), reaction chamber is slowly introducing plasma gas, activation time 1-5min, radio-frequency power supply
The power of offer is 200-800W, and reaction chamber vacuum degree is maintained within the scope of 0.04-0.2mbar.
Further, in step (2), plasma gas is passed through the flow 1000-1700ul/s of reaction chamber.
Further, this method further includes (5) post-processing step;
The method of post-processing are as follows: will be packed through the device sealing after step (4), and be placed in constant-temperature constant-humidity environment 20-
45min, the temperature 45 C and humidity 5% of the environment.
The invention has the benefit that
1, using floride-free hydrophobic material, waste gas containing fluoride is not generated in process of production, is also overflowed without fluorine material, to ring
Border is friendly, and environmental issue is not present;
2, the molecular structure of hydrophobic material is R-Si- (ORX)3, there is preferableization at both ends to organic matter and inorganic matter respectively
Bond resultant force is learned, plays the role of bridge joint, the end-R can be in conjunction with organic matter ,-(ORX)3It end can be in conjunction with inorganic matter, therefore to microchannel
Substrate has preferable attachment to combine effect;
3, in coating process, the vacuum degree in reaction chamber keeps stablizing, and film coating environment is stable, reaction gas sufficiently carries out
Reaction shortening plated film time, film quality stable bond is secured, simple process difficulty is low;Stable film coating environment is kept to be conducive to
Film layer is effectively adhered to and closs packing, improves film quality, film layer is stronger in microchannel inner surface adventitious deposit, ensure that hydrophobic
The persistence of performance;
4, there is pre-treatment and post-processing step, guarantee substrate surface clean dried before plated film, be conducive to improve film layer matter
Amount;Post-processing then guarantees oxygen and moisture in sample isolation air, and it is contaminated to avoid film layer well.
Detailed description of the invention
Fig. 1 is the test photo under the micro-fluidic chip microscope of one embodiment of the invention;
Fig. 2 is the test photo under the microscope for not plating the micro-fluidic chip of hydrophobic membrane.
Specific embodiment
With reference to the accompanying drawing and specific embodiment further illustrates technical solution of the present invention.
A kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel, comprising the following steps:
(1), pre-treatment pre-treatment: is carried out to the device with microchannel;
(2), it activates: microchannel surface being activated using plasma gas in reaction chamber;
(3), plated film: the hydrophobic material of vaporization enters reaction chamber, and vacuum degree maintains fixed numerical value in reaction chamber, passes through
Plasma reinforced chemical vapour deposition method makes the hydrophobic material be deposited as hydrophobic membrane in microchannel;
(4), slow vacuum breaker in reaction chamber obtains the device that microchannel is deposited with hydrophobic membrane.
Using floride-free hydrophobic material, waste gas containing fluoride is not generated in process of production, is also overflowed without fluorine material, to environment
Environmental issue is not present in close friend.The chemical general formula of hydrophobic material is R-Si- (ORX)3;Wherein ,-R is more carbon chain alkyls, and carbon is former
Subnumber amount 3-16;-RXFor-Cl ,-CH3、-C2H5It is one of or a variety of.The hydrophobic material both ends are respectively to organic matter and nothing
Machine object has preferable chemical bonded refractory resultant force, plays the role of bridge joint, the end R- can be in conjunction with organic matter ,-(ORX)3End can be with inorganic matter knot
It closes, therefore there is preferable attachment to combine effect microchannel substrate.Specifically, hydrophobic material can be using following chemical structural formula
Substance:
Ne-butyltriethoxysilaneand,Isobutyl group
Triethoxysilane,3-aminopropyltriethoxysilane,
Hexadecyl trimethoxy silane,Octadecyl trichlorosilane alkane.
Further, in step (2), (3) and (4), one end of reaction chamber has gas feed, and the opposite other end is to take out
Vacuum outlet makes gas one-way flow in the reactor chamber.By making in reaction chamber there are gas flowing, plasma gas and hydrophobic
Material gas can enter in microchannel, and can be full of microchannel, has abandoned vacuum degree change and hydrophobic material is forced to enter microchannel
Method, in stable film coating environment, hydrophobic material can be gradually deposited on microchannel interior walls, form the hydrophobic of high quality
Film.
Further, in step (3), the power that radio-frequency power supply provides is in 200-800W, and 40-60 DEG C of coating temperature, vacuum
Any definite value being maintained within the scope of 0.01-0.2mbar is spent, reaction 10-60min is maintained.Under the plating conditions, plasma point
Physical efficiency is sufficiently reacted with hydrophobic material, and hydrophobic material has optimal deposition velocity, forms the hydrophobic membrane of high quality.Reaction when
Between it is related with the thickness requirements of hydrophobic membrane, maintain the reaction time it is longer, the thickness of hydrophobic membrane is bigger.
Further, hydrophobic material vaporizes in Heating Cup, and hydrophobic material is 0.5-5ul/s in the additional amount of Heating Cup, adds
The heating temperature of hot cup is 75-120 DEG C.It is controlled by controlling additional amount and the heating temperature of hydrophobic material into reaction chamber
The vapour amount of hydrophobic material can guarantee that hydrophobic material sufficiently with plasma (orifice) gas precursor reactant, can not only save the dosage of hydrophobic material, also
It can guarantee the anti-qualitative of reaction, and then guarantee the quality of hydrophobic membrane.
Further, in step (4), the vacuum breaker time is 1-5min.Slow vacuum breaker makes nano-sized hydrophobic material in microchannel
Material is effectively adhered to and closs packing.The time of vacuum breaker is related with plated film vacuum degree and plated film time, and plated film vacuum degree is bigger,
The vacuum breaker time is longer, and plated film time is longer, and the vacuum breaker time is longer.Vacuum breaker refers to the confined air with certain vacuum degree
Between restore pressure, until identical as ambient pressure.
Further, in step (1), device is dried into 20-45min under constant-temperature constant-humidity environment, the temperature 45 of the environment
DEG C and humidity 5%.Pre-treatment is carried out to device, makes substrate surface clean dried, is conducive to improve film quality.Meanwhile it using
Above-mentioned pre-treatment parameter can guarantee that the microchannel on device is all cleaned.
Further, in step (2), reaction chamber is slowly introducing plasma gas, activation time 1-5min, radio-frequency power supply
The power of offer is 200-800W, and reaction chamber vacuum degree is maintained within the scope of 0.04-0.2mbar.It is reciprocity before plating steps
Ionized gas is activated, and hydrophobic material guarantees that the gas has enough energy and hydrophobic material anti-when entering reaction and plasma chamber
It answers, saves hydrophobic material.Plasma gas is He, Ar, N in the present invention2And O2One of or a variety of mixing.
Further, in step (2), plasma gas is passed through the flow 1000-1700ul/s of reaction chamber.Plasma gas
Reaction chamber is slowly entered, so that plasma (orifice) gas physical efficiency is slowly full of reaction chamber, can be uniformly distributed in the reactor chamber.
Further, this method further includes (5) post-processing step;The method of post-processing are as follows: will be through the device after step (4)
Sealed package is placed in constant-temperature constant-humidity environment 20-45min, the temperature 45 C and humidity 5% of the environment.Post-processing step can be protected
Oxygen and moisture in sample isolation air are demonstrate,proved, it is contaminated to avoid film layer well.Post-processing step can also make hydrophobic membrane into
One step is firm.
The present invention is further illustrated by the following examples.
The method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel in embodiment 1-6 includes following step
It is rapid:
(1) pre-treatment dries device under constant-temperature constant-humidity environment;
(2) it activates: microchannel surface being activated using plasma gas in reaction chamber;
(3) plated film: the hydrophobic material of vaporization enters reaction chamber, makes described dredge by plasma reinforced chemical vapour deposition method
Water material is deposited as hydrophobic membrane in microchannel;
(4) slow vacuum breaker in reaction chamber;
(5) it post-processes: will be packed through the device sealing after step (4), and be placed in constant-temperature constant-humidity environment.
In step (2), (3) and (4), one end of reaction chamber has gas feed, and the opposite other end is to vacuumize out
Mouthful, make gas one-way flow in the reactor chamber.The chemical general formula of hydrophobic material is R-Si- (ORX)3;Wherein, R is the long alkane of more carbon
Base, amount of carbon atom 3-16;-RXFor-Cl ,-CH3、-C2H5It is one of or a variety of.
Each step parameter is as shown in the table in embodiment 1-6.
Specifically, the device that embodiment 1-6 is modified is micro-fluidic chip.It is dredged to what the method for embodiment 1-6 obtained
Moisture film is tested, and the Static Contact hydrophobic angle of hydrophobic membrane between 120 degree of -150 degree, there is good hydrophobic effect.It will be real
The micro-fluidic chip for applying a 1-6 is tested, and test result is essentially identical, but the hydrophobic film quality of embodiment 6 is best, embodiment
6 test photo is as shown in Figure 1.In Fig. 1, oily phase microchannel 1 is intersected with water phase microchannel 2, is dredged well when having in microchannel
When water effect, Water-In-Oil drop of uniform size is formed in the microchannel after grease intersection.Hydrophobic membrane is not plated in Fig. 2
Micro-fluidic chip cannot form the Water-In-Oil drop of full grains uniform in size.
Durability test is carried out to the hydrophobic membrane that embodiment 1-6 is obtained, prior encapsulation chip is dredged at regular intervals
Moisture film carries out hydrophobic angle test, and test result is as follows shown in table.
By above-mentioned data as it can be seen that present invention has the advantage that
1, using floride-free hydrophobic material, waste gas containing fluoride is not generated in process of production, is also overflowed without fluorine material, to ring
Border is friendly, and environmental issue is not present;
2, the molecular structure of hydrophobic material is R-Si- (ORX)3, there is preferableization at both ends to organic matter and inorganic matter respectively
Bond resultant force is learned, plays the role of bridge joint, the end R- can be in conjunction with organic matter ,-(ORX)3It end can be in conjunction with inorganic matter, therefore to microchannel
Substrate has preferable attachment to combine effect;
3, in coating process, the vacuum degree in reaction chamber keeps stablizing, and film coating environment is stable, reaction gas sufficiently carries out
Reaction shortening plated film time, film quality stable bond is secured, simple process difficulty is low;Stable film coating environment is kept to be conducive to
Film layer is effectively adhered to and closs packing, improves film quality, film layer is stronger in microchannel inner surface adventitious deposit, ensure that hydrophobic
The persistence of performance;
4, there is pre-treatment and post-processing step, guarantee substrate surface clean dried before plated film, be conducive to improve film layer matter
Amount;Post-processing then guarantees oxygen and moisture in sample isolation air, and it is contaminated to avoid film layer well.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of method of plasma reinforced chemical vapour deposition hydrophobic membrane in microchannel, which comprises the following steps:
(1), pre-treatment pre-treatment: is carried out to the device with microchannel;
(2), it activates: microchannel surface being activated using plasma gas in reaction chamber;
(3), plated film: the hydrophobic material of vaporization enters reaction chamber, and vacuum degree maintains fixed numerical value in reaction chamber, by it is equal from
Son enhancing chemical vapour deposition technique makes the hydrophobic material be deposited as hydrophobic membrane in microchannel;
(4), vacuum breaker in reaction chamber obtains the device that microchannel is deposited with hydrophobic membrane.
2. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 1
In the hydrophobic material is floride-free hydrophobic material, and the chemical general formula of the hydrophobic material is R-Si- (ORX)3;Wherein, R is more carbon
Chain alkyl, amount of carbon atom 3-16;-RXFor-Cl ,-CH3、-C2H5It is one of or a variety of.
3. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature in microchannel according to claim 1 or 2
It is, in step (2), (3) and (4), one end of reaction chamber has gas feed, and the opposite other end is to vacuumize outlet,
Make gas one-way flow in the reactor chamber.
4. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 1
In in the step (3), the power that radio-frequency power supply provides is in 200-800W, and 40-60 DEG C of coating temperature, vacuum degree is maintained at
Any definite value within the scope of 0.01-0.2mbar maintains reaction 10-60min.
5. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 3
In the hydrophobic material vaporizes in Heating Cup, and hydrophobic material is 0.5-5ul/s in the additional amount of Heating Cup, and Heating Cup adds
Hot temperature is 75-120 DEG C.
6. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 1
In in the step (4), the vacuum breaker time is 1-5min.
7. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 1
In device being dried 20-45min under constant-temperature constant-humidity environment, the temperature 45 C and humidity of the environment in the step (1)
5%.
8. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 3
In in step (2), the reaction chamber is slowly introducing plasma gas, activation time 1-5min, the function that radio-frequency power supply provides
Rate is 200-800W, and reaction chamber vacuum degree is maintained within the scope of 0.04-0.2mbar.
9. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 8
In in the step (2), the plasma gas is passed through the flow 1000-1700ul/s of reaction chamber.
10. the method for plasma reinforced chemical vapour deposition hydrophobic membrane, feature exist in microchannel according to claim 1
In further including (5) post-processing step;
The method of post-processing are as follows: it will be packed through the device sealing after step (4), and be placed in constant-temperature constant-humidity environment 20-45min,
The temperature 45 C and humidity 5% of the environment.
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CN110000065A (en) * | 2019-04-24 | 2019-07-12 | 佛山市思博睿科技有限公司 | A kind of piezoelectric ceramic vibrator movable plate hydrophilic treatment method for atomizer |
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