CN109739325B - A server for wisdom high-speed railway data center - Google Patents
A server for wisdom high-speed railway data center Download PDFInfo
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- CN109739325B CN109739325B CN201910019510.6A CN201910019510A CN109739325B CN 109739325 B CN109739325 B CN 109739325B CN 201910019510 A CN201910019510 A CN 201910019510A CN 109739325 B CN109739325 B CN 109739325B
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- 230000017525 heat dissipation Effects 0.000 claims description 69
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
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Abstract
本发明属于电子通信设备技术领域，具体涉及一种用于智慧高铁数据中心的服务器。该服务器为含有散热系统的机架式服务器，散热系统包括塔式部件和换流部件，塔式部件分别连接在服务器阵列的CPU芯片和北桥芯片处；包括导热座，导热管、第一散热鳍片、第二散热鳍片和换热风扇；塔式部件通过引流管与换流部件连通，换流部件位于服务器的机柜外部，包括循环泵、冷凝管、制冷器和补充器，塔式部件和换流部件均与散热系统的控制模块电连接。该型服务器配置了新型散热系统，不仅具有更高散热效率，还具有更高的安全性，提高了服务器的性能。
The invention belongs to the technical field of electronic communication equipment, and in particular relates to a server for a smart high-speed rail data center. The server is a rack-type server with a cooling system. The cooling system includes tower components and converter components. The tower components are respectively connected to the CPU chip and the north bridge chip of the server array. fins, second radiating fins and heat exchange fans; the tower components are communicated with the exchange components through the draft tube, and the exchange components are located outside the cabinet of the server, including circulating pumps, condenser pipes, refrigerators and supplements, and the tower components and The converter components are all electrically connected with the control module of the cooling system. This type of server is equipped with a new cooling system, which not only has higher cooling efficiency, but also has higher security and improves the performance of the server.
Description
Technical Field
The invention belongs to the technical field of electronic communication equipment, and particularly relates to a server for an intelligent high-speed rail data center.
Background
The high-speed rail is short for the electrified high-speed railway, and the running speed of a locomotive in the railway system can reach more than 200 km/h. The running speed of the high-speed rail is very fast, so the safety is the problem which is considered by people primarily, the environment needs to be monitored in real time in the running process of the high-speed rail, and the stable running of a railway system is ensured by adjusting according to environmental factors and the running condition of a locomotive. A large amount of data needs to be processed in the running process of the high-speed railway, so the server of the high-speed railway control center has relatively high operation performance; meanwhile, the safety and stability of the data center are guaranteed, and faults are avoided.
The server is a device which bears computing services, responds to service requests and has the capability of guaranteeing the services. The server is constructed to include a processor, a hard disk, a memory, a system bus, etc., similar to a general-purpose computer architecture, but requires high processing power, stability, reliability, security, scalability, manageability, etc., due to the need to provide highly reliable services. In the operation process of the server, a large amount of heat is generated by the chip and the parts, the temperature of the chip is increased due to the heat, the performance of the chip is reduced due to high temperature, and the service life of the server is seriously reduced even. Therefore, how to effectively dissipate heat of the device becomes an important measure for improving service performance and safety.
The conventional server heat dissipation system comprises air cooling heat dissipation and liquid cooling heat dissipation, and the air cooling heat dissipation takes away heat locally generated by equipment in a mode that a fan rotates to increase air convection, so that the heat dissipation and cooling effects are achieved. But in the place that equipment density is higher, the space is narrow and small, the effect of this kind of heat dissipation mode can greatly reduced. The liquid cooling heat dissipation is to replace the heat dissipation fins in the air cooling heat dissipation device with heat pipes, then fill the heat conduction medium in the heat pipes, and make the heat conduction medium flow through the circulating pump, thereby achieving the effects of absorbing heat and increasing the heat dissipation area. However, the heat dissipation method has the safety risks of heat conducting medium leakage, equipment pollution or damage, and the daily maintenance cost is higher, so that the heat dissipation method is less applied to the conventional server equipment.
Based on the above contents, it can be found that the stability, safety and stability of air-cooled heat dissipation are high, but the noise is high during working, the heat dissipation efficiency is relatively low, and the application scene is limited; the radiating efficiency of liquid cooling is higher, can be applied to the narrow and small place in space, but the security is lower. If a novel heat dissipation system can be developed, the defects of the heat dissipation mode are overcome, and the operational performance and the safety of the server are greatly improved.
Disclosure of Invention
The invention aims to provide a server for an intelligent high-speed rail data center, which is provided with a novel heat dissipation system, has higher heat dissipation efficiency and higher safety and improves the performance of the server.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a server for an intelligent high-speed rail data center is a rack server and comprises a cabinet, a server array, a storage system, a power supply system and a heat dissipation system, wherein the heat dissipation system comprises a tower-type component and a current conversion component, and the tower-type component is respectively connected to a CPU chip and a north bridge chip of the server array;
the tower type part comprises a heat conduction seat attached to a CPU chip and a north bridge chip, a plurality of channels which are parallel to each other and are in contact with each other are arranged in the heat conduction seat, a heat conduction pipe penetrates through the channels, the whole heat conduction pipe is U-shaped, the part of the heat conduction pipe positioned in the heat conduction seat is horizontally arranged, the heat conduction pipe is bent and vertically arranged after being led out of the heat conduction seat, a plurality of first heat dissipation fins which are perpendicular to the surface of the heat conduction seat and are parallel to each other are arranged on the back of the heat conduction seat, second heat dissipation fins are arranged above the first heat dissipation fins and are horizontally arranged, and the heat conduction pipe penetrates through all heat dissipation fins in the second heat dissipation fins respectively; the heat exchange fans are arranged on one group of side surfaces of the second radiating fins and are opposite in position;
two ends of a heat conduction pipe in the tower type component are communicated with the current conversion component through a drainage pipe, the single current conversion component is simultaneously connected with one or more tower type components, the current conversion component is positioned outside a cabinet of the server and comprises a circulating pump, a condensation pipe, a refrigerator and a replenisher, the circulating pump and the condensation pipe form a closed circulating pipeline through the drainage pipe and the heat conduction pipe, the condensation pipe is spiral, and the condensation pipe is positioned in the refrigerator; a heat-conducting medium is arranged in the storage tank connected with the replenisher, and is extracted or filled into the circulating pipeline from the replenisher through the inlet and outlet valves;
and the tower component and the current conversion component are electrically connected with a control module of the heat dissipation system.
Preferably, the number of the heat conduction pipes is more than four; two adjacent heat conduction pipes are led out from the heat conduction seat, and when the heat conduction pipes penetrate through the second heat dissipation fins, the vertical parts in the second heat dissipation fins are sequentially and inwardly deviated, so that the vertical parts of the heat conduction pipes are positioned on different planes, and gaps are formed between the adjacent heat conduction pipes.
Preferably, the heat exchanging fan is disposed on a side surface of the second heat dissipating fin opposite to the U-shaped opening of the heat conducting pipe, and the circulating airflow formed by the heat exchanging fan passes through the second heat dissipating fin at the U-shaped opening of the heat conducting pipe.
The heat conduction pipes are distributed according to the special mode, so that the effect of the heat exchange fan for accelerating air convection can be improved; the blocking of the gaps in the second heat dissipation fins by the heat conduction pipes is avoided.
Preferably, an opening is formed in the center of the first heat dissipation fin on the heat conduction seat, a temperature sensor is arranged in the opening, and the temperature sensor is electrically connected with a control module of the heat dissipation system.
Preferably, a pressure gauge is arranged in the circulating pipeline formed by the heat conduction pipe and the current conversion component, and the pressure gauge is used for detecting the pressure of the heat conduction medium in the circulating pipeline; the pressure gauge is electrically connected with the control module.
Preferably, the refrigerator is formed by connecting a compressor, a condenser, a restrictor and an evaporator in sequence to form a vapor compression refrigeration system, and the refrigerant used in the refrigerator is an environment-friendly refrigerant R407.
Preferably, the heat pipe and the heat conducting seat are made of copper metal, and the first radiating fins and the second radiating fins are made of copper or aluminum metal; the drainage tube is made of flexible material high polymer material.
The first heat dissipation fins and the second heat dissipation fins can be made of aluminum metal besides copper metal, and the cost is properly reduced in consideration of the heat conduction performance. The drainage tube and the current conversion component are mainly located outside the cabinet of the server, so that the drainage tube is suitable for being produced by utilizing flexible materials, and the drainage tube is convenient to arrange and store.
Preferably, the heat-conducting medium is pure water, methanol or silicone oil. The heat-conducting medium needs to be a material which has good heat-conducting efficiency, higher specific heat capacity, lower freezing point and no corrosion effect, and other media meeting the conditions can be selected besides the materials.
When the heat dissipation system in the server is installed, the tower type component is installed on the surfaces of a CPU chip, a north bridge chip and other high-heating components, the heat conducting seat is attached to the surfaces of the chips, the chips are tightly combined by using heat conducting grease, then the chips are fixed by using a fastener or other fasteners, and the tower type component is electrically connected with the control module by using related cables after the heat dissipation system is installed; and then, the heat conduction pipe at the top of the tower type component is communicated with the current conversion component by utilizing the drainage pipe to form a closed heat conduction medium circulation pipeline. When connecting, the same current converting component can be connected with a plurality of tower components. And then the current conversion component is electrically connected with the control module through a related cable.
When the system is used, the temperature sensor in the tower-type component can detect the temperature of the heat conducting seat directly contacted with the chip in real time, so that the temperature of the chip is determined; when the temperature of the chip is relatively low, the current conversion component stops working, the heat exchange fan in the tower component runs, on one hand, heat generated by the chip is conducted to the first radiating fins through the heat conducting seat, and the heat can be rapidly dissipated due to the high surface area of the first radiating fins; on the other hand, heat can also be transferred to the second radiating fins through the heat conduction pipes, the heat exchange fans on the side surfaces of the second radiating fins can accelerate convection of air, and airflow quickly passes through gaps of the second radiating fins, so that the heat on the second radiating fins is taken away more quickly; eventually lowering the temperature of the chip.
If meet chip power too big, the unable rapid loss's of heat situation, the part of changing the current this moment starts, and the operation through the refrigerator reduces heat-conducting medium's in with the condenser pipe temperature rapidly, then the operation of rethread circulating pump carries tower part's heat pipe with low temperature heat-conducting medium, and the high temperature heat-conducting medium after absorbing the heat in the heat pipe circulates to the condenser pipe in and cools down simultaneously, through such circulation effect, promotes tower part's cooling effect. In the operation process, the pressure gauge can detect the pressure of the heat-conducting medium in the circulating pipeline, and when the pipeline leaks to cause the pressure of the heat-conducting medium to be too low, early warning can be carried out. If a moderate pressure change occurs due to expansion and contraction of the heat transfer medium, the filling or extraction of the heat transfer medium may be performed by the replenisher. In addition, in the operation process, in order to further reduce the risk of leakage of the heat-conducting medium, the heat-conducting medium in the circulating pipeline can be pumped out and stored in the storage tank under the condition that the heat dissipation performance is improved without using a converter component.
The invention has the following beneficial effects:
the cooling system in the server is more efficient, and can provide a better temperature environment for the operation of the server, so that the performance of the server is improved.
The heat dissipation system is only suitable for the tower type component to dissipate heat in a low-temperature state through the comprehensive application of the liquid cooling component and the air cooling component, and simultaneously, the current conversion component is started in a high-temperature state, so that the heat dissipation performance of the tower type component is improved by using the liquid cooling system. In the system, the converter component and the tower component are designed in a split manner, and the liquid heat-conducting medium cannot enter a server cabinet under the state that the tower component works independently; only when the converter component is needed to operate and heat dissipation is assisted, the heat-conducting medium enters the server cabinet; and even if the heat-conducting medium enters the cabinet, the heat-conducting medium only circulates in the sealed heat-conducting pipe, so that the system has little risk of leakage and damage to a server mainboard or a chip.
In addition, due to the adoption of a split design, a tower type component does not need to be provided with a related structure for liquid cooling circulation, so that the tower type component has smaller size specification, is applied to a rack type server with narrow space, and has better compatibility of a heat dissipation system.
In the invention, in order to further improve the safety of the current conversion component, the circulating pipeline is also provided with the pressure gauge for monitoring the pressure of the heat-conducting medium in the circulating pipeline in real time, so that the fault that the heat-conducting medium leaks due to pipeline damage is prevented, and the pressure of the heat-conducting medium in the circulating pipeline can be relieved or pressurized under the condition that the pressure of the heat-conducting medium in the circulating pipeline changes due to expansion caused by heat and contraction caused by cold.
The tower-type component is equivalent to an air-cooling heat dissipation device in a traditional heat dissipation system, and in order to improve the heat dissipation performance of the component and enable the component to be more effectively fused with a current conversion component, the structure of the component is improved, the structure and the arrangement mode of a heat conduction pipe are changed, and a group of heat dissipation fins are added, so that the air-cooling heat dissipation effect is better, and the double heat dissipation mode and the comprehensive heat dissipation mode of air cooling and liquid cooling can be realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of a circulation pipe constituted by a heat transfer pipe and a commutation member in this embodiment;
FIG. 2 is a schematic view of the structure of the tower unit in this embodiment;
fig. 3 is a schematic structural view of the heat conducting base and the first heat dissipating fins in the present embodiment;
FIG. 4 is a layout of the position of the heat pipe in the present embodiment;
labeled as: 1. a tower member; 2. a current converting member; 11. a heat conducting base; 12. a heat conducting pipe; 13. a first heat radiation fin; 14. a second heat radiation fin; 15. a heat exchange fan; 20. a drainage tube; 21. a circulation pump; 22. a condenser tube; 23. a refrigerator; 24. a replenisher; 25. a pressure gauge; 110. a channel; 111. a temperature sensor.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the connection can be mechanical connection or circuit connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as appropriate to those of ordinary skill in the art.
As shown in fig. 1, a server for an intelligent high-speed rail data center is a rack server, and includes a cabinet, a server array, a storage system, a power supply system, and a heat dissipation system, where the heat dissipation system includes a tower component 1 and a current conversion component 2, and the tower component 1 is connected to a CPU chip and a north bridge chip of the server array respectively;
as shown in fig. 2 and fig. 3, the tower member 1 includes a heat conducting base 11 attached to a CPU chip and a north bridge chip, a plurality of channels 110 parallel to each other and contacting each other are disposed inside the heat conducting base 11, a heat conducting pipe 12 penetrates through the channels 110, the heat conducting pipe 12 is entirely U-shaped, a portion inside the heat conducting base 11 is horizontally disposed, the heat conducting pipe 12 is bent and vertically disposed after being led out from the heat conducting base 11, a plurality of first heat dissipating fins 13 perpendicular to the surface of the heat conducting base 11 and parallel to each other are disposed on the back of the heat conducting base 11, a second heat dissipating fin 14 is disposed above the first heat dissipating fin 13, the second heat dissipating fin 14 is horizontally disposed, and the heat conducting pipe 12 respectively penetrates through each heat dissipating fin in the second heat dissipating fin 14; the heat exchange fan 15 with opposite positions is arranged at one group of side surfaces of the second heat dissipation fins 14;
the two ends of a heat conduction pipe 12 in the tower component 1 are communicated with a current conversion component 2 through a drainage pipe 20, the single current conversion component 2 is simultaneously connected with one or more tower components 1, the current conversion component 2 is positioned outside a cabinet of the server and comprises a circulating pump 21, a condensation pipe 22, a refrigerator 23 and a replenisher 24, the circulating pump 21 and the condensation pipe 22 form a closed circulating pipeline with the heat conduction pipe 12 through the drainage pipe 20, the condensation pipe 22 is spiral, and the condensation pipe 22 is positioned in the refrigerator 23; a heat-conducting medium is arranged in the storage tank connected with the replenisher 24, and the heat-conducting medium is pumped or filled into the circulating pipeline from the replenisher 24 through the inlet and outlet valves;
the tower component 1 and the converter component 2 are both electrically connected with a control module of the heat dissipation system.
As shown in fig. 2 and 4, the number of the heat conductive pipes 12 is more than four; two adjacent heat conduction pipes 12 are led out from the heat conduction seat 11, and when the two adjacent heat conduction pipes 12 penetrate through the second heat dissipation fins 14, the vertical parts in the second heat dissipation fins 14 are sequentially and inwardly offset, so that the vertical parts of the heat conduction pipes 12 are located on different planes, and gaps are formed between the adjacent heat conduction pipes 12.
The heat exchanging fan 15 is disposed on the second heat dissipating fins 14 at a side opposite to the U-shaped opening of the heat conducting pipe 11, and the circulating airflow generated by the heat exchanging fan 15 passes through the second heat dissipating fins 14 at the U-shaped opening of the heat conducting pipe 11.
The more the heat conduction pipes 12 are, the better the heat conduction and radiation efficiency is, but the more the heat conduction pipes 12 are, the more the heat conduction pipes influence the convection of air, and in the embodiment, the heat conduction pipes 12 are arranged according to the special mode, so that the effect of the heat exchange fan 15 on accelerating the convection of air can be improved; the heat conduction pipe 12 is prevented from blocking the gap in the second heat dissipation fins 14.
An opening is arranged in the center of the first heat dissipation fin 13 on the heat conduction seat 11, a temperature sensor 111 is arranged in the opening, and the temperature sensor 111 is electrically connected with a control module of the heat dissipation system.
A pressure gauge 25 is arranged in a circulating pipeline formed by the heat conduction pipe 12 and the current conversion part 2, and the pressure gauge 25 is used for detecting the pressure of a heat conduction medium in the circulating pipeline; the pressure gauge 25 is electrically connected to the control module.
The refrigerator 23 is formed by connecting a compressor, a condenser, a restrictor and an evaporator in sequence to form a vapor compression refrigeration system, and the refrigerant used in the refrigerator 23 is an environment-friendly refrigerant R407.
The heat pipe 12 and the heat conduction base 11 are made of copper metal, and the first heat radiation fins 13 and the second heat radiation fins 14 are made of copper or aluminum metal; the drainage tube 20 is made of a flexible material polymer material.
The copper metal has excellent thermal conductivity and is suitable for preparing the thermal conductive base 11, and the first heat dissipation fins 13 and the second heat dissipation fins 14 can be made of aluminum metal in addition to the copper metal, so that the cost can be reduced properly in consideration of the thermal conductivity. The drain tubes 20 and the commutation members 2 are mainly located outside the cabinet of the server and are therefore suitable for production using flexible materials, thereby making the drain tubes 20 more convenient to arrange and store.
The heat-conducting medium is pure water, methanol or silicone oil. The heat-conducting medium needs to be a material which has good heat-conducting efficiency, higher specific heat capacity, lower freezing point and no corrosion effect, and other media meeting the conditions can be selected besides the materials.
When the heat dissipation system in the server is installed, the tower-type component 1 is installed on the surfaces of a CPU chip, a north bridge chip and other high-heating components, the heat conducting seat 11 is attached to the surfaces of the chips, the chips are tightly combined by using heat conducting grease, then the chips are fixed by using fasteners or other fasteners, and the tower-type component 1 is electrically connected with a control module by using related cables after the installation is finished; the heat conduction pipe 12 at the top of the tower component 1 is communicated with the converter component 2 by using the drainage pipe 20 to form a closed heat conduction medium circulation pipeline. When connecting, one and the same converter member 2 may be connected to a plurality of tower members 1. And then the commutation component 2 is electrically connected with the control module through the related cable.
In the use process of the system, the temperature sensor 111 in the tower component 1 can detect the temperature of the heat conducting seat 11 directly contacted with the chip in real time so as to determine the temperature of the chip; when the temperature of the chip is relatively low, the converter component 2 stops working, the heat exchange fan 15 in the tower component 1 runs, on one hand, heat generated by the chip is conducted to the first heat dissipation fins 13 through the heat conduction seat 11, and the heat can be quickly dissipated due to the high surface area of the first heat dissipation fins 13; on the other hand, heat can also be transferred to the second cooling fins 14 through the heat pipe 12, the heat exchange fan 15 on the side of the second cooling fins 14 can accelerate convection of air, and the airflow rapidly passes through the gaps of the second cooling fins 14, so that the heat on the second cooling fins 14 is more rapidly taken away; eventually lowering the temperature of the chip.
If the power of the chip is too large and the heat cannot be dissipated quickly, the converter component 2 is started at the moment, the temperature of the heat-conducting medium in the condensation pipe 22 is reduced rapidly through the operation of the refrigerator 23, then the low-temperature heat-conducting medium is conveyed into the heat-conducting pipe 12 of the tower component 1 through the operation of the circulating pump 21, meanwhile, the high-temperature heat-conducting medium which absorbs the heat in the heat-conducting pipe 12 is circulated into the condensation pipe 22 to be cooled, and the cooling effect of the tower component 1 is improved through the circulating function. In the operation process, the pressure gauge 25 can detect the pressure of the heat-conducting medium in the circulating pipeline, and when the pressure of the heat-conducting medium is too low due to leakage of the pipeline, early warning can be performed. If a moderate pressure change occurs due to expansion and contraction of the heat transfer medium, the filling or extraction of the heat transfer medium may be performed by the replenisher 24. In addition, in the operation process, in order to further reduce the risk of heat-conducting medium leakage, the heat-conducting medium in the circulating pipeline can be pumped out and stored in the storage tank under the condition that the heat dissipation performance is improved without using the converter component 2.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
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| CN114760813A (en) * | 2022-04-01 | 2022-07-15 | 乐山希尔电子股份有限公司 | Heat dissipation method of electronic integrated module |
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| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| CN206147503U (en) * | 2016-10-28 | 2017-05-03 | 福州外语外贸学院 | Heat abstractor and computer |
| CN206819276U (en) * | 2017-06-23 | 2017-12-29 | 深圳市七彩虹禹贡科技发展有限公司 | A kind of air-cooled integral type display card cooling device of water cooling |
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| CN109739325A (en) | 2019-05-10 |
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