CN109719387A - Laser processing device and method, laser package method, laser anneal method - Google Patents
Laser processing device and method, laser package method, laser anneal method Download PDFInfo
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- CN109719387A CN109719387A CN201711048772.2A CN201711048772A CN109719387A CN 109719387 A CN109719387 A CN 109719387A CN 201711048772 A CN201711048772 A CN 201711048772A CN 109719387 A CN109719387 A CN 109719387A
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Abstract
The present invention provides a kind of laser processing device and method and laser package method, laser anneal method, a kind of laser processing device, including laser module, laser scanning module, spectral module and control unit, the laser module provides the laser for processing, the laser is incident to the spectral module after the laser scanning module, the laser is carried out light splitting and forms reflected light and refraction light by the spectral module, and the laser scanning module controls the reflected light and the refraction light and treats processing materials symmetrical scanning according to scan path；Described control unit is connect with the laser module and the laser scanning module, for controlling the laser module and the laser scanning module.The present invention is divided using spectral module, and the utilization rate of laser module is the 2 times or more of the prior art, reduces 2 times or even more compared with prior art to the rotation angle requirement of equipment, yield improves 2 times or more.
Description
Technical field
The present invention relates to field of laser processing, in particular to laser processing device and method, laser package method, laser moves back
Ignition method.
Background technique
There is provided laser beams for existing laser package technique, and material to be packaged is arranged in work stage, and laser beam passes through
Relevant apparatus for shaping exposes on material to be packaged, completes encapsulation after so that the frit on material to be packaged is melted condensation.
In order to improve yield and converted products speed, light-splitting processing is carried out to optical path in apparatus for shaping, so that one
Set laser package device can encapsulate several materials to be packaged simultaneously.As Chinese patent CN201410603985.7 (publication date:
On June 11st, 2016), CN201010180148.X (publication date: on November 23rd, 2011), CN201020235578.2 it is (open
Day: on March 2nd, 2011) it all discloses and light-splitting processing is made to optical path to improve the technique of yield.
Wherein Chinese patent CN201410603985.7 (publication date: on June 11st, 2016) and CN201010180148.X
(publication date: on November 23rd, 2011) is divided before Laser Scanning Equipment after luminous source optical fiber goes out light.The former
Using separate unit vibration mirror scanning equipment, the eyeglass of inevitable requirement galvanometer reaches great talent and is able to achieve control to optical path, if realizing multichannel envelope
Dress, then have special requirement, to increase the required precision and rotation to galvanometer to the eyeglass on scanning device galvanometer
Rate request, the synchronous encapsulation of Yao Shixian multi beam optical path, there are limitations for the requirement to galvanometer；The latter is additionally arranged a scanning and sets
It is standby, gone out after light by luminous source optical fiber and be divided, optical path is divided by multichannel by reflecting mirror, is sealed using more scanning devices
Dress, the requirement to scanning device is similar with general encapsulation mark mode, improves packaging effect, but increases a laser and sweep
Equipment cost is retouched, effect is not optimal.
Above scheme is all made that biggish raising to yield, but is all to sacrifice cost for existing scheme
In the case of optimization is made to yield, be not truly realized and not only save cost, but improve yield.
Summary of the invention
The invention proposes a kind of laser processing devices and method, laser package method, laser anneal method, for solving
The above problem.
In order to achieve the above objectives, the present invention provides a kind of laser processing devices, including laser module, laser scanning mould
Block, spectral module and control unit, the laser module provide the laser for processing, and the laser passes through the laser
The spectral module is incident to after scan module, the laser is carried out light splitting and forms reflected light and refraction by the spectral module
Light, the laser scanning module controls the reflected light and the refraction light is treated processing materials according to scan path and symmetrically swept
It retouches；Described control unit is connect with the laser module and the laser scanning module, for controlling the laser module
With the laser scanning module.
Preferably, the processing unit (plant) further includes lens module, the refraction of light beam for the spectral module to be emitted at
The light beam that optical path is parallel to each other.
Preferably, the spectral module includes the first reflecting mirror and spectroscope, and the laser passes through the laser scanning mould
Be incident to first reflecting mirror after block, first reflecting mirror by the laser reflection to the spectroscope, it is described later
Spectroscope light splitting, forms the reflected light and the refraction light.
Preferably, the spectroscope is perpendicular to the lens module.
Preferably, the spectral module further includes the second reflecting mirror and third reflecting mirror, is set up separately described spectroscopical two
Side and mirror surface is perpendicular to the lens module, the spectroscope favours the lens module, the reflected light and the refraction
Wherein light beam in light is incident to the lens unit, and another light beam is successively reflected by second reflecting mirror, the third
Mirror reflexes to the lens module.
Preferably, the spectral module further includes the second reflecting mirror and third reflecting mirror, is set up separately described spectroscopical two
Side and mirror surface is perpendicular to the lens module, perpendicular to the lens module, the reflected light is incident to described the spectroscope
Second reflecting mirror, the refracted light incident are reflected onto the lens module to the third reflecting mirror later.
Preferably, have angle β between first reflecting mirror and the lens module, angle β and the laser scanning
The rotation angle ψ of module meets following condition:
Preferably, the light beam being emitted after the spectral module is incident to the same lens module.
Preferably, the light beam being emitted after the spectral module is incident to different lens modules.
Preferably, the material to be processed includes material to be packaged, material to be annealed.
The present invention also provides a kind of laser processings, and the laser provided by laser module is after laser scanning module
Into spectral module, form reflected light and refraction light after spectral module light splitting, the laser scanning module according to
The scan path of processing materials adjusts the laser, so that the reflected light and refraction light are appointed to single simultaneously according to scan path
The material to be processed of meaning symmetric shape is scanned, or is swept respectively to the material to be processed of two symmetrical arbitrary shapes
It retouches.
Preferably, when the material to be processed of the single any symmetric shape of processing, the reflected light and refraction light are on scanning road
The hot spot that the initial position of diameter is formed has overlapping region.
The present invention also provides a kind of laser package methods, carry out laser package using the laser processing.
The present invention also provides a kind of laser anneal methods, carry out laser annealing using the laser processing.
Compared with prior art, the present invention has the advantage that
1, spectral module is arranged after laser scanning module, does not have to consider visual field size inside laser scanning module；
2, it is divided using spectral module, improves the utilization rate to laser module, the utilization rate of laser module is existing
There is the 2 times or more of technology；
3, it is divided using spectral module, reduces the requirement to laser scanning module equipment of itself angle, the rotation to equipment
Gyration requires to reduce 2 times or even more compared with prior art；
4, it is divided using spectral module, improves yield, compared with prior art, encapsulation yield improves 2 times or more；
5, it is divided using spectral module, the incident mirror surface size of condenser lens is not required, as long as satisfaction one is to be added
The visual field of work material, if visual field not enough need to only increase the number of condenser lens when encapsulating multiple materials to be processed, equally
Reduce cost；
6, in process, process equipment immobilizes, and only controls spot motion in the process segment, reduces control difficulty,
It improves efficiency；
7, laser beam is processed in the form of symmetrical, can carry out multiple beam processing to the material of single symmetric shape, again
Can processing unit simultaneous processing to multiple arbitrary shapes arranged in symmetrical fashion, improve processing efficiency, and only separate unit swashs
The demand of multiple material simultaneous processings to be processed can be realized in light process equipment, improves compatibility, reduces cost；
8, without controlling multi beam spot motion simultaneously, the light beam of laser scanning module output need to be only controlled, is reduced
Control difficulty.
Detailed description of the invention
Fig. 1 is the laser processing device structural schematic diagram of the embodiment of the present invention one；
Fig. 2 is material top view to be packaged in Fig. 1；
The light splitting schematic diagram of Fig. 3 embodiment of the present invention one；
Fig. 4 is that the scanning of the embodiment of the present invention one has dead angle light path schematic diagram；
Fig. 5 is more than one material simultaneous processing schematic diagrames to be processed of the embodiment of the present invention；
Fig. 6 is Fig. 5 material glazed thread scan path schematic diagram to be processed；
Fig. 7 is that multiple F-theat mirrors provided by the invention increase visual field schematic diagram；
Fig. 8 is the scanning of the embodiment of the present invention two without the full symmetric light splitting optical path schematic diagram in dead angle；
Fig. 9 is that the single material to be processed of the embodiment of the present invention two carries out symmetrical scanning and two sides sweep speed uniform structure is shown
It is intended to；
Figure 10 is material glazed thread scan path schematic diagram to be processed in Fig. 9；
Figure 11 is that the embodiment of the present invention three is scanned without dead angle way symmetric light splitting optical path schematic diagram；
Figure 12 and Figure 13 is all spectroscope light splitting optical path schematic diagram in Figure 11；
Figure 14 is that the embodiment of the present invention three carries out symmetrical scanning to single material to be processed and two sides sweep speed is inconsistent
Structural schematic diagram；
Figure 15 is material glazed thread scan path schematic diagram to be processed in Figure 14；
Figure 16 is the straight line symmetrical machining light scan path schematic diagram of the embodiment of the present invention three；
Figure 17 is the circle symmetrical machining opticpath schematic diagram of the embodiment of the present invention three；
Figure 18 is three ellipsometry process light path schematic diagram of the embodiment of the present invention.
In figure: 110- host computer, 120- controller module, 130- laser scanning module, 140- laser module, 200- point
Optical module, the first reflecting mirror of 210-, 220- spectroscope, the second reflecting mirror of 230-, 240- third reflecting mirror, 300- object to be processed
Material, 310- cover-plate glass, 340- frit, 330- base plate glass, 350- electrode, 360-OLED layers, 400-F-theta mirror,
1301- portal frame, 1302- galvanometer unit；
12,14~18- light, 13- mirror surface；21~30- light.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Fig. 1 is please referred to, laser processing device provided by the invention includes:
Control unit, laser module 140, laser scanning module 130, spectral module 200 and material to be processed 300.
Wherein control unit includes host computer 110, the controller module connecting with host computer 110 120, controller module
120 connect with laser module 140 and the control of laser scanning module 130.
Wherein laser module 140 is used to provide encapsulation laser beam used, which passes through laser scanning mould
The laser of scanning is formd after the integration of block 130, which moves on the scan path that host computer 110 is calculated, and wears
It is exposed on material 300 to be processed after crossing spectral module 200, laser scanning module 130 swashs according to scan path adjustment single beam
Light, so that the reflected light formed after spectral module 200 and refraction light treat processing materials 300 by scan path and carries out laser
Processing.
As shown in figure 5, the laser processing device further includes lens module, for be emitted the spectral module 200
Light beam reflects the light beam being parallel to each other at optical path.
The lens module includes at least one F-theta mirror 400, and optionally, the lens module includes a F-
Theta mirror 400, the light beam being emitted after the spectral module 200 enter the same F-theta mirror 400.Optionally, described
Mirror module includes multiple F-theta mirrors 400, and the light beam being emitted after the spectral module 200 enters different F-theta mirrors
400。
The first reflecting mirror 210 and spectroscope 220 are included at least in spectral module 200 provided in this embodiment, laser passes through
Incident to spectroscope 220 after the reflection of the first reflecting mirror 210 after laser scanning module 130, specifically referring to figure 3., first is anti-
Mirror 210 is penetrated relative to 400 slant setting of F-theta mirror, spectroscope 220 is placed vertically, establishes XY two-dimensional coordinate system, horizontal direction
For Y direction, vertical direction is X-direction, the light from the spot center for the laser being emitted in laser scanning module 130 with
The intersection point of first reflecting mirror, 210 mirror surface 13 is the intersection point of X-axis and Y-axis, and laser enters after laser scanning module 130 out light and divides
Optical module 200 is inclined by the mirror-reflection of the first reflecting mirror 210 of placement first and is divided to spectroscope 220, formed reflected light and
Light is reflected, wherein the first reflecting mirror 210 is rotated relative to the inclination angle b and 130 equipment of laser scanning module of F-theta mirror 400
Angle ψ meets following condition:
Assuming that selecting both sides of the edge light from the light beam that laser scanning module 130 projects is respectively light 12 and light
14, the two angle is ψ, and light 14 forms light 16 after the mirror surface 13 of the first reflecting mirror 210 reflects, and light 12 is by the
The mirror surface 13 of one reflecting mirror 210 forms light 15 after reflecting, light 15 forms 17 He of reflected light after the light splitting of spectroscope 220
Reflect light 18.
The relationship of the mirror surface 13 of light 12 and light 14 and the first reflecting mirror 210 meets:
The intersection point of the intersection point (x1, y1) of light 12 and mirror surface 13, light 14 and mirror surface 13 can be then found out by above formula
The specific coordinate value of (x2, y2):
Then for the length L of the first reflecting mirror 210dThere is following constraint condition:
Requirement for spectroscope 220 is specifically referring to figure 3. incident to what the light of spectroscope 220 was formed after light splitting
Reflected light and refraction light, wherein incidence angle is θ, angle of reflection θ1, refraction angle θ2, must satisfy θ=θ1=θ2, in this way may be used
To guarantee that, in scanning, reflected light scans in a symmetrical manner always with refraction light.
In scanning, laser is moved according to scan path, when laser is mobile, is entered to spectroscope 220 is incident
Firing angle necessarily can also change, it is assumed that change rate is Δ θ, then the change rate of angle of reflection is Δ θ1, the change rate at refraction angle is
Δθ2, should also meet Δ θ=Δ θ at this time1=Δ θ2。
Assuming that at this time laser spot position on spectroscope 220 relative to lower work face (if lower section is lens module, then
Working face be its make light generate refraction plane of refraction) vertical distance h, then can calculate light variation front and back light movement
Horizontal distance
Δ d=h* (tan (θ+Δ θ)-tan θ), thus in laser beam moving process, it is based on above-mentioned calculation formula, it can
To control scan path.
In the present embodiment, lens module is provided between spectral module 200 and material to be processed, which is
Horizontal positioned, plane of refraction is parallel to the horizontal plane.Reflected light and refraction light after the mirror 220 that is split light splitting are rolled over by lens module
The light beam that optical path is parallel to each other is formed after penetrating, and is then exposed on material to be processed.Reflection after being divided due to the mirror 220 that is split
Light and refraction light are to two different directions, ordinary circumstance, if meeting visual field requirement, lens module includes a F-theta
Mirror 400 is greatly utilized visual field and reduces costs in this way referring to Fig. 5；It, can benefit if visual field requirement is larger
With multiple F-theta mirrors 400, referring to Fig. 7, the light beam for being emitted spectroscope 220 is incident to different F-theta mirrors 400 respectively,
On the one hand solve the problems, such as that visual field, another aspect optical path are more nearly the shaft core position of F-theta mirror 400 according to such cabling,
Can avoid leading to multibeam scanning greatly due to visual field when being incident to same F-theta mirror 400 is F-theta mirror 400
Marginal position avoids the axial portions scanning Dead Core Problems of F-theta mirror 400.
Please continue to refer to Fig. 5, laser scanning module 130 includes portal frame 1301 and galvanometer unit 1302, galvanometer unit
1302 are slidably mounted on portal frame 1301, and material 300 to be processed is located at 1301 lower section of portal frame, and portal frame 1301 can also make
It is replaced with other laser scanning microscope carriers.
Material to be processed 300 of the present invention includes material to be packaged, material to be annealed etc., and the present embodiment applies to add
Can refer to Fig. 1 and Fig. 2 described in work the case where material to be packaged, from bottom to up respectively base plate glass 330, be placed on base plate glass
Oled layer 360 on 330, and the frit 340 being placed on around oled layer 360, are arranged on base plate glass 330 and oled layer
The electrode 350 of 360 connections, cover-plate glass 310 are covered on above structure, use between cover-plate glass 310 and base plate glass 330
The encapsulation connection of frit 340 when laser package, passes through cover board using the laser that laser processing device described in the present embodiment is emitted
Glass 310 is radiated on frit 340, so that 340 heating and melting of frit, laser package is completed in molding after solidification.
The present invention also provides a kind of laser processings using above-mentioned laser processing device, by the laser module
140 laser provided form the laser moved along scan path after the laser scanning module 130, along scan path
Mobile laser enters the spectral module 200, is divided after first reflecting mirror 210 reflection by the spectroscope 220,
Form reflected light and refraction light, it is ensured that angle of reflection, the refraction of the incidence angle and the reflected light of the incident spectroscope 220
The refraction angle of light is equal, the reflected light and the light for reflecting light and being parallel to each other by formation optical path after lens module refraction
Line, and irradiated to the material to be processed, the material to be processed is laser machined, the laser scanning module 130 is pressed
Adjust the laser according to the scan path of material 300 to be processed so that the reflected light and refraction light according to scan path simultaneously
The material to be processed 300 of single any symmetric shape is scanned, or respectively to the to be processed of two symmetrical arbitrary shapes
Material 300 is scanned.
Embodiment two
The difference between this embodiment and the first embodiment lies in Fig. 8 is please referred to, in order to reach scanning machining without dead angle, Ke Yi
220 two sides of spectroscope setting, two reflecting mirrors, respectively the second reflecting mirror 230 and third reflecting mirror 240 positioned at left side, second
Reflecting mirror 230 and third reflecting mirror 240 are symmetrical about spectroscope 220, and height of two reflecting mirrors relative to material to be processed
Height less than spectroscope 220 relative to material to be processed.
Reflected light and refraction light after the light splitting of spectroscope 220 is respectively by the second reflecting mirror 230 and third reflecting mirror
240 are reflected into lens module, and spectroscope 220 and two reflecting mirrors are all perpendicular to lens module at this time, at this time reflected light and folding
Processing speed and the machining path for penetrating light are all identical.
Fig. 9 and Figure 10 are please referred to, using laser processing device provided in this embodiment and method to single symmetric shape
Material to be processed laser machined, can to avoid the axial portions of lens module scan dead angle.The present embodiment can be symmetrical
Single any symmetric figure is processed, can also carry out simultaneous processing to two symmetrical arbitrary shape figures.
Embodiment three
The present embodiment is with the difference of embodiment one, please refers to Figure 14 and Figure 15:
Figure 11 is please referred to, also needs two reflecting mirrors of setting at this time, two reflecting mirrors are equally placed vertically, but the two phase
Height for material to be processed is simultaneously unequal, in addition, 220 slant setting of spectroscope, angle with horizontal plane α.
In Figure 11, two maximum rim rays of spacing are selected in the laser beam incident to spectroscope 220, respectively 21
With 22, to spectroscope 220 it is incident then to generate two incidence points be respectively A point and B point, project the light on A point through excessive
Light microscopic 220 forms reflection light 23 after reflecting, and the light projected on B point forms reflection light after the reflection of spectroscope 220
24, wherein light 24 is vertical direction, and two reflection lights 23,24 are all directly entered lens module and are reflected.
Light on A point and B point is respectively formed refracted light 25 and 26 after the refraction of spectroscope 220, and light 25 is by the
Reflection light 27 is formed after the reflection of three reflecting mirrors 250, light 26 forms reflection light 28, light after being reflected by third reflecting mirror 250
Reflection point of the line 25 on third reflecting mirror 250 is C point, and reflection point of the light 26 on third reflecting mirror 250 is D point, reflection
Light 27 and reflected light ray 28 are all incident to the second reflecting mirror 240, and incidence point is respectively E point and F point, 27 He of reflection light
28 form reflection light 29 and 30 after the reflection of the second reflecting mirror 240, and reflection light 29 and 30 all enters F-theta mirror 400.
Figure 12 is please referred to, spectroscope 220 and the angle of trunnion axis are α, be can be obtained at this time between A point and B point in vertical side
It is respectively to the distance in horizontal direction
h1=Δ Lsin α
h2=Δ Lcos α
The angle of reflection light 23 and vertical direction, reflection light 24 and vertical direction at this time can be calculated according to above formula
Between angle be respectively the θ of β=2-φ
Wherein
Local field of view at this time are as follows: length1=(L0+L1+L2+L3)tanβ
length2=(L0+L1+L2+L3-h1)tanδ
Wherein vertical distance of the L0 between A point and C point, L1 are the vertical distance of C point and E point, L2 be E point and F point it
Between distance, L3 is the vertical distance between the horizontal plane where F point and the F-theta mirror 400, and φ is incident light at C point
The incidence angle of beam,For the incidence angle of incident beam at D point, ω is the angle of incident beam and 220 mirror surface of spectroscope at B point,
That is the incidence angle of incident beam at B point.
Have reflected light path visual field as follows:
S+2 Δ s=length1+length2+h2
Similarly we can find out refraction light visual field be
Wherein S is the bore radius of F-theta mirror 400, and 2* Δ S is the overlapping region that two-beam spot is passed by,
Parameter meets simultaneously at this time
L1=L2+L3
In addition, according to refractive index law it is found that being in 220 internal refraction angle of spectroscope
Wherein n is ambient refractive index, and n1 is the spectroscope refractive index, and θ is that A points out incident beam and spectroscope mirror surface
Angle, θ ' are the mirror surface that incident ray enters refracted light and spectroscope 220 after spectroscope 220 in spectroscope 220 at A point
Angle.
So having
Please refer to Figure 13, have at this time from A point enter after spectroscope 220 refraction point and after the refraction of spectroscope 220 from minute
Vertical range h3 and horizontal distance h4 between the eye point of 220 another side of light microscopic outgoing are respectively as follows:
h3=a/tan θ ' * sin α
Wherein a is the thickness of spectroscope 220.
Then meet condition at this time
s+length2+h2-h4=(L0-h3)tanφ
By arrangement, have:
Wherein, vertical distance of the L between C point and D point, Δ L are the length of A point and B point on 220 mirror surface of spectroscope,
Known θ, ω, Δ L, L, a, L2, S, Δ s, θ ' are it is known that find out α, L0,L1,L3The modes of emplacement of spectroscope 220 can be positioned, divided
Between vertical range, third reflecting mirror 240 and the second reflecting mirror 230 between light microscopic 220 and third reflecting mirror 240 it is vertical away from
From, the vertical range of the second reflecting mirror 230 and 400 working face of F-theta mirror.
At this point, the parameter between spectroscope 220, the second reflecting mirror 230 and third reflecting mirror 240 meets following requirements:
When processing the figure of single symmetric shape, adjustment spectroscope 220, the first reflecting mirror 210, the second reflecting mirror 230,
Relationship between third reflecting mirror 240, by the second reflecting mirror 230, third reflecting mirror after mirror 220 is divided so that laser is split
Being formed after 240 reflection has the laser facula in region of overlapping each other, this be in order to protect joint hot spot have one slowly
The power rise phase and synchronized in joint heated, optimize the processing effect of joint.
Please refer to Figure 16, when processing scan path be straight line, then be arranged initial position reflected light and reflect light formed
Hot spot is interlaced with each other, and then the two scans corresponding track with synchronous processing speed, due to only changing to spectroscope
The angle of 220 incident incident beams, then reaching symmetrical machining in the case where meeting the law of refraction and reflection law.
Figure 17 is please referred to, when the scan path of processing is circular arc, same initial position reflected light and the refraction light of being arranged is formed
Hot spot it is interlaced with each other, both then corresponding track is scanned with synchronous processing speed, is added with reaching good connector
Work efficiency fruit, reflected light and refraction light are starting to be scanned at processing with opposite directions.
Figure 18 is please referred to, when the scan path of processing is ellipse, similar to the above case, details are not described herein again.
Above-described embodiment is described in the present invention, but the present invention is not limited only to above-described embodiment.Obvious this field
Technical staff can carry out various modification and variations without departing from the spirit and scope of the present invention to invention.If in this way, this hair
These bright modifications and variations within the scope of the claims of the present invention and its equivalent technology, then the invention is also intended to include
Including these modification and variations.
Claims (14)
1. a kind of laser processing device, which is characterized in that including laser module, laser scanning module, spectral module and control
Unit processed, the laser module provide the laser for processing, and the laser is incident to after the laser scanning module
The laser is carried out light splitting and forms reflected light and refraction light, the laser scanning mould by the spectral module, the spectral module
Block controls the reflected light and the refraction light and treats processing materials symmetrical scanning according to scan path；Described control unit and institute
It states laser module to connect with the laser scanning module, for controlling the laser module and the laser scanning module.
2. laser processing device as described in claim 1, which is characterized in that the processing unit (plant) further includes lens module, is used
The light beam being parallel to each other at optical path is reflected in the light beam for being emitted the spectral module.
3. laser processing device as claimed in claim 2, which is characterized in that the spectral module includes the first reflecting mirror and divides
Light microscopic, the laser are incident to first reflecting mirror after the laser scanning module, and first reflecting mirror will be described
Laser reflection is divided by the spectroscope later to the spectroscope, forms the reflected light and the refraction light.
4. laser processing device as claimed in claim 3, which is characterized in that the spectroscope is perpendicular to the lens module.
5. laser processing device as claimed in claim 3, which is characterized in that the spectral module further include the second reflecting mirror and
Third reflecting mirror sets up separately in spectroscopical two sides and mirror surface is perpendicular to the lens module, and the spectroscope favours institute
State lens module, the wherein light beam in the reflected light and the refraction light is incident to the lens unit, another light beam according to
It is secondary that the lens module is reflexed to by second reflecting mirror, the third reflecting mirror.
6. laser processing device as claimed in claim 3, which is characterized in that the spectral module further include the second reflecting mirror and
Third reflecting mirror sets up separately in spectroscopical two sides and mirror surface is perpendicular to the lens module, and the spectroscope is perpendicular to institute
Lens module is stated, the reflected light is incident to second reflecting mirror, the refracted light incident to the third reflecting mirror, later
It is reflected onto the lens module.
7. laser processing device as claimed in claim 3, which is characterized in that first reflecting mirror and the lens module it
Between have angle β, the rotation angle ψ of angle β and the laser scanning module meets following condition:
8. the laser processing device as described in claim 4,5 or 6, which is characterized in that be emitted after the spectral module
Light beam is incident to the same lens module.
9. the laser processing device as described in claim 4,5 or 6, which is characterized in that be emitted after the spectral module
Light beam is incident to different lens modules.
10. laser processing device as claimed in claim 1, which is characterized in that the material to be processed includes wait seal
Fill material, material to be annealed.
11. a kind of laser processing using laser processing device as claimed in claim 1, which is characterized in that
The laser provided by laser module enters spectral module after laser scanning module, the shape after spectral module light splitting
At reflected light and refraction light, the laser scanning module adjusts the laser according to the scan path of material to be processed, so that institute
It states reflected light and reflects light and the material to be processed of single any symmetric shape is scanned simultaneously according to scan path, or respectively
The material to be processed of two symmetrical arbitrary shapes is scanned.
12. laser processing as claimed in claim 11, which is characterized in that process the to be processed of single any symmetric shape
When material, the reflected light and the hot spot for reflecting initial position formation of the light in scan path have overlapping region.
13. a kind of laser package method, which is characterized in that carry out laser using laser processing as claimed in claim 11
Encapsulation.
14. a kind of laser anneal method, which is characterized in that carried out using the laser processing as described in claim 11 is any
Laser annealing.
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| CN201711048772.2A CN109719387B (en) | 2017-10-31 | 2017-10-31 | Laser processing device and method, laser packaging method and laser annealing method |
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| CN201711048772.2A CN109719387B (en) | 2017-10-31 | 2017-10-31 | Laser processing device and method, laser packaging method and laser annealing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243316A (en) * | 2019-07-05 | 2019-09-17 | 新代科技(苏州)有限公司 | A kind of processing unit (plant) |
| CN112059434A (en) * | 2020-08-11 | 2020-12-11 | 上海市激光技术研究所 | Laser processing equipment and taper improving method |
| CN115609162A (en) * | 2022-12-19 | 2023-01-17 | 扬州艾镭激光设备有限公司 | Automatic height-adjusting type laser marking machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110243316A (en) * | 2019-07-05 | 2019-09-17 | 新代科技(苏州)有限公司 | A kind of processing unit (plant) |
| CN112059434A (en) * | 2020-08-11 | 2020-12-11 | 上海市激光技术研究所 | Laser processing equipment and taper improving method |
| CN115609162A (en) * | 2022-12-19 | 2023-01-17 | 扬州艾镭激光设备有限公司 | Automatic height-adjusting type laser marking machine |
| CN115609162B (en) * | 2022-12-19 | 2023-03-07 | 扬州艾镭激光设备有限公司 | Automatic increase formula laser marking machine |
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