CN109768034A - Pressure sensor module and pressure sensor device with pressure sensor module - Google Patents
Pressure sensor module and pressure sensor device with pressure sensor module Download PDFInfo
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- CN109768034A CN109768034A CN201811329884.XA CN201811329884A CN109768034A CN 109768034 A CN109768034 A CN 109768034A CN 201811329884 A CN201811329884 A CN 201811329884A CN 109768034 A CN109768034 A CN 109768034A
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- pressure sensor
- substrate
- pressure
- sensor module
- connecting element
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/90—Masterslice integrated circuits
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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- H01L2924/191—Disposition
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to the pressure sensor modules that one kind can be neatly packed into, it is with module carrier, module carrier has substrate, wherein, pressure sensor chip and the control being electrically connected with pressure sensor chip are electrically connected on substrate and with the printed conductor of substrate with analysis processing circuit arrangement, wherein, control has ASIC circuit part and passive electric components with analysis processing circuit, wherein, furthermore, the molding material for fully covering ASIC circuit part and passive component on substrate is arranged on substrate, wherein, molding material has on substrate leaves a blank, wherein, pressure sensor chip is arranged in leave a blank in and there with gel overlay object covering, wherein, there is the contact surface being electrically connected with control with analysis processing circuit on the contact side of assembly side in substrate.Pressure sensor module has electrical connecting element that is particularly molding, stretching out from module carrier, and electrical connecting element has high anti-medium and resistance to vibration.
Description
Technical field
The present invention relates to a kind of pressure sensor modules and a kind of pressure sensing with such pressure sensor module
Device equipment.Pressure sensor module be used to detect the pressure of fluid media (medium) and may be mounted at pressure sensor for this purpose
In equipment.This kind of pressure sensor apparatus is for example applied in automotive engineering, such as is applied in particulate filter or be used for
Particulate filter is applied in the engine control system with particulate filter and is applied in low pressure exhaust gas recycling
In or apply as tank pressure sensing device or in other manners apply.Diversity based on application possibility, exists
Demand to the pressure sensor module that can be neatly packed into, the pressure sensor module may be mounted to be applied with corresponding
In the matched pressure sensor apparatus of situation.Pressure sensor apparatus has and the matched press-in connection geometry of applicable cases
And shell structure, and the unit that pressure sensor module can be used as miniaturization is neatly packed into phase in different installation situations
In the shell receiving portion for the pressure sensor apparatus answered.
Background technique
Such as from a kind of pressure sensor module known to 10 2,010 039 599 A1 of DE.Known pressure sensor mould
Block can be mounted in pressure sensor apparatus in different installation situations.Therefore, it faces upward installationIt is equally possible like that with the installation in normal position, in the installation of facing upward, pressure
Sensor module overturns 180 ° of ground installations, and in the normal position, pressure sensor module is to deviate from pressure sensor chip
Side be fixed in shell receiving portion.In known pressure sensor module, at passive electric components and control and analysis
The part of reason circuit is externally exposed medium.Connecing between pressure sensor module and the printed conductor of pressure sensor apparatus
Touching is realized by bonding wire.These connections for anti-medium are designed, the gold bonding lead connection manufactured bothersomely may be
Required, this makes heating process become and improve manufacturing cost.In addition, bonding wire connection is nothing for vibrational loading
Resistance, in the most adverse case, bonding wire connection may be damaged due to the vibrational loading.
A kind of pressure sensor module as known to 10 2,016 201 847 A1 of DE, the pressure sensor module have
Module carrier, the module carrier have substrate.Pressure sensor chip and the control being electrically connected with pressure sensor chip with
Analysis processing circuit is arranged on the assembly side of substrate and is electrically connected with the printed conductor of substrate.Analysis processing circuit has
ASIC circuit part and passive electric components, the electric components are fully covered by the molding material being applied on the assembly side of substrate
Lid.Molding material have leaves a blank, wherein pressure sensor chip is arranged in leave a blank in and covered there with gel overlay object
Lid.The pressure sensor module can particularly advantageously, it is cheap and simply manufacture.ASIC circuit part and passive structure
Part is protected particularly well to prevent there is the medium of intrusion.In known pressure sensor module, in substrate away from assembly side
Contact side on be disposed with control with analyze the contact surface that is electrically connected of processing circuit, the contact surface is by being encased in sealing material
In material, can be conductive adhesive is electrically connected with the printed conductor of pressure sensor apparatus respectively.
Summary of the invention
The present invention relates to a kind of pressure sensor modules of type for forming the classification, wherein pressure sensor module
With the electrical connecting element stretched out from module carrier, wherein connecting element is respectively provided with longitudinal extension, wherein connecting element exists
Its side longitudinally extended looks up respectively with head section in portion at one end and has on its end away from head section
There is jointing, wherein head section has with direction perpendicular to the longitudinally-extending than corresponding in the plane for being parallel to substrate
Remaining section of connecting element bigger width in this direction, wherein the head section configuration of corresponding connecting element has face
To the flat contact surface of the contact side of substrate, the contact surface is welded directly to be attached on the contact side of substrate corresponding
On the electric interface of connecting element, wherein connecting element has elastic segments between head section and jointing respectively,
In, elastic segments have alternate bending section (wechselseitig), wherein what corresponding connecting element longitudinally extended at it
Side looks up, and from head section, direction assembles lateral bend and on the direction longitudinally extended on the first bending position
It is arranged on second bending position at the first bending position rear towards contact side and is so back bent, so that the phase of connecting element
The jointing answered is parallel to contact surface extension.
Pass through special configuration of the connecting element on pressure sensor module and fixation, pressure sensing according to the present invention
Device module can be realized the pressure in the case where connecting element is high simultaneously relative to the load-bearing capacity of vibrational loading and shake load
High resistance of the sensor module especially to iodine and diiodomethane.
By for protecting the known molding technique of ASIC circuit part and passive electric components and being welded on substrate
The combination of the special configuration of connecting element on downside is to realize pressure sensor module in different pressure sensor apparatus
In multiplicity application and high anti-medium combination.Connecting element can fully replace the key used in the prior art
Close wire connections, but due to its configuration and relative jitter load is stable and can directly set with pressure sensor
Standby printed conductor welds together.The connection much more cheap than the gluing connection used in the prior art can make
It makes.It is realized and the contact surface of substrate attached respectively by the configuration in order to weld the head section being arranged of connecting element
The connection of stable mechanical and electric-type.Flexiblely the connecting element of configuration respectively on two end on the one hand by with
The welded connecting of contact surface and on the other hand with the welded connecting of the printed conductor of pressure sensor apparatus and born relative to vibration
Lotus constructs particularly stablely.Pressure sensor module according to the present invention can be manufactured by the cheap standard method of cost.
Next, concept " pressure " for example describes such as partial pressure and/or absolute pressure and/or pressure difference and/or pressure
Curve and/or Pressure Development, such as in time.Such as pressure may also be related to the difference of multiple pressure.That is, pressure sensor
Module especially can be differential pressure measurement equipment, i.e., following equipment: the equipment setting is used for, and is detected in first pressure such as first
The difference of first pressure and second pressure for example between the second pressure in second pressure room in pressure chamber.For example, these are pressed
One in power room may relate to reference pressure chamber, such as the room with atmospheric pressure.Another pressure chamber can for example measure Jie
The pressure-loaded to be measured of matter.Other configurations are also possible.
Substantially, " fluid media (medium) " can be regarded as the arbitrary substance in fluid, especially gaseous state.Such as it can
Can relate to following substance: the substance is to arbitrary slowly shearing not with resistance.In general, the state of fluid can be temperature
It is relevant to spend relevant and/or pressure.Fluid media (medium) can be used as pure substance or exist as compounding substances.
Substantially, concept " molding material " describes a kind of arbitrary material, which can bear in the initial state
Molding process in a mold or in the tool.It is particularly likely to be related to hardenable material or material blends, the material
Material or material blends can form in the initial state, to harden and keep dimensionally stable.Molding material especially can be with
It including at least one plastics or a kind of plastic hybrid or also include at least one original material for plastics.For example,
Molding material may include at least one stir-in resin and/or artificial resin and/or thermosetting resin.It is also contemplated that other
Material.Molding material, which can be set, to be used for, at least partially around substrate together with component.Molding material, which can be set, to be used for, and is protected
Component is protected to prevent damaging due to caused by mechanical damage, pollution etc..Molding material can such configuration so that pressure sensing
Device chip is not molded material covering at least partly.
In addition, module carrier can have at least one pressure opening.Such as pressure opening can be or including penetrating
Drilling.
Pressure sensor chip is related to a kind of semiconductor substrate, and the semiconductor substrate is configured to, and detects fluid media (medium)
At least one pressure.Pressure sensor chip has diaphragm.Diaphragm for example can be exposed to the pressure of fluid media (medium) in side
And it is more or less consumingly bent under the influence of this.Pressure sensor chip can be constructed preferably by porous silicon.
In addition, pressure sensor chip is fully or partly with the covering of gel overlay object.The offer pair of gel overlay object
The protection of pressure sensor chip is to prevent external action.Gel is interpreted as a kind of decentralized system, and the decentralized system is by least two
A component part composition.Here, fixed component part constitutes spongiform, three-dimensional network, the hole of the network is by liquid
Or gas filling.Such as it may relate to Silica hydrogel.
Concept " control and analysis and processing unit " indicates electrical and/or electronics circuit, and the circuit setting is used for, visits
Survey and/or adjust at least one signal, especially electric signal.For example, control can have at least one with analysis and processing unit
ASIC circuit part (specific integrated circuit) and at least one passive electric components, such as capacitor.Substantially, it is also contemplated that
Other configurations.
The substrate of module carrier can be circuit board and including printed conductor.It is particularly likely to be related to LGA substrate (Land
Grid Array, planar lattice array).Printed conductor can be used for the electrical connection of electronic component.Printed conductor can be such as
By copper or gold manufacture.Substantially, it is also contemplated that other materials.Pressure sensor chip and control and analysis and processing unit
It is electrically connected with printed conductor.Sensor element and/or control especially can have pad with analysis and processing unit, the pad with
The bonding face of printed conductor is electrically connected.
The bonding face of printed conductor can be covered at least partially through protection materials.Protection materials, which can be set, to be used for,
The protection in para-linkage face is provided to prevent external action.Protection materials may include such as resin, especially epoxy resin or silicone
Glue.
It can be realized advantageous configuration and expansion scheme of the invention by the inclusion of feature in the dependent claims.
Advantageously, the first bending position of connecting element can be apart from substrate on the direction of connecting element longitudinally extended
Incline highest 3mm.Thus it is advantageously carried out, for required for arrangement of the pressure sensor module in pressure sensor apparatus
Installation space be small in terms of its lateral size.Because pressure sensor module can also be installed installing with to face upward or
Person is overturning the installation in " normal position " in 180 ° of position relative to it, as a result, pressure sensor module rotate so as to
Few installation space is also required in the case where the elastic segments for accommodating connecting element.
Particularly advantageously, the module carrier of the molding material with substrate and arrangement over the substrate is perpendicular to lining
There is mounting height, also, deviating from for jointing contacts the side of side and connecing for connecting element on the direction of the assembly side at bottom
The spacing of contacting surface is between the 60% and 100% of the mounting height of module carrier.By the measure, connecting element is on the one hand realized
Enough elasticity and on the other hand realize, pressure sensor module in normal position but also can not only face upward
It is simply installed in position.Jointing is located in two positions in the height of module carrier, without additional peace
Fill space.Therefore, the welding of the printed conductor of jointing and pressure sensor apparatus is easily realized in two positions.
Molding material can be partly also on the assembly side that the bottom left a blank is applied to substrate, also, pressure sensor
Chip is placed in molding material on the bottom left a blank.In this case, it can be realized further installation space to reduce,
Mode is, on the direction perpendicular to the assembly side of substrate, ASIC circuit part cloth between pressure sensor chip and substrate
It sets in molding material section.Reduce space requirement on substrate by the measure.It is combined as a result, with the configuration of connecting element
The especially short installation length of ground generation pressure sensor module.When pressure sensor module is measured designed for absolute pressure
When, which is particularly advantageous.
Pressure sensor module can advantageously have pressure opening, and the pressure opening construction is in the substrate.Pressure is opened
Mouth can have inner wall, and the inner wall carrys out limit only by the material of substrate.This can be simply manufactured, and mode is to incite somebody to action
Pressure opening is introduced into substrate, is especially introduced into circuit board substrates as drilling.
In addition, the pressure sensor apparatus with proposed pressure sensor module is advantageously, to pass in the pressure
In sensor module, pressure sensor apparatus has shell, and the shell has at least one pressure feed path, also, pressure
Sensor module so accommodates in the housing, so that pressure sensor module is fixed in shell receiving portion and covers there
Pressure feed path, wherein connecting element is welded on the printed conductor of pressure sensor apparatus with jointing.Pass through
It is welded to connect the particularly stable connection generated between connecting element and printed conductor.
Concept " shell " is related to arbitrarily molding element, and the element setting is used for, fully or partly surrounds
The component of equipment and further protect these components to prevent external action such as mechanical load or moisture.Shell may include to
Few a first shell part, especially housing baseWith at least one second shell part, especially shell
Lid.First shell part and second shell part can be connected with each other in locking manner with material.Title " first " and " second " housing section
Simple title can be considered as by dividing, and a plurality of types of first shells can be set without illustrating order of priority and being for example not excluded for
Exactly a type of possibility is distinguished in part and a plurality of types of second shell parts.Furthermore, it is possible to which there are additional
Housing parts, such as third housing parts.
Shell may include at least one shell receiving portion for accommodating pressure sensor module.Shell receiving portion is especially
It may relate to the recess portion in housing parts.Pressure sensor module can be fixed in shell receiving portion by sealing adhesive portion.
Shell can surround at least one pressure chamber.Pressure chamber can be sealed relative to other shell chambers or pressure chamber.Pressure passes
Sensor module can also be partially positioned in pressure chamber and be partially positioned in other shell chambers or pressure chamber simultaneously
And it is sealed relative to a housing parts or multiple housing parts.Pressure chamber especially can be following room: fluid media (medium) is extremely
A pressure accounts for leading in the chamber less, at least one described pressure is detected by equipment.
Shell can have one or two or more than two pressure feed path.Each pressure feed path can be with
With pressure-loaded, such as with the pressure-loaded of the pressure of measuring medium, external pressure or reference pressure, such as outside air.
Preferably, the pressure sensor chip of pressure sensor module can be by pressure feed path so and with pressure to be detected
The fluid media (medium) of power connects, which is detected by pressure sensor component.
It can be at least one other pressure-loaded pressure sensor chip by second pressure feed path.It is described another
Outer pressure preferably can be different from first pressure, however can also be consistent with first pressure, such as be equally used for executing calibration
And/or balance.
Advantageously, pressure sensor module can be mounted on pressure confession with the side equipped with gel overlay object of module carrier
To above channel.The embodiment is for example adapted for absolute pressure measurement or relative pressure measurement, such as suitable for fuel tank pressure
Force snesor.
Advantageously, pressure sensor module also can be set measures for pressure difference, also, the substrate of pressure sensor module
It can have pressure opening, the inner wall of the pressure opening carrys out limit only by the material of substrate.The contact side of substrate can be with
It is arranged in above the first pressure feed path of pressure sensor apparatus, thus pressure opening and first pressure feed path fluid
Connect likes.Contact side can by around the edge of pressure feed path, sealing adhesive portion in shell receiving portion it is viscous
It is connected on shell.The side equipped with gel overlay object of pressure sensor module can preferably by second pressure feed path with
Second pressure load.
Detailed description of the invention
Fig. 1 shows the cross section of the first embodiment of pressure sensor module according to the present invention,
Fig. 2 a shows the top view of the second embodiment of pressure sensor module according to the present invention,
Fig. 2 b shows the top view of the downside of the pressure sensor module in Fig. 2 a,
Fig. 3 shows tool, and there are two the vertical views of the downside of the 3rd embodiment of the pressure sensor module of pressure sensor chip
Figure,
Fig. 4 a shows the signal of the fourth embodiment of pressure sensor module according to the present invention, without connecting element
The cross section of property,
Fig. 4 b shows the perspectivity view of the fourth embodiment of pressure sensor module according to the present invention,
Fig. 4 c shows the top view of the downside of the fourth embodiment of pressure sensor module according to the present invention,
Fig. 4 d shows the side view of the fourth embodiment of pressure sensor module according to the present invention,
Fig. 5 shows the cross section of the embodiment of the pressure sensor apparatus with pressure sensor module,
Fig. 6 shows the segment A of the amplification in Fig. 5,
Fig. 7 shows the cross section of the other embodiment of the pressure sensor apparatus with pressure sensor module.
Specific embodiment
Fig. 1 shows the cross section of the illustrative first embodiment of pressure sensor module according to the present invention.Pressure passes
Sensor module 100 includes module carrier 101, and the module carrier has at least one substrate 102 and at least one molding material
110.Molding material 110 exists preferably in the use of sensor module 100 with the state of hardening.Substrate 102 can such as structure
Type is circuit board.In addition, substrate 102 can have the basic configuration of cuboid or plate shape.Substrate 114 can for example completely
Ground is partly manufactured by the epoxide resin material that glass fibre is reinforced.
Molding material 110 can be used for for example including flowable resinous material or artificial resin material and can be set,
The substrate is at least partly covered on the assembly side 103 of the substrate 102.
In addition, pressure sensor module has pressure opening 118, the pressure opening for example introduces substrate as drilling
In 102, so that the inner wall of pressure opening 118 is by the material of substrate come limit.Channel 119 connects the pressure opening of substrate 102
118, the channel for example across the molding material section 117 of molding material 110 and passes through adhesion layer 116, such as adhesive
Or solder be oriented to and terminated at diaphragm 106 with the groove of the blind-hole type of pressure sensor chip 105.
The construction that pressure sensor chip 105 is arranged in molding material 110 is that recess portion is left a blank in 111.Molding material 110
It partly can be also applied on the bottom for leaving a blank 111 on the assembly side 103 of substrate 102, also, pressure sensor chip
105 can be placed on the bottom for leaving a blank 111 by adhesion layer 116 molding material of molding material 110 as shown
On section 117.Pressure sensor chip 105 covers pressure opening 118 and is leaving a blank in 111 fully or partly with solidifying
Glue covering 113 covers.The setting of gel overlay object 113 is used for, and provides the protection to pressure sensor chip 105 to prevent external shadow
It rings and pressure is allowed to be transmitted on diaphragm 106.
In addition, pressure sensor module 100 has control and analysis processing circuit 107.Control and analysis processing circuit 107
It can be set and be used for, detect and/or adjust at least one signal.Control is arranged in the dress of substrate 102 with analysis processing circuit 107
With on side 103.Control has at least one ASIC circuit part 108 (specific integrated circuit) and nothing with analysis processing circuit 107
The electric components 109 in source, such as capacitor.Molding material 110 fully covers the ASIC circuit part 108 on substrate 102
With passive component 109.In terms of a possibility that controlling the configuration with analysis processing circuit, illustratively with reference in DE 10
Structure described in 2016 201 847 A1, and control and be not limited by the structure with analysis processing circuit.
Substrate 102 includes printed conductor 130.Pressure sensor chip 105 and control can examples with analysis processing circuit 107
Such as it is electrically connected by bonding wire interconnecting piece 114,115 with printed conductor 130.For this purpose, molding material section 117, which has, to be made
At least one groove 150 of the exposure of printed conductor 130, bonding wire interconnecting piece 114 pass through at least one described groove and are applied to
On printed conductor 130.
The bonding face of printed conductor 130 can cover in groove 150 at least partially through protection materials 112.Protection
Material 112, which can be set, to be used for, and provides the protection in para-linkage face to prevent external action.Protection materials 112 especially may include tree
Rouge, especially epoxy resin.Protection materials 112 can be covered with gel overlay object 113.
In the embodiment in figure 1, pressure sensor module is preferably provided for pressure difference measurement and can be opened by pressure
Mouth 118 is loaded with first pressure and is loaded by gel overlay object 113 with second pressure, the first pressure and second pressure
The two acts on 106 generation of diaphragm.
Illustrated in such external Fig. 1, pressure sensor module 100 has from module carrier 101 in side Xiang Shangshen
Electrical connecting element 120 out.Connecting element 120 is respectively provided with longitudinal extension L.It looks up, connects in the side that the longitudinal direction extends (L)
Element is respectively with head section 121 and in the end that it deviates from head section 121 on the end of module oriented approach carrier 101
It is upper that there is jointing 123.Head section 121 has with L perpendicular to the longitudinally-extending than phase in the plane for being parallel to substrate 102
The bigger width B of remaining section for the connecting element 120 answered, this can be seen best by Fig. 4 c.
121 configuration of head section of connecting element 120 has flat contact surface 132, back of the contact surface towards substrate 102
The contact side 104 of assembly side 103 from substrate.The electrical contact of each connecting element 120 corresponding with being attached to of connecting element 120
Face 131 is welded directly on the contact side 104 of substrate 102.
Connecting element 120 has elastic segments 122 between head section 121 and jointing 123 respectively, wherein bullet
Property section 122 be equipped with alternate bending section.Each connecting element 120 looks up in the side that it longitudinally extends L from head section 121
Setting out has the first bending position 124.First bending position 124 preferably looks up in the side for longitudinally extending L in the side of substrate 102
Arrange to 140 rear highest 3mm of rib.Connecting element 120 is bent on the first bending position 124 towards assembly side 103.Such as connect
Connecing element 120 can be relative to flat contact surface 132 with the angle bending between 30 ° and 90 °.In the direction for longitudinally extending L
On see, be disposed with the second bending position 125 at 124 rear of the first bending position.Connecting element 120 can be in the second bending position
It is so back bent on 125 towards contact side 104, so that the corresponding jointing 123 of connecting element 120 is parallel to contact surface
132 and substrate 102 extend.For example, connecting element 120 can be on the second bending position 125 relative to being arranged in the first bending
The section 127 of straight line between position 124 and the second bending position 125 is back bent the angle between 30 ° and 90 °.
As found out in Fig. 1 finely, the mould of the molding material 110 with substrate 102 and arrangement on substrate
Block carrier 101 has mounting height H on the direction perpendicular to the assembly side 103 of substrate 102.Mounting height H can for example have
There is the value between 2mm and 10mm.Side 133 and the contact of connecting element 121 away from contact side 104 of jointing 123
The spacing A in face 132 is preferably between the 60% and 100% of the mounting height H of module carrier 101.Preferably, jointing 123
In the region being located between the first plane and second plane parallel with first plane for extending through contact side 104
Extended with leaving 101 ground of module carrier on inherent lateral, second plane extend through molding material 110 away from contact side
104 outer surface 134.
Fig. 2 a shows the top view of the second embodiment of pressure sensor module according to the present invention, in the pressure sensing
In device module, pressure sensor chip 105 is directly arranged on substrate 102 by adhesion layer 116.That is, in this embodiment,
Saved molding material section 117, also, the groove 150 in molding material occupy leave a blank 111 entire bottom.Fig. 2 b with
Perspectivity view from below shows identical pressure sensor module, in the perspectivity view, it can be seen that pressure opening
118.As can be found out well in Fig. 2 a and 2b, module carrier 101 is preferably with the geometry of compact cuboid
Structure.
Fig. 3 shows the top view of the downside of the 3rd embodiment of pressure sensor module.In this embodiment, two pressure
Sensor chip 105 is arranged on module carrier 101.It can be seen that two pressure openings 118 in Fig. 3, in described two pressure
Overthe openings are respectively disposed with a pressure sensor chip.Two pressure sensor chips 3 can with identical control and point
Processing circuit 107 is analysed to connect.But it is also possible that two sseparated controls and analysis processing circuit are arranged on substrate 102
107.In addition, nature is it is also possible that setting more than two pressure sensor chip.
Fig. 4 a shows the schematical cross section of the fourth embodiment of pressure sensor module 100 according to the present invention,
In, connecting element is not shown.In this embodiment, pressure sensor module setting is for absolute pressure measurement or relative pressure
Measurement.Therefore, the not set pressure opening 118 in substrate 102.
As in fig.4 it can be seen that as, molding material 110 in Fig. 1 similarly partly also staying herein
Sky 111 bottom on be applied on the assembly side 103 of substrate 102, also, pressure sensor chip 105 leave a blank 111 bottom
On be placed in molding material.Due to eliminating pressure opening 118, it is possible to, in the assembly side 103 perpendicular to substrate 102
Side looks up, and ASIC circuit part 108 is economical space saving arranged in mould between pressure sensor chip 105 and substrate 102
Inside the molding material section 117 of prepared material 110.
Fig. 4 b shows the perspectivity view for the fourth embodiment.Fig. 4 c shows the top view of the downside of the embodiment,
The top view shows shape and the position of head section 121 particularly well.Fig. 4 d shows the side view of the embodiment.
Fig. 5 shows the embodiment of the pressure sensor apparatus 200 with pressure sensor module 100 according to the present invention
Cross section.The embodiment may for example be related to measuring for absolute pressure or the pressure sensor for relative pressure measurement is set
It is standby.Pressure sensor apparatus 200 has shell 200 made of such as plastics.Shell can be constructed for example in two style, described
Shell has housing bottom part 208 shown here and unshowned case lid.Shell 200 has a for example, at least pressure
Feed path 201, at least one described pressure feed path are arranged in from the pressure sleeve that housing bottom part 208 stretches out.Pressure
Force snesor module 100, such as pressure sensor module shown in Fig. 4 a to 4d are contained in shell 200.It can such as see
As out, shell 200 has the shell receiving portion 202 of channel-shaped.Pressure sensor module 100 is so fixed on the shell of channel-shaped
In receiving portion 202, so that the pressure sensor module covers pressure feed path 201, wherein module carrier 101 is equipped with
The side of gel overlay object 113 is preferably directly mounted on 201 top of pressure feed path and towards pressure feed path
201.Pressure sensor module 100 can be fixed by the circular sealing adhesive portion that pressure feed path 201 is sealed
In shell receiving portion 202.Therefore, the pressure in pressure feed path 201 can be transmitted to pressure by gel overlay object 113
On sensor chip 105.The connecting element 120 of pressure sensor module 100 is welded to pressure with its jointing 123
On the printed conductor 203 of sensor device 200.Printed conductor 203 can be the punching being for example ejected into housing bottom part 208
207 electricity of plug pin of grid route (Stanzgitterbahn), the punching grid route and pressure sensor apparatus 200
Connection.Fig. 6 is shown, and the stable welded connecting 204 between jointing 123 and printed conductor 203 can be easily manufactured.
Fig. 7 show one of the pressure sensor apparatus with pressure sensor module 100 according to the present invention it is other
The cross section of embodiment.The embodiment may for example be related to the pressure sensor apparatus measured for pressure difference.Pressure sensor is set
Standby 200 have shell 200 made of such as plastics.Shell can construct in two style, and the shell has housing bottom part
208 and case lid 205.Shell 200 has such as first pressure feed path 201, the first pressure feed path and fluid
Pipeline fitting connection.In addition, shell 200 has a such as second pressure feed path 201a, the second pressure feed path and outer
Connect to portion's connector 201b fluid-type.Pressure sensor module 100 --- pressure sensor module for example shown in FIG. 1
100 are contained in shell 200.The sealing plate (Dichtschwert) 206 at case lid 205, which is arranged in, hermetically to be sticked on
On the outer surface 134 of module carrier 101, thus, it is possible to structural contact room 209, the contact chamber is supplied relative to first pressure
Channel 201 and second pressure feed path 201a sealing.
As can be seen, shell 200 has the shell receiving portion 202 of channel-shaped.Pressure sensor module 100 is such
It is encased in the shell receiving portion 202 of channel-shaped, so that the contact side 104 of substrate 102 is arranged in the first of pressure sensor apparatus
201 top of pressure feed path.The substrate 102 of pressure sensor module 100 has pressure opening 118, the pressure opening
Inner wall can preferably carry out limit only by the material of substrate 102, also, the pressure supplies with being open fluid-type with first pressure
It is connected to channel 201.Contact side 104 can by around first pressure feed path 201 edge, in shell receiving portion
Sealing adhesive portion 212 in 202 is adhered on shell 200.Second pressure feed path 201a is connect with pressure chamber 211, in institute
State the side equipped with gel overlay object 113 that pressure sensor module 100 is also disposed in pressure chamber.Sealing adhesive portion 211 will
First feed path 201 is isolated with pressure chamber 211.Also in this embodiment, the connecting element 120 of pressure sensor module 100
It is welded on the printed conductor 203 of pressure sensor apparatus 200 with its jointing 123.
It can be found out well according to the entirely different structure of the pressure sensor apparatus in Fig. 5 and Fig. 7, it can be how
Neatly it is packed into pressure sensor module according to the present invention.Wherein, in all cases, it realizes steady relative to shake load
Fixed structure and ensure high anti-medium.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017219986.5 | 2017-11-09 | ||
| DE102017219986.5A DE102017219986A1 (en) | 2017-11-09 | 2017-11-09 | Pressure sensor module and pressure sensor device with a pressure sensor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109768034A true CN109768034A (en) | 2019-05-17 |
| CN109768034B CN109768034B (en) | 2024-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811329884.XA Active CN109768034B (en) | 2017-11-09 | 2018-11-09 | Pressure sensor module and pressure sensor device having the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109768034B (en) |
| DE (1) | DE102017219986A1 (en) |
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|---|---|---|---|---|
| US6298730B1 (en) * | 1997-12-11 | 2001-10-09 | Nagano Keiki Co., Ltd. | Pressure sensor |
| JP2008082903A (en) * | 2006-09-28 | 2008-04-10 | Citizen Miyota Co Ltd | Sensor module |
| CN101436585A (en) * | 2007-11-16 | 2009-05-20 | 塞米克朗电子有限及两合公司 | Power semiconductor module having a substrate and a pressure device |
| DE102010039599A1 (en) * | 2010-08-20 | 2012-02-23 | Robert Bosch Gmbh | Sensor module for receiving a pressure sensor chip and for mounting in a sensor housing |
| CN102460101A (en) * | 2009-05-20 | 2012-05-16 | 微型金属薄膜电阻器有限公司 | Pressure sensor |
| US20170160158A1 (en) * | 2014-08-19 | 2017-06-08 | Tyco Electronics AMP Korea Co. Ltd | Pressure Sensor |
| CN107240583A (en) * | 2016-03-29 | 2017-10-10 | 英飞凌科技股份有限公司 | multi-chip pressure sensor package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016201847A1 (en) | 2015-05-28 | 2016-12-01 | Robert Bosch Gmbh | Device for detecting a pressure of a fluid medium and method for producing the device |
-
2017
- 2017-11-09 DE DE102017219986.5A patent/DE102017219986A1/en active Pending
-
2018
- 2018-11-09 CN CN201811329884.XA patent/CN109768034B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6298730B1 (en) * | 1997-12-11 | 2001-10-09 | Nagano Keiki Co., Ltd. | Pressure sensor |
| JP2008082903A (en) * | 2006-09-28 | 2008-04-10 | Citizen Miyota Co Ltd | Sensor module |
| CN101436585A (en) * | 2007-11-16 | 2009-05-20 | 塞米克朗电子有限及两合公司 | Power semiconductor module having a substrate and a pressure device |
| CN102460101A (en) * | 2009-05-20 | 2012-05-16 | 微型金属薄膜电阻器有限公司 | Pressure sensor |
| DE102010039599A1 (en) * | 2010-08-20 | 2012-02-23 | Robert Bosch Gmbh | Sensor module for receiving a pressure sensor chip and for mounting in a sensor housing |
| US20170160158A1 (en) * | 2014-08-19 | 2017-06-08 | Tyco Electronics AMP Korea Co. Ltd | Pressure Sensor |
| CN107240583A (en) * | 2016-03-29 | 2017-10-10 | 英飞凌科技股份有限公司 | multi-chip pressure sensor package |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102017219986A1 (en) | 2019-05-09 |
| CN109768034B (en) | 2024-07-02 |
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