CN109728205B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN109728205B CN109728205B CN201910002917.8A CN201910002917A CN109728205B CN 109728205 B CN109728205 B CN 109728205B CN 201910002917 A CN201910002917 A CN 201910002917A CN 109728205 B CN109728205 B CN 109728205B
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Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the manufacturing method of the display panel comprises the following steps: forming a pixel defining layer on a substrate by adopting an insulating material doped with a plurality of pore-forming particles; controlling the pore-forming particles to migrate to the edge of one side of the pixel defining layer, which is far away from the substrate; solidifying the pixel defining layer, and controlling the pore-forming particles to sublimate so as to form a plurality of openings on the surface of the pixel defining layer on the side departing from the substrate; forming a hole injection layer on the surface of the pixel defining layer with the opening; the hole injection layer is interrupted at each opening. The pore-forming particles are doped in the pixel defining layer and the sublimation of the pore-forming particles is controlled, so that a plurality of openings are formed on the upper surface of the pixel defining layer, and therefore, the hole injection layer is separated at each opening, the transverse transmission of current between adjacent sub-pixels is effectively blocked, and the problem of crosstalk between the adjacent sub-pixels is solved.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
The Organic Light-Emitting Diode (OLED) display device has many advantages of flexibility, bending, lightness, thinness, larger visual angle, bright color, no need of backlight source, electric energy saving, and the like, and has a wide application prospect. However, the OLED display device also has a troublesome problem of crosstalk between adjacent sub-pixels, which becomes one of the key factors that prevent the mass production of OLEDs.
The anode of the OLED display device is mostly manufactured by adopting a magnetron sputtering (Sputter) process, the surface roughness of the obtained anode is poor, bulges can appear in some places, the point discharge phenomenon is easily generated at the positions of the bulges to cause abnormal light emission, and the abnormal discharge phenomenon caused by the unevenness of the surface of the anode can be effectively improved by properly increasing the thickness of a Hole Injection Layer (HIL).
However, since the hole injection layer is fabricated by a high-precision Metal Mask (FMM) evaporation method, the cost is too high, and the hole injection layer is too thick to easily block the holes on the FMM Mask, it is difficult to form a patterned hole injection layer, and therefore, the hole injection layer is mainly formed by a full-surface evaporation method.
Disclosure of Invention
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, which are used for solving the problem that crosstalk is easy to occur between adjacent sub-pixels in an organic light emitting diode display device in the prior art.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including:
forming a pixel defining layer on a substrate by adopting an insulating material doped with a plurality of pore-forming particles;
controlling each pore-forming particle to migrate to the edge of one side of the pixel defining layer, which is far away from the substrate;
solidifying the pixel defining layer, and controlling the pore-forming particles to sublimate so that a plurality of openings are formed on the surface of the pixel defining layer on the side away from the substrate;
forming a hole injection layer on a surface of the pixel defining layer having the opening; the hole injection layer is interrupted at each of the openings.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present invention, the pore-forming particles have magnetism;
the controlling of the pore-forming particles to migrate to the edge of the pixel defining layer on the side away from the substrate base plate comprises:
and placing the pixel defining layer in a magnetic field, controlling the pore-forming particles to move to the surface protruding out of one side of the pixel defining layer, which is far away from the substrate, by adjusting the magnetic field intensity and the magnetic field direction, and controlling the height of the pore-forming particles protruding out of the pixel defining layer to be less than half of the height of the pore-forming particles in the direction vertical to the substrate.
In a possible implementation manner, in the manufacturing method provided by an embodiment of the present invention, the controlling sublimation of each pore-forming particle includes:
and controlling each pore-forming particle to sublimate by adopting a heating or illumination mode.
In a possible implementation manner, in the manufacturing method provided in the embodiment of the present invention, the method further includes: forming a hole transport layer on the hole injection layer; the hole transport layer is interrupted at each of the openings.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present invention, the pore-forming particles are magnetic nanoparticles that are composed of magnetic particles as a reaction core and an organic material as a coating.
In a second aspect, an embodiment of the present invention provides a display panel, including: the device comprises a substrate, a pixel defining layer positioned on the substrate, and a hole injection layer positioned on one side of the pixel defining layer, which is far away from the substrate;
the pixel defining layer is provided with a plurality of openings on the surface of one side facing away from the substrate base plate;
the hole injection layer is interrupted at each of the openings.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the display panel further includes: and the hole transport layer is positioned on one side of the hole injection layer, which is far away from the substrate base plate, and is separated at each opening.
In a possible implementation manner, in the above display panel provided by the embodiment of the present invention, in a cross section of the pixel defining layer in a direction perpendicular to the substrate, an aperture of the opening at the opening is smaller than a maximum aperture at the inside.
In a possible implementation manner, in the display panel provided by the embodiment of the invention, the depth of the opening is in a range of 60nm to 160 nm.
In a third aspect, an embodiment of the present invention provides a display device, including: the display panel is provided.
The invention has the following beneficial effects:
the embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein the manufacturing method of the display panel comprises the following steps: forming a pixel defining layer on a substrate by adopting an insulating material doped with a plurality of pore-forming particles; controlling the pore-forming particles to migrate to the edge of one side of the pixel defining layer, which is far away from the substrate; solidifying the pixel defining layer, and controlling the pore-forming particles to sublimate so as to form a plurality of openings on the surface of the pixel defining layer on the side departing from the substrate; forming a hole injection layer on the surface of the pixel defining layer with the opening; the hole injection layer is interrupted at each opening. According to the manufacturing method of the display panel provided by the embodiment of the invention, the pore-forming particles are doped in the insulating material for manufacturing the pixel defining layer, and the sublimation of the pore-forming particles is controlled after the pixel defining layer is formed, so that the pixel defining layer forms a plurality of openings on the surface of one side away from the substrate, therefore, when a hole injection layer is formed on the surface of the pixel defining layer in the following process, the hole injection layer is separated at each opening, thereby effectively blocking the transverse current transmission between adjacent sub-pixels and relieving the crosstalk problem between the adjacent sub-pixels.
Drawings
FIG. 1 is a schematic diagram of a display panel in the prior art;
FIG. 2 is a simplified schematic diagram of the schematic diagram of FIG. 1;
fig. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 4a to fig. 4e are schematic structural diagrams corresponding to steps in a manufacturing method according to an embodiment of the present invention;
FIG. 5 is a simplified schematic diagram of the structure shown in FIG. 4 e;
FIGS. 6a to 6f are schematic cross-sectional views of pore-forming particles according to embodiments of the present invention;
FIG. 7 is a schematic top view of the pixel defining layer of the structure shown in FIG. 4 e;
FIG. 8 is a schematic cross-sectional view of a pixel defining layer;
100, a substrate base plate; 101. a buffer layer; 102. an inorganic layer; 103. a pixel defining layer; 104. a hole injection layer; 105. a hole transport layer; 106. an electron transport layer; 107. an electron injection layer; 108. a cathode; 109. a thin film transistor; 110. an anode; 111. a packaging layer; 112. a light emitting layer; 113. a hole blocking layer; 114. pore-forming particles; 115. and (6) opening holes.
Detailed Description
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, aiming at the problem that crosstalk is easy to occur between adjacent sub-pixels in an organic light emitting diode display device in the prior art.
Embodiments of a display panel, a method for manufacturing the same, and a display device according to embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.
Fig. 1 is a schematic structural diagram of an OLED display panel in the prior art, and fig. 2 is a schematic simplified structural diagram of fig. 1, as shown in fig. 1 and fig. 2, a hole injection layer 104 is generally located on a side of an anode 110 away from a substrate 100, and the anode 110 is mostly manufactured by a magnetron sputtering process, so that the surface of the anode 110 is uneven, and a point discharge phenomenon is generated at a convex position, thereby causing abnormal light emission. However, due to the manufacturing cost and thickness, the hole injection layer 104 is difficult to pattern, so the hole injection layer 104 is mainly formed by evaporation over the whole surface, and the hole injection layer 104 has high conductivity, so that current is transmitted laterally to the adjacent sub-pixels, as shown by the arrows in fig. 2, electrons in the red (R) sub-pixel flow to the green (G) sub-pixel and the blue (B) sub-pixel along the hole injection layer 104, and thus the crosstalk phenomenon occurs.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a display panel, as shown in fig. 3, including:
s201, forming a pixel defining layer 103 on a substrate 100 by adopting an insulating material doped with a plurality of pore-forming particles 114 to obtain a structure shown in FIG. 4 a;
s202, controlling each pore-forming particle 114 to move to the edge of the pixel defining layer 103 on the side away from the substrate 100, as shown in FIG. 4 b;
s203, curing the pixel defining layer 103, and controlling sublimation of the pore-forming particles, so that a plurality of openings 115 are formed on the surface of the pixel defining layer 103 on the side away from the substrate 100, as shown in fig. 4 c;
s204, forming a hole injection layer 104 on the surface of the pixel defining layer 103 with the opening 115; the hole injection layer 104 is interrupted at each opening, as shown in fig. 4 d.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the pore-forming particles are doped in the insulating material for manufacturing the pixel defining layer, and the sublimation of the pore-forming particles is controlled after the pixel defining layer is formed, so that the pixel defining layer forms a plurality of openings on the surface of one side away from the substrate, therefore, when a hole injection layer is formed on the surface of the pixel defining layer in the following process, the hole injection layer is separated at each opening, thereby effectively blocking the transverse current transmission between adjacent sub-pixels and relieving the crosstalk problem between the adjacent sub-pixels.
Referring to fig. 4a, before step S201, a buffer layer 101, an inorganic layer 102, each film layer in the thin film transistor 109, an anode 110, and other film layers may be formed on the base substrate 100. In practical applications, the substrate 100 may be made of a flexible material such as Polyimide (PI), or may be made of a material such as glass, which is not limited herein. Specifically, the anode 110 may have a stacked structure of Indium Tin Oxide (ITO), silver (Ag), and ITO, and the anode 110 may have a block structure corresponding to each sub-pixel one by one, and the cathode may have a full-surface structure.
In the step S201, a plurality of pore-forming particles are doped in an insulating material used for manufacturing the pixel defining layer, where the insulating material may be an organic material, but not limited herein, and the pore-forming particles may be uniformly distributed in the insulating material by stirring or the like, and then an insulating layer is formed on the substrate 100 by using the insulating material doped with the pore-forming particles, and the insulating layer is patterned to obtain the pixel defining layer 103, as shown in fig. 4a, where a position of the pixel defining layer 103 having a pattern is a gap between sub-pixels, and a position outside the pattern of the pixel defining layer 103, that is, a position of a pit on the pixel defining layer 103 is a position of a sub-pixel, and the pit is used for accommodating a light emitting layer to be formed and connecting the light emitting layer to the anode 110.
As shown in fig. 4a, in the pixel defining layer 103 obtained in step S201, the pore-forming particles 114 are substantially uniformly distributed in the pixel defining layer 103, that is, the pore-forming particles 114 exist at each depth position of the pixel defining layer 103, and in order to ensure that the blocking effect of the subsequently formed opening on the hole injection layer is good, the doping concentration (volume concentration) of the pore-forming particles 114 may be in the range of 0.002% to 0.02%, preferably 0.005%, so that after the pore-forming particles 114 are moved to the same depth in the subsequent step S202, the density of the pore-forming particles 114 on the upper surface layer of the pixel defining layer 103 is 16 to 49 particles/μm2Preferably about 36 pieces/. mu.m2。
If the sublimation of the pore-forming particles 114 is directly controlled, the depth of the formed opening is not uniform, the opening with too small depth may not be enough to block the hole injection layer, and the opening with too large depth may cause the cathode to be disconnected at the opening, so that before the sublimation of the pore-forming particles 114 is controlled, the migration of the pore-forming particles 114 to the edge of the pixel defining layer 103 away from the substrate 100, such as the edge of the pixel defining layer 103, which is required to be controlled in step S202
As shown in fig. 4b, the pore-forming particles 114 are located at the same depth of the pixel defining layer 103, so that the depths of the subsequently formed openings are the same, and the openings with proper depths can be obtained, thereby preventing the openings from being too deep to block the hole injection layer, or preventing the openings from being too deep to block the subsequently formed cathode at the openings.
In step S203, the position of the pore-forming particles 114 in the pixel defining layer 103 is fixed by curing the pixel defining layer 103, so as to ensure that the depths of the subsequently formed openings are consistent. Referring to fig. 4b, in step S202, the pore-forming particles 114 are controlled to migrate to a surface slightly protruding from the side of the pixel defining layer 103 away from the substrate 100 (for convenience of illustration, the surface of the pixel defining layer away from the substrate is referred to as an upper surface), that is, by controlling the migration of the pore-forming particles 114, a small opening is formed on the surface of the pixel defining layer 103, in step S203, during the process of controlling the sublimation of the pore-forming particles 114, the pore-forming particles 114 are sublimated from the portion protruding from the surface of the pixel defining layer 103, and then the remaining portion of the pore-forming particles 114 are continuously gasified and leave the pixel defining layer 103 from the opening, so that the small-opening and large-inner-space opening 115 shown in fig. 4c is formed on the upper surface of the pixel defining layer 103.
In the step S204, the hole injection layer 104 is formed on the surface of the pixel defining layer 103 having the opening 115, and since the opening 115 has a smaller opening and a larger internal space, the hole injection layer 104 is easily blocked at the edge of the opening 115 to form the structure shown in fig. 4d, thereby effectively blocking electrons from being transmitted to the adjacent sub-pixels and effectively improving the problem of light emission crosstalk of the display panel.
As shown in fig. 4e, film layers such as the hole transport layer 105, the light emitting layer 112, the electron transport layer 106, the electron injection layer 107, the cathode 108, and the encapsulation layer 111 are sequentially formed on the hole injection layer 104, and since the hole transport layer 105 is adjacent to the hole injection layer 104, the hole transport layer 105 is relatively easily cut off at the opening 115, and if the depth of the opening 115 is large, the electron transport layer 106 can be cut off at the opening 115, but the cathode 108 is far from the opening 115 and is not easily cut off at the opening 115, and therefore, the arrangement of the opening 115 does not affect the overall arrangement of the cathode 108 and the normal display of the display panel. In specific implementation, which film layers are blocked at the opening 115 can be controlled by adjusting the depth of the opening 115, and specifically, the mobility of the pore-forming particles 114 in the step S202 can be adjusted.
Fig. 5 is a simplified structural diagram of fig. 4e, and as shown in fig. 5, a hole blocking layer 113 (HBL) may be further disposed between the electron transport layer 106 and the light emitting layer 112 to block holes in the hole transport layer 105 from being transported into the electron transport layer 106, so as to prevent abnormal light emission. Because the hole injection layer 104 and the hole transport layer 105 are separated at the gap between the sub-pixels, electrons cannot be transversely transported, and if the light is emitted to the red (R) sub-pixel, the phenomenon of stealing brightness of the green (G) sub-pixel and the blue (B) sub-pixel is not caused, so that the display effect of the display panel is improved.
In fig. 5, the hole injection layer 104 and the hole transport layer 105 are only illustrated as being separated at the gaps between the sub-pixels, and in the specific implementation, because the thickness of the hole transport layer 105 is smaller than that of the hole injection layer 104, and the conductivity of the hole transport layer 105 is weaker than that of the hole injection layer 104, the hole injection layer 104 has a larger influence on the crosstalk between the sub-pixels, and the hole transport layer 105 has a smaller influence on the crosstalk between the sub-pixels, so that the depth of the opening can be controlled to only separate the hole injection layer 104 at the gaps between the sub-pixels, and the problem of the crosstalk between the sub-pixels can be greatly alleviated.
In addition, since the lateral transport rate of the electron injection layer 107, the electron transport layer 106 and the hole blocking layer 113 is smaller than that of the hole injection layer 104 and the hole transport layer 105, and the electron injection layer 107, the electron transport layer 106 and the hole blocking layer 113 are also thinner, the influence on crosstalk between sub-pixels is smaller, and the partition of the hole injection layer 104 and the hole transport layer 105 can prevent adjacent sub-pixels from generating brightness crosstalk, the electron injection layer 107, the electron transport layer 106 and the hole blocking layer 113 can be also not partitioned, and the partition of the cathode 108 can be also avoided.
Specifically, in the manufacturing method provided by the embodiment of the present invention, the pore-forming particles have magnetism;
the step S202 may include:
referring to fig. 4b, pixel defining layer 103 is placed in a magnetic field, and by adjusting the intensity and direction of the magnetic field, each pore-forming particle 114 is controlled to migrate to the surface protruding from the side of pixel defining layer 103 away from substrate 100, and the height of pore-forming particle 114 protruding from pixel defining layer 103 in the direction perpendicular to substrate 100 is less than half of the height of pore-forming particle 114.
Since the pore-forming particles are magnetic, in step S202, the pore-forming particles 114 can be controlled to migrate to the position protruding from the upper surface of the pixel defining layer 103 by adjusting the magnetic field strength and the magnetic field direction, the operation is simple and effective, specifically, the magnetic field strength can be controlled within a range of 10 to 200Gs, preferably 15Gs, for example, the migration of the pore-forming particles can be controlled by slowly increasing the applied magnetic induction intensity, and the magnetic induction line can be perpendicular to the substrate by controlling the magnetic field direction. Meanwhile, referring to fig. 8, fig. 8 is illustrated by taking an opening 115 formed by a pore-forming particle as an example, that is, a circle in the drawing may indicate a position where the pore-forming particle migrates to the upper surface of the pixel defining layer 103, in order to enable the formed opening 115 to block a film layer formed on the pixel defining layer 103, it is preferable to control the pore-forming particle to slightly protrude from the upper surface of the pixel defining layer 103, that is, in a direction perpendicular to the substrate, a height of the pore-forming particle protruding from the pixel defining layer is less than a half of a height of the pore-forming particle, and it can also be understood that a small part of the pore-forming particle protrudes from the upper surface of the pixel defining layer by controlling a magnetic field strength and a magnetic field direction, in step S203, a portion of the pore-forming particle protruding from the upper surface of the pixel defining layer is sublimated first, and then a portion of the, the pore-forming particles completely sublimate to leave an opening on the pixel defining layer.
In addition, in the step S202, the migration of the pore-forming particles to the edge of the inner portion of the upper surface of the pixel defining layer, that is, the pore-forming particles are adjacent to the upper surface of the pixel defining layer, in step S203, during the sublimation of the pore-forming particles, there are forces acting in all directions, since the pore-forming particles are closer to the upper surface of the pixel defining layer, in the sublimation process, the pore-forming particles are easily broken through the upper surface of the pixel defining layer after being gasified, so as to form smaller openings on the upper surface of the pixel defining layer, the remaining pore-forming particles are gradually vaporized and leave from the opening, so as to form an opening on the upper surface of the pixel defining layer, where the specific position of the pore-forming particles after migration in step S202 is not limited, as long as the formed opening can block the film layer formed on the pixel defining layer and does not affect the normal display of the display panel.
In a specific implementation manner, in the above manufacturing method provided by an embodiment of the present invention, in the step S203, controlling sublimation of each pore-forming particle includes:
and controlling the sublimation of each pore-forming particle by adopting a heating or illumination mode.
The pore-forming particles can be energized by heating or by light irradiation to sublimate the pore-forming particles and form openings of a specific size at the positions of the pore-forming particles. Specifically, when adopting the heating method to sublime, can place display panel and heat a period of time with the uniform temperature in the heating furnace, for example can toast about 10min at the temperature of 130 ~ 300 ℃ (preferably 245 ℃) to make the pore-forming particle fully sublime, perhaps when adopting the illumination method to sublime, can place the light source in the display panel top, through adjusting illumination intensity and illumination time, so that the pore-forming particle fully sublimes. In practical applications, sublimation of each pore-forming particle may be controlled after the pixel defining layer is completely cured, or sublimation of each pore-forming particle may be controlled during the curing process of the pixel defining layer, which is not limited herein.
Further, in the manufacturing method provided by the embodiment of the present invention, referring to fig. 4e and fig. 5, the manufacturing method may further include: forming a hole transport layer 105 on the hole injection layer 104; hole transport layer 105 is interrupted at each opening 115. In specific implementation, by controlling the depth of the opening 115, the hole transport layer 105 can be also blocked at the opening 115, thereby further eliminating the phenomenon of crosstalk of brightness between sub-pixels and improving the display effect of the display panel.
Specifically, in the manufacturing method provided by an embodiment of the present invention, the pore-forming particles are magnetic nanoparticles that are composed of magnetic particles as a reaction core and an organic material as a coating.
The magnetic particles are used as the reaction core of the pore-forming particles, so that the pore-forming particles have magnetism, and the magnetic field is used to control the migration of the pore-forming particles in the step S202 so as to adjust the depth of the subsequently formed opening, thereby simplifying and effectively operating the step S202. By using the organic matter as the wrapping material, on one hand, the pore-forming particles can be more easily doped into the insulating material for manufacturing the pixel defining layer, on the other hand, the organic matter can be changed from a solid state to a gaseous state through sublimation and leaves the pixel defining layer to form the open pore, and because the size of the magnetic particles is small, the organic matter can carry the magnetic particles to leave the pixel defining layer in the sublimation process, so that the open pore is ensured to be formed at the position.
Specifically, the magnetic particles may be Fe3O4The organic matter can be phenolic resin, and can be formed by a microwave hydrothermal method to form Fe3O4The nano particles are used as reaction cores, the phenolic resin is used as pore-forming particles of a wrapping material, and Fe is used3O4Phenolic resin, and the magnetic nanoparticles may also be selected from Fe3O4Polyaniline and Fe3O4Polylactic acid-polyethylene glycol, Fe3O4Polyacrylic acid, Fe3O4Polyacrylic acid or Fe3O4And/or polystyrene. The preparation method is not limited to a microwave hydrothermal method, and can also be one of methods such as a chemical deposition method, a sol-gel method, an emulsion polymerization method, a dispersion polymerization method, a suspension polymerization method, a distillation precipitation method, a hydrothermal method, a microemulsion method or a self-assembly technology, and the like, wherein the sublimation temperature range of the formed pore-forming particles is 130-300 ℃.
The prepared pore-forming particles may be screened using a molecular sieve to obtain pore-forming particles having a particle diameter in the range of 10 to 200nm (preferably 160nm), and the particle diameter size of the obtained pore-forming particles may be adjusted by changing the reference of the molecular sieve.
In the present embodiment, the cross-sectional shape of the pore-forming particle 114 shown in fig. 6a is exemplified as a circle, but in the specific implementation, the cross-sectional shape of the pore-forming particle may be a parallelogram, a rhombus, an ellipse, a pentagon, etc., as shown in fig. 6b to 6e, or may be an irregular shape as shown in fig. 6f, and the cross-sectional shape of the pore-forming particle is not limited herein.
In a second aspect, based on the same inventive concept, embodiments of the present invention provide a display panel, and since the principle of the display panel to solve the problem is similar to the above manufacturing method, the implementation of the display panel may refer to the implementation of the above manufacturing method, and repeated details are not repeated.
As shown in fig. 4e, the display panel provided in the embodiment of the present invention includes: the structure comprises a substrate 100, a pixel defining layer 103 positioned on the substrate 100, and a hole injection layer 104 positioned on one side of the pixel defining layer 103, which is far away from the substrate 100;
the pixel defining layer 103 has a plurality of openings 115 at a surface on a side facing away from the substrate base plate 100;
According to the display panel provided by the embodiment of the invention, the surface of the pixel defining layer, which is far away from the substrate, is provided with the plurality of openings, so that the hole injection layer, which is positioned on the side of the pixel defining layer, which is far away from the substrate, is separated at the openings, thereby effectively blocking the transverse transmission of current between adjacent sub-pixels and relieving the problem of crosstalk between the adjacent sub-pixels.
Fig. 7 is a schematic top view of the pixel defining layer 103 in the structure shown in fig. 4e, in which a circle is taken as an example of an opening, and in a specific implementation, the cross section of the opening may have other shapes, such as a quadrangle and a pentagon, and the shape of the opening is not limited herein. The figure shows sub-pixels in 2 rows and 6 columns as an example, and the number and arrangement of the sub-pixels are not limited. Since the pixel defining layer 103 has the opening 115 on the upper surface thereof, it is formed subsequentlyThe hole injection layer 104 can be isolated at the openings 115 to reduce the crosstalk between sub-pixels, and in practice, the density of the openings 115 can be adjusted to achieve the effect of almost eliminating the lateral current between adjacent sub-pixels, for example, the density of the openings 115 on the surface of the pixel definition layer can be 16-49/μm2In the range, preferably about 36/um2In practical implementation, the openings 115 on the surface of the pixel defining layer 103 may be arranged in a substantially array as shown in fig. 7, or may be arranged in other manners, for example, the openings 115 between adjacent rows may be arranged in a crossing manner, as long as the distribution density is substantially uniform, and the distribution of the openings 115 is not limited herein.
As shown in FIG. 8, the size of the opening is illustrated by taking one opening 115 as an example, the thickness of the pixel defining layer 103 may be about 1 μm, the pore-forming particles 114 are spherical, the radius of the opening 115 is R, the depth of the opening 115 is a, and the aperture of the opening 115 is b, and then a, b and R satisfy R2＝(a-R)2+(b/2)2Wherein a is more than or equal to 60nm and less than or equal to 160nm, preferably a is approximately equal to 120nm, R is approximately equal to 80nm, and b is approximately equal to 138 nm.
Further, as shown in fig. 4e, the display panel provided in the embodiment of the present invention may further include: a hole transport layer 105 on the side of the hole injection layer 104 facing away from the substrate 100, the hole transport layer 105 being interrupted at the openings.
In specific implementation, by controlling the depth of the opening 115, the hole transport layer 105 can be also blocked at the opening 115, thereby further eliminating the phenomenon of crosstalk of brightness between sub-pixels and improving the display effect of the display panel.
In addition, referring to fig. 4e as well, for the electron transport layer 106 or the electron injection layer 107 located on the side of the light emitting layer 112 away from the substrate 100, the depth of the opening 115 may be adjusted to block the electron transport layer 106 or the electron injection layer 107 at the opening 115, or may be set to be not blocked, which is not limited herein. It can be understood that the farther the distance from the opening 115 is, the less easily the electron transport layer 106 is blocked at the opening 115, as shown in fig. 4e, the electron transport layer 106 is blocked at the opening 115, and the electron injection layer 107 which is farther the distance from the opening 115 is not blocked at the opening 115, furthermore, since the cathode 108 is farther the distance from the opening 115, the opening 115 will not affect the cathode 108, and the cathode 108 is still disposed as a whole layer, thereby ensuring the normal display of the display panel.
In practical implementation, in the display panel provided by the embodiment of the invention, as shown in fig. 4e, in a cross section of the pixel defining layer 103 in a direction perpendicular to the substrate 100, an aperture of the opening 115 at the opening is smaller than a maximum aperture at the inside. That is, the small opening of each opening 115 in the upper surface of the pixel defining layer 103 has a large internal space, and this shape enables the film layer formed over the pixel defining layer 103 to be more easily cut off at the opening 115.
Specifically, in the display panel provided by the embodiment of the present invention, the depth of the opening is preferably in a range from 60nm to 160 nm. Therefore, the hole injection layer can be ensured to be separated at the opening, and the cathode is ensured not to be separated at the opening, so that the phenomenon of brightness crosstalk among the sub-pixels is improved under the condition of ensuring normal display of the display panel.
In a third aspect, based on the same inventive concept, an embodiment of the present invention provides a display device, including the above display panel, where the display device may be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.
The display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention have the advantages that the pore-forming particles are doped in the insulating material for manufacturing the pixel defining layer, and the sublimation of the pore-forming particles is controlled after the pixel defining layer is formed, so that the pixel defining layer is provided with a plurality of openings on the surface of the side away from the substrate, therefore, when the hole injection layer is formed on the surface of the pixel defining layer in the following process, the hole injection layer is separated at each opening, the transverse transmission of current between adjacent sub-pixels can be effectively blocked, the problem of crosstalk between the adjacent sub-pixels is relieved, the manufacturing method is simple and easy in process, the hole injection layer can be separated under the condition that a mask is not needed, the process cost is low, the manufacturing cost can be greatly reduced, and in addition, before the sublimation of the pore-forming particles, the pore-forming particles are controlled to move to the inner edge of the upper surface of the pixel, the depth of the opening can be adjusted, the depth of the opening is prevented from being too small to cut off the hole injection layer, the depth of the opening is guaranteed not to cut off the cathode, the resistance of the light-emitting device is guaranteed not to be increased, the power consumption of the whole OLED display panel is kept unchanged, and normal display of the display panel is guaranteed.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a pixel defining layer on a substrate by adopting an insulating material doped with a plurality of pore-forming particles; the pore-forming particles are magnetic;
placing the pixel defining layer in a magnetic field, and controlling the pore-forming particles to migrate to the edge of one side of the pixel defining layer, which is far away from the substrate, by adjusting the magnetic field intensity and the magnetic field direction;
solidifying the pixel defining layer, and controlling the pore-forming particles to sublimate so that a plurality of openings are formed on the surface of the pixel defining layer on the side away from the substrate;
forming a hole injection layer on a surface of the pixel defining layer having the opening; the hole injection layer is interrupted at each of the openings.
2. The method of claim 1, wherein the controlling migration of the pore-forming particles to an edge of the pixel defining layer facing away from the substrate comprises:
and controlling the pore-forming particles to move to the surface protruding out of one side of the pixel defining layer, which is far away from the substrate, and in the direction vertical to the substrate, the height of the pore-forming particles protruding out of the pixel defining layer is less than half of the height of the pore-forming particles.
3. The method of claim 1, wherein said controlling sublimation of each of said pore-forming particles comprises:
and controlling each pore-forming particle to sublimate by adopting a heating or illumination mode.
4. The method of manufacturing of claim 1, further comprising: forming a hole transport layer on the hole injection layer; the hole transport layer is interrupted at each of the openings.
5. The method according to any one of claims 1 to 4, wherein the pore-forming particles are magnetic nanoparticles each comprising a magnetic particle as a reaction core and an organic material as a coating.
6. A display panel, comprising: the device comprises a substrate, a pixel defining layer positioned on the substrate, and a hole injection layer positioned on one side of the pixel defining layer, which is far away from the substrate;
the pixel defining layer is provided with a plurality of openings on the surface of one side facing away from the substrate base plate; the opening is formed after pore-forming particles are sublimated; the depth of the opening is in the range of 60nm to 160 nm;
the hole injection layer is interrupted at each of the openings.
7. The display panel of claim 6, further comprising: and the hole transport layer is positioned on one side of the hole injection layer, which is far away from the substrate base plate, and is separated at each opening.
8. The display panel according to claim 6, wherein the aperture of the opening at the opening is smaller than a maximum aperture of the inside in a cross section of the pixel defining layer in a direction perpendicular to the substrate base plate.
9. A display device, comprising: a display panel according to any one of claims 6 to 8.
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| CN110459582B (en) * | 2019-08-26 | 2022-04-08 | 合肥京东方卓印科技有限公司 | Display panel, manufacturing method thereof, driving control method and display device |
| CN110581155A (en) * | 2019-08-27 | 2019-12-17 | 武汉华星光电半导体显示技术有限公司 | Light-emitting panel, preparation method of light-emitting panel, and display device |
| CN110649078B (en) * | 2019-09-30 | 2022-01-11 | 京东方科技集团股份有限公司 | Substrate for display and display device |
| CN111710789B (en) * | 2020-06-30 | 2022-11-11 | 云谷（固安）科技有限公司 | Display panel, manufacturing method of display panel, and display device |
| CN111710792B (en) * | 2020-06-30 | 2023-05-02 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof |
| CN113013210B (en) | 2021-02-19 | 2023-12-26 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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| JP4888268B2 (en) * | 2007-07-23 | 2012-02-29 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| JP6242121B2 (en) * | 2013-09-02 | 2017-12-06 | 株式会社ジャパンディスプレイ | LIGHT EMITTING DEVICE DISPLAY DEVICE AND LIGHT EMITTING DEVICE DISPLAY DEVICE MANUFACTURING METHOD |
| TWI545735B (en) * | 2013-09-09 | 2016-08-11 | Japan Display Inc | Organic electroluminescent display device and manufacturing method thereof |
| KR20160066650A (en) * | 2014-12-02 | 2016-06-13 | 삼성디스플레이 주식회사 | Fabrication method of display device and display device |
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| CN112670332B (en) * | 2017-04-20 | 2025-01-07 | 京东方科技集团股份有限公司 | Pixel unit and manufacturing method thereof and display device |
| CN107104129B (en) * | 2017-05-19 | 2021-01-26 | 京东方科技集团股份有限公司 | OLED device manufacturing method, OLED device and display panel |
| CN112242494A (en) * | 2017-07-12 | 2021-01-19 | 京东方科技集团股份有限公司 | An organic electroluminescence display panel, preparation method and display device |
| CN108649050B (en) * | 2018-04-24 | 2021-11-23 | 京东方科技集团股份有限公司 | OLED display substrate, manufacturing method and display device |
| CN108987449B (en) * | 2018-07-27 | 2021-01-19 | 京东方科技集团股份有限公司 | Pixel defining layer, manufacturing method thereof and display substrate |
| CN109065584B (en) * | 2018-08-06 | 2021-01-26 | 京东方科技集团股份有限公司 | Pixel definition layer, display substrate and preparation method |
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