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CN109898051B - Wear-resistant and corrosion-resistant DLC/SiNxComposite film and preparation method thereof - Google Patents

Wear-resistant and corrosion-resistant DLC/SiNxComposite film and preparation method thereof Download PDF

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CN109898051B
CN109898051B CN201910249636.2A CN201910249636A CN109898051B CN 109898051 B CN109898051 B CN 109898051B CN 201910249636 A CN201910249636 A CN 201910249636A CN 109898051 B CN109898051 B CN 109898051B
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魏秋平
马莉
周科朝
余志明
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Hunan Xinfeng Technology Co ltd
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Central South University
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Abstract

一种抗磨损耐腐蚀的DLC/SiNx复合薄膜及其制备方法;所述复合薄膜在金属或合金基体表面制备非晶态金属或合金改性层后,采用磁控溅射技术依次制备SiNx薄膜、DLC薄膜。其制备方法是将金属或合金基体置于磁控溅射设备中,采用等离子轰击金属或合金基体表面,对金属或合金基体表面进行离子刻蚀或者离子刻蚀的同时进行离子注入,得到表面改性层后,采用磁控溅射在表面改性层上原位制备SiNx薄膜和DLC薄膜。本发明制备的类金刚石薄膜具有低成本效率高的优势。可以对基底进行离子清洗,也能提升含碳气氛的离化率,同时可以施加基底偏压,有效提升复合膜的综合性能,特别是射频基底偏压不会随薄膜厚度的增加而大幅降低偏压效果,适合大规模应用。A wear-resistant and corrosion-resistant DLC/SiN x composite film and a preparation method thereof; the composite film prepares an amorphous metal or alloy modified layer on the surface of a metal or alloy substrate, and sequentially prepares SiN x by using a magnetron sputtering technology Film, DLC film. The preparation method is as follows: placing a metal or alloy substrate in a magnetron sputtering device, bombarding the surface of the metal or alloy substrate with plasma, and performing ion etching on the surface of the metal or alloy substrate or performing ion implantation at the same time as ion etching to obtain a surface modification. After the property layer was formed, the SiN x thin film and the DLC thin film were prepared in situ on the surface modified layer by magnetron sputtering. The diamond-like thin film prepared by the invention has the advantages of high cost and high efficiency. The substrate can be ion-cleaned, and the ionization rate of the carbon-containing atmosphere can be improved. At the same time, the substrate bias can be applied to effectively improve the overall performance of the composite film. In particular, the RF substrate bias will not greatly reduce the bias with the increase of the film thickness. Pressure effect, suitable for large-scale applications.

Description

一种抗磨损耐腐蚀的DLC/SiNx复合薄膜及其制备方法A kind of wear-resistant and corrosion-resistant DLC/SiNx composite film and preparation method thereof

技术领域technical field

本发明公开了一种抗磨损耐腐蚀的DLC/SiNx复合薄膜及制备方法,属于属于类金刚石薄膜材料制备技术领域。The invention discloses a wear-resistant and corrosion-resistant DLC/ SiNx composite film and a preparation method, which belong to the technical field of diamond-like film material preparation.

背景技术Background technique

类金刚石薄膜具有优异的力学、耐摩擦性能、抗腐蚀性能,且可以在低温下沉积,在摩擦学、生物医用等领域有着很大的应用潜力。但类金刚石薄膜存在一个特性——内应力高,这使得膜基结合力十分弱且自身厚度十分有限。为此类金刚石薄膜必须添加过渡层或者掺杂。而掺杂则可能弱化类金刚石薄膜某一方面的性能。所以寻找一种合适的过渡层是促进类金刚石薄膜应用的关键。过渡层不仅仅影响类金刚石薄膜的结合力,对耐腐蚀性能也影响很大,所以除了与基体和类金刚石薄膜都结合强度高外,还得自身腐蚀电阻大,不加速薄膜或者基底的腐蚀。Diamond-like carbon films have excellent mechanical, friction resistance, corrosion resistance, and can be deposited at low temperature, and have great application potential in tribology, biomedical and other fields. However, the diamond-like carbon film has a characteristic - high internal stress, which makes the bonding force of the film base very weak and its own thickness is very limited. A transition layer or doping must be added for such diamond films. Doping, on the other hand, may weaken the performance of a certain aspect of the diamond-like carbon film. Therefore, finding a suitable transition layer is the key to promoting the application of diamond-like carbon films. The transition layer not only affects the bonding force of the diamond-like carbon film, but also has a great influence on the corrosion resistance. Therefore, in addition to the high bonding strength with the matrix and the diamond-like carbon film, it also has a high corrosion resistance and does not accelerate the corrosion of the film or substrate.

目前,类金刚石薄膜主要有阴极弧沉积、等离子增强CVD(PECVD)和磁控溅射三种制备方法。At present, there are three main preparation methods for diamond-like carbon films: cathodic arc deposition, plasma enhanced CVD (PECVD) and magnetron sputtering.

阴极弧是最早用来沉积类金刚石薄膜的一种方法,是在强电场的作用下,将碳原子沉积到基底上,其存在的主要缺陷是:1,制备的类金刚石薄膜具有极高的内应力局限了类金刚石薄膜的厚度在纳米级,难以添加过渡层或者掺杂;2,强电场导致会有大量石墨颗粒被轰击出来最后沉积在基底上,无法获得高质量的类金刚石薄膜,而通过添加磁过滤装置减少石墨颗粒却会同时过滤很大一部分碳离子或原子降低沉积效率,且过滤装置复杂成本高。尽管磁过滤阴极弧能制备出高sp3C含量的类金刚石薄膜,但无法工业化应用,并未受到企业的青睐。Cathodic arc is one of the earliest methods used to deposit diamond-like carbon films. It is to deposit carbon atoms on the substrate under the action of a strong electric field. The main defects are: 1. The prepared diamond-like carbon films have extremely high internal The stress limits the thickness of the diamond-like carbon film to the nanometer level, and it is difficult to add a transition layer or doping; 2. The strong electric field causes a large number of graphite particles to be bombarded and finally deposited on the substrate, so high-quality diamond-like carbon film cannot be obtained. Adding a magnetic filter device to reduce graphite particles will filter a large part of carbon ions or atoms at the same time and reduce the deposition efficiency, and the filter device is complicated and costly. Although magnetic filtration cathodic arc can prepare diamond-like carbon films with high sp3C content, it cannot be applied industrially and is not favored by enterprises.

PECVD制备类金刚石薄膜沉积效率高,且类金刚石薄膜sp3C含量高的同时内应力相对较低,综合性能优异,然而其掺杂元素必须以气氛形式输入,这极大的阻碍了制备金属掺杂类金刚石薄膜。The deposition efficiency of the diamond-like carbon film prepared by PECVD is high, and the sp3C content of the diamond-like carbon film is relatively low, and the internal stress is relatively low, and the comprehensive performance is excellent. However, its doping elements must be input in the form of atmosphere, which greatly hinders the preparation of metal-doped films diamond film.

磁控溅射主要包括离子源辅助磁控溅射和直流偏压磁控溅射;离子源辅助磁控溅射可以制备的类金刚石薄膜结合强度高,种类多,但综合性能上稍差,离子源及其维护成本高。而直流偏压磁控溅射制备类金刚石薄膜时,由于溅射时靶表面会生成并累积覆盖碳化物等而导致金属靶绝缘,轰击靶面的正离子会在靶面上累积,导致靶电位上升,使得电极间的电场逐渐变小,直至辉光放电熄灭和溅射停止,同时,由于DLC膜本身导电性很差,直流偏压效果则会减弱甚至不再起作用,导致薄膜沉积厚度受限。在三种不同制备方法中,基底偏压都是必不可少的,但由于类金刚石薄膜的电导率极低,而现有技术通常采用直流偏压,因此,随着沉积厚度的增加基底偏压对类金刚石薄膜结构的影响减弱,当厚度达到 4μm时完全失效。Magnetron sputtering mainly includes ion source assisted magnetron sputtering and DC bias magnetron sputtering; ion source assisted magnetron sputtering can prepare diamond-like carbon films with high bonding strength and many types, but the overall performance is slightly worse. Source and maintenance costs are high. When DC bias magnetron sputtering is used to prepare diamond-like carbon films, the metal target is insulated due to the formation and accumulation of carbides on the target surface during sputtering, and the positive ions bombarding the target surface will accumulate on the target surface, resulting in the potential of the target. The electric field between the electrodes gradually decreases until the glow discharge is extinguished and the sputtering stops. At the same time, due to the poor conductivity of the DLC film itself, the DC bias effect will weaken or even no longer work, resulting in limited film deposition thickness. . In the three different preparation methods, the substrate bias is essential, but since the conductivity of the diamond-like carbon film is extremely low, and the prior art usually uses a DC bias, the substrate bias increases with the increase of the deposition thickness. The effect on the structure of the diamond-like carbon film is weakened, and it fails completely when the thickness reaches 4 μm.

另外,由于DLC薄膜的缺陷,电解质沿着缺陷扩散到基底,形成微电池腐蚀,腐蚀速率非常快甚至超过没有薄膜保护的基底,导致DLC薄膜保护的基体长期耐腐蚀性能不良。现有技术虽然有采用过渡层的结构,但其并未解决膜层、过渡层与基体之间的电位问题,其耐腐蚀性能并不如人意。In addition, due to the defects of the DLC film, the electrolyte diffuses to the substrate along the defects, resulting in corrosion of the microbattery, and the corrosion rate is very fast even exceeding the substrate without film protection, resulting in poor long-term corrosion resistance of the substrate protected by the DLC film. Although the prior art adopts the structure of the transition layer, it does not solve the potential problem between the film layer, the transition layer and the substrate, and its corrosion resistance performance is not satisfactory.

综上,现有技术存在膜基结合力不理想、膜层内应力大、耐腐蚀性能不理想、制备成本高等缺陷,因此,急需提供一种有效的解决方案。To sum up, the prior art has the defects of unsatisfactory film-base bonding force, large internal stress of the film layer, unsatisfactory corrosion resistance, and high preparation cost. Therefore, an effective solution is urgently needed.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于克服现有技术之不足,提供一种工艺成本低、膜层结构合理、抗磨损耐腐蚀性能好的DLC/SiNx复合薄膜及制备方法。The purpose of the present invention is to overcome the deficiencies of the prior art, and to provide a DLC/ SiNx composite film with low process cost, reasonable film structure, good wear and corrosion resistance and a preparation method.

本发明所提出的射频偏压辅助磁控溅射制备技术具有低成本高效率制备综合性能优异的类金刚石薄膜的优势。既能使用射频偏压对基底进行离子清洗用以提升结合力,也能用射频偏压在提升含碳气氛的离化率同时施加基底偏压提升力学性能,且磁控靶既能沉积过渡层也能提供掺杂元素,或者使用石墨靶制备本征类金刚石薄膜。特别是射频基底偏压不会随着薄膜厚度的增加而使偏压效果大幅度下降,适合大规模应用。The radio frequency bias-assisted magnetron sputtering preparation technology proposed in the present invention has the advantages of low cost and high efficiency for preparing diamond-like thin films with excellent comprehensive properties. RF bias can be used to ion clean the substrate to improve the bonding force, and RF bias can be used to increase the ionization rate of carbon-containing atmosphere while applying substrate bias to improve mechanical properties, and the magnetron target can deposit transition layers. Doping elements can also be provided, or a graphite target can be used to prepare intrinsic diamond-like carbon films. In particular, the RF substrate bias will not greatly decrease the bias effect with the increase of the film thickness, which is suitable for large-scale applications.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,在金属或合金基体表面制备非晶态金属或合金改性层后,采用磁控溅射技术依次制备SiNx薄膜、DLC薄膜;所述SiNx薄膜中,x取值在0-1.5,不包含0。2、根据权利要求1所述的抗磨损耐腐蚀的DLC/SiNx复合薄膜,其特征在于,采用等离子轰击金属或合金基体表面,在金属或合金基体表面进行离子刻蚀与离子注入,得到表面改性层。The invention is a DLC/SiN x composite film with wear resistance and corrosion resistance. After the amorphous metal or alloy modified layer is prepared on the surface of the metal or alloy substrate, the magnetron sputtering technology is used to prepare the SiN x film and the DLC film in turn; In the SiN x film, the value of x is in the range of 0-1.5, excluding 0. 2. The wear-resistant and corrosion-resistant DLC/SiN x composite film according to claim 1 is characterized in that, a metal or alloy substrate is bombarded by plasma Surface, ion etching and ion implantation are performed on the surface of the metal or alloy substrate to obtain a surface modification layer.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,可应用在硬质合金园锯盘及PCB线路板铣刀等具体产品上;硬质合金圆锯盘产品锯片为弹簧钢等钢板材料,钢板材料厚度为2.5-4.0mm,直径主要有D300-D600mm。锯片外圆上有 120-140个锯齿,锯齿上镶焊有硬质合金刀头;所述PCB线路板铣刀规格为外径 20-315mm,孔径5-40mm,厚度0.2-6.0mm。The anti-wear and corrosion-resistant DLC/SiN x composite film of the invention can be applied to specific products such as hard alloy circular saw discs and PCB circuit board milling cutters; the saw blade of the hard alloy circular saw disc product is a steel plate such as spring steel Material, the thickness of the steel plate material is 2.5-4.0mm, and the diameter is mainly D300-D600mm. There are 120-140 serrations on the outer circle of the saw blade, and a carbide cutter head is inlaid on the serrations; the specifications of the PCB circuit board milling cutter are 20-315mm in outer diameter, 5-40mm in aperture, and 0.2-6.0mm in thickness.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,将金属或合金基体置于磁控溅射设备的样品基台上,样品基台与接地的真空室绝缘并连接射频电源,对纯金属或合金基体施加偏压,采用等离子轰击金属或合金基体表面,在金属或合金基体表面进行离子刻蚀与离子注入,得到表面改性层;表面改性层为非晶态层。The invention is a DLC/SiN x composite film with wear resistance and corrosion resistance. The metal or alloy substrate is placed on the sample base of the magnetron sputtering equipment. The sample base is insulated from the grounded vacuum chamber and connected to the radio frequency power supply. The metal or alloy substrate is biased, and the surface of the metal or alloy substrate is bombarded by plasma, and ion etching and ion implantation are performed on the surface of the metal or alloy substrate to obtain a surface modification layer; the surface modification layer is an amorphous layer.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,施加的偏压为500-1000V,等离子体选自Ar等离子体、Ar和N的混合等离子体中的一种;等离子轰击时间 10-20min;表面改性层厚度5~100nm。The anti-wear and anti-corrosion DLC/SiN x composite thin film of the present invention, the applied bias voltage is 500-1000V, the plasma is selected from Ar plasma, a mixed plasma of Ar and N; the plasma bombardment time is 10- 20min; the thickness of the surface modification layer is 5-100nm.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,SiNx薄膜+DLC薄膜厚度为0.0001-0.1mm。The invention is a wear-resistant and corrosion-resistant DLC/SiN x composite thin film, and the thickness of the SiN x thin film + DLC thin film is 0.0001-0.1 mm.

本发明一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,金属基体选自金属镁、铝、钛、铜、铁中的一种;合金基体选自金属镁、铝、钛、铜、铁的合金中的一种。The invention is a wear-resistant and corrosion-resistant DLC/SiN x composite film, the metal matrix is selected from one of metal magnesium, aluminum, titanium, copper and iron; the alloy matrix is selected from metal magnesium, aluminum, titanium, copper and iron. one of the alloys.

一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的制备方法,是将金属或合金基体置于磁控溅射设备中,采用等离子轰击金属或合金基体表面,对金属或合金基体表面进行离子刻蚀或者离子刻蚀的同时进行离子注入,得到表面改性层后,采用磁控溅射在表面改性层上原位制备SiNx薄膜和DLC薄膜;A method for preparing a wear-resistant and corrosion-resistant DLC/SiN x composite thin film is to place a metal or alloy substrate in a magnetron sputtering device, bombard the surface of the metal or alloy substrate with plasma, and perform ion etching on the surface of the metal or alloy substrate. Ion implantation is carried out at the same time as etching or ion etching, and after obtaining the surface modification layer, the SiN x film and the DLC film are prepared in situ on the surface modification layer by magnetron sputtering;

一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的制备方法,表面改性层的制备是将金属或合金基体置于磁控溅射设备的样品基台上,样品基台与接地的真空室绝缘并连接射频电源,对纯金属或合金基体施加偏压,采用等离子轰击金属或合金基体表面,对金属或合金基体表面进行离子刻蚀或者离子刻蚀的同时进行离子注入,制备得到表面改性层;施加的偏压为500-1000V,等离子体选自Ar等离子体、Ar和N等离子体中的一种;等离子轰击时间10-20min;表面改性层厚度 5~100nm。注入的离子选自N,C,Cr,O,Si,Ti中的至少一种。A method for preparing a wear-resistant and corrosion-resistant DLC/SiN x composite film, the preparation of the surface modification layer is that a metal or alloy substrate is placed on a sample base of a magnetron sputtering device, and the sample base is connected to a grounded vacuum chamber Insulate and connect the radio frequency power supply, apply a bias voltage to the pure metal or alloy substrate, use plasma to bombard the surface of the metal or alloy substrate, and perform ion etching or ion implantation on the surface of the metal or alloy substrate to prepare the surface modification. layer; the applied bias voltage is 500-1000V, the plasma is selected from Ar plasma, Ar and N plasma; the plasma bombardment time is 10-20min; the thickness of the surface modification layer is 5-100nm. The implanted ions are selected from at least one of N, C, Cr, O, Si, and Ti.

一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的制备方法,在表面改性层上原位制备SiNx薄膜和DLC薄膜工艺如下:A method for preparing a wear-resistant and corrosion-resistant DLC/SiN x composite thin film, the in-situ preparation of the SiN x thin film and the DLC thin film on the surface modification layer is as follows:

SiNx薄膜采用反应磁控溅射制备,以Si或Si3N4作为溅射靶材,溅射源为射频、中频或直流电源,溅射气氛为Ar与N2或者Ar与NH3的混合气氛;磁控溅射工艺参数为:SiN x thin films are prepared by reactive magnetron sputtering, using Si or Si 3 N 4 as the sputtering target, the sputtering source is radio frequency, intermediate frequency or DC power supply, and the sputtering atmosphere is a mixture of Ar and N 2 or Ar and NH 3 Atmosphere; magnetron sputtering process parameters are:

混合气氛中Ar与N2或者Ar与NH3的流量比为1-8,靶功率密度为3.5-18.5 W·cm-2,工作气压为0.5-10Pa,沉积时间5-60min;In the mixed atmosphere, the flow ratio of Ar and N 2 or Ar and NH 3 is 1-8, the target power density is 3.5-18.5 W·cm -2 , the working pressure is 0.5-10Pa, and the deposition time is 5-60min;

DLC薄膜制备时,采用石墨靶或者金属作为溅射靶材;When the DLC film is prepared, a graphite target or metal is used as the sputtering target;

采用石墨作为靶材溅射时:When sputtering with graphite as the target:

溅射气氛为氩气,溅射源为射频、中频或直流电源;The sputtering atmosphere is argon, and the sputtering source is radio frequency, intermediate frequency or DC power supply;

磁控溅射工艺参数为:The magnetron sputtering process parameters are:

靶功率密度为3.5-18.5W·cm-2,工作气压为0.25-5Pa,沉积时间5-60min,施加初始偏压20-25V,磁控溅射过程中,每隔5-10分钟调增一次偏压,偏压调增幅度为5-30V,当偏压达到300V时,停止偏压调增;The target power density is 3.5-18.5W·cm -2 , the working pressure is 0.25-5Pa, the deposition time is 5-60min, the initial bias voltage is 20-25V, and the increase is every 5-10 minutes during the magnetron sputtering process Bias voltage, the bias voltage adjustment rate is 5-30V, when the bias voltage reaches 300V, the bias voltage adjustment is stopped;

采用金属靶作为靶材溅射时:When sputtering with a metal target as the target:

溅射气氛为Ar与C2H2或者Ar与CH4的混合气氛,溅射源为射频、中频或直流电源;The sputtering atmosphere is a mixed atmosphere of Ar and C 2 H 2 or Ar and CH 4 , and the sputtering source is radio frequency, intermediate frequency or DC power supply;

金属靶材选自W、Mo、Ti、Cr、Si、Al中的一种或其合金;The metal target is selected from one of W, Mo, Ti, Cr, Si, Al or its alloy;

磁控溅射工艺参数为:The magnetron sputtering process parameters are:

混合气氛中Ar与C2H2或者Ar与CH4的流量比为0.5-6,靶功率密度为 3.5-18.5W·cm-2,工作气压为0.5-10Pa,沉积时间5-60min,施加初始偏压20-25V,磁控溅射过程中,每隔5-10分钟调增一次偏压,偏压调增幅度为5-30V,当偏压达到300V时,停止偏压调增;使得薄膜具有由内而外不断增强的梯度硬度(偏压升高,薄膜中硬质相SP3C含量上升),降低薄膜内的残余应力,提高薄膜抗磨损性能。The flow ratio of Ar and C 2 H 2 or Ar and CH 4 in the mixed atmosphere is 0.5-6, the target power density is 3.5-18.5W·cm -2 , the working pressure is 0.5-10Pa, the deposition time is 5-60min, and the initial The bias voltage is 20-25V. During the magnetron sputtering process, the bias voltage is adjusted every 5-10 minutes. The bias voltage adjustment increment is 5-30V. When the bias voltage reaches 300V, the bias voltage adjustment is stopped; It has gradient hardness increasing from inside to outside (the bias voltage increases, the content of hard phase SP 3 C in the film increases), the residual stress in the film is reduced, and the wear resistance of the film is improved.

本发明根据现有技术种种缺陷,提出了射频偏压辅助磁控溅射沉积DLC,对基底可以施加不同大小的射频偏压,可以高效率地制备出膜基结合强度高,力学性能、耐摩擦性能和耐腐蚀性能均优异的类金刚石薄膜。通过改变射频偏压,可以改变类金刚石薄膜中sp2与sp3之间的比例,可以对类金刚石薄膜的结构进行大范围的有效调控。由于本发明既可以通过通入气体掺杂源,也可以使用金属靶对DLC进行掺杂或制备过渡层。本发明选用了SiNx过渡层作为DLC膜与基体之间的缓冲层,解决了DLC膜内应力过高的问题,进一步的提升了DLC性能,同时在制备SiNx过渡层之前,我们使用高射频偏压条件下,使用Ar,N等离子体轰击基底,在基底制备了非晶改性层,制备的非晶改性层具有改善基体表面状态使表面更密实、提高基体与过渡层之间结合性能、减小基体和第二相之间腐蚀电位等优势,结果证实非晶层/SiNx/DLC膜具有优异的力学性能和耐腐蚀性能。According to various defects of the prior art, the present invention proposes a radio frequency bias-assisted magnetron sputtering deposition of DLC, which can apply radio frequency bias voltages of different sizes to the substrate, and can efficiently prepare a film substrate with high bonding strength, mechanical properties and friction resistance. Diamond-like carbon film with excellent performance and corrosion resistance. By changing the RF bias, the ratio between sp2 and sp3 in the diamond-like carbon film can be changed, and the structure of the diamond-like carbon film can be effectively controlled in a wide range. Because of the present invention, the DLC can be doped or the transition layer can be prepared by using a gas doping source or a metal target. In the present invention, the SiNx transition layer is selected as the buffer layer between the DLC film and the substrate, which solves the problem of excessive stress in the DLC film and further improves the DLC performance. At the same time, before preparing the SiNx transition layer, we use a high radio frequency bias Under certain conditions, the substrate was bombarded with Ar, N plasma, and an amorphous modified layer was prepared on the substrate. The advantages such as corrosion potential between the small matrix and the second phase confirm that the amorphous layer/SiNx/DLC film has excellent mechanical properties and corrosion resistance.

本发明由于采用上述工艺方法及膜层结构,具有以下优点:The present invention has the following advantages due to the adoption of the above-mentioned process method and film structure:

1、采用射频偏压辅助磁控溅射制备技术,具有低成本高效率制备综合性能优异的类金刚石薄膜的优势。这种技术既能使用射频偏压对基底进行离子清洗用以提升结合力,也能用射频偏压在提升含碳气氛的离化率同时施加基底偏压提升力学性能,且磁控靶既能沉积过渡层也能提供掺杂元素,或者使用石墨靶制备本征类金刚石薄膜。1. The use of radio frequency bias-assisted magnetron sputtering preparation technology has the advantages of low-cost and high-efficiency preparation of diamond-like carbon films with excellent comprehensive properties. This technology can not only use RF bias to ion clean the substrate to improve the bonding force, but also use RF bias to improve the ionization rate of the carbon-containing atmosphere while applying substrate bias to improve the mechanical properties, and the magnetron target can not only Deposition of transition layers can also provide doping elements, or use graphite targets to prepare intrinsic diamond-like carbon films.

射频基底偏压还有一个优势是不会随着薄膜厚度的增加而使偏压效果大幅度下降。因为,射频电源是交流电,周期交替作用在靶上,当溅射靶处于正半周时,电子流向靶面,中和其表面积累的正电荷,并且积累电子,使其表面呈现负偏压,在射频电压的负半周期时吸引正离子轰击靶材,从而使溅射过程得以持续进行,减轻或防止靶中毒现象发生;另外,射频电压可以穿过任何种类的阻抗,所以当DLC膜沉积较厚时,由于DLC薄膜自身对射频电源的屏蔽效果较弱所以可以继续施加偏压而不受厚度的影响。An additional advantage of RF substrate biasing is that there is no significant reduction in biasing effect with increasing film thickness. Because the radio frequency power supply is alternating current, the cycle acts on the target alternately, when the sputtering target is in the positive half cycle, the electrons flow to the target surface, neutralize the positive charge accumulated on the surface, and accumulate electrons, making the surface present a negative bias. The negative half cycle of the RF voltage attracts positive ions to bombard the target, so that the sputtering process can continue, reducing or preventing the occurrence of target poisoning; in addition, the RF voltage can pass through any kind of impedance, so when the DLC film is deposited thicker When the DLC film itself has a weak shielding effect on the RF power supply, the bias voltage can continue to be applied without being affected by the thickness.

2、制备非晶过渡层,有效改善膜基结合力2. Prepare an amorphous transition layer to effectively improve the bonding force of the film base

1)非晶改性层改善了基体表面状态使表面更密实;1) The amorphous modified layer improves the surface state of the substrate and makes the surface denser;

由于非晶层的均匀单相,成分和组织更为均匀,成分起伏较少,无明显晶界,无第二相颗粒或位错等特点,所以在基体表面制备非晶改性层,可以大大改善基体金属或者合金表面的不平整状态,消除基体表面业已存在的孔洞或孔隙、裂纹、针孔等缺陷,从而,大幅度降低基体表面腐蚀核心缺陷的数量,提高复合膜层结构的耐腐蚀性能。Due to the uniform single phase of the amorphous layer, the composition and structure are more uniform, the composition fluctuates less, there is no obvious grain boundary, no second phase particles or dislocations, etc., so the preparation of the amorphous modified layer on the surface of the substrate can greatly improve the Improve the unevenness of the surface of the base metal or alloy, and eliminate existing defects such as holes or pores, cracks, and pinholes on the base surface, thereby greatly reducing the number of core corrosion defects on the base surface and improving the corrosion resistance of the composite film structure. .

2)非晶改性层减小了基体和第二相之间的腐蚀电位;2) The amorphous modified layer reduces the corrosion potential between the matrix and the second phase;

非晶层制备过程中的离子轰击或刻蚀可以使基体或其中的杂质元素与同样的离子发生化学结合而产生相似结构的新相,增大了基体表面的化学均匀性,减小了原本基体和第二相之间的腐蚀电位。另外,非晶层可以抑制基体中的杂质元素向基体表面的扩散,避免因杂质扩散到基体表面而成为点蚀核心的情况。The ion bombardment or etching during the preparation of the amorphous layer can chemically combine the matrix or its impurity elements with the same ions to generate a new phase with similar structure, which increases the chemical uniformity of the surface of the matrix and reduces the original matrix. and the corrosion potential between the second phase. In addition, the amorphous layer can inhibit the diffusion of impurity elements in the matrix to the surface of the matrix, and avoid the situation that the impurities diffuse to the surface of the matrix and become the pitting core.

3)非晶改性层制备过程中基体有耐腐蚀新相产生:3) During the preparation of the amorphous modified layer, a new corrosion-resistant phase is produced in the matrix:

离子轰击或者离子注入的过程中将与基体原子结合形成新相。例如N等离子体轰击或者N离子注入镁合金基体表面将生成耐腐蚀相的Mg3N2新相是耐腐蚀相,从而提升基体表面的耐腐蚀性能。During the process of ion bombardment or ion implantation, a new phase will be formed by combining with the matrix atoms. For example, N plasma bombardment or N ion implantation on the surface of the magnesium alloy substrate will generate a new phase of Mg3N2, which is a corrosion-resistant phase, which is a corrosion-resistant phase, thereby improving the corrosion resistance of the substrate surface.

4)由于非晶层本身结构原子的无序性,使得非晶层本身就具备较好的耐腐蚀性能,同时,杂质离子或电解质中离子在非晶层中移动也变得非常困难,从而阻碍了基体腐蚀的发生。4) Due to the disorder of the structural atoms of the amorphous layer itself, the amorphous layer itself has good corrosion resistance, and at the same time, it is very difficult for impurity ions or ions in the electrolyte to move in the amorphous layer, thus hindering the The occurrence of substrate corrosion.

本发明采用等离子轰击金属或者合金表面,由于使用几百伏甚至上千伏的偏压,是在较大偏压条件下完成的等离子轰击,这使得基体表面温度会迅速升高,基体表面成分与等离子体成分在较高温度下会发生一定的冶金结合,或者基体表层成分会重新固溶,等离子体轰击结束后将偏压突减至很低的值或直接关闭开始沉积过渡层,由于等离子轰击基体表面整个过程大约只需持续10-20分钟左右,所以基体快速升至高温的同时其周围环境的温度不会明显升高,当轰击结束后,表面处于高温的基体直接暴露于温度较低的周围环境中,迅速冷却,所以等离子轰击近似是一个快速熔化快速凝固的过程,满足形成非晶层所需的快冷条件。另外,在很高的偏压作用下进行等离子体轰击基体表面,高能粒子撞击基体表面使其产生大量的空位或者填隙原子,这些点缺陷会在热激活作用下不断迁移运动并形成位错。在高能量的较长时间轰击下,会造成更高的位错密度,由于每种金属或者合金表面所能维持的位错密度存在着固有极限,当等离子体轰击基体表面造成的位错密度超过这个固有极限时,会造成基体表面内部晶格崩溃造成无序态而最终使基体表面形成非晶层。The present invention uses plasma to bombard the metal or alloy surface. Because of the use of a bias voltage of several hundred volts or even thousands of volts, the plasma bombardment is completed under the condition of a relatively large bias voltage, which causes the surface temperature of the substrate to rise rapidly, and the surface composition of the substrate is different from that of the substrate. The plasma composition will undergo a certain metallurgical bond at a higher temperature, or the composition of the surface layer of the matrix will be re-dissolved. After the plasma bombardment ends, the bias voltage is suddenly reduced to a very low value or the transition layer is directly turned off to start the deposition of the transition layer. The whole process on the surface of the substrate only lasts about 10-20 minutes, so the temperature of the surrounding environment will not increase significantly when the substrate rapidly rises to high temperature. In the surrounding environment, it cools rapidly, so the plasma bombardment is approximately a process of rapid melting and solidification, which satisfies the rapid cooling conditions required for the formation of an amorphous layer. In addition, when plasma bombards the surface of the substrate under the action of a high bias voltage, high-energy particles strike the surface of the substrate to generate a large number of vacancies or interstitial atoms. These point defects will continuously migrate and form dislocations under the action of thermal activation. Under high-energy bombardment for a longer time, higher dislocation density will be caused. Due to the inherent limit of the dislocation density that can be maintained on the surface of each metal or alloy, when the dislocation density caused by plasma bombardment on the surface of the substrate exceeds When this inherent limit is reached, the internal lattice collapse on the surface of the matrix will cause a disordered state and eventually an amorphous layer will be formed on the surface of the matrix.

3、通过非晶过渡层,有效改善膜基电位3. Through the amorphous transition layer, the film base potential can be effectively improved

本发明将等离子浸入式离子注入技术作为沉积薄膜的前处理方式,因其需要的能量低,效率高,容易实现与其他真空制备技术复合,十分适合注入N离子。除了改变成分外,还可以通过改变金属或者合金的结构提升耐腐蚀性能;使得金属或合金具有长期稳定的耐腐蚀性能。The present invention uses the plasma immersion ion implantation technology as the pretreatment method for depositing thin films, which is very suitable for implanting N ions because of its low energy requirement, high efficiency, and easy realization of compounding with other vacuum preparation technologies. In addition to changing the composition, the corrosion resistance can also be improved by changing the structure of the metal or alloy; so that the metal or alloy has long-term stable corrosion resistance.

综合以上,本发明的射频偏压辅助磁控溅射技术解决了现有技术存在的多种缺陷,具有明显的优势。To sum up, the radio frequency bias-assisted magnetron sputtering technology of the present invention solves various defects existing in the prior art, and has obvious advantages.

具体实施方式Detailed ways

以下通过实施例及对比例对本发明作进一步详细说明。The present invention will be described in further detail below through examples and comparative examples.

本发明实施例及对比例制备的样品性能指标见表1.The performance indexes of the samples prepared in the embodiment of the present invention and the comparative example are shown in Table 1.

实施例1:Example 1:

(1)Ar等离子体改性层制备(1) Preparation of Ar plasma modified layer

以耐腐蚀性较差的AZ31镁合金为基体,将清洗好的AZ31镁合金基底放入溅射室内,基底正对石墨靶,基底连接射频电源,通入16sccm氩气,溅射电源为直流电源,电源功率为37W,工作气压1.1pa,施加基体偏压700V,轰击时间 15min,在基体表面得到非晶改性层。The AZ31 magnesium alloy with poor corrosion resistance is used as the substrate, and the cleaned AZ31 magnesium alloy substrate is placed in the sputtering chamber. , the power supply is 37W, the working pressure is 1.1pa, the substrate bias voltage is 700V, and the bombardment time is 15min, and an amorphous modified layer is obtained on the surface of the substrate.

(2)SiNx薄膜制备(2) Preparation of SiNx thin films

旋转靶材使AZ31镁合金基底正对硅靶,同时通入氩气和氮气,流量比为4:1,溅射电源为射频电源,射频功率为200W,工作气压0.75pa,沉积时间60min。Rotate the target so that the AZ31 magnesium alloy substrate faces the silicon target, and at the same time, argon and nitrogen are introduced, the flow ratio is 4:1, the sputtering power source is radio frequency power source, the radio frequency power is 200W, the working pressure is 0.75pa, and the deposition time is 60min.

(3)类金刚石薄膜制备(3) Preparation of diamond-like carbon films

旋转基底使AZ31镁合金基底正对石墨靶,基底连接射频电源,施加偏压50 V,同时通入氩气和乙炔,流量比为8:3,溅射电源为直流电源,电源功率150W,工作气压1.3pa,沉积时间6min。Rotate the substrate so that the AZ31 magnesium alloy substrate is facing the graphite target, the substrate is connected to a radio frequency power supply, a bias voltage of 50 V is applied, and argon and acetylene are fed at the same time. The flow ratio is 8:3. The air pressure was 1.3pa, and the deposition time was 6min.

实施例2:Example 2:

(1)Ar,N等离子体改性层制备(1) Preparation of Ar, N plasma modified layer

以耐腐蚀性较差的AZ31镁合金为基体,将清洗好的AZ31镁合金基底放入溅射室内,基底正对石墨靶,基底连接射频电源,通入氩气和氮气,流量比为 4:1,溅射电源为直流电源,电源功率为37W,工作气压1.1pa,施加基体偏压 700V,轰击时间15min,在基体表面得到非晶改性层。Using AZ31 magnesium alloy with poor corrosion resistance as the substrate, put the cleaned AZ31 magnesium alloy substrate into the sputtering chamber. 1. The sputtering power supply is a DC power supply, the power supply is 37W, the working pressure is 1.1pa, the substrate bias is 700V, and the bombardment time is 15min to obtain an amorphous modified layer on the surface of the substrate.

(2)SiNx薄膜制备(2) Preparation of SiNx thin films

旋转基底使AZ31镁合金基底正对硅靶,同时通入氩气和氮气,流量比为4:1,溅射电源为射频电源,射频功率为200W,工作气压0.75pa,沉积时间60min。The substrate was rotated so that the AZ31 magnesium alloy substrate was facing the silicon target, and argon and nitrogen were introduced at the same time, the flow ratio was 4:1, the sputtering power was RF power, the RF power was 200W, the working pressure was 0.75pa, and the deposition time was 60min.

(3)类金刚石薄膜制备(3) Preparation of diamond-like carbon films

旋转靶材使AZ31镁合金基底正对石墨靶,基底连接射频电源,施加偏压50 V,同时通入氩气和乙炔,流量比为8:3,溅射电源为直流电源,电源功率150W,工作气压1.3pa,沉积时间6min。Rotate the target so that the AZ31 magnesium alloy substrate is facing the graphite target, the substrate is connected to a radio frequency power supply, a bias voltage of 50 V is applied, and argon and acetylene are fed at the same time. The flow ratio is 8:3. The working pressure is 1.3pa, and the deposition time is 6min.

实施例3:Example 3:

(1)Ar,N等离子体改性层制备(1) Preparation of Ar, N plasma modified layer

以耐腐蚀性较差的AZ31镁合金为基体,将清洗好的AZ31镁合金基底放入溅射室内,基底正对石墨靶,基底连接射频电源,通入氩气和氮气,流量比为 4:1,溅射电源为直流电源,电源功率为37W,工作气压1.1pa,施加基体偏压 700V,轰击时间15min,在基体表面得到非晶改性层。Using AZ31 magnesium alloy with poor corrosion resistance as the substrate, put the cleaned AZ31 magnesium alloy substrate into the sputtering chamber. 1. The sputtering power supply is a DC power supply, the power supply is 37W, the working pressure is 1.1pa, the substrate bias is 700V, and the bombardment time is 15min to obtain an amorphous modified layer on the surface of the substrate.

(2)SiNx薄膜制备(2) Preparation of SiNx thin films

旋转基底使AZ31镁合金基底正对硅靶,同时通入氩气和氮气,流量比为4:1,溅射电源为射频电源,射频功率为200W,工作气压0.75pa,沉积时间60min。The substrate was rotated so that the AZ31 magnesium alloy substrate was facing the silicon target, and argon and nitrogen were introduced at the same time, the flow ratio was 4:1, the sputtering power was RF power, the RF power was 200W, the working pressure was 0.75pa, and the deposition time was 60min.

(3)梯度类金刚石薄膜制备(3) Preparation of gradient diamond-like carbon films

旋转靶材使AZ31镁合金基底正对石墨靶,基底连接射频电源,同时通入氩气和乙炔,沉积过程中,氩气流量固定为16sccm,乙炔流量从0(sccm)缓慢增加至8(sccm),同时线性增加基体偏压,从25V逐步增加至至140V。溅射电源为直流电源,电源功率150W,工作气压1.1pa,沉积时间20min。Rotate the target so that the AZ31 magnesium alloy substrate is facing the graphite target, the substrate is connected to the RF power supply, and argon and acetylene are introduced at the same time. During the deposition process, the argon flow rate is fixed at 16sccm, and the acetylene flow rate is slowly increased from 0 (sccm) to 8 (sccm). ), while linearly increasing the substrate bias from 25V to 140V. The sputtering power supply is a DC power supply, the power supply is 150W, the working pressure is 1.1pa, and the deposition time is 20min.

对比例1:Comparative Example 1:

(1)SiNx薄膜制备(1) Preparation of SiNx thin films

以耐腐蚀性较差的AZ31镁合金为基体,将清洗好的AZ31镁合金基底放入溅射室内,基底正对硅靶,同时通入氩气和氮气,流量比为4:1,溅射电源为射频电源,射频功率为200W,工作气压0.75pa,沉积时间60min。The AZ31 magnesium alloy with poor corrosion resistance was used as the substrate, and the cleaned AZ31 magnesium alloy substrate was placed in the sputtering chamber, the substrate was facing the silicon target, and argon gas and nitrogen gas were introduced at the same time, and the flow ratio was 4:1. The power source is radio frequency power, the radio frequency power is 200W, the working pressure is 0.75pa, and the deposition time is 60min.

(2)类金刚石薄膜制备(2) Preparation of diamond-like carbon films

旋转靶材使AZ31镁合金基底正对石墨靶,基底连接射频电源,施加偏压50 V,同时通入氩气和乙炔,流量比为8:3,溅射电源为直流电源,电源功率150W,工作气压1.3pa,沉积时间6min。Rotate the target so that the AZ31 magnesium alloy substrate is facing the graphite target, the substrate is connected to a radio frequency power supply, a bias voltage of 50 V is applied, and argon and acetylene are fed at the same time. The flow ratio is 8:3. The working pressure is 1.3pa, and the deposition time is 6min.

对所得类金刚石复合薄膜的各项性能进行检测,检测结果见表1。The properties of the obtained diamond-like carbon composite films were tested, and the test results are shown in Table 1.

通过电化学方法测试(使用三电极体系,参比电极为饱和Ag/AgCl电极,对电极为Pt片(15mm×15mm×0.1mm),样品为工作电极(暴露面积0.25cm2),电解质3.5wt.%NaCl溶液)其抗腐蚀性能,通过测试塔菲尔极化曲线获得其腐蚀电流;耐磨性使用往复式摩擦磨损测试方法进行表征,使用对偶件为氮化硅球 (直径4.2mm),滑行距离8mm,载荷8N,频率为8Hz。Tested by electrochemical method (using a three-electrode system, the reference electrode is a saturated Ag/AgCl electrode, the counter electrode is a Pt sheet (15mm×15mm×0.1mm), the sample is a working electrode (exposed area 0.25cm2), and the electrolyte is 3.5wt. %NaCl solution) and its corrosion resistance, the corrosion current is obtained by testing the Tafel polarization curve; the wear resistance is characterized by the reciprocating friction and wear test method, and the counterpart is a silicon nitride ball (diameter 4.2mm), sliding The distance is 8mm, the load is 8N, and the frequency is 8Hz.

性能检测Performance testing

表1:Table 1:

Figure BDA0002012033670000101
Figure BDA0002012033670000101

性能比较:从表1的数据可以看出:Performance comparison: From the data in Table 1, it can be seen that:

摩擦系数(COF.):实施例3<实施例2<实施例1<对比例1;Coefficient of friction (COF.): Example 3 < Example 2 < Example 1 < Comparative Example 1;

腐蚀电流密度:实施例3<实施例2<实施例1<对比例1。Corrosion current density: Example 3<Example 2<Example 1<Comparative Example 1.

从表1的数据可以看出,本发明实施例1-3制备的类金刚石复合薄膜的摩擦系数小于对比例制备的薄膜;最大腐蚀电流密度仅仅是对比例的1/4。It can be seen from the data in Table 1 that the friction coefficient of the diamond-like composite films prepared in Examples 1-3 of the present invention is smaller than that of the films prepared by the comparative example; the maximum corrosion current density is only 1/4 of the comparative example.

Claims (8)

1.一种抗磨损耐腐蚀的DLC/SiNx复合薄膜,其特征在于,在金属或合金基体表面制备非晶态金属或合金改性层后,采用磁控溅射技术依次制备SiNx薄膜、DLC薄膜;所述SiNx薄膜中,x取值在0-1.5,不包含0;采用等离子轰击金属或合金基体表面,在金属或合金基体表面进行离子刻蚀与离子注入,得到表面改性层。1. a wear-resistant and corrosion-resistant DLC/SiN composite film, is characterized in that, after preparing amorphous metal or alloy modified layer on metal or alloy substrate surface, adopt magnetron sputtering technology to prepare SiN film successively, DLC film; in the SiN x film, the value of x is 0-1.5, excluding 0; the surface of the metal or alloy substrate is bombarded by plasma, and ion etching and ion implantation are performed on the surface of the metal or alloy substrate to obtain a surface modification layer . 2.根据权利要求1所述的抗磨损耐腐蚀的DLC/SiNx复合薄膜,其特征在于,将金属或合金基体置于磁控溅射设备的样品基台上,样品基台与接地的真空室绝缘并连接射频电源,对纯金属或合金基体施加偏压,采用等离子轰击金属或合金基体表面,在金属或合金基体表面进行离子刻蚀与离子注入,得到表面改性层。2. The wear-resistant and corrosion-resistant DLC/SiN composite film according to claim 1 , wherein the metal or alloy substrate is placed on the sample base of the magnetron sputtering equipment, and the sample base is connected to a grounded vacuum The chamber is insulated and connected to a radio frequency power supply, a bias voltage is applied to the pure metal or alloy substrate, the surface of the metal or alloy substrate is bombarded with plasma, and ion etching and ion implantation are performed on the surface of the metal or alloy substrate to obtain a surface modification layer. 3.根据权利要求1或2所述的抗磨损耐腐蚀的DLC/SiNx复合薄膜,其特征在于,施加的偏压为 500-1000V,等离子体选自Ar等离子体、Ar和N的混合等离子体中的一种;等离子轰击时间 10-20min; 表面改性层厚度5~100 nm。3. The wear-resistant and corrosion-resistant DLC/SiN composite film according to claim 1 and 2, wherein the applied bias voltage is 500-1000V, and the plasma is selected from the mixed plasma of Ar plasma, Ar and N One of them; the plasma bombardment time is 10-20min; the thickness of the surface modification layer is 5-100 nm. 4.根据权利要求3所述的抗磨损耐腐蚀的DLC/SiNx复合薄膜,其特征在于,SiNx薄膜+DLC薄膜厚度为0.0001-0.1mm。4. The wear-resistant and corrosion-resistant DLC/ SiNx composite film according to claim 3, wherein the thickness of the SiNx film+DLC film is 0.0001-0.1 mm. 5.根据权利要求4所述的一种用于金属或合金表面抗磨耐腐的DLC/SiNx复合薄膜,其特征在于,金属基体选自金属镁、铝、钛、铜、铁中的一种;合金基体选自金属镁、铝、钛、铜、铁的合金中的一种。5. a kind of DLC/ SiN composite film for wear-resistant and corrosion-resistant metal or alloy surface according to claim 4, is characterized in that, metal matrix is selected from one of metal magnesium, aluminum, titanium, copper, iron The alloy matrix is selected from one of the alloys of metal magnesium, aluminum, titanium, copper and iron. 6.制备如权利要求5所述的一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的方法,是将金属或合金基体置于磁控溅射设备中,采用等离子轰击金属或合金基体表面,对金属或合金基体表面进行离子刻蚀或者离子刻蚀的同时进行离子注入,得到表面改性层后,采用磁控溅射在表面改性层上原位制备SiNx薄膜和DLC薄膜。6. the method for preparing a kind of wear-resistant and corrosion-resistant DLC/SiN composite film as claimed in claim 5 is to place metal or alloy substrate in magnetron sputtering equipment, and use plasma to bombard the metal or alloy substrate surface, The surface of the metal or alloy substrate is ion-etched or ion-implanted at the same time as ion-etching to obtain a surface-modified layer, and then magnetron sputtering is used to in-situ prepare SiN x film and DLC film on the surface-modified layer. 7.根据权利要求6所述的一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的制备方法,其特征在于:表面改性层的制备是将金属或合金基体置于磁控溅射设备的样品基台上,样品基台与接地的真空室绝缘并连接射频电源,对纯金属或合金基体施加偏压,采用等离子轰击金属或合金基体表面,对金属或合金基体表面进行离子刻蚀或者离子刻蚀的同时进行离子注入,制备得到表面改性层;施加的偏压为 500-1000V,等离子体选自Ar等离子体、Ar和N等离子体中的一种;等离子轰击时间 10-20min; 表面改性层厚度5~100 nm。7. the preparation method of a kind of wear-resistant and corrosion-resistant DLC/SiN composite thin film according to claim 6, is characterized in that: the preparation of surface modification layer is to place metal or alloy matrix in magnetron sputtering equipment On the sample base, the sample base is insulated from the grounded vacuum chamber and connected to a radio frequency power supply. A bias voltage is applied to the pure metal or alloy base, and the surface of the metal or alloy base is bombarded with plasma to perform ion etching or ion etching on the surface of the metal or alloy base. Ion implantation is performed at the same time of etching to prepare a surface modification layer; the applied bias voltage is 500-1000V, and the plasma is selected from one of Ar plasma, Ar and N plasma; the plasma bombardment time is 10-20min; The thickness of the modified layer is 5-100 nm. 8.根据权利要求7所述的一种抗磨损耐腐蚀的DLC/SiNx复合薄膜的制备方法,其特征在于:在表面改性层上原位制备SiNx薄膜和DLC薄膜工艺如下:8. the preparation method of a kind of anti-wear and corrosion-resistant DLC/SiN x composite thin film according to claim 7, is characterized in that: on the surface modification layer, the in-situ preparation of SiN x thin film and DLC thin film technology is as follows: SiNx薄膜采用反应磁控溅射制备,以Si或Si3N4作为溅射靶材,溅射源为射频、中频或直流电源,溅射气氛为Ar与N2或者Ar与NH3的混合气氛;磁控溅射工艺参数为:SiN x thin films are prepared by reactive magnetron sputtering, using Si or Si 3 N 4 as the sputtering target, the sputtering source is radio frequency, intermediate frequency or DC power supply, and the sputtering atmosphere is a mixture of Ar and N 2 or Ar and NH 3 Atmosphere; magnetron sputtering process parameters are: 混合气氛中Ar与N2或者Ar与NH3的流量比为1-8,靶功率密度为3.5-18.5 W•cm-2,工作气压为0.5-10Pa,沉积时间5-60min;In the mixed atmosphere, the flow ratio of Ar and N 2 or Ar and NH 3 is 1-8, the target power density is 3.5-18.5 W·cm -2 , the working pressure is 0.5-10Pa, and the deposition time is 5-60min; DLC薄膜制备时,采用石墨靶或者金属作为溅射靶材;When the DLC film is prepared, a graphite target or metal is used as the sputtering target; 采用石墨作为靶材溅射时:When sputtering with graphite as the target: 溅射气氛为氩气,溅射源为射频、中频或直流电源;The sputtering atmosphere is argon, and the sputtering source is radio frequency, intermediate frequency or DC power supply; 磁控溅射工艺参数为:The magnetron sputtering process parameters are: 靶功率密度为3.5-18.5 W•cm-2,工作气压为0.25-5Pa,沉积时间5-60min,施加初始偏压20-25V,磁控溅射过程中,每隔5-10分钟调增一次偏压,偏压调增幅度为5-30V,当偏压达到300V时,停止偏压调增;The target power density is 3.5-18.5 W·cm -2 , the working pressure is 0.25-5Pa, the deposition time is 5-60min, the initial bias voltage is 20-25V, and the increase is every 5-10 minutes during the magnetron sputtering process Bias voltage, the bias voltage adjustment rate is 5-30V, when the bias voltage reaches 300V, the bias voltage adjustment is stopped; 采用金属靶作为靶材溅射时:When sputtering with a metal target as the target: 溅射气氛为Ar与C2H2或者Ar与CH4的混合气氛,溅射源为射频、中频或直流电源;The sputtering atmosphere is a mixed atmosphere of Ar and C 2 H 2 or Ar and CH 4 , and the sputtering source is radio frequency, intermediate frequency or DC power supply; 金属靶材选自W、Mo、Ti、Cr、Si、Al中的一种或其合金;The metal target is selected from one of W, Mo, Ti, Cr, Si, Al or its alloy; 磁控溅射工艺参数为:The magnetron sputtering process parameters are: 混合气氛中Ar与C2H2或者Ar与CH4的流量比为0.5-6,靶功率密度为3.5-18.5 W•cm-2,工作气压为0.5-10Pa,沉积时间5-60min,施加初始偏压20-25V,磁控溅射过程中,每隔5-10分钟调增一次偏压,偏压调增幅度为5-30V,当偏压达到300V时,停止偏压调增。In the mixed atmosphere, the flow ratio of Ar and C 2 H 2 or Ar and CH 4 is 0.5-6, the target power density is 3.5-18.5 W·cm -2 , the working pressure is 0.5-10Pa, the deposition time is 5-60min, and the initial The bias voltage is 20-25V. During the magnetron sputtering process, the bias voltage is increased every 5-10 minutes, and the bias voltage adjustment increment is 5-30V. When the bias voltage reaches 300V, the bias voltage adjustment is stopped.
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