CN109855658A - Motor, encoder, magnetic degree sensor and preparation method thereof - Google Patents
Motor, encoder, magnetic degree sensor and preparation method thereof Download PDFInfo
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- CN109855658A CN109855658A CN201910369440.7A CN201910369440A CN109855658A CN 109855658 A CN109855658 A CN 109855658A CN 201910369440 A CN201910369440 A CN 201910369440A CN 109855658 A CN109855658 A CN 109855658A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000004020 conductor Substances 0.000 claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 30
- 239000006071 cream Substances 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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Abstract
The magnetic degree sensor and preparation method thereof that present invention discloses a kind of for motor, the magnetic degree sensor include chip body, package substrate substrate；The chip body, which hangs down, stands upright on the package substrate substrate；The chip body is equipped with several external connection cushion blocks, and each external connection cushion block is set to the same side of chip body；The chip body includes magnetic-resistance sensing unit, conductor element and chip basal body, and the magnetic-resistance sensing unit and conductor element are arranged in chip basal body plane, to sense the magnetic field with chip basal body plane parallel direction；A bar groove is opened on the package substrate substrate, the width of slot corresponds to the thickness of chip body, can longitudinally place the chip body just；The bottom of the chip body is set in the slot.The motor includes stator, rotor, magnetic mechanism and above-mentioned magnetic degree sensor.High-precision motor control can be achieved in the present invention, and reduces the installation complexity of sensor.
Description
Technical field
The invention belongs to magnetic sensor technologies fields, are related to a kind of magnetic degree sensor more particularly to a kind of magnetic resistance type magnetic
Angular transducer.
Background technique
Requirement with electromechanics trade to operation stability, reliability and working efficiency steps up, more and more nothings
Brushless motor and permanent magnet synchronous motor need high-precision control, this has driven the wilderness demand to Magnetic Sensor.Magnetic sensing
Device mainly passes through the magnetic direction or intensity of measurement motor inner magnet, determines driving current by control section, thus
Achieve the purpose that motor operates.
Carrying out control using Magnetic Sensor in motor at present has following this design: referring to FIG. 1, it is at present forever
The structural schematic diagram of magnetic-synchro motor, rotor portion have permanent magnet ring around shaft constitute, stator by silicon steel sheet stack at iron core
It is constituted with coil.One or more Hall sensor is installed in the inside of stator, rotor permanent magnet is sensed by Hall sensor
The pole polarity or magnetic field strength of body, and then the signal of Hall sensor is fed back to controller, then controller is adjusted
Electrical current direction, time and the size of stator coil reach the target of accurate control motor.
Since the sensitivity of Hall sensor is not high thus also not high to the measurement accuracy in magnetic field, it is difficult to provide high-precision
Vector controlled.In addition, the requirement to setting angle also brings certain be stranded to installation when installing multiple Hall sensors
It is difficult.Therefore, the more highly sensitive magnetic resistance type magnetic degree sensor of use, can provide high-precision control.In addition, it is only necessary to one
Magnetic resistance type magnetic degree sensor can directly measure the magnetic direction and rotor angle of rotor permanent magnet, to reduce peace
The complexity of dress.
It in electric motor control, needs to know position of the rotor relative to driving coil, has on rotor a pair of or several right
Permanent magnet, therefore common method is to measure rotor-position with magnetic degree sensor.In low speed and motor of less demanding
In, common means are to be set with three Hall sensors come location, but want to these three Hall sensor installation site accuracy
It asks high, when motor is smaller and smaller, can not place.In addition, the accuracy of Hall sensor is also not high enough, it is not able to satisfy height
The requirement of precision motor.
In encoder field, photoelectric encoder precision is high, but price is also high, and size is big, and common magnetic coder is installation
In spindle central, with a pair of of magnetic pole, precision is inadequate.
In view of this, nowadays there is an urgent need to design a kind of angular transducer, to overcome existing for existing angular transducer
Drawbacks described above.
Summary of the invention
The present invention provides a kind of motor, encoder, magnetic degree sensor and preparation method thereof, it can be achieved that high-precision motor
Control, and reduce the installation complexity of sensor.
In order to solve the above technical problems, according to an aspect of the present invention, adopting the following technical scheme that
A kind of magnetic degree sensor, the magnetic degree sensor include: chip body, package substrate substrate；The chip body
It hangs down and stands upright on the package substrate substrate.
As one embodiment of the present invention, the chip body is equipped with several external connection cushion blocks, each external connection
Cushion block is set to the same side of chip body.
As one embodiment of the present invention, the chip body includes magnetic-resistance sensing unit, conductor element and chip
Matrix, the magnetic-resistance sensing unit and conductor element are arranged in chip basal body plane, parallel with chip basal body plane to sense
The magnetic field in direction.
As one embodiment of the present invention, a bar groove is opened on the package substrate substrate, the width of slot corresponds to chip
The thickness of ontology can longitudinally place the chip body just；The bottom of the chip body is set in slot.
As one embodiment of the present invention, each external connection cushion block of the chip body is located in chip body
Portion, so that the packaging height of entire magnetic degree sensor is less than the sum of height and package substrate substrate thickness of chip body.
As one embodiment of the present invention, each external connection cushion block of the chip body is located in chip body
Portion, so that height of the packaging height of entire magnetic degree sensor close to chip body.
A kind of motor, the motor include stator, rotor, magnetic mechanism, magnetic degree sensor；The magnetic mechanism setting
In rotor exterior, it is fixedly installed with rotor；
The stator is set to outside magnetic mechanism, has gap between stator and magnetic mechanism；The magnetic degree sensor is solid
Surely it is set to the stator；
The magnetic degree sensor includes: chip body, package substrate substrate；The chip body include magnetic-resistance sensing unit,
Conductor element and chip basal body, the magnetic-resistance sensing unit and conductor element are arranged in chip basal body plane, to sense and core
The magnetic field of sheet matrix plane parallel direction；
The chip body, which hangs down, stands upright on the package substrate substrate；The chip body is equipped with several external connection cushion blocks, respectively
External connection cushion block is set to the same side of chip body；
A bar groove is opened on the package substrate substrate, the width of slot corresponds to the thickness of chip body, can longitudinally place just described
Chip body；The bottom of the chip body is set in slot, and each external connection cushion block of chip body is located in chip body
Portion, so that height of the packaging height of entire magnetic degree sensor close to chip body.
A kind of motor, the motor include stator, rotor, magnetic mechanism and above-mentioned magnetic degree sensor.
As one embodiment of the present invention, the magnetic mechanism is magnet ring；The magnetic degree sensor is set to magnetic
The side of ring, alternatively, the magnetic degree sensor is set to the top of magnet ring.
A kind of encoder, the encoder include magnet ring, magnetic mechanism and above-mentioned magnetic degree sensor, the magnetic degree
Sensor is set to the top of magnet ring.
A kind of preparation method of above-mentioned magnetic degree sensor, the preparation method include:
Before packaging, upper tin ball is first all set on external connection cushion block is having phase with tin ball relative position when package floor designs
The the second line cushion block answered coats tin cream in the second line cushion block；
Chip body is vertically placed on package substrate substrate, the second line on the tin ball on chip body and package substrate substrate
Tin cream intersection on cushion block, by the high temperature melt and cooling of reflow ovens, automatically forms a solid pad；
As one embodiment of the present invention, each external connection cushion block of the chip body is located in the middle part of chip body, makes
The packaging height for obtaining entire magnetic degree sensor is less than the sum of height and package substrate substrate thickness of chip body.
The beneficial effects of the present invention are: motor proposed by the present invention, magnetic degree sensor and preparation method thereof, it can be achieved that
High-precision motor control, and reduce the installation complexity of sensor.
The magnetic direction of rotor permanent magnet is predominantly located at rotor radially, and magnetic resistance type magnetic degree sensor is planar magnetic
(magnetic field size or direction that magnetoresistive technologies measure are the planes in chip wafer) of field induction, so magnetic resistance cannot be used simply
Type magnetic degree sensor directly replaces Hall sensor (magnetic field of Hall sensor measurement is perpendicular to plane).In addition, smart
Close small machine also can allow magnetoresistive sensor arranged orthogonal without space.
Present invention arranged orthogonal in chip wafer encapsulation process by magnetic degree sensor chip forms new magnetic degree and passes
Sensor structure.With magnetoresistive technologies AMR (magnetic resistance anisotropy), GMR (giant magnetoresistance) or TMR(magnetoresisitve tunnel effect) etc. be made
Magnetic degree sensor can use one replace three Hall sensors, the precision of induction can be improved while cost is reduced.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing permanent magnet synchronous motor.
Fig. 2 is the electric machine structure schematic diagram that magnetic resistance type magnetic degree sensor is used in one embodiment of the invention.
Fig. 3 is the schematic layout pattern of magnetic resistance type magnetic degree sensor chip in one embodiment of the invention.
Fig. 4 is that the schematic diagram of tin ball is arranged in the external connection cushion block of magnetic degree sensor chip in one embodiment of the invention.
Fig. 5 is package substrate substrate design schematic diagram in one embodiment of the invention.
Fig. 6 is that tin ball and package floor tin cream are joined schematic diagram on chip body in one embodiment of the invention.
Fig. 7 is that fluting places the schematic diagram of chip body in package floor in one embodiment of the invention.
Fig. 8 is the schematic layout pattern of magnetic degree sensor chip in one embodiment of the invention.
Fig. 9 is that tin ball and package floor tin cream are joined schematic diagram on chip body in one embodiment of the invention.
Specific embodiment
The preferred embodiment that the invention will now be described in detail with reference to the accompanying drawings.
For a further understanding of the present invention, the preferred embodiment of the invention is described below with reference to embodiment, still
It should be appreciated that these descriptions are only further explanation the features and advantages of the present invention, rather than to the claims in the present invention
Limitation.
Just for several typical embodiments, the present invention is not limited merely to the model of embodiment description for the description of the part
It encloses.Some technical characteristics in same or similar prior art means and embodiment, which are replaced mutually, also to be described in the present invention
In the range of protection.
Present invention discloses a kind of magnetic degree sensor, Fig. 5 is that package substrate substrate design is shown in one embodiment of the invention
It is intended to；Referring to Fig. 5, in one embodiment of this invention, the magnetic degree sensor includes: chip body 11, package substrate
Substrate 12；The chip body 11, which hangs down, stands upright on the package substrate substrate 12.
Fig. 3 is the schematic layout pattern of magnetic resistance type magnetic degree sensor chip in one embodiment of the invention；Referring to Fig. 3,
In one embodiment of the invention, the chip body 11 is equipped with several external connection cushion blocks 112, and each external connection cushion block 112 is
It is set to the same side of chip body 11, convenient for connecting with package substrate substrate 12.The Aspect Ratio of design chips ontology will close
It is suitable, it can guarantee its stability when wafer is cut into chip body, and hangs down and stand upright on package substrate substrate chip body.
In one embodiment of this invention, and not all external connection cushion block 112 is in the same side of chip body 11；Such as
Fruit not line, each external connection cushion block 112 can not be in the same side.
Please continue to refer to Fig. 3, in one embodiment of this invention, the chip body 11 include magnetic-resistance sensing unit 111,
Conductor element and chip basal body 110, the magnetic-resistance sensing unit 111 and conductor element are arranged in 110 plane of chip basal body, to
The magnetic field of sensing and 110 plane parallel direction of chip basal body.
Fig. 4 is that the schematic diagram of tin ball is arranged in the external connection cushion block of magnetic degree sensor chip in one embodiment of the invention；
Referring to Fig. 4, in one embodiment of this invention, before the encapsulation of magnetic degree sensor chip, first on external connection cushion block 112
It all sets tin ball 113, when package floor (i.e. package substrate substrate 12) designs, is having corresponding the with 113 relative position of tin ball
Two line cushion blocks 122 coat tin cream in the second line cushion block 122, chip body 11 are vertically placed on package substrate substrate 12,
Tin ball 113 on chip body 11 intersects with the tin cream on the second line cushion block 122 on package substrate substrate 12.Fig. 6 is this
It invents in an embodiment tin ball and package floor tin cream on chip body to join schematic diagram, referring to Fig. 6, real of the invention one
It applies in example, by the high temperature melt and cooling of reflow ovens, automatically forms a solid pad；It is vertically encapsulated to realization
Purpose.In embodiment shown in fig. 6, chip body 11 is directly vertically placed on package substrate substrate 12, package substrate substrate 12
Do not open up slot.
Fig. 7 is that fluting places the schematic diagram of chip body in package floor in one embodiment of the invention；Referring to Fig. 7,
In one embodiment of the invention, a bar groove 121 is opened on the package substrate substrate 12, the width of slot 121 corresponds to chip body 11
Thickness, can longitudinally place the chip body 11 just.
In one embodiment of this invention, each external connection cushion block 112 of the chip body 11 is located in chip body
Portion so that the packaging height of entire magnetic degree sensor be less than chip body 11 height and 12 thickness of package substrate substrate it
With.
Fig. 8 is the schematic layout pattern of magnetic degree sensor chip in one embodiment of the invention, and Fig. 9 is one embodiment of the invention
Tin ball and package floor tin cream are joined schematic diagram on middle chip body；Fig. 8, Fig. 9 are please referred to, in one embodiment of this invention,
The bottom of the chip body 11 is set in slot 121, and each external connection cushion block 112 of chip body 11 is located at chip body 11
Middle part so that the packaging height of entire magnetic degree sensor can be close to height (the package substrate substrate 12 of chip body 11
Thickness by setting slot 121 be reduced, reduced height is denoted as the depth of slot 121；Slot 121 is deeper, reduced height
It is worth bigger), connection in this way can reduce the height of chip package.
The present invention discloses a kind of motor, and the motor includes stator, rotor, magnetic mechanism and above-mentioned magnetic degree sensing
Device.
In one embodiment of this invention, the magnetic mechanism is magnet ring；The magnetic degree sensor is set to magnet ring
Side, alternatively, the magnetic degree sensor is set to the top of magnet ring.
Fig. 2 is the electric machine structure schematic diagram that magnetic resistance type magnetic degree sensor is used in one embodiment of the invention；Please refer to figure
2, in one embodiment of this invention, the motor includes stator 2, rotor 3, magnetic mechanism 4, magnetic degree sensor 1；Magnetic degree
Sensor 1 can could be secured to the upper surface of magnetic mechanism 4, together with control panel on the stator 2；The magnetic mechanism 4 is set
It is placed in the outside of rotor 3, is fixedly installed with rotor 3.The stator 2 is set to the outside of magnetic mechanism 4, stator 2 and magnetic machine
There is gap between structure 4；The magnetic degree sensor 1 is fixedly installed on the stator 2.The structure of the magnetic degree sensor 1
For details, reference can be made to above each embodiments, or other knots that those skilled in the art can associate according to the present invention
Structure.
The present invention discloses a kind of encoder, and the encoder includes magnet ring, magnetic mechanism and above-mentioned magnetic degree sensor,
The magnetic degree sensor is set to the top of magnet ring.Magnetic degree sensor is mounted on above multi-pole magnet-ring, can be effectively increased
Precision；Such as 8 pairs of magnetic poles, it is increased by three precision.
The present invention also discloses a kind of preparation method of above-mentioned magnetic degree sensor, the preparation method include: before packaging,
Upper tin ball 113 is first all set on external connection cushion block 112, it is corresponding having with 113 relative position of tin ball when package floor designs
Second line cushion block 122(is in combination with Fig. 3, Fig. 4), tin cream is coated in the second line cushion block 122；Chip body 11 is vertically placed on
On package substrate substrate, the tin ball 113 on chip body and the tin cream phase on the second line cushion block 122 on package substrate substrate
It hands over, by the high temperature melt and cooling of reflow ovens, automatically forms a solid pad (in combination with Fig. 5, Fig. 6)；As this
A kind of embodiment of invention, each external connection cushion block of the chip body are located in the middle part of chip body, the package substrate
A bar groove 121 is opened on substrate 12, the width of slot 121 corresponds to the thickness of chip body 11, can longitudinally place the chip sheet just
Body 11, so that the packaging height of entire magnetic degree sensor is less than the sum of height and package substrate substrate thickness of chip body
(in combination with Fig. 7 to Fig. 9).
In conclusion motor proposed by the present invention, magnetic degree sensor and preparation method thereof are, it can be achieved that high-precision motor
Control, and reduce the installation complexity of sensor.
Present invention arranged orthogonal in chip wafer encapsulation process by magnetic degree sensor chip forms new magnetic degree and passes
Sensor structure.With magnetoresistive technologies AMR (magnetic resistance anisotropy), GMR (giant magnetoresistance) or TMR(magnetoresisitve tunnel effect) etc. be made
Magnetic degree sensor can use one replace three Hall sensors, the precision of induction can be improved while cost is reduced.
Description and application of the invention herein are illustrative, is not wishing to limit the scope of the invention to above-described embodiment
In.The deformation and change of embodiments disclosed herein are possible, the realities for those skilled in the art
The replacement and equivalent various parts for applying example are well known.It should be appreciated by the person skilled in the art that not departing from the present invention
Spirit or essential characteristics in the case where, the present invention can in other forms, structure, arrangement, ratio, and with other components,
Material and component are realized.Without departing from the scope and spirit of the present invention, can to embodiments disclosed herein into
The other deformations of row and change.
Claims (11)
1. a kind of magnetic degree sensor, which is characterized in that the magnetic degree sensor includes: chip body, package substrate substrate；
The chip body, which hangs down, stands upright on the package substrate substrate.
2. magnetic degree sensor according to claim 1, it is characterised in that:
The chip body is equipped with several external connection cushion blocks, and each external connection cushion block is set to the same side of chip body.
3. magnetic degree sensor according to claim 1, it is characterised in that:
The chip body includes magnetic-resistance sensing unit, conductor element and chip basal body, the magnetic-resistance sensing unit and conductor list
Member is arranged in chip basal body plane, to sense the magnetic field with chip basal body plane parallel direction.
4. magnetic degree sensor according to claim 1, it is characterised in that:
A bar groove is opened on the package substrate substrate, the width of slot corresponds to the thickness of chip body, can longitudinally place just described
Chip body；The bottom of the chip body is set in slot.
5. magnetic degree sensor according to claim 4, it is characterised in that:
Each external connection cushion block of the chip body is located in the middle part of chip body, so that the encapsulation of entire magnetic degree sensor is high
Degree is less than the sum of height and package substrate substrate thickness of chip body.
6. magnetic degree sensor according to claim 5, it is characterised in that:
Each external connection cushion block of the chip body is located in the middle part of chip body, so that the encapsulation of entire magnetic degree sensor is high
Spend the height close to chip body.
7. a kind of motor, which is characterized in that the motor includes stator, rotor, magnetic mechanism, magnetic degree sensor；The magnetic
Property mechanism be set to rotor exterior, with rotor be fixedly installed；
The stator is set to outside magnetic mechanism, has gap between stator and magnetic mechanism；The magnetic degree sensor is solid
Surely it is set to the stator；
The magnetic degree sensor includes: chip body, package substrate substrate；The chip body include magnetic-resistance sensing unit,
Conductor element and chip basal body, the magnetic-resistance sensing unit and conductor element are arranged in chip basal body plane, to sense and core
The magnetic field of sheet matrix plane parallel direction；
The chip body, which hangs down, stands upright on the package substrate substrate；The chip body is equipped with several external connection cushion blocks, respectively
External connection cushion block is set to the same side of chip body；
A bar groove is opened on the package substrate substrate, the width of slot corresponds to the thickness of chip body, can longitudinally place just described
Chip body；The bottom of the chip body is set in slot, and each external connection cushion block of chip body is located in chip body
Portion, so that height of the packaging height of entire magnetic degree sensor close to chip body.
8. a kind of motor, which is characterized in that the motor includes one of stator, rotor, magnetic mechanism and claim 1 to 6 institute
The magnetic degree sensor stated.
9. motor according to claim 8, it is characterised in that:
The magnetic mechanism is magnet ring；The magnetic degree sensor is set to the side of magnet ring, alternatively, the magnetic degree sensor
It is set to the top of magnet ring.
10. a kind of encoder, which is characterized in that the encoder includes one of magnet ring, magnetic mechanism and claim 1 to 6 institute
The magnetic degree sensor stated, the magnetic degree sensor are set to the top of magnet ring.
11. the preparation method of magnetic degree sensor described in a kind of one of claim 1 to 6, which is characterized in that the preparation method
Include:
Before packaging, upper tin ball is first all set on external connection cushion block is having phase with tin ball relative position when package floor designs
The the second line cushion block answered coats tin cream in the second line cushion block；
Chip body is vertically placed on package substrate substrate, the tin ball on chip body and second on package substrate substrate connect
Tin cream intersection on line cushion block, by the high temperature melt and cooling of reflow ovens, automatically forms a solid pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910369440.7A CN109855658A (en) | 2019-05-06 | 2019-05-06 | Motor, encoder, magnetic degree sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910369440.7A CN109855658A (en) | 2019-05-06 | 2019-05-06 | Motor, encoder, magnetic degree sensor and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109855658A true CN109855658A (en) | 2019-06-07 |
Family
ID=66889437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910369440.7A Pending CN109855658A (en) | 2019-05-06 | 2019-05-06 | Motor, encoder, magnetic degree sensor and preparation method thereof |
Country Status (1)
| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116576933A (en) * | 2023-07-14 | 2023-08-11 | 微传智能科技（常州）有限公司 | Intelligent metering method for measuring flow and flow direction |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240015A (en) * | 1994-02-24 | 1995-09-12 | Sony Corp | Base fo fixing magnetic head, magnetic head assembly and production of magnetic head assembly |
| CN101369009A (en) * | 2007-08-14 | 2009-02-18 | 新科实业有限公司 | Magnetic sensor and method for manufacturing the same |
| JP2013195381A (en) * | 2012-03-22 | 2013-09-30 | Stanley Electric Co Ltd | Current detection device |
| CN103687302A (en) * | 2012-09-14 | 2014-03-26 | 欧姆龙株式会社 | Substrate structure, method of mounting semiconductor chip, and solid state realy |
| CN104159400A (en) * | 2014-08-26 | 2014-11-19 | 安捷利电子科技（苏州）有限公司 | Packaging structure and circuit board of novel embedded components |
| CN108351389A (en) * | 2015-11-09 | 2018-07-31 | Tdk株式会社 | Magnetic sensor |
| CN208401694U (en) * | 2018-05-23 | 2019-01-18 | 中山瑞信智能控制系统有限公司 | A switched reluctance motor |
-
2019
- 2019-05-06 CN CN201910369440.7A patent/CN109855658A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240015A (en) * | 1994-02-24 | 1995-09-12 | Sony Corp | Base fo fixing magnetic head, magnetic head assembly and production of magnetic head assembly |
| CN101369009A (en) * | 2007-08-14 | 2009-02-18 | 新科实业有限公司 | Magnetic sensor and method for manufacturing the same |
| JP2013195381A (en) * | 2012-03-22 | 2013-09-30 | Stanley Electric Co Ltd | Current detection device |
| CN103687302A (en) * | 2012-09-14 | 2014-03-26 | 欧姆龙株式会社 | Substrate structure, method of mounting semiconductor chip, and solid state realy |
| CN104159400A (en) * | 2014-08-26 | 2014-11-19 | 安捷利电子科技（苏州）有限公司 | Packaging structure and circuit board of novel embedded components |
| CN108351389A (en) * | 2015-11-09 | 2018-07-31 | Tdk株式会社 | Magnetic sensor |
| CN208401694U (en) * | 2018-05-23 | 2019-01-18 | 中山瑞信智能控制系统有限公司 | A switched reluctance motor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116576933A (en) * | 2023-07-14 | 2023-08-11 | 微传智能科技（常州）有限公司 | Intelligent metering method for measuring flow and flow direction |
| CN116576933B (en) * | 2023-07-14 | 2023-10-20 | 微传智能科技（常州）有限公司 | Intelligent metering method for measuring flow and flow direction |
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