CN109861556A - Power conversion device - Google Patents
Power conversion device Download PDFInfo
- Publication number
- CN109861556A CN109861556A CN201810118950.2A CN201810118950A CN109861556A CN 109861556 A CN109861556 A CN 109861556A CN 201810118950 A CN201810118950 A CN 201810118950A CN 109861556 A CN109861556 A CN 109861556A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- power supply
- power
- shell
- supply change
- Prior art date
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Links
- 238000006243 chemical reaction Methods 0.000 title abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 76
- 239000000110 cooling liquid Substances 0.000 claims abstract description 44
- 230000004308 accommodation Effects 0.000 claims description 67
- 238000001914 filtration Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 22
- 230000008054 signal transmission Effects 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 208000029154 Narrow face Diseases 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 description 8
- 239000000470 constituent Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000002708 enhancing effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
Abstract
本案关于一种电源转换装置。其包括壳体、主板、电磁滤波板、信号板以及散热模块。壳体包括第一散热墙以及冷却液流道。主板架构于壳体之上。主板包含第一表面以及第一功率器件。第一表面面向壳体。散热模块包括第一绝缘导热片以及第一弹性夹件。第一绝缘导热片贴合于对应的第一散热墙。于主板的第一表面趋向壳体且将第一功率器件夹固于容置空间时，第一弹性夹件靠压第一功率器件贴合于第一绝缘导热片，以使第一功率器件通过第一绝缘导热片与第一散热墙以及冷却液流道热耦接。
This case is about a power conversion device. It includes a casing, a main board, an electromagnetic filter board, a signal board and a heat dissipation module. The casing includes a first heat dissipation wall and a cooling liquid flow channel. The mainboard is constructed on the casing. The mainboard includes a first surface and a first power device. The first surface faces the housing. The heat dissipation module includes a first insulating heat-conducting sheet and a first elastic clip. The first insulating heat-conducting sheet is attached to the corresponding first heat dissipation wall. When the first surface of the motherboard tends to the housing and the first power device is clamped in the accommodating space, the first elastic clip presses the first power device and is attached to the first insulating and heat-conducting sheet, so that the first power device can pass through. The first insulating heat-conducting sheet is thermally coupled with the first heat dissipation wall and the cooling liquid flow channel.
Description
Technical field
This case is about a kind of power supply device, espespecially a kind of power supply change-over device of high power density.
Background technique
Vehicle-mounted charge module (On Board Charge Module, OBCM) refers to that one kind is installed on electric car, thoroughly
Cross the power supply change-over device that land-based AC power grid charges to on-vehicle battery group.When being charged, user can will be exchanged
Power cable, which is directly inserted into the socket of electric car, to charge to electric car.In this kind of power supply change-over device
Including at least power conversion module and base housing etc., power conversion module is converted to external power supply on automobile to realize
The AC/DC power supply of used each voltage class.When power conversion module is in running order, a large amount of heat can be generated
Amount, base housing provides heat dissipation design and dissipates the heat that power conversion module generates, to avoid the accumulation because of heat
Influence the overall performance of power conversion module.However, the design of power conversion module at present and base housing correspond to offer
Heat dissipation design is bad, causes the overall volume of vehicle-mounted charge module bigger, power density is lower.
Therefore, how to develop a kind of power supply change-over device to solve prior art problem encountered, actually this field is urgently
Project to be solved.
Summary of the invention
This case is designed to provide a kind of power supply change-over device.It is laid by optimization each constituent component, makes its assembly
Fixation is simple and reliable, while enhancing the heat-sinking capability of each constituent component, and reduce power supply change-over device overall volume and
Promote the overall power density of power supply change-over device.
The another object of this case is to provide a kind of power supply change-over device.It is thermally conductive by penetrating the power device on mainboard
The radiating surface of shell is fixed and conformed to the radiating module of insulation, and each component that constitutes is set between mainboard and shell and is placed in
The accommodation groove of shell, the radiating surface and accommodation groove of shell are thermally coupled in the cooling liquid flowing channel of shell simultaneously, to reduce interface resistance,
Simplify assembling structure, and then achievees the purpose that the reliability and heat-sinking capability that reduce cost, promote power supply change-over device.
To reach foregoing purpose, this case provides a kind of power supply change-over device.It includes shell, mainboard, em filtering plate, letter
Number plate and radiating module.Shell includes at least one first heat dissipation wall and a cooling liquid flowing channel, wherein the first heat dissipation wall thermal coupling
It is connected to cooling liquid flowing channel.Mainboard framework is on shell, and wherein mainboard includes a first surface and at least one first power device
Part, wherein first surface is set on mainboard towards shell, the first power device, and including one first face and one second face.
Em filtering type structure is electrically connected to mainboard on the shell.Signal type structure is electrically connected to master on the shell
Plate.Radiating module includes at least one first insulating heat-conductive piece and at least one first elastic pinching member, wherein the first insulating heat-conductive piece
Corresponding first heat dissipation wall is fitted in, the first elastic pinching member is fixed on shell and relative to the first insulating heat-conductive piece, so that first
Elastic pinching member and the first insulating heat-conductive horse are configured to an accommodating space, tend to shell in the first surface of mainboard and by the first function
When rate device is clamped on the accommodating space between the first elastic pinching member and the first insulating heat-conductive piece, the first elastic pinching member is by pressure first
First face of power device, the second face paste of the first power device is together in the first insulating heat-conductive piece, so that the first power device is logical
Cross the first insulating heat-conductive piece and the first heat dissipation wall and cooling liquid flowing channel thermal coupling.
Detailed description of the invention
Fig. 1 is the structural exploded view for disclosing the power supply change-over device of the first preferred embodiment of this case；
Fig. 2 is the part-structure exploded view for disclosing the power supply change-over device of the first preferred embodiment of this case；
Fig. 3 is the part-structure exploded view for disclosing another visual angle of power supply change-over device of the first preferred embodiment of this case；
Fig. 4 is the cooling liquid flowing channel configuration diagram for disclosing the first preferred embodiment of this case；
Fig. 5 is the circuit block diagram for disclosing the power supply change-over device of the first preferred embodiment of this case；
Fig. 6 to Fig. 9 is that structure of the power supply change-over device of announcement the first preferred embodiment of this case in the different assembling stages is shown
It is intended to.
[symbol description]
1: power supply change-over device
10: shell
11: the first heat dissipation walls
12: cooling liquid flowing channel
12a: liquid input tube
12c, 12d, 12f: channel
12b, 12e: narrow face
12g: liquid output pipe
13: the first accommodation grooves
14: the second accommodation grooves
15: the second heat dissipation walls
16: power input
17: power output end
18: signal transmission end
19: bottom cover
20: mainboard
21: first surface
22: second surface
23: the first power devices
23a: the first face
23b: the second face
24: transformer module
25: the second power devices
25a: the first face
25b: the second face
27: power factor correction circuit
28: isolation DC/DC converter
29: high voltage direct current electromagnetism filter circuit
30: radiating module
31: the first insulating heat-conductive pieces
32: the first elastic pinching members
33: accommodating space
34: the second insulating heat-conductive pieces
35: the second elastic pinching members
36: heat-conducting glue
40: em filtering plate
50: signal plate
60: outer cover
L1: first side
L2: second side
Specific embodiment
The some exemplary embodiments for embodying this case features and advantages will describe in detail in the explanation of back segment.It should be understood that
This case can have various variations in different aspects, all not depart from the range of this case, and explanation therein and diagram
In itself to be illustrated as being used, not for limitation this case.
Fig. 1 is the structural exploded view for disclosing the power supply change-over device of the first preferred embodiment of this case.Fig. 2 is to disclose this case the
The part-structure exploded view of the power supply change-over device of one preferred embodiment.Fig. 3 is the power supply for disclosing the first preferred embodiment of this case
Conversion equipment is in the part-structure exploded view at another visual angle.As shown in Figure 1 to Figure 3, the power supply change-over device 1 of this case includes shell
10, mainboard 20, em filtering plate 40, signal plate 50 and radiating module 30.Shell 10 include at least one first heat dissipation wall 11 with
And a cooling liquid flowing channel 12, wherein the first heat dissipation wall 11 is thermally couple to cooling liquid flowing channel 12.20 framework of mainboard is on shell 10.
Mainboard 20 includes a first surface 21, a second surface 22 and at least one first power device 23, wherein 21 face of first surface
To shell 10, the first power device 23 is set to first surface 21, and including one first face 23a and one second face 23b.Electromagnetism
Filter band 40 is set between the first surface 21 of mainboard 20 and shell 10, and is electrically connected to mainboard 20.Signal plate 50 is set to
Between the first surface 21 and shell 10 of mainboard 20, and it is electrically connected to mainboard 20.Radiating module 30 includes at least one first insulation
Thermally conductive sheet 31 and at least one first elastic pinching member 32.First insulating heat-conductive piece 31, which can be for example but be not only restricted to one, directly covers copper
(DBC, Direct Bond Copper) ceramic substrate.Wherein the first insulating heat-conductive piece 31 fits in corresponding first heat dissipation wall
11, the first elastic pinching member 32 is fixed on shell 10 and relative to the first insulating heat-conductive piece 31, so that the first elastic pinching member 32 and
One insulating heat-conductive piece, 31 framework forms an accommodating space 33.Tend to shell 10 in the first surface 21 of mainboard 20 and by the first power
When device 23 is clamped on the accommodating space 33 between the first elastic pinching member 32 and the first insulating heat-conductive piece 31, the first elastic pinching member 32
The first face 23a by pressing the first power device 23, the second face 23b of the first power device 23 fit in the first insulating heat-conductive piece
31, so that the first power device 23 passes through the first insulating heat-conductive piece 31 and the first heat dissipation wall 11 and 12 thermal coupling of cooling liquid flowing channel
It connects.It is emphasized that the first elastic pinching member 32 compresses the pattern of the first face 23a of the first power device 23 and its is assembled in shell
10 sequence or every one first elastic pinching member 32 correspond to the visual actual demands such as the quantity configuration of the first power device 23 and adjust
Become, but the essential feature of this unrestricted this case technology, it is any to form accommodating space 33 with respect to the first heat dissipation wall 11 and maintain bullet
The elastic pinching member of property power may be applicable to this case, and this case is not limited to this.It is otherwise noted that in other embodiments
In, the first power device 23 may be disposed at the second surface 22 of mainboard 20, and mainboard 20, em filtering plate 40 and signal plate 50 are then
Co-architecture is within shell 10.Tend to shell 10, mainboard 20, em filtering plate 40, signal in the first surface 21 of mainboard 20
Plate 50 and the first power device 23 are placed within shell 10, and the first power device 23 on second surface 22 is clamped on
When accommodating space 33 between one elastic pinching member 32 and the first insulating heat-conductive piece 31, the first elastic pinching member 32 is by pressing the first power device
The second face 23b of first face 23a of part 23, the first power device 23 fit in the first insulating heat-conductive piece 31, so that the first power
Device 23 passes through the first insulating heat-conductive piece 31 and the first heat dissipation wall 11 and 12 thermal coupling of cooling liquid flowing channel.Therefore, the first power
Device 23 is set to the position of mainboard 20, and also visual practical application request modulation, this case are not limited to aforementioned state sample implementation, also
It repeats no more.In above-described embodiment, mainboard 20 can be made of one piece of circuit board and also be made of muti-piece circuit board.
Specifically, this case first radiate the visual practical application request of wall 11 and be set to it is any on shell 2 can be with cooling
The position of 12 thermal coupling of liquid stream road, and in this present embodiment, it is especially more preferably with the peripheral side for being adjacent to shell 10.Furthermore first
Power device 23 can be for example but be not only restricted to be vertically arranged relative to mainboard 20, and be inserted in the first surface 21 of mainboard 20
On, and to be adjacent to the peripheral side of mainboard 20 it is further preferred that.On the other hand, the first insulating heat-conductive piece 31 can for example, by but be not only restricted to
One heat-conducting glue (not shown) and adhered on the first corresponding heat dissipation wall 12 in advance, and the first elastic pinching member 32 is then using example
It in this way but is not only restricted to a bolt and is fixed on shell 10 in advance, so that the first elastic pinching member 32 and the first insulating heat-conductive piece 31
Between framework form required accommodating space 33, in it is rear accommodating and clamping first power device 23.In an embodiment, first
Power device 23 can for example, by but be not only restricted to a heat-conducting glue (not shown) and adhere on the first insulating heat-conductive piece 31.It is worth
It is noted that due to radiating module 30 relative to the first heat dissipation wall 11 and framework in the peripheral side of shell 10, and the first power device
Part 23 is adjacent to the peripheral side of mainboard 20, and the first elastic pinching member 32 can then be fixed on shell 10 in advance or exist in 20 framework of mainboard
It is recycled e.g. after on casing 10 but is not only restricted to a bolt and the first elastic pinching member 32 is locked in shell 10, make the first elasticity
First face 23a of the folder 32 by pressing the first power device 23, the second face 23b of the first power device 23 fits in the first insulation and leads
Backing 31, and then accommodate the first power device 23 and be clamped on accommodating space 33, and the first power device 23 is exhausted by first
Edge thermally conductive sheet 31 and the first heat dissipation wall 11 and 12 thermal coupling of cooling liquid flowing channel.In addition, power supply change-over device 1 further includes an outer cover
60, it is set on shell 10 and mainboard 20, and be covered on the second surface 22 of mainboard 20, to protection power source converting means
Set 1.
On the other hand, in this present embodiment, the more framework of power supply change-over device 1 is an one-way electric power conversion equipment, to incite somebody to action
One AC power source is converted to a high-voltage DC power supply.In addition to the aforementioned em filtering plate 40 and signal plate for being electrically connected to mainboard 20
Except 50, mainboard 20 further includes a transformer module 24 and at least one second power device 25, by 1 frame of power supply change-over device
Structure is an one-way electric power conversion equipment.Wherein transformer module 24 and the second power device 25 are the first tables for being set to mainboard 20
On face 21, and the second power device 25 lies low setting relative to mainboard 20.On the other hand, to make power supply change-over device 1 while reaching
At high power density and the framework of high cooling efficiency, shell 10 further includes one second heat dissipation wall 15, the first accommodation groove 13 and one
Second accommodation groove 14, wherein the second heat dissipation wall 15, the first accommodation groove 13, the second accommodation groove 14 and aforementioned first heat dissipation wall 11 are same
It is thermally couple to cooling liquid flowing channel 12.Radiating module 30 further includes at least one second insulating heat-conductive piece 34 and at least one second elasticity
Folder 35, the second insulating heat-conductive piece 34 fit in corresponding second heat dissipation wall 15, and the second elastic pinching member 35 is set to mainboard 20
Between first surface 21 and the first face 25a of the second power device 25.In 20 framework of mainboard when on shell 10, the first power device
Second face 23b of part 23 and the second face 25b of the second power device 25 passes through the first insulating heat-conductive piece of radiating module 30 respectively
31 and second insulating heat-conductive piece 34 be thermally couple to shell 10 first heat dissipation wall 11 with second radiate wall 15.In addition, Yu Benshi
It applies in example, transformer module 24 is more placed in the first accommodation groove 13, and em filtering plate 40 and signal plate 50 are then placed in second
Accommodation groove 14.Since the first accommodation groove 13 and the second accommodation groove 14 are thermally couple to cooling liquid flowing channel 12, therefore transformer module 24, electricity
The heat that magnetic filter band 40 generates can be conducted by the first accommodation groove 13 and the second accommodation groove 14 to 12 loss of cooling liquid flowing channel.
In an embodiment, when transformer module 24 and em filtering plate 40 and signal plate 50 are respectively contained in the first accommodation groove 13 and the
When two accommodation grooves 14, more one can be added for example in the first accommodation groove 13 and the second accommodation groove 14 but is not only restricted to thermal plastic insulation
(not shown), to enhance transformer module 24, em filtering plate 40 respectively by 14 heat of the first accommodation groove 13 and the second accommodation groove
It is coupled to the efficiency of cooling liquid flowing channel 12.In this present embodiment, the second accommodation groove 14 is located on three side phases of the first accommodation groove 13
Adjacent side wall.First heat dissipation wall 11 is set to the peripheral side of shell 10 and is adjacent to the one side wall or the second accommodating of the first accommodation groove 13
The one side wall of slot 14.Second heat dissipation wall 15 is then set to another phase of 13 adjacent walls of the first heat dissipation wall 11 and the first accommodation groove
To the top surface of side wall.In mainboard 20 first surface 21 is towards shell 10 and framework is when on shell 10, in power supply change-over device 1
The first power device 23 by the first insulating heat-conductive piece 31 be thermally couple to the first heat dissipation wall 11, transformer module 24 accommodating and heat
It is coupled to the first accommodation groove 13 and the second power device 25 and second heat dissipation wall 15 is thermally couple to by the second insulating heat-conductive piece 34.
It is that an e.g. secondary side power device and one are former that wherein the first power device 23 and the second power device 25, which can distinguish framework,
The combination of avris power device.By the corresponding first heat dissipation wall 11 of the first power device 23 and 25 institute of the second power device
It is opposite two side walls for being adjacent to the first accommodation groove 13 respectively with the second heat dissipation wall 15, then the first power device 23 and the second power
Device 25 can be adjacent to 24 whereabouts of transformer module, be the list of a tool high power density by 1 framework of power supply change-over device
To power supply change-over device.In addition, being electrically connected to the em filtering plate 40 of mainboard 20 and signal plate 50 is more placed in the second accommodation groove
14.Whereby, the first power device 23, the second power device 25, transformer module 24, em filtering plate 40 and signal plate 50
Simple and reliable is fixed between shell 10 and mainboard 20, while enhancing to the first power device 23, the second power device
25, the heat-sinking capability of transformer module 24 and em filtering plate 40, and reduce the overall volume and promotion of power supply change-over device 1
The overall power density of power supply change-over device.In this present embodiment, the cooling liquid flowing channel 12 of shell 10 is even more to be formed in opposite the
One heat dissipation wall 11, second radiates another opposite face of wall 15, the first accommodation groove 13 and the place of the second accommodation groove 14, can be for example including
At least channel 12c, 12d, 12f and at least one narrow face 12b, 12e, and cover a bottom cover 19 and constitute.Wherein bottom cover 19 can lead to
It crosses e.g. but is not only restricted to bolt and be locked in shell 10 and form cooling liquid flowing channel 12.Shell 10 further includes a liquid input tube
12a and a liquid output pipe 12g, liquid input tube 12a are connected to liquid output pipe 12g by cooling liquid flowing channel 12.Fig. 4
It is the cooling liquid flowing channel configuration diagram for disclosing the first preferred embodiment of this case.As shown in Fig. 2, Fig. 3 and Fig. 4, in this present embodiment,
Cooling liquid flowing channel 12 includes such as three channels 12c, 12d, 12f and two narrow face 12b, 12e.Wherein channel 12c, 12f thermal coupling
It is connected to the first heat dissipation wall 11, channel 12d is thermally couple to the second heat dissipation wall 15, while channel 12c and channel 12d are thermally couple to first
Two opposing sidewalls of accommodation groove 13.On the other hand, narrow face 12b and narrow face 12e are to be thermally couple to the first accommodation groove 13 and the respectively
Two accommodation grooves 14.Liquid input tube 12a passes through narrow face 12b, channel 12c, channel 12d, narrow face 12e and the ditch of cooling liquid flowing channel 12
Road 12f is connected to liquid output pipe 12g, and whereby, cooling liquid flowing channel 12 efficient can be taken away through the first insulating heat-conductive piece 31
It is thermally couple to the first power device 23 of the first heat dissipation wall 11, the second heat dissipation wall 15 is thermally couple to by the second insulating heat-conductive piece 34
The second power device 25, be thermally couple to the transformer module 24 of the first accommodation groove 13 and be thermally couple to the electricity of the second accommodation groove 14
Heat caused by magnetic filter band 40, and then promote the heat-sinking capability of power supply change-over device.Certainly, the cooling liquid flowing channel of shell 10
12 layings for radiating wall 11, second heat dissipation wall 15, the first accommodation groove 13 and the second accommodation groove 14 relative to first visually actually need
It asks and adjusts variation, this case is not limited to this, and is not repeated here.It is otherwise noted that in other embodiments,
First power device 23 is an integrated power module, and the second power device 25 is an integrated power module, can so be simplified
The assembling structure of power supply change-over device 1, and then reduce cost.
It is worth noting that, in this present embodiment, being an one-way electric power conversion equipment in 1 framework of power supply change-over device, using
When an AC power source being converted to a high-voltage DC power supply, the package assembly 1 of power supply change-over device further includes a power input
16, one power output end 17 and a signal transmission end 18 are held, can for example be set to a first side L1 of shell 10, and opposite
The second side L2 set by liquid input tube 12a and liquid output pipe 12g.Fig. 5 is to disclose this case first preferably to implement
The circuit block diagram of the power supply change-over device of example.To realize one-way electric power conversion equipment, the first power device 23 on mainboard 20,
Second power device 25 and transformer module 24 more assembled with other electronic building bricks a power factor correction circuit 27 in this way for framework,
One isolation DC/DC converter 28 and a high voltage direct current electromagnetism filter circuit 29.It is electrically connected to the em filtering plate 40 of mainboard 20
Can framework be e.g. an alternating electromagnetic filter band.In addition, be electrically connected to the signal plate 50 of mainboard 20 then can framework be to be, for example,
One low-voltage signal plate.Referring to Fig. 3 and Fig. 5, when power supply change-over device executes power supply conversion, an input ac power first may be used
It is transmitted to the alternating electromagnetic filter band of 40 framework of em filtering plate via power input 16, then is transmitted to the function of mainboard 20 because of school
Positive circuit 27 is exported via power output end 17 again after mainboard 20 is converted to a high-voltage DC power supply.On the other hand, in
Power supply change-over device executes signal processing, and input signal is believed via the low pressure that signal transmission end 18 is transmitted to 50 frameworks of signal plate
Number plate, behind the primary side side of 25 frameworks of the first power device 23 on mainboard 20 and the second power device and secondary side, then via
Signal plate 50 and signal transmission end 18 export.It is worth noting that, being placed in the em filtering of the second accommodation groove 14 of shell 10
More in response to the conversion of aforementioned execution power supply and signal processing demand, electromagnetism is filtered in this present embodiment for plate 40 and signal plate 50
Wave plate 40 and signal plate 50 are adjacent to the first side L1 where power input 16 and signal transmission end 18, reduce power input
End 16 promotes the function of power supply change-over device 1 to em filtering plate 40 and signal transmission end 18 to the distance of signal plate 50
Rate efficiency.Certainly, power input 16, power output end 17 and signal transmission end 18 are relative to em filtering plate 40 and signal
The laying of plate 50 also visual actual demand and modulation, this case are not limited to previous embodiment.
Specifically, power supply change-over device 1, which can optimize each constituent component, lays realization unidirectional electric energy conversion, make its assembly
Fixation is simple and reliable, while enhancing to the heat-sinking capability of each constituent component, and reduce the overall volume of power supply change-over device with
And promote the overall power density of power supply change-over device.Fig. 6 to Fig. 9 is the power supply converting means for disclosing the first preferred embodiment of this case
It is placed in the structural schematic diagram in different assembling stages.Firstly, as shown in fig. 6, in this present embodiment, shell 10 includes at least one first
Wall 11, cooling liquid flowing channel 12 (referring to fig. 2), the first accommodation groove 13, the second accommodation groove 14, second heat dissipation wall 15 radiate (referring to figure
1), power input 16, power output end 17, signal transmission end 18, liquid input tube 12a and liquid output pipe 12g.Power supply
Input terminal 16, power output end 17 and signal transmission end 18 are set to the first side L1 of shell 10.Liquid input tube 12a and
Liquid output pipe 12g is set to the second side L2 opposite with first side L1.Cooling liquid flowing channel 12 is relative to the first heat dissipation wall
11, the first accommodation groove 13, the second accommodation groove 14 and the second heat dissipation wall 15 are set to an opposing bottom surface, are dissipated with being thermally couple to first
Hot wall 11, the first accommodation groove 13, the second accommodation groove 14 and the second heat dissipation wall 15.First insulating heat-conductive piece 31 of radiating module 30
It can be for example with the second insulating heat-conductive piece 34 but be not only restricted to one and directly cover copper (DBC, Direct Bond Copper) ceramic base
Plate, and respectively for example, by but be not only restricted to a heat-conducting glue 36 and adhere to corresponding the first heat dissipation wall 12 and the in advance respectively
On two heat dissipation walls 15.
In this present embodiment, the first elastic pinching member 32 of radiating module 30 is pre- using being, for example, but being not only restricted to a bolt
It is first fixed on shell 10, so that framework forms required accommodating sky between the first elastic pinching member 32 and the first insulating heat-conductive piece 31
Between 33, in it is rear accommodating and clamping first power device 23.But the sequence that the first elastic pinching member 32 is fixed on shell 10 not limits
The essential features of this case processed.In an embodiment, the first elastic pinching member 32 can be in the second face 23b of the first power device 23
After neighbour is placed in the first insulating heat-conductive piece 31, then the first elastic pinching member 32 is locked in shell 10, makes the first elastic pinching member 32 by pressure
The second face 23b of first face 23a of the first power device 23, the first power device 23 fit in the first insulating heat-conductive piece 31, into
And it accommodates the first power device 23 and is clamped on accommodating space 33, and the first power device 23 passes through the first insulating heat-conductive piece 31
With the first heat dissipation wall 11 and 12 thermal coupling of cooling liquid flowing channel.On the other hand, it is electrically connected to the transformer module 24 of mainboard 20 also
It can be placed in the first accommodation groove 13 in advance, in this present embodiment, when transformer module 24 is placed in the first accommodation groove 13, first holds
One can be more added for example but be not only restricted to thermal plastic insulation (not shown) by setting in slot 13, to enhance transformer module 24 by first
Accommodation groove 13 is thermally couple to the efficiency of cooling liquid flowing channel 12.
Then, as shown in fig. 7, second can be also placed in advance by being connected to the em filtering plate 40 of mainboard 20 and signal plate 50
Accommodation groove 14.Likewise, in this present embodiment, when em filtering plate 40 and signal plate 50 are placed in the second accommodation groove 14, the
Also one can be added in two accommodation grooves 14 for example but be not only restricted to thermal plastic insulation (not shown), to enhance em filtering plate 40 and letter
Number plate 50 is thermally couple to the efficiency of cooling liquid flowing channel 12 by the second accommodation groove 14.Significantly, since the power supply of this case
Conversion equipment 1 can for example framework be an one-way electric power conversion equipment, in response to aforementioned executions power supply convert and signal processing demand,
It, can be adjacent respectively by em filtering plate 40 and signal plate 50 when em filtering plate 40 and the accommodating of signal plate 50 to the second accommodation groove 14
First side L1 where power input 16 and signal transmission end 18 reduces power input 16 to em filtering plate 40
And signal transmission end 18 is to the distance of signal plate 50, and then promotes the power density of the package assembly 1 of power supply change-over device.
Then, as shown in figure 8, the first power device when the first surface 21 of mainboard 20 tends to shell 10, on mainboard 20
Part 23 and the second power device 25 distinguish corresponding first heat dissipation wall 11 and radiate wall 15 with second, and mainboard 20 for example, by but not
It is limited to a bolt and is locked on shell 10.In this present embodiment, the second elastic pinching member 35 of radiating module 30 is (referring to figure
2) it can for example be set between the first surface 21 of mainboard 20 and the first face 25a of the second power device 25, in the of mainboard 20
When one surface 21 tends to shell 10, first face 25a of second elastic pinching member 35 by pressing the second power device 25, the second power device
25 the second face 25b fits in the second insulating heat-conductive piece 34 so that the second power device 25 by the second insulating heat-conductive piece 34 with
Second heat dissipation wall 15 and 12 thermal coupling of cooling liquid flowing channel.In addition, if the first elastic pinching member 32 be fixed in advance shell 10 and with
First insulating heat-conductive piece 31 forms accommodating space 33, then when the first surface 21 of mainboard 20 tends to shell 10, the first power device
Part 23, which is planted, enters accommodating space 33, makes first face 23a of first elastic pinching member 32 by pressing the first power device 23, the first power
Second face 23b of device 23 fits in the first insulating heat-conductive piece 31, so that the first power device 23 passes through the first insulating heat-conductive piece
31 and the first heat dissipation wall 11 and 12 thermal coupling of cooling liquid flowing channel.Power supply change-over device 1 after assembling is i.e. as shown in Figure 9.
It is worth noting that, in this present embodiment, the first elastic pinching member 32 of radiating module 30 is relative to the first heat dissipation
Wall 11 and framework are adjacent to the peripheral side of mainboard 20 in the peripheral side of shell 10, and the first power device 23, then the first elastic clip
Part 32, which then can recycle e.g. after 20 assembling structure of mainboard is on casing 10 but be not only restricted to a bolt, is locked in shell 10,
Fit in first face 23a of first elastic pinching member 32 by pressing the first power device 23, the second face 23b of the first power device 23
First insulating heat-conductive piece 31, so that the first power device 23 passes through the first insulating heat-conductive piece 31 and the first heat dissipation wall 11 and cooling
12 thermal coupling of liquid stream road.Certainly, the first elastic pinching member 32 also can be preset in the peripheral side of shell 10, exist in 20 framework of mainboard
After on casing 10, then adjust the elastic force of first face 23a of first elastic pinching member 32 by pressing the first power device 23.It should be emphasized that
Be, the first elastic pinching member 32 compress the pattern of the first face 23a of the first power device 23 and its be assembled in shell 10 sequence it is equal
Visual actual demand and modulation, but the essential feature of this unrestricted this case technology, it is any can opposite first heat dissipation wall 11 form appearance
33 and the elastic pinching member of elastic force is maintained to may be applicable to the package assembly of this case between emptying, this case is not limited to this.Yu Ben
In embodiment, power supply change-over device 1 more may include an outer cover 60 (referring to Fig. 1), be set on shell 10 and mainboard 20, and cover
It is placed on the second surface 22 of mainboard 20, to protection power source conversion equipment 1.
Specifically, in this present embodiment, when 1 framework of power supply change-over device is, for example, an one-way electric power conversion equipment,
It executes AC power source and is unidirectionally converted to the major heat of high voltage direct current subject job and generate component, as in the present embodiment on mainboard 20
The first power device 23, the second power device 25 with transformer module 24 and em filtering plate 40 with shortest distance heat
It is coupled to the cooling liquid flowing channel 12 of shell 10.Wherein for the first power device 23 and the second power device that can generate amount of heat
Part 25, more e.g. directly cover that copper (DBC, Direct Bond Copper) ceramic substrate is thermally couple to shell 10 by one the
One heat dissipation wall 11 and the second heat dissipation wall 15, to reduce interface resistance.Better, the second face 23b of the first power device 23 and
Between one insulating heat-conductive piece 31, between the first insulating heat-conductive piece 31 and the first heat dissipation wall 11, the second face of the second power device 25
Between 25b and the second insulating heat-conductive piece 34 and between the second insulating heat-conductive piece 34 and the second heat dissipation wall 15 more can for example, by but
It is not only restricted to the hot interfaces materials such as a heat-conducting glue 36 (referring to Fig. 6) and is bonded, further decrease the interface in heat loss approach
Thermal resistance.On the other hand, the first accommodation groove 13 and second of accommodating transformer module 24 and em filtering plate 40 and signal plate 50 holds
One can be more added for example but be not only restricted to thermal plastic insulation (not shown) by setting in slot 14, be filtered with enhancing transformer module 24 and electromagnetism
Wave plate 40 is thermally couple to the efficiency of cooling liquid flowing channel 12.It is worth noting that, this case power supply change-over device 1 is in addition to considering with most short
Major heat generation component is thermally couple to outside cooling liquid flowing channel 12 by distance, and the first heat dissipation heat dissipation wall 15, first of wall 11, second holds
Lay the electrical connection for more considering each main composition inter-module in the position for setting slot 13 and the second accommodation groove 14.Such as implement
The first power device 23 and the second power device 25 are that framework is to secondary side needed for executing one-way electric power conversion respectively in example
Side power device and primary side side power device.By the first power device 23 and the institute of the second power device 25 corresponding the
One heat dissipation wall 11 and the second heat dissipation wall 15, but the first heat dissipation wall 11 and the second heat dissipation wall 15 are adjacent to the first accommodation groove 13 more respectively
Opposite two side walls, then the first power device 23 and the second power device 25 can be adjacent to 24 whereabouts of transformer module,
Distance is connected to reduce secondary side and primary side side power device to transformer, resistance is connected in favor of reducing, avoids interfering, together
When raising efficiency.Likewise, in response to power supply change-over device 1 in executing one-way electric power conversion and signal processing demand, by electromagnetism
Filter band 40 and signal plate 50 are adjacent to the first side L1 where power input 16 and signal transmission end 18, can reduce power supply
Input terminal 16 is also conducive to promote power supply conversion to em filtering plate 40 and signal transmission end 18 to the distance that connects of signal plate 50
The efficiency of device 1.Furthermore being connected to the liquid input tube 12a and liquid output pipe 12g of cooling liquid flowing channel 12 more can be relative to
The first side L1 at place and be set to another second side L2, make power supply change-over device 1 sufficiently integration using space, reduce it is whole
Body volume reaches the dual purpose of hoisting power density and the efficiency that radiates.But it is emphasized that aforementioned power source conversion equipment 1
In, between shell 10 and mainboard 20 each constituent component lay the visual actual demand of optimization and adjust variation, this case not by
It is limited to the combination of previous embodiment illustration, and is not repeated here.
In above-described embodiment, by taking 1 framework of power supply change-over device is an one-way electric power conversion equipment as an example.In other embodiments
In, power supply change-over device 1 can also framework be a two-way power supply change-over device, with realizing between AC power source and high-voltage DC power supply
Mutual conversion.
In conclusion this case provides a kind of package assembly of power supply change-over device.It is laid by optimization each constituent component,
Keep its assembly fixation simple and reliable, while enhancing the heat-sinking capability of each constituent component, and reduce the entirety of power supply change-over device
Volume and the overall power density for promoting power supply change-over device.In addition, thermally conductive exhausted by penetrating the power device on mainboard
The radiating surface of shell is fixed and conformed to the radiating module of edge, and each component that constitutes is set between mainboard and shell and is placed in shell
The accommodation groove of body, the radiating surface and accommodation groove of shell are thermally coupled in the cooling liquid flowing channel of shell simultaneously, to reduce interface resistance, letter
Disguise distribution structure, and then achievees the purpose that reduce cost, promotes package assembly reliability and heat-sinking capability.
This case appointed as those skilled in the art apply craftsman think and be it is all as modify, it is so neither de- such as the appended claims
The range to be protected.
Claims (21)
1. a kind of power supply change-over device characterized by comprising
One shell, including at least one first heat dissipation wall and a cooling liquid flowing channel, wherein it is cold to be thermally couple to this for the first heat dissipation wall
But liquid stream road；
One mainboard, framework is on the shell, and wherein the mainboard includes a first surface and at least one first power device,
In the first surface be set on the mainboard towards the shell, first power device, and including one first face and one second
Face；
One em filtering plate, framework are electrically connected to the mainboard on the shell；
One signal plate, framework are electrically connected to the mainboard on the shell；And
One radiating module, including at least one first insulating heat-conductive piece and at least one first elastic pinching member, wherein first insulation
Thermally conductive sheet fits in the corresponding first heat dissipation wall, which is fixed on the shell and leads relative to first insulation
Backing so that first elastic pinching member and the first insulating heat-conductive horse are configured to an accommodating space, in the mainboard this first
Surface tends to the shell and first power device is clamped between first elastic pinching member and the first insulating heat-conductive piece
When the accommodating space, first face of first elastic pinching member by pressing first power device, first power device this
Two face pastes are together in the first insulating heat-conductive piece, so that first power device passes through the first insulating heat-conductive piece and first heat dissipation
Wall and the cooling liquid flowing channel thermal coupling.
2. power supply change-over device according to claim 1, which is characterized in that first power device is set to first table
Face, and the em filtering plate and the signal plate are all set between the first surface of the mainboard and shell.
3. power supply change-over device according to claim 1, which is characterized in that the shell includes one first accommodation groove and one
Second accommodation groove is thermally couple to the cooling liquid flowing channel, and wherein the second accommodating slot part is located on first accommodation groove.
4. power supply change-over device according to claim 3, which is characterized in that the mainboard further includes a transformer module, electricity
It is connected to the mainboard, and is set between the first surface of the mainboard and the shell.
5. power supply change-over device according to claim 4, which is characterized in that the transformer module is placed in first accommodating
Slot, the em filtering plate and the signal plate are placed in second accommodation groove.
6. according to power supply change-over device described in claim 3,4 or 5, which is characterized in that the first heat dissipation wall be adjacent to this
The side wall of one accommodation groove or second accommodation groove.
7. power supply change-over device according to claim 3, which is characterized in that the cooling liquid flowing channel include an at least channel with
At least one narrow face.
8. power supply change-over device according to claim 7, which is characterized in that an at least channel be thermally couple to this first dissipate
The side wall of hot wall, the side wall of first accommodation groove or second accommodation groove.
9. power supply change-over device according to claim 7, which is characterized in that at least one narrow face is thermally couple to first appearance
Set the bottom surface of slot or the bottom surface of second accommodation groove.
10. power supply change-over device according to claim 1, which is characterized in that the mainboard further includes at least one second power
Device is set to the first surface, which includes one first face and one second face, and wherein the shell further includes
At least one second heat dissipation wall, first surface towards the mainboard, and be thermally couple to the cooling liquid flowing channel, the wherein radiating module
It further include at least one second insulating heat-conductive piece and at least one second elastic pinching member, which fits in corresponding
The second heat dissipation wall, second elastic pinching member are set to the first surface of the mainboard and first face of second power device
Between and relative to the second insulating heat-conductive piece, when the first surface of the mainboard tends to the shell, second elastic pinching member
First face by pressing second power device, second face paste of second power device together in the second insulating heat-conductive piece,
So that second power device passes through the second insulating heat-conductive piece and the second heat dissipation wall and the cooling liquid flowing channel thermal coupling.
11. power supply change-over device according to claim 10, which is characterized in that the shell includes one first accommodation groove,
In this second heat dissipation wall relative to this at least one first heat dissipation wall, this first heat dissipation wall and this second heat dissipation wall be adjacent to this respectively
Two opposing sidewalls of the first accommodation groove.
12. power supply change-over device described in 0 or 11 according to claim 1, which is characterized in that second power device is relative to this
Mainboard lies low setting.
13. power supply change-over device according to claim 1, which is characterized in that first power device is relative to the mainboard
It is vertically arranged.
14. power supply change-over device according to claim 1, which is characterized in that the power supply change-over device includes that a power supply is defeated
Enter end, a power output end and a signal transmission end, is set to a first side of the shell, the power input is by being somebody's turn to do
Em filtering plate is electrically connected to the mainboard, which is electrically connected to the mainboard, which passes through the signal plate
It is electrically connected to the mainboard.
15. power supply change-over device according to claim 14, which is characterized in that the signal plate be adjacent to the shell this
A side.
16. power supply change-over device according to claim 14, which is characterized in that the shell include a liquid input tube and
One liquid output pipe, which is connected to the liquid output pipe by the cooling liquid flowing channel, and is set to the shell
One second side, wherein the first side and the second side are relative to each other.
17. power supply change-over device according to claim 1, which is characterized in that first power device is adjacent to the mainboard
Peripheral side.
18. power supply change-over device according to claim 1, which is characterized in that the first insulating heat-conductive piece directly covers for one
Copper ceramic substrate.
19. power supply change-over device according to claim 1, which is characterized in that the radiating module further includes a heat-conducting glue, if
It is placed between the first insulating heat-conductive piece and the first heat dissipation wall.
20. power supply change-over device according to claim 1, which is characterized in that at least one first power device is integrated for this
A power module.
21. power supply change-over device according to claim 10, which is characterized in that at least one second power device is integrated for this
A power module.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810118950.2A CN109861556B (en) | 2018-02-06 | 2018-02-06 | Power conversion device |
| TW107112126A TWI713831B (en) | 2018-02-06 | 2018-04-09 | Power conversion device |
| US16/239,554 US10483840B2 (en) | 2018-02-06 | 2019-01-04 | Power conversion apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810118950.2A CN109861556B (en) | 2018-02-06 | 2018-02-06 | Power conversion device |
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| Publication Number | Publication Date |
|---|---|
| CN109861556A true CN109861556A (en) | 2019-06-07 |
| CN109861556B CN109861556B (en) | 2025-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810118950.2A Active CN109861556B (en) | 2018-02-06 | 2018-02-06 | Power conversion device |
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| Country | Link |
|---|---|
| US (1) | US10483840B2 (en) |
| CN (1) | CN109861556B (en) |
| TW (1) | TWI713831B (en) |
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| CN112074179A (en) * | 2020-09-30 | 2020-12-11 | 深圳威迈斯新能源股份有限公司 | Heat radiation structure and vehicle-mounted power supply |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225552A (en) * | 2020-03-27 | 2020-06-02 | 深圳威迈斯新能源股份有限公司 | Heat dissipation structure and installation method thereof |
| CN112074179A (en) * | 2020-09-30 | 2020-12-11 | 深圳威迈斯新能源股份有限公司 | Heat radiation structure and vehicle-mounted power supply |
| CN116133332A (en) * | 2022-12-31 | 2023-05-16 | 无锡志东机电设备有限公司 | A T-shaped circuit board controller assembly structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201935178A (en) | 2019-09-01 |
| TWI713831B (en) | 2020-12-21 |
| US10483840B2 (en) | 2019-11-19 |
| CN109861556B (en) | 2025-03-04 |
| US20190245430A1 (en) | 2019-08-08 |
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