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CN109872632A - Array substrate - Google Patents

Array substrate Download PDF

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Publication number
CN109872632A
CN109872632A CN201910211629.3A CN201910211629A CN109872632A CN 109872632 A CN109872632 A CN 109872632A CN 201910211629 A CN201910211629 A CN 201910211629A CN 109872632 A CN109872632 A CN 109872632A
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CN
China
Prior art keywords
metal wire
connecting line
metal
array substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910211629.3A
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Chinese (zh)
Inventor
卢延涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to CN201910211629.3A priority Critical patent/CN109872632A/en
Publication of CN109872632A publication Critical patent/CN109872632A/en
Pending legal-status Critical Current

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Abstract

The present invention provides a kind of array substrate, the array substrate includes the first connecting line and the second connecting line, first connecting line is for connecting driving chip and flexible circuit board, second connecting line is for connecting gate driving circuit and flexible circuit board, wherein, at least one of first connecting line and second connecting line are that the metal wire of at least two-layer laminate setting is in parallel;The present invention is in parallel by setting double layer of metal line at least one of the first connecting line and the second connecting line, so that at least one of the first connecting line and the second connecting line reduce impedance, to reduce pressure drop, solving existing display panel there is technical issues that on cabling with biggish.

Description

Array substrate
Technical field
The present invention relates to field of display technology, more particularly, to a kind of array substrate.
Background technique
Existing display panel reduces display screen frame to improve screen accounting, it will usually make FPC (flexible circuit board) to IC The cabling of cabling and GOA circuit (Gate On Array, gate driving circuit) between (driving chip) uses same layer impedance Lesser metal.
As shown in Figure 1, since FPC needs to pass to signal IC, and the signal transmitted is high frequency electric source signal, to make Obtaining has biggish pressure drop on cabling, and the cable run distance of GOA circuit is longer, causes to have on the cabling of GOA circuit biggish Pressure drop, so that the display problems such as colour cast and brightness irregularities occurs in display panel.
So existing display panel there is technical issues that on cabling with biggish.
Summary of the invention
The present invention provides a kind of array substrate, and for solving existing display panel, there are have biggish pressure drop on cabling Technical problem.
To solve the above problems, technical solution provided by the invention is as follows:
A kind of array substrate characterized by comprising
First connecting line, for connecting driving chip and flexible circuit board;
Second connecting line, for connecting gate driving circuit and flexible circuit board;
Wherein, at least one of first connecting line and second connecting line are the gold of at least two-layer laminate setting It is in parallel to belong to line.
In array substrate provided by the invention, first connecting line includes the first metal wire and second being arranged in parallel Metal wire, first metal wire and the second metal wire are same metal material.
In array substrate provided by the invention, first connecting line includes the first metal wire and second being arranged in parallel Metal wire, first metal wire and the second metal wire are different metal material.
It further include the first metal layer in array substrate provided by the invention, first metal wire and the second metal wire Projection on the first metal layer is identical.
It further include the first metal layer and second metal layer, first metal wire in array substrate provided by the invention It is set to the first metal layer, second metal wire is set to second metal layer.
It further include the first metal layer and gate insulating layer, first metal wire in array substrate provided by the invention It is set to the first metal layer, second metal wire is set to source-drain electrode layer.
In array substrate provided by the invention, first connecting line include overlay and parallel connection setting the first metal wire, Second metal wire and third metal wire, first metal wire, the second metal wire, third metal wire are different metal material.
In array substrate provided by the invention, second connecting line includes the first metal wire and second being arranged in parallel Metal wire, first metal wire and the second metal wire are different metal material.
In array substrate provided by the invention, the material of first metal wire include molybdenum, titanium, in aluminium neodymium alloy extremely One few, the material of second metal wire includes at least one of molybdenum, titanium, aluminium neodymium alloy.
In array substrate provided by the invention, first metal wire is in parallel by via hole with the second metal wire.
The utility model has the advantages that the present invention provides a kind of array substrate, which includes the first connecting line and the second connecting line, First connecting line is for connecting driving chip and flexible circuit board, and second connecting line is for connecting gate driving circuit And flexible circuit board, wherein at least one of first connecting line and second connecting line are that at least two-layer laminate is set The metal wire set is in parallel;The present invention is by setting double layer of metal line at least one of the first connecting line and the second connecting line Parallel connection, to reduce pressure drop, solves existing so that at least one of the first connecting line and the second connecting line reduce impedance With the presence of there is the technical issues of biggish pressure drop on display panel cabling.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these Figure obtains other attached drawings.
Fig. 1 is existing display panel schematic diagram;
Fig. 2 is the first schematic diagram of array substrate in the embodiment of the present invention;
Fig. 3 is the second schematic diagram of array substrate in the embodiment of the present invention;
Fig. 4 is array substrate third schematic diagram in the embodiment of the present invention;
Fig. 5 is the 4th schematic diagram of array substrate in the embodiment of the present invention.
Specific embodiment
The explanation of following embodiment is referred to the additional illustration, the particular implementation that can be used to implement to illustrate the present invention Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side] Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention there is technical issues that there is biggish, the embodiment of the present invention on cabling for existing display panel To solve the problems, such as this.
Shown in (a) as shown in figure 1, existing display panel includes array substrate 10 and color membrane substrates 11, the color membrane substrates 11 are arranged in array substrate 10, and the array substrate 10 includes viewing area 110 and non-display area, are equipped with GOA in non-display area Cabling 111, IC14 and FPC13, shown in (b) as shown in figure 1, IC14 and FPC13 pass through the first metal layer on glass substrate 15 Cabling 12 connects, but due to the non-high-frequency signal of signal between FPC and IC, so that having biggish pressure drop on cabling 12, and GOA Cabling 111 is apart from longer, so that having biggish pressure drop on GOA cabling 111, so that signal damages in transmission process Consumption, and then display panel is caused the display problems such as colour cast and brightness irregularities occur, i.e., there are have on cabling for existing display panel There is the technical issues of biggish pressure drop.
As shown in Fig. 2, the embodiment of the present invention provides a kind of array substrate, which includes:
First connecting line 25, for connecting driving chip 24 and flexible circuit board 26;
Second connecting line 27, for connecting gate driving circuit 23 and flexible circuit board 26;
Wherein, at least one of first connecting line 25 and second connecting line 27 are at least two-layer laminate setting Metal wire it is in parallel.
Present invention implementation provides a kind of array substrate, which includes the first connecting line and the second connecting line, described First connecting line is for connecting driving chip and flexible circuit board, and second connecting line is for connecting gate driving circuit and soft Property circuit board, wherein at least one of first connecting line and second connecting line are that at least double layer of metal line is in parallel; The present invention is in parallel by setting double layer of metal line at least one of the first connecting line and the second connecting line, so that first connects At least one of wiring and the second connecting line reduce impedance, to reduce pressure drop, solve existing display panel and exist There is the technical issues of biggish pressure drop on cabling.
In one embodiment, as shown in (a) in Fig. 2, the embodiment of the present invention provides a kind of array substrate, the array base Plate includes viewing area 21 and non-display area 22, and the first connecting line 25 and the second connecting line 27, institute are provided in non-display area 22 It is in parallel to state the metal wire that at least one of the first connecting line and the second connecting line are at least two-layer laminate setting;In Fig. 2 (b) shown in, driving chip 24 and flexible circuit board 26, the driving chip 24 and flexible circuit board 26 are fitted on substrate 28 It being connected by the first connecting line 25, the first connecting line 25 includes the first metal wire 251 and the second metal wire 252 being arranged in parallel, First metal wire and the second metal wire are same metal material, and metal material includes titanium, molybdenum but not limited to this, by by the One connecting line is set as double layer of metal line parallel connection, so that the impedance of the first connecting line reduces, so that on the first connecting line Pressure drop is reduced, so that solving existing display panel there is technical issues that on cabling with biggish.
It should be noted that the first metal wire is not limited to be bonded setting with the second metal wire, guaranteeing the first metal wire Under the premise of in parallel with the second metal wire, it can make between the first metal wire and the second metal wire that there are gaps.
In embodiments of the present invention, the first metal wire, the second metal wire, third metal wire are not specific to a certain metal material, Also it is not specific to a certain metal wire, is no longer described in following embodiments.
In one embodiment, the first connecting line includes the first metal wire and the second metal wire being arranged in parallel, and first Metal wire and the second metal wire are different materials, such as the first metal wire is titanium, the second metal wire is molybdenum, by the first metal wire with Second metal wire is in parallel, so that the impedance of the first connecting line becomes smaller, so that the pressure drop of the first connecting line reduces or the first metal The material of line is molybdenum, titanium, one in aluminium neodymium alloy, and the material of second metal wire is molybdenum, titanium, one in aluminium neodymium alloy It is a.
In one embodiment, the first connecting line includes the first metal wire and the second metal wire being arranged in parallel, and described The material of one metal wire be molybdenum, second metal wire material be titanium or first metal wire material be molybdenum, it is described The material of second metal wire is that the material of aluminium neodymium alloy or first metal wire is the material of titanium, second metal wire For aluminium neodymium alloy, the material of metal wire is not limited to molybdenum, titanium, aluminium neodymium alloy, such as aluminum titanium alloy, aluminium molybdenum in the embodiment of the present invention Alloy etc. has more low-impedance material.
As shown in (a) in Fig. 3, the embodiment of the present invention provides a kind of array substrate, which includes flexible base board 31, it is equipped with active layer 37 on flexible base board 31, interlayer insulating film 32 is equipped on active layer 37, is set on interlayer insulating film 32 There is the first metal layer 38, first grid insulating layer 33 is equipped on the first metal layer 38, is equipped on first grid insulating layer 33 Second metal layer 39 is equipped with second grid insulating layer 34 in second metal layer 39, and source is equipped on second grid insulating layer 34 Drain electrode layer 36 is equipped with planarization layer 35, as shown in (b) in Fig. 3, driving chip 24 and flexible circuit board on source-drain electrode layer 36 26 by the first connecting line connect, first connecting line include the first metal wire 251 and the second metal wire 252, described first Metal wire 251 is in parallel with the second metal wire 252, and first connecting line is set to the first metal layer, by by the first metal layer The first connecting line be set as the first metal wire and the second metal wire being arranged in parallel so that the impedance of the first connecting line reduces, And then it solves existing display panel and there is technical issues that on cabling with biggish.
In one embodiment, the first connecting line includes the first metal wire and the second metal wire being arranged in parallel, and first Connecting line is set to second metal layer, can extend to non-display area from viewing area by second metal layer and form the first connecting line, Perhaps turned in viewing area by the first metal layer line to second metal layer formed the first connecting line or by the first metal wire by The first metal layer extends to form, and the second metal wire is extended to form by second metal layer.
In one embodiment, the first connecting line includes the first metal wire and the second metal wire being arranged in parallel, and first Connecting line is set to source-drain electrode layer, can form the first connection by the way that the first metal layer to be turned to line to source-drain electrode layer in viewing area Line.
In one embodiment, as shown in (b) in Fig. 4, the first connecting line 25 includes the first metal wire being arranged in parallel 251, the second metal wire 252, third metal wire 253, by setting the first metal wire being arranged in parallel, for the first connecting line Two metal wires and third metal wire, to reduce pressure drop, solve existing aobvious so that the impedance of the first connecting line further decreases It is biggish to show that panel there is technical issues that have on cabling.
In the present embodiment, the first metal wire and third metal wire are same metal material, the second metal wire and the first gold medal Belong to line different metal material;Or first metal wire and the second metal wire be same metal material, third metal wire and the first gold medal Category line is different metal material;Perhaps the first metal wire, the second metal wire, third metal wire are identical material or the first gold medal Belonging to line, the second metal wire, third metal wire is different metal material, for example, the first metal wire is titanium, the second metal wire is Molybdenum, third metal wire are aluminium neodymium alloy;The embodiment of the present invention does not limit the material of the first connecting line, is to reduce the first connecting line Premise, the metal material for keeping the first connecting line impedance small.
As shown in figure 5, the embodiment of the present invention provides a kind of array substrate, which includes driving chip 24 and flexibility Circuit board 26, the driving chip 24 are connect with the flexible circuit board 26 by the first connecting line, the first connecting line packet Include the first metal wire 251 and the second metal wire 252 being arranged in parallel, in embodiments of the present invention, the first metal wire and the second gold medal Belong to line be generally aligned in the same plane, it is contemplated that being arranged in parallel the first metal wire and the second metal wire can be such that its thickness increases, this hair The first metal wire and the second metal wire are set to same plane in bright embodiment, so that the impedance of the first connecting line reduces, into And it solves existing display panel and there is technical issues that on cabling with biggish.
In one embodiment, the first metal wire is generally aligned in the same plane with the second metal wire, is guaranteeing the first connecting line While stability, the first metal wire can be arranged and the second metal wire is arranged in parallel and same plane;Or it can be by the first gold medal Belong to line and the setting of the second metal wire and same layer, such as reduce the thickness of the first metal wire and the second metal wire, makes the first metal Line and the second metal wire are in same layer, such as the first metal wire and the second metal wire are two metal wires in the first metal layer; And consider the stability of the first connecting line, the first metal wire, the second metal wire, third metal wire can be set to same flat Face.
In one embodiment, the second connecting line includes the first metal wire and the second metal wire being arranged in parallel, and described One metal wire and the second metal wire are different metal material, by setting the first metal wire and the second metal for the second connecting line Line, and the first metal wire is in parallel with the second metal wire, so that the impedance of the second connecting line reduces, to reduce by the second connecting line Pressure drop, and then solve existing display panel and there is technical issues that on cabling with biggish.
In one embodiment, the second connecting line includes the first metal wire, the second metal wire and the third gold being arranged in parallel Belong to line, first metal wire, the second metal wire, the material of third metal wire are different, by setting for the second connecting line One metal wire, the second metal wire, third metal wire, so that the impedance of the second connecting line reduces, to be further reduced pressure drop.
In one embodiment, the second connecting line includes the first metal wire and the second metal wire of overlay and parallel connection setting, institute It states and is equipped with insulating materials between the first metal wire and the second metal wire, the first metal wire and the second metal wire is made to pass through via hole simultaneously Connection.
In one embodiment, the second connecting line includes the first metal wire and the second metal wire of overlay and parallel connection setting, the One metal wire is overlapped with the projection of the second metal wire on the first metal layer, such as the first metal wire and the second metal wire are first The rectangle for being projected as a coincidence on metal layer, but the embodiment of the present invention does not limit the shape of the first metal wire and the second metal wire It shape and does not limit the first metal wire and is overlapped with the projection of the second metal wire.
In one embodiment, the first metal wire, the second metal wire, third metal wire are titanium, molybdenum, one in aluminium neodymium alloy Kind metal material, but the embodiment of the present invention does not limit the material of the second connecting line.
In one embodiment, the first connecting line and the second connecting line can be set to same layer, such as first is connected Line and the second connecting line are set to the first metal layer or second metal layer or source-drain electrode layer;Or the first connecting line is arranged In the first metal layer, the second connecting line is set to second metal layer.
In one embodiment, the first metal wire being arranged in parallel and the second metal wire are set by the first connecting line, it will Second connecting line is set as the third metal wire and the 4th metal wire being arranged in parallel, by by the first connecting line and the second connecting line It is set as the multiple layer metal line being arranged in parallel, so that the impedance of the first connecting line and the second connecting line reduces, and then reduces pressure Drop, and then solve existing display panel and there is technical issues that on cabling with biggish.
The embodiment of the present invention provides a kind of liquid crystal display panel, which includes array substrate, color membrane substrates and set The liquid crystal being placed between array substrate and color membrane substrates, the array substrate include the array base as described in above-described embodiment is any Plate.
In one embodiment, display panel is OLED display panel, which includes such as above-described embodiment Any array substrate.
The embodiment of the present invention provides a kind of display panel, which includes array substrate, which includes the One connecting line and the second connecting line, first connecting line is for connecting driving chip and flexible circuit board, second connection Line is for connecting gate driving circuit and flexible circuit board, wherein in first connecting line and second connecting line extremely Few one is that at least double layer of metal line is in parallel;The present invention is by the way that at least one of the first connecting line and the second connecting line to be arranged It is in parallel for double layer of metal line, so that at least one of the first connecting line and the second connecting line reduce impedance, to reduce Pressure drop, solving existing display panel there is technical issues that on cabling with biggish.
According to above embodiments:
The embodiment of the present invention provides a kind of array substrate, which includes the first connecting line and the second connecting line, institute The first connecting line is stated for connecting driving chip and flexible circuit board, second connecting line for connect gate driving circuit and Flexible circuit board, wherein at least one of first connecting line and second connecting line are that at least double layer of metal line is simultaneously Connection;The present invention is in parallel by setting double layer of metal line at least one of the first connecting line and the second connecting line, so that the At least one of one connecting line and the second connecting line reduce impedance, to reduce pressure drop, solve existing display panel There is technical issues that have on cabling biggish.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention Decorations, therefore protection scope of the present invention subjects to the scope of the claims.

Claims (10)

1. a kind of array substrate characterized by comprising
First connecting line, for connecting driving chip and flexible circuit board;
Second connecting line, for connecting gate driving circuit and flexible circuit board;
Wherein, at least one of first connecting line and second connecting line are the metal wire of at least two-layer laminate setting It is in parallel.
2. array substrate as described in claim 1, which is characterized in that first connecting line includes the first gold medal being arranged in parallel Belong to line and the second metal wire, first metal wire and the second metal wire are same metal material.
3. array substrate as described in claim 1, which is characterized in that first connecting line includes the first gold medal being arranged in parallel Belong to line and the second metal wire, first metal wire and the second metal wire are different metal material.
4. array substrate as claimed in claim 3, which is characterized in that further include the first metal layer, first metal wire with The projection of second metal wire on the first metal layer is identical.
5. array substrate as claimed in claim 3, which is characterized in that it further include the first metal layer and second metal layer, it is described First metal wire is set to the first metal layer, and second metal wire is set to second metal layer.
6. array substrate as claimed in claim 3, which is characterized in that it further include the first metal layer and source-drain electrode layer, described One metal wire is set to the first metal layer, and second metal wire is set to source-drain electrode layer.
7. array substrate as described in claim 1, which is characterized in that first connecting line includes the of overlay and parallel connection setting One metal wire, the second metal wire and third metal wire, first metal wire, the second metal wire, third metal wire are difference Metal material.
8. array substrate as described in claim 1, which is characterized in that second connecting line includes the first gold medal being arranged in parallel Belong to line and the second metal wire, first metal wire and the second metal wire are different metal material.
9. array substrate as claimed in claim 8, which is characterized in that the material of first metal wire includes molybdenum, titanium, aluminium neodymium At least one of alloy, the material of second metal wire include at least one of molybdenum, titanium, aluminium neodymium alloy.
10. array substrate as claimed in claim 8, which is characterized in that first metal wire and the second metal wire passed through Hole is in parallel.
CN201910211629.3A 2019-03-20 2019-03-20 Array substrate Pending CN109872632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910211629.3A CN109872632A (en) 2019-03-20 2019-03-20 Array substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910211629.3A CN109872632A (en) 2019-03-20 2019-03-20 Array substrate

Publications (1)

Publication Number Publication Date
CN109872632A true CN109872632A (en) 2019-06-11

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CN112783377A (en) * 2021-02-25 2021-05-11 惠州市华星光电技术有限公司 Touch panel and touch device
CN113193244A (en) * 2021-04-28 2021-07-30 歌尔股份有限公司 Battery device and head-mounted display equipment
CN114758582A (en) * 2022-05-17 2022-07-15 云谷(固安)科技有限公司 Display panel and manufacturing method thereof
US11839123B2 (en) 2021-03-11 2023-12-05 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and display device

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CN114758582A (en) * 2022-05-17 2022-07-15 云谷(固安)科技有限公司 Display panel and manufacturing method thereof

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