CN109791176A - Circuit board and multiple-printed-panel for circuit board - Google Patents
Circuit board and multiple-printed-panel for circuit board Download PDFInfo
- Publication number
- CN109791176A CN109791176A CN201780060305.3A CN201780060305A CN109791176A CN 109791176 A CN109791176 A CN 109791176A CN 201780060305 A CN201780060305 A CN 201780060305A CN 109791176 A CN109791176 A CN 109791176A
- Authority
- CN
- China
- Prior art keywords
- circuit
- area
- circuit board
- conducting wire
- jackknifing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of circuit board (P1, P2) and the multiple-printed-panel for circuit board (10) including the circuit board (P1, P2).Circuit board (the P1, it P2) include the first circuit region (100) and at least one the second circuit area (200) for being provided with conducting wire (102), first circuit region (100) is connect by the first jackknifing area (B1) with the second circuit area (200), and the second circuit area (200) is separated with first circuit region (100) with the fracture in first jackknifing area (B1).The second circuit area (200) includes at least one conducting end (202), first jackknifing area (B1) includes at least one conducting wire (41), and the conducting end (202) is electrically connected by the conducting wire (102) in the conducting wire (41) and first circuit region (100).Circuit board (the P1, P2 by the way that conducting end (202) are arranged on separable circuit region in), so that test circuit includes on the first circuit region (100) of conducting wire (102), so that the testing efficiency and reliability for conducting wire (102) in the first circuit region (100) are higher without being directly arranged at.
Description
The present invention relates to circuit board testing technical field more particularly to a kind of measuring technologies for circuit board in circuit board research and development, generating process.
Circuit board has been widely used in multi-field electronic device at present, such as living electric apparatus such as the consumer electronics such as mobile phone, computer field, refrigerator, air-conditioning etc..The electric conduction routing for carrying multiple functional circuits on circuit board and connecting the functional circuitry.In general, circuit board after having made electric conduction routing and after patch installs electronic component, needs to be tested for electric conduction routing and the functional circuitry for having electronic component to constitute.So with regard to needing to weld in test circuit and the signal transmission end of electric conduction routing and functional circuit on circuit board.With quickling increase for circuit board integrated level, causes on circuit board electric conduction routing more and setting is very intensive.Thus, it is directly welded with the electric conduction routing on circuit board when will directly test circuit, often occur short circuit between electric conduction routing, damaged so as to cause electric conduction routing on circuit board, or even the functional circuit and whole circuit board that are electrically connected with electric conduction routing damage.
Summary of the invention
To solve aforementioned technical problem, the present invention provides a kind of higher circuit board of testing reliability.
Further, a kind of multiple-printed-panel for circuit board including aforementioned circuit plate is provided.
A kind of circuit board, the first circuit region and at least one second circuit area including being provided with conducting wire, first circuit region is connect by the first jackknifing area with the second circuit area, and the second circuit area is separated with first circuit region with the fracture in first jackknifing area.The second circuit area includes at least one conducting end, and first jackknifing area includes at least one conducting wire, and the conducting end is electrically connected by the conducting wire in the conducting wire and first circuit region.
A kind of multiple-printed-panel for circuit board, including at least two aforementioned circuit plates, described two circuit boards pass through the interconnection of the second jackknifing area along a first direction, and second jackknifing area includes multiple through-holes, and the through-hole is convenient for the fracture of second jackknifing area under external force.
Compared to the prior art, external test circuit passes through the conducting end that is set in second circuit area,
The conducting wire in one jackknifing area is electrically connected the functional circuit of the first circuit region and perhaps conducting wire and is tested for functional circuit or conducting wire.After the completion of test, the first jackknifing area is broken under external force, so that second circuit area is separated from each other with the first circuit region, so as to complete the production and test of the first circuit region.Since test circuit is electrically connected by second circuit area and the first circuit region, that is test circuit is without being placed directly onto the first circuit region, namely test circuit will not in the first circuit any conducting wire or circuit setting have an impact, improve testing efficiency and reliability.
To describe the technical solutions in the embodiments of the present invention more clearly, the drawings to be used in the embodiments are briefly described below, apparently, drawings in the following description are only some embodiments of the invention, for those of ordinary skill in the art, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the planar structure schematic diagram of multiple-printed-panel for circuit board in one embodiment of the invention.
Fig. 2 is the planar structure schematic diagram of first circuit board as shown in Figure 1.
Fig. 3 is the enlarged structure schematic diagram of adjacent two conducting wires as shown in Figure 2.
Following will be combined with the drawings in the embodiments of the present invention, and technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art's every other embodiment obtained under that premise of not paying creative labor, shall fall within the protection scope of the present invention.
Referring to Fig. 1, its planar structure schematic diagram for multiple-printed-panel for circuit board in first embodiment of the invention.
As shown in Figure 1, circuit plate jigsaw 10 includes two circuit boards mutually spliced, described two circuit boards are respectively defined as first circuit board P1 and second circuit board P2, and first circuit board P1 mutually splices with second circuit board P2.For ease of description, the plane right-angle coordinate being made of two orthogonal first direction X and second direction Y is defined in the present embodiment.Wherein, first circuit board P1 and second circuit board P2 are along second direction Y arranged adjacent, and mutually splicing on X in a first direction.
It should be noted that in board production technique in order to improve the efficiency of circuit board process technique, usually multiple circuit boards being stitched together and carry out the production of element, multiple circuit boards are fixed on use and circuit board
In supporting frame made of identical material.Wherein, general on supporting frame and be not provided with conducting wire or circuit structure, and element on circuit boards complete after separation is cut off from circuit board.
Please continue to refer to Fig. 1, first circuit board P1 central symmetry identical and mutual with second circuit board P2 structure, that is to say, that first circuit board P1 rotates 180 ° with second circuit board P2 and is overlapped.Certainly, in other embodiments of the present invention, first circuit board P1 can also be connect in a manner of axisymmetric with second circuit board P2, be not limited thereto.
Wherein, first circuit board P1 includes that the first circuit region 100 of X arrangement along a first direction and second circuit area 200, the first circuit region 100 are connect with second circuit area 200 along second direction Y by the first jackknifing area B1.Certainly, because second circuit board P2 is identical as first circuit board P1 structure, this place is just repeated no more.It further include the second jackknifing area B2 that X extends along a first direction between second circuit board P2 and first circuit board P1, wherein, second jackknifing area B2 includes multiple through-holes, and through-hole is broken under external force convenient for the second jackknifing area B2, so that first circuit board P1 is separated from each other with second circuit board P2.
Wherein, the second jackknifing area B2 includes multiple first through hole H1 and multiple second through-hole H2, wherein first through hole H1 is circle, and the second through-hole H2 is integrally in long strip, and the opposite both ends of X are arc along a first direction.Preferably, the second jackknifing area B2 along a first direction X opposite end with the second through-hole H2 arc-shaped endpoint constitute notch.Pass through the setting of first through hole H1 and the second through-hole H2 as a result, when receiving the external force perpendicular to in-plane where the second jackknifing area B2, the second jackknifing area B2 can be easier to X along a first direction and break apart.
Further referring to Fig. 2, for the planar structure schematic diagram of first circuit board P1 as indicated with 1.
It is appreciated that first circuit board P1 and second circuit board P2 (Fig. 1) are with regard to the mutually independent board structure of circuit of formation separated from each other after the second jackknifing area B2 is broken apart under external force.
As shown in Fig. 2, X arranged adjacent is arranged the first circuit region 100 in a first direction with second circuit area 200, and is connected with each other by the first jackknifing area B1 along second direction Y in first circuit board P1.In the present embodiment, first circuit board P1 further includes Support 300 and third jackknifing area B3, wherein X is set side by side in a first direction with second circuit area 200 for Support 300, and is connected along second direction with the first circuit region 100 by third jackknifing area B3.Support 300 and second circuit area 200 are located at the opposite end of the first circuit region 100 X along a first direction.
Specifically, multiple functional circuits 101 and conducting wire 102 are provided in the first circuit region 100.The functional circuit 101 can be micro process integrated circuit, storage circuit, signal transmitting and receiving circuit etc..Conducting wire 102 can be the conducting wire of the connection functional circuit 101.
Second circuit area 200 includes bonding pad 201, and bonding pad 201 is interior including multiple mutually insulateds and along the conducting end 202 of second direction Y setting spaced apart.Bonding pad 201 is used to accept the circuit element being electrically connected with conducting end 202 or conductor wire (not shown).Certainly, the circuit that circuit element is perhaps connected by conductor wire can be test circuit for carrying out functional test for functional circuit 101 or conducting wire 102.Conducting end 202 is used to be electrically connected with the external test circuitry.Wherein it is possible to be electrically connected by modes such as welding.
Second circuit area 200 further includes registration holes 203 and tooling hole 204.Registration holes 203 are disposed adjacent with tooling hole 204, and are all set in second circuit area 200 along one end of second direction Y.Registration holes 203 are for being identified the position of first circuit board P1.Tooling hole 204 with other fixed equipments for connecting to be fixed for the first circuit board P1.
First jackknifing area B1 includes that a plurality of X along a first direction extends and along the second direction Y conducting wire 41 spaced apart being arranged, multiple conducting ends 202 in the bonding pad 201 and functional circuit 101 or conducting wire 102 in the first circuit region 100 is electrically connected in conducting wire 41, in other words, conducting end 202 and functional circuit 101 can be electrically connected in conducting wire 41, and conducting end 202 and conducting wire 102 can also be electrically connected.
First jackknifing area B1 has first size L1 along second direction, and the first circuit region 100 has the second size L2 with second circuit area 200 along a first direction, and the first size L1 is less than the second size L2.Specifically, the first jackknifing area B1 has at least one arc notch OP on second direction Y, preferably, the first jackknifing area B1 is respectively provided with the arc notch OP in the opposite end of second direction Y.The arc notch OP is used for when the first jackknifing area B1 receives external force convenient for fracture, so that second circuit area 200 is separated with the first circuit region 100.
Referring to Figure 2 together -3, Fig. 3 is the enlarged structure schematic diagram of two conducting wires 41 of arbitrary neighborhood as shown in Figure 2.As shown in Figure 3, arbitrary neighborhood two are respectively defined as the first conducting wire 41a and the second conducting wire 41b in a plurality of conducting wire 41, between first conducting wire 41a and the second conducting wire 42b along the spacing of second direction Y be first distance S1, the first conducting wire 41a second direction Y have the first width W1.Second conducting wire 41b has the second width W2 in second direction Y, wherein first distance S1 is greater than twice of minimum dimension in the first width W1 and second width W2 the two, to prevent two neighboring conducting wire 41 to be shorted, and the width of the first jackknifing area B1 can be allowed smaller.For example, the size of first distance S1 is greater than twice of the second width W2 size as a result, as shown in figure 3, the second width W2 is less than the first width W1.Preferably, in another embodiment, first distance S1 be greater than the first width W1 with it is maximum sized in second width W2 the two
2 times, in this way, can prevent from being shorted between adjacent two conducting wire 41.
Further, first circuit region 100 adjacent to the first jackknifing area B1 includes and has clearance zone 103, clearance zone 103 comprises only the extended line of a plurality of conducting wire 41, and other conducting elements are not set, to avoid when the first jackknifing area B1 fracture, other its conducting elements in conducting wire 41 and the first circuit region 100 are electrically connected and short circuit phenomenon occur.
Please continue to refer to Fig. 2, due to the functional circuit 101 or the electric connection of conducting wire 102 in multiple conducting ends 201, a plurality of conducting wire 41 and the first circuit region 100 and be connected, external test circuit then can be set to multiple conducting ends 201 in second circuit area 200 by electric connection as a result, and the functional circuit 101 or conducting wire 102 of the first circuit region 100 electrically conduct.Data exchange and concurrent testing with functional circuit 101 or conducting wire 102 can be realized in test circuit.After the completion of test circuit is for the test of functional circuit 101 or conducting wire 102, the first jackknifing area B1 is broken under external force, so that second circuit area 200 is separated from each other with the first circuit region 100.Other circuit elements since no setting is required in second circuit area 200, therefore conducting end 202 is arranged with enough spaces for it, and makes that there is sufficiently large distance between conducting end 202, therefore adjacent conducting end 202 can be effectively prevent short circuit phenomenon occur when being external test circuit welding.So when testing circuit by second circuit area 200 and the electric connection of the first circuit region 100, that is no setting is required in the first circuit region 100 and functional circuit 101 or the electric connection of conducting wire 102 for test circuit, namely test circuit will not in the first circuit 100 any conducting wire or circuit setting have an impact, improve testing efficiency and reliability.
Accordingly, conducting end and other conducting wires are not provided on Support 300, it is provided only with registration holes (not indicating) and location hole (not indicating), the shape and structure of third jackknifing area B3 between Support 300 and the first circuit region 100 can be identical as the first jackknifing area B1, includes multiple first through hole H1 and the second through-hole H2.Preferably, the notch that third jackknifing area B3 is constituted along the opposite end of second direction Y with the arc-shaped endpoint of the second through-hole H2.Thus, pass through the setting of first through hole H1 and the second through-hole H2, when receiving perpendicular to the external force of in-plane where third jackknifing area B3, third jackknifing area B3 can be easier to break apart along second direction Y, so that Support 300 is separated from each other with the first circuit region 100.
Production and the test process of multiple-printed-panel for circuit board 10 and first circuit board P1 are illustrated presently in connection with Fig. 1 and Fig. 2.
Firstly, multiple-printed-panel for circuit board 10 is formed from original plate as shown in Figure 1 has such as first circuit board P1 and second circuit board P2 structure interconnected.Wherein, first circuit board P1 and second circuit board P2 is logical
Cross the second jackknifing area B2 X connection along a first direction.Second circuit area 200 and Support 300 is respectively set at the both ends of the first circuit region 100 X along a first direction in each circuit board P1, the conducting end of test is set in second circuit area 200, it is not provided with conducting wire or element on Support 300, is only used for support and fixes the multiple-printed-panel for circuit board 10.And functional circuitry 101 and conducting wire 102 are provided on the first circuit region 100, conducting wire 102 is electrically connected by the conducting end 202 of conducting wire and second circuit area 200 across the first jackknifing area B1.
Secondly, apply external force perpendicular to in-plane where first circuit board P2 and second circuit board P2 to the second jackknifing area B2, so that X is broken the second jackknifing area B2 along a first direction, so that X is separated along a first direction with second circuit board P2 by first circuit board P2.
Again, the conducting end 202 of external test circuit and second circuit area 200 is welded, so that external test circuit is electrically conducted by conducting end 202, conducting wire 41 with functional circuit 101 and conducting wire 102.Starting test circuit work, so that perhaps conducting wire 102 carries out data interaction to be tested for functional circuit 101 or conducting wire 102 for test circuit and functional circuit 101.
Finally, after testing test of the circuit completion for functional circuit 101 or conducting wire 102, apply external force perpendicular to in-plane where first circuit board P1 to the first jackknifing area B1, so that the first jackknifing area B1 is broken along second direction Y, so that second circuit area 200 be separated with the first circuit region 100 along second direction Y.
Similarly, the third jackknifing area B3 between Support 300 and the first circuit region 100 is broken by mode above-mentioned, so that Support 300 is separated from each other with the first circuit region 100 in second direction Y.Wherein, the division of Support 300 can be at any time, such as before first circuit board P1 is separated with the 2nd P2 or after first circuit board P1 is separated with the 2nd P2 or the first circuit 100 separated with second circuit area 200 front and back be ok, be not defined.
It is understood that, above disclosed is only presently preferred embodiments of the present invention, of course, the scope of rights of the present invention cannot be limited by this, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and equivalent changes made in accordance with the claims of the present invention, it still belongs to the scope covered by the invention.
Claims (10)
- A kind of circuit board, the first circuit region and at least one second circuit area including being provided with conducting wire, first circuit region is connect by the first jackknifing area with the second circuit area, and the second circuit area is separated with first circuit region with the fracture in first jackknifing area, it is characterized in that, the second circuit area includes at least one conducting end, first jackknifing area includes at least one conducting wire, and the conducting end is electrically connected by the conducting wire in the conducting wire and first circuit region.
- Circuit board according to claim 1, it is characterized in that, first circuit region, first jackknifing area and the second circuit area are arranged along a first direction, first jackknifing area has first size along the second direction vertical with the first direction, first circuit region has the second size along the second direction with the second circuit area, and the first size is less than second size.
- Circuit board according to claim 2, which is characterized in that first jackknifing area includes at least one arc notch in this second direction.
- Circuit board according to claim 3, which is characterized in that opposite both ends are respectively provided with the arc notch in this second direction in first jackknifing area.
- Circuit board according to claim 2, it is characterized in that, two conducting wires of arbitrary neighborhood are defined as the first conducting wire and the second conducting wire at least one conducting wire, between first conducting wire and second conducting wire along the spacing of second direction be first distance, first conducting wire has the first width in the second direction, second conducting wire has the second width in the second direction, wherein the first distance is greater than twice of minimum dimension in first width and the second width.
- Circuit board according to claim 5, which is characterized in that first circuit region includes the clearance zone of neighbouring first jackknifing area setting, and the clearance zone comprises only at least one conducting wire along the extended line of the first direction.
- Circuit board according to claim 5, which is characterized in that the second circuit area includes bonding pad, at least one described conducting end is all set in the bonding pad, and the bonding pad is used to accept the electronic component or conductor wire being electrically connected with the conducting end.
- Circuit board according to claim 7, it is characterized in that, at least one described conducting end is used to be electrically connected with the test circuit outside the circuit board, the test circuit is electrically conducted with the conducting wire by the conducting end, the conducting wire and carries out data exchange and tested with being directed to the conducting wire, after the completion of the test for the conducting wire, the fracture of first jackknifing area under external force, the second circuit area are separated with first circuit region.
- Circuit board according to claim 5, it is characterized in that, the second circuit area further includes registration holes and tooling hole, the registration holes and the tooling hole are set to the second circuit area along one end of second direction, the registration holes are for being identified the position of the circuit board, and the tooling hole with other fixed equipments for connecting to be fixed for the circuit board.
- A kind of multiple-printed-panel for circuit board, it is characterized in that, circuit board including at least two as described in claim 2-9 any one, described two circuit boards pass through the second jackknifing area being arranged along a first direction and are connected with each other, second jackknifing area includes multiple through-holes, and the through-hole is convenient for the fracture of second jackknifing area under external force.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/090467 WO2019000257A1 (en) | 2017-06-28 | 2017-06-28 | Circuit board and circuit board panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109791176A true CN109791176A (en) | 2019-05-21 |
Family
ID=64741917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780060305.3A Pending CN109791176A (en) | 2017-06-28 | 2017-06-28 | Circuit board and multiple-printed-panel for circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109791176A (en) |
| WO (1) | WO2019000257A1 (en) |
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- 2017-06-28 WO PCT/CN2017/090467 patent/WO2019000257A1/en active Application Filing
- 2017-06-28 CN CN201780060305.3A patent/CN109791176A/en active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2019000257A1 (en) | 2019-01-03 |
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