CN109801927A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN109801927A CN109801927A CN201910100035.5A CN201910100035A CN109801927A CN 109801927 A CN109801927 A CN 109801927A CN 201910100035 A CN201910100035 A CN 201910100035A CN 109801927 A CN109801927 A CN 109801927A
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- flexible substrates
- water barrier
- display panel
- gas
- protective layer
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- Thin Film Transistor (AREA)
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Abstract
The present invention provides a kind of display panel and preparation method thereof; by the way that water barrier is arranged between flexible substrates and protective layer; water barrier is prepared by hydrophobic material; during preparing thin film transistor (TFT) using wet process on the protection layer, even if steam can be generated, steam can also be obstructed by water barrier; it will not be absorbed by flexible substrates; steam will not be discharged in subsequent high temperature process accordingly, to solve the problems, such as that film transistor device is removed, improve the yield of display panel.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of display panel and preparation method thereof.
Background technique
With the development of semiconductor display device and the growing consumption demand of consumer, flexible display at present
Part or collapsible display part, which have begun, is largely introduced to the market, is gradually widely used in mobile phone, intelligence dresses, is vehicle-mounted
Equal fields.
But there are also many problems demands to overcome for flexible display device at present, for example, flexible display device (such as flexible hydraulic
LCD panel) transparent flexible PI (Polyimide, polyimides) film for generally using, PI thin film cladding is in substrate of glass
On, PI film absorbs water in order to prevent, so after making silicon nitride buffer protection layer on PI film, then prepare thin film transistor (TFT) etc.
Dependency structure.But wet processing step is more in actual process, even if being protected using nitridation silicon buffer layer, it is also difficult to
Reach complete water proof purpose, be easy to discharge steam in subsequent high temperature process after the water suction of PI film, causes film thereon brilliant
The removing of body tube device.
Summary of the invention
The present invention aiming at the above shortcomings existing in the prior art, provides a kind of display panel and preparation method thereof, to
At least partly solve the problems, such as that flexible display device water proof effect is poor.
The present invention is in order to solve the above technical problems, adopt the following technical scheme that
The present invention provides a kind of display panel, including flexible substrates and the protective layer that is formed in the flexible substrates,
It is characterized in that, further includes water barrier, the water barrier is between the flexible substrates and the protective layer, and the water barrier
Material be hydrophobic material.
Preferably, the flexible substrates are rough surface adjacent to the surface of the protective layer.
Preferably, the material of the water barrier is fluorocarbon polymer material.
Preferably, the water barrier with a thickness of 10-100nm.
The present invention also provides a kind of preparation methods of display panel, are used to prepare foregoing display panel, the side
Method the following steps are included:
Coating polyimide solution and film-forming on underlay substrate, to form flexible substrates；
Water barrier is prepared in the flexible substrates, the material of the water barrier is hydrophobic material；
Protective layer is prepared on the water barrier using pecvd process.
Further, on underlay substrate after preparation flexible substrates, before preparing water barrier in the flexible substrates,
The method also includes:
The flexible substrates are roughened far from the surface of the underlay substrate.
Preferably, described that the flexible substrates are roughened far from the surface of the underlay substrate, it is specific to wrap
It includes:
The flexible substrates are performed etching with preset first reaction condition using reaction gas, so that the flexibility
Substrate forms rough surface far from the surface of the underlay substrate.
Preferably, the reaction gas includes oxygen；
First reaction condition includes: that reaction temperature is 50-200 DEG C, and the flow of oxygen is 20-1000cm3/ min, work
Making air pressure is 50Pa, and discharge power 150W, etch period was less than 5 minutes.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the display panel that the embodiment of the present invention 1 provides；
Fig. 2 is the step schematic diagram of the display panel for the preparation embodiment 1 that the embodiment of the present invention 3 provides.
Marginal data:
1, underlay substrate 2, flexible substrates 3, water barrier
4, protective layer 5, grid 6, gate insulation layer
7, active layer 8, interlayer dielectric layer 9, source electrode
10, it drains
Specific embodiment
Below in conjunction with the attached drawing in the present invention, clear, complete description is carried out to the technical solution in the present invention, is shown
So, described embodiment is a part of the embodiments of the present invention, instead of all the embodiments.Based on the implementation in the present invention
Example, those of ordinary skill in the art's every other embodiment obtained without making creative work, all belongs to
In the scope of protection of the invention.
Embodiment 1
The embodiment of the present invention 1 provides a kind of display panel, as shown in Figure 1, the display panel includes: 2 He of flexible substrates
The protective layer 4 being formed in flexible substrates 2, further includes water barrier 3, water barrier 3 between flexible substrates 2 and protective layer 4, and
The material of water barrier 3 is hydrophobic material.
It should be noted that the display panel that the embodiment of the present invention 1 provides is flexible display panels, flexible display panels are needed
Each film layer structure is prepared on underlay substrate 1, finally again remove underlay substrate 1.Therefore, as shown in Figure 1, flexible substrates 2
At on underlay substrate 1.
The material of flexible substrates 2 is polyimides, and the material of protective layer 4 can be silicon nitride.
The display panel that the embodiment of the present invention 1 provides, by the way that water barrier 3 is arranged between flexible substrates 2 and protective layer 4,
Water barrier 3 is prepared by hydrophobic material, during using wet process to prepare thin film transistor (TFT) on protective layer 4, even if water can be generated
Vapour, steam can also be obstructed by water barrier 3, will not be absorbed by flexible substrates 2, will not be discharged in subsequent high temperature process accordingly
Steam improves the yield of display panel to solve the problems, such as that film transistor device is removed.
In order to further increase the water isolating of display panel, it is preferred that flexible substrates 2 are adjacent to the surface of protective layer 4
Rough surface.
Preferably, the material of water barrier 3 can be fluorocarbon polymer material, and fluorocarbon polymer material is a kind of fluorine-containing carbon
Polymer material, due to wherein containing fluorine, so surface can be very low, suitable for building super hydrophobic surface.
3 collective effect of water barrier on coarse 2 surface of flexible substrates and fluorocarbon polymer material, water proof better effect can
In the outside of flexible substrates 2, to prevent flexible substrates 2 from absorbing steam steam isolation.
It should be noted that the material of water barrier 3 may be other hydrophobic materials, for example, silane coupling agent class material,
Such as γ-methacryloxypropyl trimethoxy silane (MPTMS), N- methyl perfluoro octyl sulfonyl amido acrylic acid second
Ester (MPSAEA), but these hydrophobic materials require the reaction atmosphere of solution phase.
Preferably, water barrier 3 with a thickness of 10-100nm.
Further, as shown in Figure 1, the display panel can also include thin film transistor (TFT), thin film transistor (TFT) setting exists
On protective layer 4, thin film transistor (TFT) may include: grid 5, gate insulation layer 6, active layer 7, interlayer dielectric layer 8, source electrode 9 and drain electrode
10.Fig. 1 illustrates by taking bottom gate thin film transistor as an example, certainly, top gate type thin film transistor also protection scope of the present invention it
It is interior.
Preferably, the display panel can be liquid crystal display panel or OLED display panel, wherein liquid crystal display panel
It is no longer superfluous herein that the specific structure of the OLED device of the specific structure and OLED display panel of middle liquid crystal layer belongs to the prior art
It states.
Embodiment 2
The embodiment of the present invention 2 provides a kind of display panel, and the difference of the display panel and the display panel of embodiment 1 exists
In: it is not provided with water barrier 3 between flexible substrates 2 and protective layer 4, only passes through the surface shape in flexible substrates 2 adjacent to protective layer 4
The effect of barrier steam is realized at rough surface.
Certainly, skilled person will appreciate that, the effect of the barrier steam for the display panel that embodiment 2 provides is not as good as implementation
The effect of the barrier steam for the display panel that example 1 provides.
Embodiment 3
The embodiment of the present invention 3 provides a kind of preparation method of display panel, is used to prepare display surface described in embodiment 1
Plate is described in detail the preparation method of the display panel below in conjunction with Fig. 2.The preparation method packet of the display panel
Include following steps:
Step 101, coating polyimide solution and film-forming on underlay substrate, to form flexible substrates.
Specifically, usual underlay substrate 1 is glass substrate as shown in Fig. 2, providing a kind of underlay substrate 1.In underlay substrate
PI solution is coated on 1, after curing process, forms PI film, flexible substrates 2 of the PI film as display panel.
Step 102, water barrier is prepared in the flexible substrates.
Specifically, using the mixed gas or fluoro-gas of fluoro-gas and methane and the mixed gas of helium, pre-
If the second reaction condition under, in flexible substrates 2 deposition form fluorocarbon polymer film layer as water barrier 3.
Second reaction condition includes: that the flow of fluoro-gas is 10-40cm3/ min, preferably 20cm3/ min, methane
Or the flow of helium is 20-80cm3/ min, preferably 50cm3/ min, operating air pressure 133Pa, discharge power 120W, deposition
Time is 10-100 seconds.
Specifically, vacuumized to reaction chamber background so that pressure in reaction chamber is less than 1.5Pa, by fluoro-gas and
The mixed gas of methane or argon gas is passed through the deposition that reaction chamber carries out fluorocarbon film, and fluoro-gas includes one of
Or any combination: CF4、CHF3、C2F4、C3F6、C4F8、CF2Cl2。
Preferably, deposition formed fluorocarbon polymer film layer (i.e. water barrier 3) with a thickness of 10-100nm.
Step 103, protective layer is prepared on the water barrier using pecvd process.
In order to realize the planarization on surface, it is convenient for subsequent thin film transistor fabrication, while protecting water barrier 3, reduces steam
With the influence of ion pair flexible substrates 2, need to prepare a protective layer 4 again on water barrier 3, with completely cut off steam and it is various from
Son.
In embodiments of the present invention, the material of protective layer 4 is SiNx, can specifically pass through PECVD (Plasma
Enhanced Chemical Vapor Deposition) technique prepares protective layer 4 on water barrier 3.
Preferably, the thickness of protective layer 4 can be 50nm-500nm.
It can be seen that by step 101-103 by the way that water barrier 3, water proof are arranged between flexible substrates 2 and protective layer 4
Layer 3 is prepared by hydrophobic material, during using wet process to prepare thin film transistor (TFT) on protective layer 4, even if steam, water can be generated
Vapour can also be obstructed by water barrier 3, will not be absorbed by flexible substrates 2, will not discharge steam in subsequent high temperature process accordingly,
To solve the problems, such as that film transistor device is removed, the yield of display panel is improved.
Further, flexible substrates are prepared on underlay substrate (to prepare i.e. after step 101), in the flexible substrates
Water barrier (i.e. before step 102), the method also includes following steps:
Step 101 ', the flexible substrates are roughened far from the surface of the underlay substrate.
Specifically, with preset first reaction condition, being performed etching to flexible substrates 2, using reaction gas so that flexible
Substrate 2 forms rough surface far from the surface of underlay substrate 1.
In embodiments of the present invention, reaction gas is oxygen, and the first reaction condition includes: that reaction temperature is 50-200 DEG C,
The flow of oxygen is 20-1000cm3/ min, operating air pressure 50Pa, discharge power 150W, etch period was less than 5 minutes.
Specifically, the underlay substrate 1 for being formed with flexible substrates 2 is placed in the reaction chamber of plasma device, and
It is heated to 50-200 DEG C, preferably 110 DEG C between upper and lower pole plate, and by bottom crown, keeps temperature constant.To described anti-
Chamber background is answered to vacuumize, vacuum degree is in 1.5Pa hereinafter, then with 20-1000cm3The flow of/min is passed through into reaction chamber
Oxygen, so that the indoor operating air pressure of reaction chamber is maintained at 50Pa, it is remote to flexible substrates 2 under the conditions of discharge power is 150W
Continuous surface etching from underlay substrate 1 is no more than 5 minutes, to make flexible substrates 2 far from the rough surface of underlay substrate 1
Change.
The PI film of bottom can be prevented in array substrate using the water proof characteristic of the fluorocarbon polymer of above-mentioned rough surface
It is not in then to reduce subsequent since high temperature release steam causes PI thin in relevant wet process processing procedure the phenomenon that absorbing steam
Film deformation and the thereon stripping problem of thin film transistor film layer.
After step 101,101 ', 102,103 are completed, the underlying structure of display panel, which is just prepared, to be completed comprising lining
Substrate 1, the non-transparent flexible substrate 2 (flexible substrates 2 have rough surface) that can be used for laser lift-off, hydrophobization water barrier 3
And the SiNx protective layer 4 for completely cutting off steam and various ions.It should be noted that also needing enterprising in the underlying structure
One step prepares the structures such as array substrate, display device.In embodiments of the present invention, as shown in Fig. 2, with LTPS (Low
Temperature Poly-silicon, low temperature polycrystalline silicon) mode array substrate for, prepared in the underlying structure thin
Film transistor structure, specifically, being sequentially prepared grid 5, gate insulating layer 6, active layer 7, interlayer dielectric layer 8, source electrode 9, drain electrode
10 etc..
It should be noted that after the structures such as display device are completed in preparation in underlying structure, it is also necessary to remove underlay substrate
1, to form flexible display panels.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of display panel, including flexible substrates and the protective layer being formed in the flexible substrates, which is characterized in that also wrap
Water barrier is included, the water barrier is between the flexible substrates and the protective layer, and the material of the water barrier is hydrophobic
Material.
2. display panel as described in claim 1, which is characterized in that the flexible substrates are adjacent to the surface of the protective layer
Rough surface.
3. display panel as claimed in claim 1 or 2, which is characterized in that the material of the water barrier is fluorocarbon polymer material
Material.
4. display panel as claimed in claim 1 or 2, which is characterized in that the water barrier with a thickness of 10-100nm.
5. a kind of preparation method of display panel is used to prepare display panel according to any one of claims 1-4, the side
Method the following steps are included:
Coating polyimide solution and film-forming on underlay substrate, to form flexible substrates；
Water barrier is prepared in the flexible substrates, the material of the water barrier is hydrophobic material；
Protective layer is prepared on the water barrier using pecvd process.
6. method as claimed in claim 5, which is characterized in that on underlay substrate after preparation flexible substrates, described soft
Before preparing water barrier in property substrate, the method also includes:
The flexible substrates are roughened far from the surface of the underlay substrate.
7. method as claimed in claim 6, which is characterized in that the table to the flexible substrates far from the underlay substrate
Face is roughened, and is specifically included:
The flexible substrates are performed etching with preset first reaction condition using reaction gas, so that the flexible substrates
Surface far from the underlay substrate forms rough surface.
8. the method for claim 7, which is characterized in that the reaction gas includes oxygen；
First reaction condition includes: that reaction temperature is 50-200 DEG C, and the flow of oxygen is 20-1000cm3/ min, work gas
Pressure is 50Pa, and discharge power 150W, etch period was less than 5 minutes.
9. method as claimed in claim 5, which is characterized in that it is described to prepare water barrier in the flexible substrates, it is specific to wrap
It includes:
It is anti-preset second using the mixed gas or fluoro-gas of fluoro-gas and methane and the mixed gas of helium
Under the conditions of answering, deposition forms fluorocarbon polymer film layer in the flexible substrates.
10. method as claimed in claim 9, which is characterized in that second reaction condition includes: that the flow of fluoro-gas is
10-40cm3The flow of/min, methane or helium is 20-80cm3/ min, operating air pressure 133Pa, discharge power 120W sink
The product time is 10-100 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910100035.5A CN109801927A (en) | 2019-01-31 | 2019-01-31 | Display panel and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910100035.5A CN109801927A (en) | 2019-01-31 | 2019-01-31 | Display panel and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN109801927A true CN109801927A (en) | 2019-05-24 |
Family
ID=66560862
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910100035.5A Pending CN109801927A (en) | 2019-01-31 | 2019-01-31 | Display panel and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405906A (en) * | 2015-12-15 | 2016-03-16 | 上海正硅实业发展有限公司 | Double-sided power-generating photovoltaic assembly |
| CN109062432A (en) * | 2018-07-23 | 2018-12-21 | 江西沃格光电股份有限公司 | Flexible touch panel and preparation method thereof |
| CN109087999A (en) * | 2018-08-22 | 2018-12-25 | 京东方科技集团股份有限公司 | Flexible substrates and preparation method thereof, flexible organic light-emitting diode display substrate |
-
2019
- 2019-01-31 CN CN201910100035.5A patent/CN109801927A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405906A (en) * | 2015-12-15 | 2016-03-16 | 上海正硅实业发展有限公司 | Double-sided power-generating photovoltaic assembly |
| CN109062432A (en) * | 2018-07-23 | 2018-12-21 | 江西沃格光电股份有限公司 | Flexible touch panel and preparation method thereof |
| CN109087999A (en) * | 2018-08-22 | 2018-12-25 | 京东方科技集团股份有限公司 | Flexible substrates and preparation method thereof, flexible organic light-emitting diode display substrate |
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Application publication date: 20190524 |