CN109860255A - The preparation method of flexible display panels - Google Patents
The preparation method of flexible display panels Download PDFInfo
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- CN109860255A CN109860255A CN201910125772.0A CN201910125772A CN109860255A CN 109860255 A CN109860255 A CN 109860255A CN 201910125772 A CN201910125772 A CN 201910125772A CN 109860255 A CN109860255 A CN 109860255A
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Abstract
The present invention relates to a kind of preparation methods of flexible display panels, including luminescent layer making step, protective film to paste step, the first cutting step, the second cutting step, non-bonding area strip step, bonding step and bonding area strip step.The hard substrate that the present invention passes through the reservation bonding area size in the bonding process production of Flexible Displays, so that flexible substrates are in bonding because of the presence of the higher hard substrate of hardness, the stability in bonding region is improved, the characteristic that qualification rate improves, device is shown is uniform, improves Flexible Displays quality to crimp when making bonding process.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of preparation methods of flexible display panels.
Background technique
Organic EL display panel (OrganicElectroluminesenceDisplay, OLED) is relative to liquid crystal
Display screen (LiquidCrystalDisplay, LCD) has self-luminous, frivolous, wide viewing angle, high brightness, high contrast, low driving
The advantages that voltage and quick response, it is considered to be next-generation display technology, i.e. Flexible Displays (FlexibleDisplay) technology.
Flexible Displays (FlexibleDisplay) technology is developed rapidly in recent years, since Flexible Displays are frivolous with its
Change, narrow frame, shock resistance be strong, flexible, deformable, can be customized, easy to carry the advantages that, greatly improves the display of screen
Quality.And touch function is integrated into OLED display screen, better user interface can be provided for OLED display screen, had
There is good application prospect.Wherein flexible touch-control OLED display screen, due to the characteristics such as its low-power consumption, flexible, durable, to can wear
Wear formula equipment application will bring far-reaching influence, at present flexibility touch-control OLED display screen with personal intelligent terminal continuous infiltration
There is certain application in markets such as smart phone, wearing and household electrical appliances thoroughly.
With the development of technology, flexible display panels are more and more widely used, due to flexible display panels
Flexible substrates easily deform, therefore in the preparation process of flexible display panels, positioning, carrying, storage of flexible substrates etc. are equal
It is relatively difficult, therefore, usually flexible material layer is now formed on the transparent substrate, successively be formed on the flexible material layer later
Buffer layer and various display structures (by taking flexible organic LED display panel as an example, including thin film transistor (TFT), data line,
The structures such as grid line, capacitor, anode, organic luminous layer, cathode, pixel confining layer), then shone with ultraviolet laser from transparent substrate side
Flexible material layer is penetrated, the adhesive force between flexible material layer and transparent substrate is reduced, so that carrying the soft of various display structures
Property material layer (i.e. laser lift-off) is removed from transparent substrate, formed flexible display panels.
During manufacturing plasma display module, the interconnection being related between display screen electrode terminal and flexible circuit,
The interconnection between interconnection and flexible circuit between flexible circuit board and rigid circuit board.It is widely used in these connections
Anisotropically conducting adhesive, placing it in needs between parts to be joined, be then formed portion to its pressurized, heated
Reliable and stable machinery, electrical connection between part.This process is referred to as bonding in external magazine and product description
(Bonding), according to its Track character, we are also referred to as thermocompression bonding or hot pressing.
But, the backboard process of Flexible Displays is difficult compatible with existing mould group technique, carries out bonding on a flexible substrate
Technique, development difficulty are very big.
There are two types of modes for now common Flexible Displays bonding process:
1) hard substrate with flexible substrates is cut into small pieces, then carries out bonding production on small pieces hard substrate,
It finally takes flexible substrates off and carries out back side pad pasting and function membrane process；
2) flexible substrates on big plate are taken off and is separated with hard substrate, carry out back side pad pasting on a flexible substrate, then
Small pieces are cut into, and carry out circuit bonding in small pieces flexible substrates after being cut into small pieces, finally stick back side functional membrane；
Currently, following steps are usually used in the preparation of flexible display, firstly, in the monolith being arranged on hard substrate
TFT (thin film transistor (TFT)) element, OLED (Organic Light Emitting Diode) luminescent layer and thin-film package are completed on flexible substrate substrate
The production of layer；Then, paste one layer of upper protective film with low viscous force in thin-film encapsulation layer, the protective film mainly for the protection of
Thin-film encapsulation layer improves packaging effect to protect it from the scratch in subsequent technique to greatest extent；Later, by above-mentioned production
The Flexible Displays component of completion is separated from hard substrate, is pasted on Flexible Displays component on the parting surface of hard substrate
Cover lower protective film；Then, Flexible Displays component is cut into display panel one by one, by bonding area in each display panel
Upper protective film removes, and carries out panel test and subsequent bonding process to each display panel；Finally, each is shown
Upper protective film on panel removes, and pastes the upper functional membrane of needs, such as barrierfilm (barrier layer), pol (polaroid)
Etc., each display panel for completing above-mentioned steps is flexible display.
It is on hard substrate or in flexible substrates that the maximum difference of two kinds of production processes, which is exactly bonding preparation,.
Wherein the disadvantage of the second way is exactly in display component bonding manufacturing process, to need accurate position
With flatness, but the thermal expansion coefficient of a variety of materials when bonding, force deformation be different and flexible substrates out-of-flatness, causes work
Skill error is larger, unevenly influences Flexible Displays quality so as to cause the characteristic that the bad higher, device of bonding is shown.
Therefore, a kind of preparation method of convenient and practical flexible display panels is needed at present.
Summary of the invention
For bonding problem existing for Flexible Displays, a kind of preparation method of new flexible display panels of the embodiment of the present invention
With the preparation method of flexible display panels, two kinds of common at present Flexible Displays bonding process are combined, can solve
The bad problem that bonding process occurs directly is made in flexible substrates, qualification rate raising is crimped when making bonding, device is shown
Characteristic uniformly, improve Flexible Displays quality.
The present invention provides a kind of preparation method of flexible display panels, the packet of the preparation method of the flexible display panels
Include following steps:
S1, luminescent layer making step, provide a hard substrate, and a flexible luminescent layer is prepared on the hard substrate；Institute
Stating flexible luminescent layer includes a flexible substrates, is pasted to the hard substrate；The flexible substrates are preset with an at least bonding and draw
Lead area；
S2, protective film paste step, paste protective film far from the side of the hard substrate in the flexible luminescent layer；
The flexible luminescent layer and the hard substrate are cut into more than two panel blocks by S3, the first cutting step,
Each panel block includes an at least bonding boot section；
The hard substrate of each panel block is cut into bonding area and two, non-bonding area by S4, the second cutting step
Point, cutting line is corresponding with the edge line of an at least bonding boot section；
S5, non-bonding area strip step, by each non-bonding area from the sur-face peeling of the flexible substrates；
S6, bonding step, by side of at least bonding element bonding to the panel block far from the hard substrate, often
One bonding element is correspondingly connected with a bonding boot section；
S7, bonding area strip step are obtained flexible aobvious by each bonding area from the sur-face peeling of the flexible substrates
Show panel.
Further, in other embodiments, the preparation method of the flexible display panels further include: S8, functional membrane
Step is pasted, pastes functional membrane on a surface of the protective film.
Luminescent layer making step, specifically comprises the following steps: described in step S3
S101, a hard substrate is provided, criss-cross groove is etched in the one side of the hard substrate；
S102, it is applied to the reeded side of hard substrate using coating or by heat-resistant adhesive by the way of spraying, formation one is viscous
Close layer；
S103, flexible substrates are pasted to the adhesive layer, obtain the hard substrate for posting flexible substrates；
S104, Array plate, OLED element and TFE layer are set gradually on the hard substrate for post flexible substrates, then carry out
Lamination obtains the flexible luminescent layer of one be attached on the hard substrate.
The preparation method of the new flexible display panels of one kind provided in an embodiment of the present invention, passes through the bonding in Flexible Displays
Retain the hard substrate of bonding area size when technique makes, so that flexible substrates are subsequent crimping (carrying out bonding with circuit element)
Because of the presence of the higher hard substrate of hardness among process, the stability in bonding region is improved, route is slowed down and occurs not
Good, to crimp when making bonding process, the characteristic that qualification rate improves, device is shown is uniform, improves Flexible Displays quality.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the flow chart of the preparation method of flexible display panels described in one embodiment of the invention；
Fig. 2 is the flow chart of luminescent layer making step described in one embodiment of the invention；
Fig. 3 is in the first cutting step described in the embodiment of the present invention, flexible luminescent layer and hard substrate cut after knot
Structure schematic diagram；
Fig. 4 is that the structure in the second cutting step described in the embodiment of the present invention, after the hard substrate of panel block is cut is shown
It is intended to；
Fig. 5 is in bonding step described in the embodiment of the present invention, and panel block is by the stepped construction schematic diagram after bonding；
Fig. 6 is that functional membrane described in the embodiment of the present invention pastes in step, the stepped construction schematic diagram of flexible display panels.
Wherein:
1, hard substrate, 2, adhesive layer, 3, flexible substrates,
4, Array plate, 5, OLED element, 6, TFE layers,
7, protective film, 8, bonding element, 9, functional membrane,
10, flexible luminescent layer, 11, bonding boot section, 12, panel block,
13, bonding area, 14, non-bonding area.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
Term used in description of the invention is only used to describe particular implementation, and is not intended to show of the invention
Concept.Unless have clearly different meanings in context, it is otherwise, used in the singular to express the table for covering plural form
It reaches.In the description of the present invention, it should be appreciated that there are this hairs for the terms meant for illustration such as " comprising ", " having " and " containing "
A possibility that feature for being disclosed in bright specification, number, step, movement or combinations thereof, and be not intended to exclude may be present or can
A possibility that adding other one or more features, number, step, movement or combinations thereof.Same reference numerals in attached drawing refer to
For same section.
The embodiment of the present invention provides the preparation method of the new flexible display panels of one kind and the preparation side of flexible display panels
Method.It will be described in detail respectively below.
As shown in Figure 1, in the preferred embodiment of the present invention, providing a kind of preparation side of new flexible display panels
Method includes the following steps S1~S8.
S1, luminescent layer making step provide a hard substrate 1, and a flexible luminescent layer is prepared on the hard substrate 1
10；Flexible luminescent layer 10 includes a flexible substrates 3, is pasted to hard substrate 1；Flexible substrates 3 are preset with the guidance of an at least bonding
Area 11.
As shown in Fig. 2, the luminescent layer making step specifically comprises the following steps S101~S104.
S101, etching step provide a hard substrate 1, etch in length and breadth in the one side (such as upper surface) of hard substrate 1
Staggered groove (not shown)；
Heat-resistant adhesive is applied to the reeded side of hard substrate 1 by the way of coating or spraying by S102, glue application step
(upper surface of hard substrate 1) forms an adhesive layer 2；
S103, substrate attach step, and flexible substrates 3 are pasted to adhesive layer 2 (upper surface of hard substrate 1), are pasted
The hard substrate of flexible substrate；
S104, lamination step are set gradually in the side (above flexible substrates 3) that hard substrate 1 posts flexible substrates 3
Array plate 4, OLED element 5 and TFE layer 6, then be laminated, obtain the flexible luminescent layer 10 of one be attached on hard substrate 1.
In the present embodiment, hard substrate 1 can be glass substrate, silicon wafer, metal, quartz base plate, quartz wafer or hard
Film etc..In embodiments of the present invention, the preferred glass substrate of transparent substrate, because entire treatment process be all 600 degrees Celsius with
Lower completion, therefore general glass substrate is all applicable.
In the present embodiment, the heat-resistant adhesive of adhesive layer 2 is UV glue.Prior art is to the hard substrate 1 and flexible luminescent layer
10 be laser-cut into before the independent face plate 12 of monolithic, and hard substrate 1 is still covered in the flexible base of flexible luminescent layer 10
On bottom 3.Firstly, it is necessary to stick POL polaroid (not shown) in flexible luminescent layer 10, core will be driven followed by packaging technology
Piece (not shown) and circuit board (not shown) are encapsulated on the panel of well cutting, then by laser scanning, by hard substrate 1 from
It peels off to form display panel product in flexible substrates 3.Due in radium-shine cutting process in the cut edge of flexible substrates 3
Caused micro-crack, the width of the hallrcuts usually in 20~40um or so, and then make hard substrate 1 from flexible substrates 3 into
During row removing, tension force effect, which is easy to extend micro-crack caused by radium-shine cutting, to be increased, and in turn results in Flexible Displays
The risk of the damage of panel itself route and TFE encapsulation.Therefore, coating UV glue can carry out reinforcement to the edge of flexible substrates 3,
The intensity for further increasing 3 edge of flexible substrates after flexible display panels are cut, is reduced to the probability that slight crack extends internally, and is promoted
Yields.
The panel of flexible display panels must be flexible substrates 3, since flexible substrates 3 easily deform, aobvious
Show in the preparation process of substrate, need to generate flexible material layer on hard substrate 1, then the successively shape on flexible material layer again
At various display structures.Specifically, on hard substrate 1 carry out polyimides (Polyimide) be coated and dried and solidify with
Form flexible material layer, i.e. flexible substrates 3.In addition, one layer of yellow light can be carried out after hard substrate 1 carries out initialization cleaning
Organic light blockage coating, such as: DL-100-C, or other coatings are carried out to form interim buffer layer on hard substrate 1, with protection
Flexible substrates 3 are not influenced by hard substrate 1.
Flexible substrates 3 can be polyether sulfone (PES), polyacrylate (PAR), polyetherimide (PEI), poly- naphthalenedicarboxylic acid
Glycol ester (PEN), polyphenylene sulfide (PPS), polyallyl (Polyallylate), gathers at polyethylene terephthalate (PET)
Imide resin (PI), polycarbonate (PC), Triafol T (TAC), cellulose acetate propionate (CAP) or acrylate
One or more of (Acrylamide) the organic transparent substrate of insulation that combination is constituted.Since polyimides is comprehensive
One of optimal high-molecular organic material of energy, so that flexible material has good optics, resistance toization and the performances such as oxygen that block water,
Therefore, preferred polyimides material in the present embodiment.
In the present embodiment, bonding boot section (BondingLead) 11 is every during bonding for positioning bonding area range
One bonding element is correspondingly connected with a bonding boot section 11.
S2, protective film paste step, in side of the flexible luminescent layer 10 far from hard substrate 1 (above flexible luminescent layer 10)
Paste protective film 7.
Protective film 7 can effectively stop the influence of bulky grain on hard substrate 1, reduce the flexible base of flexible luminescent layer 10
3 protrusion of bottom and depression problem, and then the success rate that flexible substrates 3 are coated with is promoted, which is also used to protect flexible luminescent layer
10 to protect it from the scratch in subsequent technique, and then improves packaging effect to greatest extent.
Flexible luminescent layer 10 and hard substrate 1 are cut into more than two panel blocks 12, often by S3, the first cutting step
One panel block 12 includes an at least bonding boot section 11.
In the first cutting step, flexible luminescent layer 10 and hard substrate 1 are all cut off；The cutting side of first cutting
To vertical with 1 upper surface of hard substrate or lower surface.All film layers are all cut off, and more than two panel blocks 12 are obtained, each
Panel block 12 includes an at least bonding boot section 11.
As shown in figure 3, the arranging in array format after dicing of panel block 12, single 12 array format of panel block and bonding
11 array format of boot section is identical.Single panel block 12 arranging in array format after dicing, is convenient for subsequent lots processed,
Working hour is saved, production efficiency is improved, to reduce production cost.
S4, the second cutting step, as shown in figure 4, the hard substrate of each panel block is cut into bonding area and non-
Bonding area two parts.In the second cutting process, the corresponding position in bonding boot section 11 first is found in the lower surface of hard substrate 1
It sets, the hard substrate 1 of a panel block 12 is cut from the bottom up using the hard substrate lower surface as cut surface, cut
Line is corresponding with the edge line of an at least bonding boot section 11 in the flexible substrates of the panel block 12, what any cutting line surrounded
Region forms a bonding area 13, shape, size, shape, the size, position of position and a bonding boot section 11 in each bonding area 13
It sets corresponding；Part in the hard substrate of each panel block 12 other than bonding area 13 is non-bonding area 14.It is cut second
During cutting, hard substrate is completely cut through, while the flexible substrates for being close to hard substrate cannot be injured again.
S5, non-14 strip step of bonding area, using laser radiation method by the non-bonding area 14 of each panel block 12 from flexibility
It removes the lower surface of substrate 3.
The laser radiation method is in a heated condition according to laser irradiation path, using ultraviolet from the hard base
1 side of plate irradiation adhesive layer 2, which reacts to lose bonding force and be changed into, melts state adhesive layer, so that flexible substrates 3 and hard substrate 1
Separation.
The specific steps of the removing include: under 100 degrees Celsius of heating condition, using the ultraviolet light irradiation institute
The interface of hard substrate 1 and the flexible substrates 3 is stated, so that photo-induced dimerization reaction occurs for the adhesive layer 2, thus described in realizing
The separation of hard substrate 1 and the flexible substrates 3；Wherein, the wavelength of the ultraviolet is 365 nanometers, the ultraviolet
Illumination be 85 megawatts every square centimeter to 100 megawatts it is every square centimeter, the irradiation time be 30 seconds.
S6, bonding step, side (the i.e. panel by 8 bonding of an at least bonding element to panel block 12 far from hard substrate
The upper surface of block) so that each bonding element 8 is correspondingly connected with a bonding boot section 11, the electronic device inside panel block 12
It is connected to a bonding element 8 by conducting particles ACF, bonding element 8 includes that driving chip (not shown) and circuit board (are schemed not
Show), thus panel block 12 obtains image data and control signal, to show content on panel.
As shown in figure 5, the stepped construction of the panel block after step S6 bonding, sequentially consists of hard substrate 1, bonding
Layer 2, flexible substrates 3, Array plate 4, OLED element 5, TFE layer 6, protective film 7 and bonding element 8.
The position of each bonding element 8 is corresponding with the position of a bonding boot section 11, the nation with a panel block 12
It is corresponding to determine 13 position of area.By retaining the hard substrate 1 of 13 size of bonding area in the bonding process production of Flexible Displays, make
Flexible substrates 3 are obtained among subsequent crimping (carrying out bonding with circuit element) process because the higher hard substrate 1 of hardness being deposited
Enable hard substrate 1 to play good supporting role in bonding by the structure of improvement hard substrate 1, improves nation
Determine the stability in region, the thermal expansion coefficient of a variety of materials, force deformation are different when reducing bonding and flexible substrates 3 are uneven
Whole, to crimp when making bonding process, the characteristic that qualification rate improves, device is shown is uniform, improves Flexible Displays quality.
S7,13 strip step of bonding area, using laser radiation method by the bonding area 13 of each panel block 12 from flexible substrates 3
Lower surface removing, obtain flexible display panels.The method of the removing is laser radiation method, the method phase with removing described in S5
Together, this will not be repeated here.
S8, functional membrane paste step, paste functional membrane 9 in the upper surface of protective film 7, and function may be implemented and show and man-machine
Interaction.
As shown in fig. 6, the stepped construction of the flexible display panels of the present embodiment, sequentially consist of flexible substrates 3,
Array plate 4, OLED element 5, TFE layer 6, protective film 7, bonding element 8 and functional membrane 9.
In conclusion in technical solution provided by the embodiments of the present application, due to leading to during preparing flexible display panels
The hard substrate 1 for retaining 13 size of bonding area in the bonding process production of Flexible Displays is crossed, so that flexible substrates 3 are in subsequent pressure
It connects and (carries out bonding with circuit element) among process because the presence of the higher hard substrate 1 of hardness, improves the steady of bonding region
It is qualitative, the bad of route generation is slowed down, so that it is equal to crimp the characteristic that qualification rate improves, device is shown when making bonding process
Even, raising Flexible Displays quality, to reduce the cost of flexible product.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
The embodiment of the present invention has been described in detail above.It should be understood that illustrative embodiments as described herein should be only
Be considered as it is descriptive, be used to help understand method and its core concept of the invention, and be not intended to restrict the invention.?
The description of features or aspect should be usually considered suitable for other exemplary embodiments in each illustrative embodiments
Similar features or aspects.Although reference example embodiment describes the present invention, can suggest those skilled in the art into
Row various change and change.The invention is intended to cover these variations and change in the scope of the appended claims.
Claims (10)
1. a kind of preparation method of flexible display panels, which comprises the steps of:
S1, luminescent layer making step, provide a hard substrate, and a flexible luminescent layer is prepared on the hard substrate；It is described soft
Property luminescent layer include a flexible substrates, be pasted to the hard substrate；The flexible substrates are preset with an at least bonding boot section；
S2, protective film paste step, paste protective film far from the side of the hard substrate in the flexible luminescent layer；
The flexible luminescent layer and the hard substrate are cut into more than two panel blocks by S3, the first cutting step, each
Panel block includes an at least bonding boot section；
The hard substrate of each panel block is cut into bonding area and non-bonding area two parts by S4, the second cutting step,
Cutting line is corresponding with the edge line of an at least bonding boot section；
S5, non-bonding area strip step, by each non-bonding area from the sur-face peeling of the flexible substrates；
S6, bonding step, by side of at least bonding element bonding to the panel block far from the hard substrate, Mei Yibang
Determine element to be correspondingly connected with a bonding boot section；
S7, bonding area strip step obtain Flexible Displays face by each bonding area from the sur-face peeling of the flexible substrates
Plate.
2. the preparation method of flexible display panels according to claim 1 characterized by comprising
S8, functional membrane paste step, paste functional membrane on a surface of the protective film.
3. the preparation method of flexible display panels according to claim 1, which is characterized in that
The luminescent layer making step, specifically comprises the following steps:
S101, etching step provide a hard substrate, and criss-cross groove is etched in the one side of the hard substrate；
Heat-resistant adhesive is applied to the reeded side of hard substrate by the way of coating or spraying, is formed by S102, glue application step
One adhesive layer；
S103, substrate attach step, and flexible substrates are pasted to the adhesive layer, obtain the hard substrate for posting flexible substrates；
S104, lamination step, the side that the hard substrate posts flexible substrates set gradually Array plate, OLED element and
TFE layers, then be laminated, obtain the flexible luminescent layer of one be attached on the hard substrate.
4. the preparation method of flexible display panels according to claim 1, which is characterized in that
In first cutting step,
The flexibility luminescent layer and the hard substrate are all cut off；And/or
The cut direction of first cutting is vertical with the hard substrate upper surface or lower surface.
5. the preparation method of flexible display panels according to claim 1, which is characterized in that
In second cutting step,
The shape in each bonding area, size, position are corresponding with the shape of a bonding boot section, size, position.
6. the preparation method of flexible display panels according to claim 1, which is characterized in that
In bonding area strip step,
Using laser radiation method by each bonding area from the sur-face peeling of the flexible substrates.
7. the preparation method of flexible display panels according to claim 1, which is characterized in that
In the bonding step,
Electronic device inside the panel block is electrically connected to a bonding element by conducting particles.
8. the preparation method of flexible display panels according to claim 1, which is characterized in that
In the non-bonding area strip step,
Using laser radiation method by each non-bonding area from the sur-face peeling of the flexible substrates.
9. the preparation method of flexible display panels according to claim 1, which is characterized in that the hard substrate is glass
Any one of substrate, silicon wafer, metal, quartz base plate, quartz wafer or ganoine thin film.
10. the preparation method of flexible display panels according to claim 1 or claim 7, which is characterized in that
The bonding element includes driving chip and circuit board.
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| CN201910125772.0A CN109860255A (en) | 2019-02-20 | 2019-02-20 | The preparation method of flexible display panels |
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| CN111458941A (en) * | 2020-04-27 | 2020-07-28 | 上海中航光电子有限公司 | Display module, manufacturing method thereof and display device |
| CN112634758A (en) * | 2020-12-18 | 2021-04-09 | 惠州视维新技术有限公司 | Packaging method and packaging system of flexible screen |
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| CN113629096A (en) * | 2021-07-26 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of spliced display screen and spliced display screen |
| CN114038779A (en) * | 2020-12-31 | 2022-02-11 | 广东聚华印刷显示技术有限公司 | Method for manufacturing flexible display device and peeling equipment |
| CN114141811A (en) * | 2021-11-30 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of spliced display screen and spliced display screen |
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Application publication date: 20190607 |