Summary of the invention
The invention reside in a kind of expansion panel of server is provided, so as to avoiding static discharge (Electrostatic
Discharge, ESD) and damage electronic equipment.
The expansion panel of server disclosed in one embodiment of the invention includes a shell, expansion an electronic building brick, one
Electroconductive elastic sheet and a conductive cover.Shell has an accommodation space.Expand electronic building brick and be located at accommodation space, and is installed in shell
Body.Electroconductive elastic sheet is located in accommodation space, and is installed in shell.Electroconductive elastic sheet is located in accommodation space, and is installed in shell.It leads
Electric elastic slice includes a linkage section, one first conductive segment, at least one second conductive segment.First conductive segment and at least one second conductive segment
It is connected to the opposite sides of linkage section.Conductive cover is installed in shell, and covers accommodation space.Wherein, the first conductive segment
Electrically it is resisted against expansion electronic building brick.At least one second conductive segment is electrically resisted against conductive cover.
According to the expansion panel of the server of above-described embodiment, pass through the first conductive segment and the second conductive segment of electroconductive elastic sheet
Circuit board and conductive cover plate are electrically contacted to respectively, so that the static discharge phenomenon generated on circuit board is able to pass through electroconductive elastic sheet
It conducts to the conductive cover of grounded processing, and then static discharge phenomenon is avoided to generate.
The explanation of explanation and the following embodiments and the accompanying drawings above with respect to the content of present invention is of the invention with explanation to demonstrate
Spirit and principle, and claims of the present invention is provided and is further explained.
Detailed description of the invention
Fig. 1 is the perspective view of the expansion panel of the server according to first embodiment of the invention.
Fig. 2 is the decomposition diagram of Fig. 1.
Fig. 3 is the perspective view of the electroconductive elastic sheet of Fig. 2.
Fig. 4 is the cross-sectional view of Fig. 1.
Fig. 5 is the partial enlargement diagram of Fig. 4.
Wherein, appended drawing reference:
The expansion panel 10 of server
Shell 100
Supporting part 110
Support portion 120
Opening 130
Expand electronic building brick 200
Circuit board 210
First face 211
Second face 212
Conductive spacer 213
First perforation 214
Expand electric connector 220
Electroconductive elastic sheet 300
Linkage section 310
First conductive segment 320
Body part 321
Second perforation 3211
Resilient projection 322
Second conductive segment 330
Back buckle section 340
Compress structure 341
Conductive cover 500
First closure 610
Second closure 620
Accommodation space S
Specific embodiment
Describe detailed features and advantage of the invention in detail in embodiments below, content is enough to make this field
Technical staff understands technology contents of the invention and implements accordingly, and according to content disclosed in this specification, claims
And attached drawing, those skilled in the art can be readily understood upon the relevant purpose of the present invention and advantage.Embodiment below is into one
The step viewpoint that the present invention will be described in detail, but it is non-anyways to limit scope of the invention.
Fig. 1 is please referred to Fig. 5.Fig. 1 is the solid of the expansion panel of the server according to first embodiment of the invention
Figure.Fig. 2 is the decomposition diagram of Fig. 1.Fig. 3 is the perspective view of the electroconductive elastic sheet of Fig. 2.Fig. 4 is the cross-sectional view of Fig. 1.Fig. 5 is Fig. 4
Partial enlargement diagram.
The expansion panel 10 of the server of the present embodiment includes that a shell 100, one expands the conductive bullet of electronic building brick 200, one
Piece 300, a sticker part 400 and a conductive cover 500.
Shell 100 is, for example, shell made of metal material or plastic cement material.Shell 100 has an accommodation space S.This
Outside, shell 100 also has a supporting part 110 and a support portion 120 and an opening 130.Supporting part 110 is located at support portion 120
In accommodation space S.Supporting part 110 is, for example, the plastic cement column with screw hole.Support portion 120 is, for example, plastic plate.130 connection of opening
Accommodation space S.
Expand electronic building brick 200 and be located at accommodation space S, and is installed in shell 100.In addition, expansion electronic building brick 200 includes
One circuit board 210 and one expands electric connector 220.Circuit board 210 has opposite one first face 211 and one second face 212.Electricity
First face 211 of road plate 210 is towards supporting part 110.Expand the first face 211 that electric connector 220 is set to circuit board 210, and
Through opening 130, part is located at except shell 100.In addition, circuit board 210 also has a conductive spacer 213 and one first perforation
214.Conductive spacer 213 is set to the first face 211 of circuit board 210.First perforation 214 runs through the first face 211 and the second face
212。
Electroconductive elastic sheet 300 is located in accommodation space S, and is installed in shell 100.Electroconductive elastic sheet 300 includes a linkage section
310, one first conductive segment, 320, two the second conductive segments 330 and a back buckle section 340.First conductive segment 320 is connected to linkage section
310 side, and be located between circuit board 210 and supporting part 110, i.e., the first conductive segment 320 is stacked at supporting part 110.
First conductive segment 320 includes a body part 321 and two resilient projections 322.Body part 321 for example in tabular,
And it is connected to linkage section 310.Body part 321 has one second perforation 3211.Two resilient projections 322 are located at the second perforation 3211
Opposite sides, and two resilient projections 322 protrude from side of the body part 321 far from supporting part 1100, and compress circuit board
210 conductive spacer 213.In this way, can be provided by the design of two resilient projections 322 first conductive segment 320 with
The conductive spacer 213 of circuit board 210 quality in electrical contact.
In addition, the expansion panel 10 of server may also include one first closure 610, the first closure 610 wears first
Perforation 214 and the second perforation 3211 are simultaneously locked on supporting part 110, will expand the circuit board 210 and conductive bullet of electronic building brick 200
Piece 300 is fixed on supporting part 110.
In addition, in the present embodiment, the quantity of resilient projection 322 is two, but is not limited thereto.In other embodiments
In, the quantity of resilient projection may also be only individually.
The part of two the second conductive segments 330 is in arcuation.Two the second conductive segments 330 are all connected to linkage section 310
Opposite side, and the first conductive segment 320 and two the second conductive segments 330 extend protrusion towards the same side of linkage section 310.At this
In embodiment, the first conductive segment 320 and two the second conductive segments 330 extend protrusion towards the same side of linkage section 310, but not
As limit.In other embodiments, the first conductive segment extends towards the phase heteropleural of linkage section convex respectively with two the second conductive segments
Out.
Back buckle section 340 is connected to linkage section 310, and the first conductive segment 320 is protruded from two the second conductive segments 330 and connect
The same face of section 310.Back buckle section 340 protrudes from the opposite side of linkage section 310.Linkage section 310 and the common sandwiched of back buckle section 340
In support portion 120.In addition, back buckle section 340 has one to compress structure 341, back buckle section 340 compresses structure 341 and can promote conduction
The chucking power of elastic slice 300 and support portion 120.
In the present embodiment, the quantity of the second conductive segment 330 is two, but is not limited thereto.In other embodiments,
The quantity of second conductive segment may also be only individually.
Conductive cover 500 is installed in shell 100, and covers accommodation space S.Conductive cover 500 is to be installed in server
Cabinet (not being painted), to carry out grounding.In addition, the second conductive segment 330 is in being resisted against conductive cover 500 at arcuation,
To provide the second conductive segment 330 and the quality in electrical contact of conductive cover 500.
In addition, the expansion panel 10 of server may also include two the second closures 620.Conductive cover 500 passes through second
Closure 620 is locked on shell 100.
In the present embodiment, the quantity of the second closure 620 is two, but is not limited thereto.In other embodiments,
The quantity of second closure may also be only individually.
In the present embodiment, expand electronic building brick 200, electroconductive elastic sheet 300 and conductive cover 500 assembling sequence for example according to
Sequence is the supporting part 110 and support portion 120 that electroconductive elastic sheet 300 is first fixed on to shell 100.Then, electronic building brick 200 will be expanded
It is stacked at the first conductive segment 320 of electroconductive elastic sheet 300.Then, it will expand electronic building brick 200 by the first closure 610 and lead
Electric elastic slice 300 is locked in shell 100.Then, conductive cover 500 is locked in by shell 100 by the second closure 620.
The conductive spacer 213 of circuit board 210 is electrically contacted to by the first conductive segment 320 of above-mentioned electroconductive elastic sheet 300, with
And the second conductive segment 330 of electroconductive elastic sheet 300 to be to electrically contact to conductive cover plate 500 at arcuation, so that being generated on circuit board 210
Static discharge phenomenon (ElectroStatic Discharge, ESD) be able to be directed to grounded place by electroconductive elastic sheet 300
The conductive cover 500 of reason.In this way, by that static discharge phenomenon can be avoided to generate by the design of electroconductive elastic sheet 300.
According to the expansion panel of the server of above-described embodiment, pass through the first conductive segment and the second conductive segment of electroconductive elastic sheet
Circuit board and conductive cover plate are electrically contacted to respectively, so that the static discharge phenomenon generated on circuit board is able to pass through electroconductive elastic sheet
It conducts to the conductive cover of grounded processing, and then static discharge phenomenon is avoided to generate.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any to be familiar with this skill
Technical staff, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations, therefore guarantor of the invention
Range is protected subject to the view scope of which is defined in the appended claims.