CN109732207A - A kind of manufacturing method of implantable medical device - Google Patents
A kind of manufacturing method of implantable medical device Download PDFInfo
- Publication number
- CN109732207A CN109732207A CN201811551704.2A CN201811551704A CN109732207A CN 109732207 A CN109732207 A CN 109732207A CN 201811551704 A CN201811551704 A CN 201811551704A CN 109732207 A CN109732207 A CN 109732207A
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- coil
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- free end
- diameter
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000003466 welding Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 29
- 238000005245 sintering Methods 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 4
- 238000002513 implantation Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 7
- 210000001124 body fluid Anatomy 0.000 description 5
- 239000010839 body fluid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000649 photocoagulation Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Electrotherapy Devices (AREA)
- Prostheses (AREA)
Abstract
The present invention provides a kind of manufacturing methods of implantable medical device, comprising: provides packaging body, packaging body includes package substrate, and the surface of package substrate includes coil area and electrode district, is equipped at least two first pads in coil area.At least one coil is provided, each coil includes two free ends, free end is directed at setting with the first pad one by one, the free end is made to be in contact with first pad, and falls into the orthographic projection of the free end on the package substrate in first pad.Using laser welding by free end together with the first pad solder, during laser welding, bonding power 50-1000w, weld interval 0.5-5s obtain implantable medical device.The manufacturing method of the present invention introduces lead material and other impurities substance due to not needing during welding manufacture, not will form potential difference at solder joint in implantation human body, avoids solder joint and is corroded the appearance of phenomenon, while improving weld strength.
Description
Technical field
The invention belongs to field of medical device technology, and in particular to a kind of manufacturing method of implantable medical device.
Background technique
With the continuous improvement of medical level, and since implantable medical device can effectively treat disease and extend patient
Service life, be widely used.In the manufacturing process of implantable medical device, needing will be on coil and packaging body
Package substrate links together, so as to the wireless transmission of data and/or energy.The methods of Reflow Soldering or soldering are generallyd use at present
Coil and package substrate are welded.But the above method is haveed the shortcomings that many, such as weld strength is low；It is easily introduced discontented
The impurity material of sufficient bio-compatibility；The presence of impurity material causes easily to form potential difference and solder joint is made to be corroded in body fluid.
It solves the above problems accordingly, it is now desired to find the new manufacturing method of one kind.
Summary of the invention
In consideration of it, by using laser welding, can be kept away the present invention provides a kind of manufacturing method of implantable medical device
Exempt from solder joint to be corroded the appearance of phenomenon, and improve weld strength, improves the quality of implantable medical device.
The present invention provides a kind of manufacturing methods of implantable medical device, comprising:
Packaging body is provided, the packaging body includes package substrate, and the surface of the package substrate includes coil area and electrode
Area is equipped at least two first pads in the coil area；
At least one coil is provided, each coil includes two free ends, by the free end and first weldering
Disk is directed at setting one by one, so that the free end is in contact with first pad, and make the free end in the package substrate
On orthographic projection fall into first pad；
Using laser welding by the free end together with first pad solder, in the process of the laser welding
In, bonding power 50-1000w, weld interval 0.5-5s obtain implantable medical device.
Manufacturing method provided by the invention, since laser welding does not need to introduce lead material and other impurities in the fabrication process
Substance, therefore not will form potential difference at solder joint in body fluid avoids solder joint and is corroded the appearance of phenomenon.Laser welding simultaneously
Compared to traditional welding methods such as Reflow Soldering or solderings, the solder joint of laser welding preparation, will not be right due to being formed in a short time
Non-solder area impacts, and weld strength can also significantly improve.It, can be in addition, the specific choice of bonding power and weld interval
The intensity for further increasing solder joint improves the quality of implantable medical device.
It wherein, further include by the free end before the free end is directed at setting with first pad one by one
End sinter spherical end into, and the diameter of the spherical end is not more than the diameter of the first pad.
Wherein, the coil is formed by coil method coiling, and the diameter of the coil method is welded with no more than described first
The diameter of disk.
Wherein, the diameter of the coil method is 50-500 μm, and the diameter of the spherical end is 100-500 μm, described
The diameter of first pad is 120-500 μm.
Wherein, the shape of first pad is circle, triangle, quadrangle or polygon.
Wherein, the material of the coil and first pad is independently selected from gold, platinum, titanium, iridium, palladium, niobium, tantalum and its conjunction
One of gold is a variety of.
Wherein, the coil includes energy coil and data coil, and the energy coil and the data coil are not led mutually
It is logical.
Wherein, in addition to the free end, the surface of the coil method is additionally provided with the insulating layer with bio-compatibility.
Wherein, in addition to the free end, anti-corrosion layer is additionally provided with outside the coil.
Wherein, multiple second pads are equipped in the electrode district, second pad with electrode for being connected.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to required in the embodiment of the present invention
The attached drawing used is illustrated.
Fig. 1 is the process flow chart of manufacturing method in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of coil of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of package substrate in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of package substrate in another embodiment of the present invention.
Appended drawing reference:
Coil -1, free end -11, energy coil -12, data coil -13, package substrate -2, coil area 21, the first weldering
Disk -211, electrode district -22, the second pad -221.
Specific embodiment
It is the preferred embodiment of the present invention below, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection scope.
Please refer to Fig. 1-Fig. 3, a kind of manufacturing method of implantable medical device provided in an embodiment of the present invention, comprising:
Step 1: providing packaging body, the packaging body includes package substrate 2, and the surface of the package substrate 2 includes coil
Area 21 and electrode district 22, the coil area 21 is interior to be equipped at least two first pads 211.
Step 2: providing at least one coil 1, each coil 1 includes two free ends 11, by the free end 11
It is directed at setting one by one with first pad 211, the free end 11 is made to be in contact with first pad 211, and makes described
Free end 11 is fallen into first pad 211 in the orthographic projection on the package substrate 2.
Step 3: the free end 11 and first pad 211 being welded together using laser welding, swashed described
During photocoagulation, bonding power 50-1000w, weld interval 0.5-5s obtain implantable medical device.
Referring to FIG. 3, the surface of package substrate 2 of the invention is equipped with coil area 21 and electrode district 22, the coil area 21
It is inside equipped with the first pad 211, for being attached with coil 1, and the second pad 221 is equipped in electrode district 22, is used for and electrode
It is attached.Referring to FIG. 2, a coil 1 of the invention is formed by single line loop material coiling, there are two free ends for tool
11。
In manufacturing process of the invention, need the free end 11 of the coil 1 and first pad 211 1 is a pair of
Quasi- setting is below specifically described alignment setting: such as present invention provides a coil 1, including two free ends 11, and
The surface of package substrate 2 is set there are two the first pad 211, therefore is needed in alignment setting one by one by a free end 11 and one
A alignment of first pad 211 setting is placed in a free end 11 in first pad 211 and connects with the first pad 211
Touching.Another free end 11 is directed at setting with another first pad 211, another free end 11 is made to be placed in other one
It is in contact in a first pad 211 and with the first pad 211.Each free end 11 for setting and every will be finally directed at one by one again
A first pad 211 is welded together using laser welding, obtains implantable medical device.
Laser welding in a short time can be melted the end portion of 1 free end 11 of coil simultaneously by high laser pulse power
Solder joint is combined together to form with the first pad 211.Therefore it is not needed as soldering processes in manufacturing process of the invention
Introduce lead material and other impurities substance, it is only necessary to use coil 1 and the first pad 211；Therefore in body fluid at solder joint not
It will form potential difference, avoid solder joint and be corroded the appearance of phenomenon.Simultaneously compared to traditional welding methods such as Reflow Soldering or solderings,
The solder joint of laser welding preparation will not impact non-solder area due to being formed in a short time, therefore weld strength also can
It significantly improves.
In addition, the specific selection of above-mentioned bonding power and weld interval, can be further improved the intensity of solder joint, improves and plant
Enter the quality of formula medical device.The weld strength for the implantable medical device for using the manufacturing method of the present invention to obtain is 20-
200g.Preferably, the weld strength of implantable medical device is 50-150g.It is highly preferred that the welding of implantable medical device is strong
Degree is 80-100g.
Preferably, during the laser welding, bonding power 100-800w, weld interval 0.5-3s.More
Preferably, during the laser welding, bonding power 200-600w, weld interval 1-2s.
In the preferred embodiment for the present invention, multiple second pads 221, second pad are equipped in the electrode district 22
221 with electrode for being connected.First pad 211 and the second pad 221 of the invention are using high after printing slurry or contact pin
It is formed after temperature sintering, or is formed again using modes such as plating or chemical platings after having prepared package substrate 2.
Referring to FIG. 4, the shape of first pad 211 is circle, triangle, four in the preferred embodiment for the present invention
Side shape or polygon.First pad 211 of triangle, quadrangle or multilateral shape can make operator be easier to carry out alignment set
It sets, greatly improves work efficiency.When the shape of the first pad 211 is round, the diameter of the first pad 211 is 100-500 μ
m.When the shape of the first pad 211 is triangle, quadrangle or polygon, the length of the longest edge of the first pad 211 is
0.1-0.5mm, the length of the most short side of the first pad 211 are 0.1-0.5mm.Preferably, the shape of first pad 211 is
Quadrangle.It is highly preferred that the shape of first pad 211 is square.
It is using alignment device that the free end 11 of coil 1 and the first pad 211 1 is a pair of in the preferred embodiment for the present invention
Quasi- setting.One free end 11 and first pad 211 can be once aligned by alignment device, can also once will be all
Free end 11 and the first all pads 211 are aligned one by one.
In the preferred embodiment for the present invention, the free end 11 is being directed at setting with first pad 211 one by one
Before, it further include the end of the free end 11 being sintered to spherical end into, and the diameter of the spherical end is no more than the first weldering
The diameter of disk 211.
Size due to preparing the coil method of coil 1 is smaller, quality is softer, by the free end 11 and described first
When pad 211 is directed at setting one by one, free end 11 is not easy to be in contact with the first pad 211.And it is being directed at first certainly
By end 11 and first after pad 211, when being directed at second free end 11 and the first pad 211, first free end 11
Position is easy to happen variation.Therefore due to weight after the present invention first uses the end sintering for burning ball machine for free end 11, end to melt
The effect of power, can glomeration end.Sintered bulbous end area of bed becomes larger, and quality is hardened, thus easily with the first pad 211 1
One alignment setting falls in free end 11 in first pad 211 and is in contact with the first pad 211, while free end 11 is right
Position is not susceptible to change when quasi- setting.
In addition, the present invention can make the diameter dimension of spherical end no more than the first pad by controlling the parameter of sintering process
211 size.Because needing operator to need using naked eyes when making free end 11 and the first pad 211 is directed at setting
Or free end 11 is first placed in the surface of the first pad 211 by the multiplying arrangements such as microscope, makes free end 11 relative to encapsulation base
The orthographic projection of plate 2 is fallen in the first pad 211, and then free end 11 falls again, and free end 11 is made to connect with the first pad 211
Touching.If the diameter dimension of spherical end is greater than the size of the first pad 211, operator is difficult for be adjusted to free end 11 the
The surface of one pad 211.Therefore free end 11 and the first pad 211 also can not just be made to be directed at setting.
In the preferred embodiment for the present invention, during sintering the end of the free end 11 into spherical end, institute
Stating sintering temperature is 600-2000 DEG C, sintering time 1-30s.Preferably, the sintering temperature is 800-1800 DEG C, when sintering
Between be 5-25s.It is highly preferred that the sintering temperature is 1000-1500 DEG C, sintering time 10-20s.
In the preferred embodiment for the present invention, the coil 1 is formed by coil method coiling, the diameter of the coil method with
No more than the diameter of first pad 211.The diameter of control coil material can preferably make the free end 11 and first of coil 1
Pad 211 aligns.If the diameter of the coil method and the diameter for being greater than first pad 211, operator are difficult
Free end 11 is adjusted to the surface of the first pad 211, and after sintering spherical end into, the diameter dimension of spherical end will become
Must be bigger, further increase the operation difficulty of operator.Preferably, the cross section of coil method of the present invention is circle
In the preferred embodiment for the present invention, the diameter of the coil method is 50-500 μm, the diameter of the spherical end
It is 100-500 μm, the diameter of first pad 211 is 120-500 μm.Using the coil method of above-mentioned size, ball joint
With the first pad 211, can be convenient for the free end 11 of coil method being directed at setting with the first pad 211.Preferably, the coil
The diameter of material is 100-450 μm, and the diameter of the spherical end is 150-480 μm, and the diameter of first pad 211 is
180-500μm.It is highly preferred that the diameter of the coil method is 150-400 μm, the diameter of the spherical end is 200-450 μ
M, the diameter of first pad 211 are 250-480 μm.
In the preferred embodiment for the present invention, the material of the coil 1 and first pad 211 independently selected from gold, platinum,
One of titanium, iridium, palladium, niobium, tantalum and its alloy are a variety of.Wherein, the material of coil 1 and the material of the first pad 211 can phases
With or it is not identical.For example, the material of coil 1 and the material of the first pad 211 be not identical, the material of coil 1 is gold, the first pad
211 material is platinum；Or the material of coil 1 is identical with the material of the first pad 211, the material of coil 1 and the first pad 211
It is titanium alloy.Preferably, the material of the coil 1 is identical as the material of first pad 211.The coil 1 of same material
And the first pad 211 can further improve welding after weld strength.
In the preferred embodiment for the present invention, the quantity of coil 1 is two, and the coil 1 includes energy coil 12 and data
Coil 13, the energy coil 12 and the data coil 13 are mutually not turned on.Coil 1 of the present invention may include energy datum line
Circle 13 or energy coil 12, data coil 13.When coil 1 is energy datum coil 13, it is only necessary to which a coil 1 can be realized
The transmission of energy and data.When coil 1 includes energy coil 12 and data coil 13, energy and data can be made to pass through energy respectively
Amount coil 12 and data coil 13 are transmitted, and keep the laser propagation effect of energy and data more preferable.The present invention only needs data coil 13
It is mutually not turned on energy coil 12, prevents the generation of short circuit phenomenon.
In the preferred embodiment for the present invention, energy coil 12 mutually can be not in contact with each other or be in contact with data coil 13, work as energy
When amount coil 12 and data coil 13 contact with each other, it is only necessary to be equipped with the insulating layer with bio-compatibility on coil method surface
?.It even if energy coil 12 and data coil 13 contact with each other, can also mutually be not turned on, avoid the generation of short circuit phenomenon.This hair
In bright preferred embodiment, data coil 13 can be set up directly in the cavity of energy coil 12, and data coil 13 may also set up
Outside energy coil 12, energy coil 12 and data coil is arranged side by side.The position of specific energy coil 12 and data coil 13
It sets the relationship present invention and is not specifically limited.Such as data coil 13 can be arranged in parallel with energy coil 12, can also be vertically arranged
Or intersection setting.In addition, data coil 13 is placed in energy coil 12 by the present invention more one to improve energy and data progressively
Laser propagation effect.
In the preferred embodiment for the present invention, the number of turns of energy coil 12 is 10-30 circle, and the number of turns of data coil 13 is 5-20
Circle.Preferably, the number of turns of energy coil 12 is 12-25 circle, and the number of turns of data coil 13 is 6-15 circle.It is highly preferred that energy line
The number of turns of circle 12 is 14-20 circle, and the number of turns of data coil 13 is 8-15 circle.
In the preferred embodiment for the present invention, when coil 1 includes energy coil 12 and data coil 13, energy coil 12
A length of 5-20mm of outmost turns, the width of outmost turns are 3-12mm；A length of 4-18mm of 13 outmost turns of data coil, the width of outmost turns
For 1-8mm.
In the preferred embodiment for the present invention, in addition to the free end 11, the surface of the coil method, which is additionally provided with, has life
The insulating layer of object compatibility.In the preferred embodiment for the present invention, in addition to the free end 11, corrosion resistant is additionally provided with outside the coil 1
Lose layer.Coil 1 of the invention is formed by single line loop material coiling, before coiling in addition to free end 11, first by coil material
The surface of material forms the insulating layer with bio-compatibility, and making coil method is not in showing for short circuit during coiling
As, and the above-mentioned insulating layer with bio-compatibility can be directly placed in the body fluid of human body.After the completion of coiling, work as coil
It when 1 quantity is one, can be molded directly outside the coil 1 in addition to free end 11 by silica gel, form anti-corrosion layer, and corrosion resistant
Lose layer with a thickness of 0.1-2mm, the cladding of coil 1 is got up, avoids contact and then being corroded with the body fluid of human body.Work as line
When the quantity of circle 1 is more than one, after the completion of coiling, also it can be used the insulating materials with stickiness by more than one coil
1 is fixed up, so as to the preparation of anti-corrosion layer.The material of insulating layer with bio-compatibility includes Parylene
(Parylene) or Teflon.The material of anti-corrosion layer includes silica gel.
In the preferred embodiment for the present invention, the manufacturing method of the present invention need to carry out Laser Welding in the environment of protective atmosphere
Connect, with guarantee welding when be not in oxidative phenomena generation, prevent weld to be oxidized.
Content provided by embodiment of the present invention is described in detail above, herein to the principle of the present invention and reality
The mode of applying is expounded and illustrates, described above to be merely used to help understand method and its core concept of the invention；Meanwhile
For those of ordinary skill in the art, according to the thought of the present invention, has change in specific embodiments and applications
Become place, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551704.2A CN109732207A (en) | 2018-12-18 | 2018-12-18 | A kind of manufacturing method of implantable medical device |
| PCT/CN2019/123440 WO2020125436A1 (en) | 2018-12-18 | 2019-12-05 | Method for manufacturing implantable medical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551704.2A CN109732207A (en) | 2018-12-18 | 2018-12-18 | A kind of manufacturing method of implantable medical device |
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| CN109732207A true CN109732207A (en) | 2019-05-10 |
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| CN201811551704.2A Pending CN109732207A (en) | 2018-12-18 | 2018-12-18 | A kind of manufacturing method of implantable medical device |
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| WO (1) | WO2020125436A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020125436A1 (en) * | 2018-12-18 | 2020-06-25 | 深圳先进技术研究院 | Method for manufacturing implantable medical device |
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| CN107452850A (en) * | 2016-05-31 | 2017-12-08 | 隆达电子股份有限公司 | Bonding wire and semiconductor package structure |
| CN107519575A (en) * | 2017-09-26 | 2017-12-29 | 杭州暖芯迦电子科技有限公司 | A kind of retina prosthese |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020125436A1 (en) * | 2018-12-18 | 2020-06-25 | 深圳先进技术研究院 | Method for manufacturing implantable medical device |
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| WO2020125436A1 (en) | 2020-06-25 |
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Application publication date: 20190510 |