CN109742041B - Control method and equipment for substrate transfer - Google Patents
Control method and equipment for substrate transfer Download PDFInfo
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- CN109742041B CN109742041B CN201910012206.9A CN201910012206A CN109742041B CN 109742041 B CN109742041 B CN 109742041B CN 201910012206 A CN201910012206 A CN 201910012206A CN 109742041 B CN109742041 B CN 109742041B
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Abstract
The embodiment of the invention provides a control method and equipment for substrate transmission, wherein the method comprises the following steps: acquiring a sheet output request signal sent by a first procedure workbench, and generating a first control signal according to the sheet output request signal, wherein the first control signal is used for controlling a robot to convey a substrate output by the first procedure workbench to a substrate temporary storage device; and acquiring a substrate demand signal sent by a second procedure workbench, and generating a second control signal according to the substrate demand signal, wherein the second control signal is used for controlling the robot to transfer the substrate stored in the substrate temporary storage device to the second procedure workbench. According to the embodiment of the invention, the situation that the first working procedure workbench is blocked because the robot transmits the substrate in busy hours can be avoided, the substrate transmission between the two working procedures is buffered, the rhythm of the two working procedures is more matched, and the aim of improving the production efficiency is fulfilled.
Description
Technical Field
The embodiment of the invention relates to the technical field of manufacturing of liquid crystal display substrates, in particular to a method and equipment for controlling substrate transmission.
Background
The Display panel is an important component of a Liquid Crystal Display (LCD) and an Organic Light Emitting Diode (OLED) Display. A display panel, whether an LCD or an OLED, generally has a Thin Film Transistor (TFT) array substrate. Taking the LCD display panel as an example, the LCD display panel mainly comprises a TFT array substrate, a Color Filter (CF) substrate, and a Liquid Crystal Layer (Liquid Crystal Layer) disposed between the two substrates, and the operating principle is to apply a driving voltage to the TFT array substrate and the CF substrate to control the rotation of Liquid Crystal molecules in the Liquid Crystal Layer, so as to refract the light of the backlight module to generate a picture.
In the production process of the TFT substrate, the substrate needs to be subjected to processes of cleaning before chemical vapor deposition, chemical vapor deposition film formation, etching to sputtering, and the like.
However, the cleaning process before cvd and the cvd process are not in the same rhythm, which often causes the problem of the cleaning of the platen before cvd (the cleaned substrate cannot be sent to the platen in time and is jammed).
Disclosure of Invention
The embodiment of the invention provides a control method and equipment for conveying a substrate, which aim to solve the problem that the rhythm of a cleaning process before chemical vapor deposition and a chemical vapor deposition film forming process is inconsistent so as to improve the production efficiency.
In a first aspect, an embodiment of the present invention provides a method for controlling substrate transfer, including:
acquiring a sheet output request signal sent by a first procedure workbench, and generating a first control signal according to the sheet output request signal, wherein the first control signal is used for controlling a robot to convey a substrate output by the first procedure workbench to a substrate temporary storage device;
and acquiring a substrate demand signal sent by a second procedure workbench, and generating a second control signal according to the substrate demand signal, wherein the second control signal is used for controlling the robot to transfer the substrate stored in the substrate temporary storage device to the second procedure workbench.
In one possible design, the method further includes:
acquiring a sheet-in request signal sent by the first procedure workbench and the number of substrates stored in the substrate temporary storage device;
and generating a third control signal according to the substrate loading request signal and the number of the substrates, wherein the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
In one possible design, the generating a third control signal according to the die-in request and the number of the substrates includes:
and if the number of the substrates is less than the preset number of the substrates, generating the third control signal.
In one possible design, the acquiring a chip out request signal sent by a first process workbench and generating a first control signal according to the chip out request signal includes:
acquiring the current state of the robot;
if the current state is idle, generating the first control signal according to the chip output request;
and if the current state is a task execution state, acquiring a completion signal of the current task after the robot completes the current task, and generating the first control signal according to the film output request and the completion signal.
In one possible design, the first process stage is a substrate cleaning stage, and the second process stage is a substrate film forming stage.
In a second aspect, an embodiment of the present invention provides a control apparatus for substrate transfer, including:
the first generation module is used for acquiring a sheet output request signal sent by a first procedure workbench and generating a first control signal according to the sheet output request signal, wherein the first control signal is used for controlling the robot to convey a substrate output by the first procedure workbench to the substrate temporary storage device;
and the second generation module is used for acquiring a substrate demand signal sent by the second procedure workbench and generating a second control signal according to the substrate demand signal, wherein the second control signal is used for controlling the robot to convey the substrate stored in the substrate temporary storage device to the second procedure workbench.
In one possible design, the apparatus further includes:
the acquisition module is used for acquiring the sheet entering request signal sent by the first procedure workbench and the number of the substrates stored in the substrate temporary storage device;
and the third generating module is used for generating a third control signal according to the substrate loading request signal and the number of the substrates, and the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
In a possible design, the third generating module is specifically configured to generate the third control signal if the number of the substrates is smaller than a preset number of the substrates.
In a possible design, the first generating module is specifically configured to obtain a current state of the robot;
if the current state is idle, generating the first control signal according to the chip output request;
and if the current state is a task execution state, acquiring a completion signal of the current task after the robot completes the current task, and generating a first control signal according to the sheet output request and the completion signal, wherein the first control signal is used for controlling the robot to transmit the substrate output by the cleaning device to the substrate temporary storage device.
In one possible design, the first process stage is a substrate cleaning stage, and the second process stage is a substrate film forming stage.
In a third aspect, an embodiment of the present invention provides a control apparatus for substrate transfer, including: at least one processor and memory;
the memory stores computer-executable instructions;
the at least one processor executes computer-executable instructions stored by the memory to cause the at least one processor to perform the method of controlling substrate transfer as set forth in the first aspect and various possible designs of the first aspect.
In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, where computer-executable instructions are stored, and when a processor executes the computer-executable instructions, the method for controlling substrate transfer according to the first aspect and various possible designs of the first aspect is implemented.
According to the control method and the control equipment for substrate transfer provided by the embodiment, a robot is controlled to transfer a substrate output by a first process workbench to a substrate temporary storage device by acquiring a sheet output request signal sent by the first process workbench and according to the sheet output request signal; the situation that the first process workbench is blocked because the robot transmits the substrate in busy hours can be avoided, the substrate demand signal sent by the second process workbench is acquired, the second control signal is generated according to the substrate demand signal, the second control signal is used for controlling the robot to transmit the substrate stored in the substrate temporary storage device to the second process workbench, the buffering between the two workbenches can be realized, the rhythm of the two processes can be kept matched, and the purpose of improving the production efficiency is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first schematic structural diagram of a TFT substrate manufacturing line system according to an embodiment of the present invention;
fig. 2 is a first flowchart illustrating a method for controlling substrate transfer according to an embodiment of the present invention;
FIG. 3 is a second schematic structural diagram of a TFT substrate manufacturing line system according to another embodiment of the present invention;
fig. 4 is a second flowchart illustrating a method for controlling substrate transfer according to another embodiment of the present invention;
fig. 5 is a second flowchart illustrating a method for controlling substrate transfer according to yet another embodiment of the present invention;
fig. 6 is a second flowchart illustrating a method for controlling substrate transfer according to another embodiment of the present invention;
fig. 7 is a first schematic structural diagram of a control apparatus for substrate transfer according to an embodiment of the present invention;
fig. 8 is a second schematic structural diagram of a control apparatus for substrate transfer according to another embodiment of the present invention;
fig. 9 is a schematic diagram of a hardware structure of a control apparatus for substrate transfer according to an embodiment of the present invention;
fig. 10 is a comparison diagram illustrating the effects before and after the use of the method or apparatus for controlling substrate transfer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a TFT substrate manufacturing line system according to an embodiment of the present invention. Such as
As shown in fig. 1, the TFT substrate manufacturing line system includes: a first working procedure workbench 11, a second working procedure workbench 12, a robot 13, a loading and unloading position 14 and a controller. The first process stage 11 may be a substrate cleaning stage for cleaning a substrate before chemical vapor deposition, and the second process stage 12 may be a substrate deposition stage for chemical vapor deposition. A robot 13 for transferring a substrate to be cleaned from the loading/unloading station 14 to the first process table 11 under the control of the controller, for transferring the cleaned substrate from the first process table 11 to the second process table 12 under the control of the controller, and for transferring the film-formed substrate from the second process table 12 to the loading/unloading station under the control of the controller. The loading and unloading station 14 comprises a sub-loading and unloading station 141 and a carrier 142, wherein the sub-loading and unloading station 141 is used for storing the substrates to be processed and the substrates with finished film formation, the carrier 142 is used for transporting the substrates to be cleaned from the sub-loading and unloading station 141 to the operation area of the robot 13 under the control of the controller, and is also used for transporting the substrates with film formation from the operation area of the robot 13 to the sub-loading and unloading station 141 under the control of the controller. The sub-loading/unloading sites 141 may be plural, and the carrier 142 may move linearly in a region beside each sub-loading/unloading site 141 to transfer the substrate between the robot 13 and each sub-loading/unloading site 141. Alternatively, the controller may be a stand-alone device, and may further include a plurality of sub-controllers.
In the specific implementation process, the first process workbench 11 sends a sheet entering request signal to the controller, if the carrier is idle, the controller controls the carrier 142 of the loading and unloading station 14 to move to the sub loading and unloading station 141 storing the substrates to be cleaned according to the sheet entering request signal, the mechanical arm of the sub loading and unloading station 141 loads the substrates to be cleaned onto the carrier 142 under the control of the controller, the carrier 142 conveys the substrates to be cleaned into the operation area of the robot 13, the robot 13 horizontally rotates the mechanical arm to a first preset direction, the mechanical arm facing the carrier 142 and grabbing the substrates to be cleaned from the carrier 142 through the mechanical arm of the telescopic robot 13, after horizontally rotating the mechanical arm again to a second preset direction, the mechanical arm of the telescopic robot 13 places the substrates to be cleaned on the first process workbench 11, after the substrates to be cleaned are cleaned, the first process workbench 11 sends a sheet exiting request signal to the controller, if the idle controller of the robot arm of the robot 13 controls the robot 13 to rotate the arm to the second preset position according to the film-out request signal, the telescopic arm picks up the cleaned substrate, then the arm is rotated to the third preset position, the cleaned substrate is placed in the idle film-forming cavity of the second working procedure workbench 12 towards the second working procedure workbench 12, the second working procedure workbench 12 sends a film-forming completion signal to the controller after the cleaned substrate completes the film-forming working procedure, the controller controls the arm of the robot to rotate to the third preset position according to the film-forming completion signal, picks up the film-formed substrate, then controls the arm to rotate to the first preset position, places the film-formed substrate on the carrier 142 waiting in the operating area of the robot 13, the carrier 142 transports the film-formed substrate to the sub-loading and unloading position 141 under the control of the controller, the robot of the sub-loading/unloading station 141 transfers the film-formed substrate from the carrier 142 to the sub-loading station 141.
Therefore, in the process, the cycle of the film forming process of the second process workbench 12 is long relative to the cleaning process of the first process workbench 11, after the substrate is cleaned, the robot 13 needs to convey the substrate formed with the film by the second process workbench 12 to the loading position, and the cleaned substrate can be conveyed to the second process workbench 12 from the mechanical arm of the robot 13 only when the second process workbench 12 has a vacant film forming cavity, so that the mechanical arm of the robot 13 occupies for a long time, and the next cleaned substrate on the first process workbench 11 cannot be discharged in time, which causes the problem of blocking of the first process workbench 11. Therefore, the embodiment of the invention provides a control method for substrate transmission, so that the rhythm of the first process and the rhythm of the second process are matched, and the production efficiency is improved.
The following description will use specific embodiments to describe the control method for substrate transfer according to the embodiments of the present invention.
Fig. 2 is a first flowchart illustrating a method for controlling substrate transfer according to an embodiment of the present invention. As shown in fig. 2, the method includes:
s201, a chip output request signal sent by a first procedure workbench is obtained, and a first control signal is generated according to the chip output request signal and is used for controlling the robot to convey the substrate output by the first procedure workbench to a substrate temporary storage device.
Optionally, the first control signal is specifically used for controlling the robot to grab the cleaned substrate after the robot rotates the mechanical arm to the second preset position according to the first control signal, and then rotates the mechanical arm to the fourth preset position, and the cleaned substrate is placed on the substrate temporary storage device through the telescopic mechanical arm towards the substrate temporary storage device.
As shown in fig. 3, in the present embodiment, a substrate temporary storage device 15 is additionally arranged on the TFT substrate manufacturing production line system provided in the above embodiment, after the first process stage 11 sends a sheet output request signal, the controller generates a first control signal according to the sheet output request signal and sends the first control signal to the robot 13, and after the robot 13 rotates the arm to the second preset position according to the first control signal, the robot captures the cleaned substrate, then rotates the arm to the fourth preset position, faces the substrate temporary storage device 15, and places the cleaned substrate on the substrate temporary storage device 15 through the telescopic arm.
S202, a substrate demand signal sent by a second procedure workbench is obtained, and a second control signal is generated according to the substrate demand signal and used for controlling the robot to transfer the substrates stored in the substrate temporary storage device to the second procedure workbench.
Optionally, the second control signal is specifically used for controlling the robot to grab the cleaned substrate temporarily stored on the substrate temporary storage device after the robot rotates the arm to the fourth preset position according to the second control signal, and then, after the robot rotates the arm to the third preset position, the cleaned substrate is placed on the substrate temporary storage device through the telescopic mechanical arm.
As shown in fig. 3, after an idle film forming cavity appears on the second process working table 12, a substrate demand signal is sent to the controller, the controller generates a second control signal according to the substrate demand signal and sends the second control signal to the robot 13, the robot 13 rotates the arm to the fourth preset position according to the second control signal, then picks the cleaned substrate temporarily stored on the substrate temporary storage device 15, and then rotates the arm to the third preset position, and places the cleaned substrate on the substrate temporary storage device 15 through the telescopic mechanical arm.
Alternatively, the robot may perform the loading and unloading operations of the substrate to and from the second process stage at the same time under the control of the controller.
In the method for controlling substrate transfer provided by this embodiment, a robot is controlled to transfer a substrate output by a first process workbench to a substrate temporary storage device by acquiring a substrate output request signal sent by the first process workbench and according to the substrate output request signal; in the idle time between S201 and S202, the robot 13 may respond to other action requirements, and avoid the situation that the first process workbench is jammed due to the fact that the robot is busy or untimely transferring the substrate, by acquiring a substrate requirement signal sent by a second process workbench and generating a second control signal according to the substrate requirement signal, the second control signal is used for controlling the robot to transfer the substrate stored in the substrate temporary storage device to the second process workbench, the buffering between the two workbenches can be realized, the cycle from busy to idle of the robot 13 is shortened, the rhythms of the two processes are kept matched, and the purpose of improving the production efficiency is achieved.
Fig. 10 is a comparison graph of the effect before and after use of the method or apparatus for controlling substrate transfer according to an embodiment of the present invention, as shown in fig. 10, a comparison between before and after using the method or apparatus for controlling substrate transfer in a TFT substrate manufacturing line system shows that, in a process of forming a GI (Gate Insulator) layer, before optimization (before using the method or apparatus), an average film forming time per substrate is 109 seconds, and after optimization (after using the method or apparatus), an average film forming time per substrate is 98 seconds, which results in a significant improvement in efficiency, where the average number of seconds is reduced by 11 seconds, and the efficiency is improved by 10%; in the process of forming the ES (Etch-Stopper, ionization suppression) layer, the effect is better, before optimization (before the method or the equipment is adopted), the average film forming time of each substrate is 98 seconds, after optimization (after the method or the equipment is adopted), the average film forming time of each substrate is 69 seconds, the average number of seconds is reduced by 29 seconds, and the efficiency is improved by 30 percent.
Fig. 4 is a second flowchart illustrating a method for controlling substrate transfer according to another embodiment of the present invention.
As shown in fig. 4, the method includes:
s401, a chip output request signal sent by the first procedure workbench is obtained, and a first control signal is generated according to the chip output request signal and used for controlling the robot to convey the substrate output by the first procedure workbench to the substrate temporary storage device.
S402, a substrate demand signal sent by a second procedure workbench is obtained, and a second control signal is generated according to the substrate demand signal and used for controlling the robot to transfer the substrate stored in the substrate temporary storage device to the second procedure workbench.
In this embodiment, S401 and S402 are similar to S201 and S202 in the embodiment of fig. 2, and are not described again here.
And S403, acquiring the sheet-in request signal sent by the first procedure workbench and the number of the substrates stored in the substrate temporary storage device.
Optionally, the acquiring a film-in request signal sent by the first process workbench may include: after the first procedure workbench finishes cleaning the substrate to be cleaned, sending the wafer-in request signal; the controller receives the incoming request signal.
Optionally, the obtaining the number of the substrates of the substrate temporary storage device may include: the controller counts the chip-out request signals to obtain a first number, counts the substrate demand signals to obtain a second number, and obtains the substrate number according to the first number and the second number.
And S404, generating a third control signal according to the substrate loading request signal and the number of the substrates, wherein the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
Optionally, if the number of the substrates is greater than the preset number of the substrates, the robot is controlled to delay for a preset time and then convey the substrates stored in the loading and unloading positions to the first process workbench.
According to the endpoint detection method provided by the embodiment, whether the robot transmits the substrates stored in the loading and unloading positions to the first process workbench is controlled according to the loading request signals and the number of the substrates, so that the rhythm of the first process can be adjusted according to the number of the substrates stored in the substrate temporary storage device, and the phenomenon that the first process workbench continuously feeds the substrates to cause sheet blockage due to mismatching with the rhythm of the second process or the breakdown of the second process workbench is avoided.
Fig. 5 is a second flowchart illustrating a method for controlling substrate transfer according to yet another embodiment of the present invention.
As shown in fig. 5, the method includes:
s501, a chip output request signal sent by a first procedure workbench is obtained, and a first control signal is generated according to the chip output request signal and used for controlling the robot to convey the substrate output by the first procedure workbench to the substrate temporary storage device.
S502, a substrate demand signal sent by a second procedure workbench is obtained, and a second control signal is generated according to the substrate demand signal and used for controlling the robot to transfer the substrates stored in the substrate temporary storage device to the second procedure workbench.
In this embodiment, S501 and S502 are similar to S201 and S202 in the embodiment of fig. 2, and are not described again here.
S503, acquiring the sheet-in request signal sent by the first procedure workbench and the number of the substrates stored in the substrate temporary storage device.
In this embodiment, S503 is similar to S403 in the embodiment of fig. 4, and is not described herein again.
And S504, if the number of the substrates is less than the preset number of the substrates, generating a third control signal, wherein the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
Optionally, predetermine base plate quantity and can be unanimous with temporary storage's hardware capacity, temporary storage's hardware restriction will plan predetermineeing quantity generally when setting up temporary storage, and temporary storage is used for short transit buffering, does not need too much capacity, predetermines the restriction and holds maximum base plate quantity + the robot demand and hold maximum base plate quantity for first process workstation demand, and temporary storage's hardware capacity is predetermine restriction + the surplus.
For example: the first procedure workbench needs to accommodate 3 substrates, the robot needs to accommodate 1 substrate, and the preset limit is 3+1 and is set to 4; if the margin is 2, the hardware capacity of the temporary storage device is 4+2, and the design is 6, and the number of the corresponding preset substrates can be 6.
In this embodiment, if the number of the substrates stored in the substrate temporary storage device is smaller than the preset number of the substrates, it indicates that the substrate temporary storage device has enough space to store the subsequently cleaned substrates, and therefore, the controller generates the third control signal based on this, so as to control the robot to immediately transfer the substrates to be cleaned stored in the loading and unloading position to the first process worktable.
According to the control method for conveying the substrate, when the number of the substrates is smaller than the preset number of the substrates, the robot is controlled to convey the substrates stored in the loading and unloading positions to the first process workbench, so that the rhythm of each process can be matched, the production efficiency is improved, and the phenomenon that the first process workbench continuously feeds the substrate to cause the substrate blocking due to the fact that the rhythm of each process is not matched with that of the second process or the second process workbench is down is avoided.
Fig. 6 is a second flowchart illustrating a method for controlling substrate transfer according to another embodiment of the present invention.
As shown in fig. 6, the method includes:
s601, acquiring the current state of the robot.
Optionally, the current state of the robot is determined according to a control signal sent to the robot last time and a received feedback signal sent by the robot last time, where the control signal includes the first control signal, the second control signal and the third control signal, the feedback signal includes a completion signal corresponding to the first control signal, and the completion signal corresponding to the second control signal and the completion signal corresponding to the third control signal.
S602, if the current state is idle, generating the first control signal according to the chip-out request.
Optionally, after the last control signal is sent to the robot and a completion signal corresponding to the control signal is received, it is determined that the robot is in an idle state.
S603, if the current state is a task execution state, obtaining a completion signal of the current task after the robot completes the current task, and generating the first control signal according to the film-out request and the completion signal.
Optionally, if the time of the received last completion signal sent by the robot is earlier than the time of the last control signal sent by the robot to the robot, it is determined that the current state is the task execution state.
S604, a substrate demand signal sent by a second procedure workbench is obtained, and a second control signal is generated according to the substrate demand signal and used for controlling the robot to transfer the substrates stored in the substrate temporary storage device to the second procedure workbench.
In this embodiment, S604 is similar to S202 in the embodiment of fig. 2, and is not described here again.
According to the control method for substrate conveying provided by the embodiment, the robot is controlled to respond to the film output request signal according to the current state of the robot, so that the response time of the film output request signal can be shortened, the production efficiency is improved, and the phenomenon that a first process worktable is blocked is avoided.
Fig. 7 is a first schematic structural diagram of a control apparatus for substrate transfer according to an embodiment of the present invention. As shown in fig. 7, the control apparatus 70 for substrate transfer includes: a first generating module 701 and a second generating module 702.
The first generating module 701 is configured to acquire a sheet output request signal sent by the first process workbench and generate a first control signal according to the sheet output request signal, where the first control signal is used to control the robot to transfer the substrate output by the first process workbench to the substrate temporary storage device.
Optionally, the first control signal is specifically used for controlling the robot to grab the cleaned substrate after the robot rotates the mechanical arm to the second preset position according to the first control signal, then rotates the mechanical arm to the fourth preset position, faces the substrate temporary storage device, and places the cleaned substrate on the substrate temporary storage device through the telescopic mechanical arm
A second generating module 702, configured to obtain a substrate demand signal sent by a second process workstation, and generate a second control signal according to the substrate demand signal, where the second control signal is used to control the robot to transfer a substrate stored in the substrate temporary storage device to the second process workstation.
Optionally, the second control signal is specifically used for controlling the robot to grab the cleaned substrate temporarily stored on the substrate temporary storage device after the robot rotates the arm to the fourth preset position according to the second control signal, and then, after the robot rotates the arm to the third preset position, the cleaned substrate is placed on the substrate temporary storage device through the telescopic mechanical arm.
According to the control equipment for conveying the substrate, which is provided by the embodiment of the invention, the robot is controlled to convey the substrate output by the first procedure workbench to the substrate temporary storage device by acquiring the sheet output request signal sent by the first procedure workbench and according to the sheet output request signal; the situation that the first process workbench is blocked because the robot transmits the substrate in busy hours can be avoided, the substrate demand signal sent by the second process workbench is acquired, the second control signal is generated according to the substrate demand signal, the second control signal is used for controlling the robot to transmit the substrate stored in the substrate temporary storage device to the second process workbench, the buffering between the two workbenches can be realized, the rhythm of the two processes can be kept matched, and the purpose of improving the production efficiency is achieved.
Fig. 8 is a second schematic structural diagram of a control apparatus for substrate transfer according to another embodiment of the present invention. As shown in fig. 8, the control apparatus 80 for substrate transfer further includes: an obtaining module 703 and a third generating module 704.
In an embodiment, the obtaining module 703 is configured to obtain a substrate entering request signal sent by the first process stage and the number of substrates stored in the substrate temporary storage device.
Optionally, the acquiring a film-in request signal sent by the first process workbench may include: after the first procedure workbench finishes cleaning the substrate to be cleaned, sending the wafer-in request signal; the controller receives the incoming request signal.
Optionally, the acquiring the number of the substrates of the substrate temporary storage device may include: the controller counts the chip-out request signals to obtain a first number, counts the substrate demand signals to obtain a second number, and obtains the substrate number according to the first number and the second number.
A third generating module 704, configured to generate a third control signal according to the substrate loading request signal and the number of substrates, where the third control signal is used to control the robot to transfer the substrate stored in the loading/unloading station to the first process workbench.
Optionally, if the number of the substrates is greater than the preset number of the substrates, the robot is controlled to delay for a preset time and then convey the substrates stored in the loading and unloading positions to the first process workbench.
In an embodiment, the third generating module 704 is specifically configured to generate the third control signal if the number of the substrates is smaller than a preset number of substrates.
In a specific embodiment, the first generating module 701 is specifically configured to obtain a current state of the robot;
if the current state is idle, generating the first control signal according to the chip output request;
and if the current state is a task execution state, acquiring a completion signal of the current task after the robot completes the current task, and generating a first control signal according to the sheet output request and the completion signal, wherein the first control signal is used for controlling the robot to transmit the substrate output by the cleaning device to the substrate temporary storage device.
Optionally, the first generating module 701 is specifically configured to determine the current state of the robot according to a control signal sent to the robot last time and a received feedback signal sent by the robot last time, where the control signal includes the first control signal, the second control signal and the third control signal, the feedback signal includes a completion signal corresponding to the first control signal, and the completion signal corresponding to the second control signal and the completion signal corresponding to the third control signal.
Optionally, the first generating module 701 is specifically configured to determine that the robot is in an idle state if a completion signal corresponding to the control signal is received after the last control signal is sent to the robot.
Optionally, the first generating module 701 is specifically configured to determine that the current state is the task execution state if a time of a received last completion signal sent by the robot is earlier than a time of a last control signal sent by the robot to the robot.
In one embodiment, the first process stage is a substrate cleaning stage, and the second process stage is a substrate film forming stage.
The endpoint detection device provided in an embodiment of the present invention may be used to implement the above method embodiments, and the implementation principle and technical effect are similar, which are not described herein again.
Fig. 9 is a schematic diagram of a hardware structure of a control apparatus for substrate transfer according to an embodiment of the present invention. As shown in fig. 9, the control apparatus 90 for substrate transfer provided by the present embodiment includes: at least one processor 901 and memory 902. The control apparatus 90 for substrate transfer further includes a communication part 903. The processor 901, the memory 902, and the communication section 903 are connected by a bus 904.
In a specific implementation process, the at least one processor 901 executes the computer-executable instructions stored in the memory 902, so that the at least one processor 901 executes the control method of substrate transfer performed by the control apparatus 90 of substrate transfer as described above.
When this embodiment is implemented as a stand-alone device, communication with the first process table, the second process table, the robot, and the loading/unloading station can be performed through the communication part 903.
For a specific implementation process of the processor 901, reference may be made to the above method embodiments, which implement principles and technical effects are similar, and details of this embodiment are not described herein again.
In the embodiment shown in fig. 9, it should be understood that the Processor may be a Central Processing Unit (CPU), other general-purpose processors, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in a hardware processor, or in a combination of the hardware and software modules within the processor.
The memory may comprise high speed RAM memory and may also include non-volatile storage NVM, such as at least one disk memory.
The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended ISA (EISA) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, the buses in the figures of the present application are not limited to only one bus or one type of bus.
The present application also provides a computer-readable storage medium having stored therein computer-executable instructions that, when executed by a processor, implement a control method of substrate transfer performed by the control apparatus of substrate transfer as above.
The present application also provides a computer-readable storage medium having stored therein computer-executable instructions that, when executed by a processor, implement a control method of substrate transfer performed by the control apparatus of substrate transfer as above.
The computer-readable storage medium may be implemented by any type of volatile or non-volatile memory device or combination thereof, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk. Readable storage media can be any available media that can be accessed by a general purpose or special purpose computer.
An exemplary readable storage medium is coupled to the processor such the processor can read information from, and write information to, the readable storage medium. Of course, the readable storage medium may also be an integral part of the processor. The processor and the readable storage medium may reside in an Application Specific Integrated Circuits (ASIC). Of course, the processor and the readable storage medium may also reside as discrete components in the apparatus.
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. A method of controlling substrate transfer, comprising:
acquiring a sheet output request signal sent by a first procedure workbench, and generating a first control signal according to the sheet output request signal, wherein the first control signal is used for controlling a robot to convey a substrate output by the first procedure workbench to a substrate temporary storage device;
acquiring a substrate demand signal sent by a second procedure workbench, and generating a second control signal according to the substrate demand signal, wherein the second control signal is used for controlling the robot to transfer the substrate stored in the substrate temporary storage device to the second procedure workbench;
acquiring a sheet-in request signal sent by the first procedure workbench and the number of substrates stored in the substrate temporary storage device;
and generating a third control signal according to the substrate loading request signal and the number of the substrates, wherein the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
2. The method of claim 1, wherein generating a third control signal according to the tile request and the number of substrates comprises:
and if the number of the substrates is less than the preset number of the substrates, generating the third control signal.
3. The method of claim 1, wherein the obtaining a clip out request signal sent by a first process stage and generating a first control signal according to the clip out request signal comprises:
acquiring the current state of the robot;
if the current state is idle, generating the first control signal according to the chip output request;
and if the current state is a task execution state, acquiring a completion signal of the current task after the robot completes the current task, and generating the first control signal according to the film output request and the completion signal.
4. The method according to any one of claims 1 to 3, wherein the first process stage is a substrate cleaning stage, and the second process stage is a substrate film forming stage.
5. A control apparatus for substrate transfer, comprising:
the first generation module is used for acquiring a sheet output request signal sent by a first procedure workbench and generating a first control signal according to the sheet output request signal, wherein the first control signal is used for controlling the robot to convey a substrate output by the first procedure workbench to the substrate temporary storage device;
and the second generation module is used for acquiring a substrate demand signal sent by the second procedure workbench and generating a second control signal according to the substrate demand signal, wherein the second control signal is used for controlling the robot to convey the substrate stored in the substrate temporary storage device to the second procedure workbench.
6. The apparatus of claim 5, further comprising:
the acquisition module is used for acquiring the sheet entering request signal sent by the first procedure workbench and the number of the substrates stored in the substrate temporary storage device;
and the third generating module is used for generating a third control signal according to the substrate loading request signal and the number of the substrates, and the third control signal is used for controlling the robot to convey the substrates stored in the loading and unloading positions to the first working procedure workbench.
7. The apparatus of claim 6, wherein the third generating module is specifically configured to generate the third control signal if the number of substrates is less than a preset number of substrates.
8. The device according to claim 5, wherein the first generating module is specifically configured to obtain a current state of the robot;
if the current state is idle, generating the first control signal according to the chip output request;
and if the current state is a task execution state, acquiring a completion signal of the current task after the robot completes the current task, and generating a first control signal according to the sheet output request and the completion signal, wherein the first control signal is used for controlling the robot to transmit the substrate output by the cleaning device to the substrate temporary storage device.
9. The apparatus according to any one of claims 5 to 8, wherein the first process stage is a substrate cleaning stage and the second process stage is a substrate film forming stage.
10. A control apparatus for substrate transfer, comprising: at least one processor and memory;
the memory stores computer-executable instructions;
the at least one processor executing the computer-executable instructions stored by the memory causes the at least one processor to perform the method of controlling substrate transfer of any of claims 1 to 4.
11. A computer-readable storage medium having stored therein computer-executable instructions that, when executed by a processor, implement the method of controlling substrate transfer according to any one of claims 1 to 4.
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| JP6817757B2 (en) * | 2016-09-16 | 2021-01-20 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate transfer method |
| CN108689171A (en) * | 2018-08-02 | 2018-10-23 | 张家港康得新光电材料有限公司 | A kind of control method, device, equipment and the medium of glass substrate transmission |
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| CN108335997A (en) * | 2017-01-17 | 2018-07-27 | 株式会社荏原制作所 | Scheduler, substrate board treatment and board carrying method |
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