CN109714925A - Electronic equipment and its packaging technology - Google Patents
Electronic equipment and its packaging technology Download PDFInfo
- Publication number
- CN109714925A CN109714925A CN201711009285.5A CN201711009285A CN109714925A CN 109714925 A CN109714925 A CN 109714925A CN 201711009285 A CN201711009285 A CN 201711009285A CN 109714925 A CN109714925 A CN 109714925A
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- CN
- China
- Prior art keywords
- shell
- casing
- glue
- waterproof
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012536 packaging technology Methods 0.000 title abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 117
- 239000000084 colloidal system Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 13
- 239000012790 adhesive layer Substances 0.000 claims 6
- 238000012858 packaging process Methods 0.000 claims 3
- 238000010276 construction Methods 0.000 abstract description 6
- 230000013011 mating Effects 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 229960001866 silicon dioxide Drugs 0.000 description 4
- 238000005266 casting Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
The disclosure provides a kind of electronic equipment and its packaging technology, the electronic equipment includes first shell and second shell, the first shell and the second shell can cooperate assembling, Waterproof glue line is equipped between the first shell and the second shell, the Waterproof glue line is formed by glue curing, and the Waterproof glue line forms enclosed construction along the cooperation position of the first shell and the second shell.The disclosure forms Waterproof glue line using glue curing by the housing mating position in electronic equipment, which is encircled into enclosed construction to seal the electronic equipment；The Waterproof glue line is securable on shell, is assembled, and be not susceptible to deform convenient for shell, is improved the waterproof performance of electronic equipment.
Description
Technical field
This disclosure relates to rate electronics packages technical field more particularly to a kind of electronic equipment and its packaging technology.
Background technique
With the rise of waterproof concept mobile phone, more and more mobile phones begin to use waterproof construction.For splitting into up and down
For the structure of two shells, in order not to enter water inside complete machine from the mating surface of two shells, need to match in two shells
Waterproof is sealed at conjunction.
In the related technology, the waterproof method of upper and lower two shells is generally used adds compressed silicone rubber between upper and lower two shells
Mode realize the effect of waterproof.
Summary of the invention
The disclosure provides a kind of electronic equipment and its packaging technology, to solve deficiency in the related technology.
According to the first aspect of the embodiments of the present disclosure, a kind of electronic equipment, including first shell and second shell, institute are provided
Assembling can be cooperated by stating first shell and the second shell, and marine glue is equipped between the first shell and the second shell
Layer, the Waterproof glue line are formed by glue curing, cooperation of the Waterproof glue line along the first shell and the second shell
Position forms enclosed construction.
Optionally, the Waterproof glue line is formed in any of the first shell and the second shell, described
First shell cooperates Waterproof glue line when assembling to be compressed with the second shell, with the first shell to cooperation assembling
And second shell sealing.
Optionally, the Waterproof glue line includes the first colloid layer being formed in the first shell, and is formed in described
The second colloid layer in second shell；The first shell and the second shell cooperation assemble when, first colloid layer with
The second colloid layer mutual extrusion deformation, with the first shell and second shell sealing to cooperation assembling.
Optionally, the Waterproof glue line passes through dispensing or spray-bonding craft in the first shell or the second shell by glue
Solidify on body.
Optionally, there are fit clearance between the first shell and the second shell, the Waterproof glue line is located at institute
It states in fit clearance and seals the gap.
Optionally, the thickness of the Waterproof glue line is greater than the fit clearance.
Optionally, the Waterproof glue line includes UV glue.
According to the second aspect of an embodiment of the present disclosure, a kind of electronic equipment packaging technology is provided, comprising the following steps:
Glue is set on the cooperation position of first shell and second shell and is solidified into sealing structure；
By the first shell and the second shell cooperation assemble, make the sealing structure be located at the first shell and
Between the second shell in fit clearance, with the first shell and second shell sealing to cooperation assembling.
It is optionally, described that glue is set on the cooperation position of first shell and second shell and is solidified into sealing structure,
Include:
Glue is set in any of the first shell and the second shell by dispensing or spray-bonding craft, institute
It states glue and is solidified into sealing structure in any of the first shell and the second shell.
It is optionally, described that glue is set on the cooperation position of first shell and second shell and is solidified into sealing structure,
Include:
Glue is set in the first shell by dispensing or spray-bonding craft and forms the first colloid layer, passes through dispensing or spray
Glue is set in the second shell and forms the second colloid layer by adhesive process, first colloid layer and the second colloid layer structure
At the sealing structure.
The technical scheme provided by this disclosed embodiment can include the following benefits:
The disclosure uses glue curing at Waterproof glue line by the cooperation position in casting of electronic device, and the marine glue is laminated
Enclosed construction is surrounded to seal the electronic equipment；The Waterproof glue line is securable on shell, is assembled convenient for shell, and be not easy
It deforms, can be improved the waterproof performance of electronic equipment.
Detailed description of the invention
Fig. 1 is the signal of local shell and Waterproof glue line in a kind of electronic equipment shown in one exemplary embodiment of the disclosure
Figure.
Fig. 2 is that local shell and Waterproof glue line show in a kind of electronic equipment shown in disclosure another exemplary embodiment
It is intended to.
Fig. 3 is the schematic diagram of Waterproof glue line compression in a kind of electronic equipment shown in one exemplary embodiment of the disclosure.
Fig. 4 is the flow chart of a kind of electronic equipment packaging technology shown in one exemplary embodiment of the disclosure.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the disclosure
A little information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.For example, not departing from
In the case where disclosure range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination ".
Fig. 1 is the signal of local shell and Waterproof glue line in a kind of electronic equipment shown in one exemplary embodiment of the disclosure
Figure；Fig. 2 is the schematic diagram of local shell and Waterproof glue line in a kind of electronic equipment shown in disclosure another exemplary embodiment.
As shown in Figures 1 and 2, the electronic equipment includes first shell 1 and second shell 2, the first shell 1 and the second shell
Body 2 can cooperate the upper housing and lower case of assembling, such as mobile phone etc..It is equipped between the first shell 1 and the second shell 2
Waterproof glue line 3, the Waterproof glue line 3 are formed by glue curing.For example, the Waterproof glue line 3 is formed using UV adhesive curing, so that should
Waterproof glue line 3 forms enclosed construction, and the fit clearance between the first shell 1 and the second shell 2 is arranged with close
Seal the electronic equipment.
When in the related art, using the soft silica gel waterproof of matter, silica gel, which is not easy to be fixed on shell, (need to use glue or stuck glue
Structure is fixed), and be relatively easy to deform and influence the waterproofness of electronic equipment in use.In the skill of the disclosure
In art scheme, since the Waterproof glue line 3 is formed by glue curing, thus the Waterproof glue line 3 is securable to the electronics and sets
It on standby shell, and is unlikely to deform, can be improved the waterproofness of electronic equipment.
Please continue to refer to Fig. 1 and Fig. 2, there are fit clearances between the first shell 1 and the second shell 2, described
Waterproof glue line 3 is located in the fit clearance and seals the fit clearance.In the present embodiment, the thickness of the Waterproof glue line 3
Degree is greater than the fit clearance, and the Waterproof glue line 3 has certain elasticity.By the first shell 1 and the second shell
After the assembling cooperation of body 2, the Waterproof glue line 3 can be compressed certain proportion and seal the fit clearance.
In one embodiment, glue can be made to be formed in the first shell 1 by dispensing or spray-bonding craft.Due to glue
It can be fixed directly in first shell 1 with viscosity, compared to silicagel pad (need to have larger space) is used, have and do not limited by space
The advantages of processed.Since glue has viscosity and thixotropy, it is adapted to the different bonding surface of shell.For example, shown in Fig. 1, institute
The contact surface stated between first shell 1 and the second shell 2 is plane 4, and glue can be in the plane 4 of the first shell 1
On be solidified into the Waterproof glue line 3.As also shown in fig. 2, the first shell 1 is curved surface front housing, after the second shell 2 is
Shell is covered with curved surface touch glass 6 in the first shell 1.Contact between the first shell 1 and the second shell 2
Face is inclined-plane 5, and glue can equally be solidified into the Waterproof glue line 3 in the plane 4 of the first shell 1.Therefore glue is used
The molding Waterproof glue line of water, is particularly suitable for the casting of electronic device with curved-surface structure, has compared to the relevant technologies
Freedom of processing is big, adapts to wide advantage.Especially when forming Waterproof glue line 3 using UV glue (light-sensitive emulsion), it can achieve fast
The cured purpose of speed, can be improved production efficiency.It is of course also possible to make glue be formed in described second by dispensing or spray-bonding craft
On shell 2, when the first shell 1 cooperates with the second shell 2 and assembles, the Waterproof glue line 3 is compressed, to cooperation
The first shell 1 and second shell 2 of assembling seal.
As shown in figure 3, in another embodiment of disclosed technique scheme, using the Waterproof glue line 3 of double-layer structure.Institute
Stating Waterproof glue line 3 includes the first colloid layer 31 and the second colloid layer 32.Wherein, the first colloid layer 31 is formed in the first shell
On 1, second colloid layer 32 is formed in the second shell 2.Such as above-described embodiment, can be made by dispensing or spray-bonding craft
Glue is respectively formed on the edge of the first shell 1 and the second shell 2, by adjusting the thixotropy and viscosity of glue
Etc. parameters to adapt to plane or inclined-plane in first shell 1 and second shell 2 etc..
When the first shell 1 is assembled with the second shell 2 cooperation, first colloid layer 31 and second glue
32 mutual extrusion of body layer deformation, with the first shell 1 and the sealing of second shell 2 to cooperation assembling.In Fig. 3, the first colloid
Layer 31 on dotted line 311 to the boundary contacted with 21 second colloid layer 32 of the first colloid layer region, for first colloid layer 31
Deformation region, the region of dotted line 321 on the second colloid layer 32 to the boundary of second colloid layer 32, for second colloid layer
32 deformation region.Setting may make Waterproof glue line 3 to have double-layer structure in this way, seal against each other for two layers, and the marine glue can be improved
The leakproofness of layer 3.
As shown from the above technical solution, the disclosure is by selecting flexible glue curing on the shell of electronic equipment
Formation type Waterproof glue line 3 assembles first shell 1 and when second shell 2 compressible Waterproof glue line 3 to reach waterproof effect.
Glue is formed in the plane or inclined-plane of casting of electronic device by dispensing or spray-bonding craft, can not be limited by space etc.,
Freedom of processing is big, adapts to wide.
The disclosure also provides a kind of electronic equipment packaging technology, as shown in figure 4, Fig. 4 is a kind of electronic equipment in the disclosure
Packaging technology flow chart.The packaging technology of the electronic equipment the following steps are included:
In step 401, glue is set on the cooperation position of first shell 1 and second shell 2 and is solidified into sealing knot
Structure.
In this step, glue can be set to the first shell 1 and the second shell 2 by dispensing or spray-bonding craft
Any of on, the glue be solidified into any of the first shell 1 and the second shell 2 sealing knot
Structure.Or glue is set in the first shell 1 by dispensing or spray-bonding craft and forms the first colloid layer 31, by dispensing or
Glue is set in the second shell 2 and forms the second colloid layer 32 by spray-bonding craft, first colloid layer 31 and described second
Colloid layer 32 constitutes the sealing structure.
Flexible glue after solidification, such as UV glue (light-sensitive emulsion) can be selected in the glue.It in the present embodiment, can be with
By parameters such as the thixotropy of adjusting glue and viscosity, glue is made to meet technique requirement.Such as, change glue thixotropy make it is described
Glue can be formed in plane and inclined-plane etc.；Or the parameter by adjusting dispenser or glue sprayer makes 3 needs of Waterproof glue line
Height and width.As can be seen from the above embodiments, the Waterproof glue line 3 is formed using glue, Waterproof glue line 3 can be made to be formed
On housing face or inclined-plane, have the advantages that not limited by space etc., freedom of processing is big, it is wide to adapt to.
In step 402, the first shell 1 and the second shell 2 cooperation are assembled, is located at the sealing structure
Between the first shell 1 and the second shell 2 in fit clearance, with the first shell 1 and second to cooperation assembling
Shell 2 seals.
As can be seen from the above embodiments, the packaging method of the disclosure only needs to adjust colloid and dispensing or glue spraying parameter in electronics
Waterproof glue line 3 is formed by curing on apparatus casing, can steady production, no longer need to that waterproof performance can be improved using glue sticking silica gel,
And improve production efficiency.
It should illustrate, the embodiment of the above method and electronic equipment can be complementary to one another in the absence of conflict.
The foregoing is merely the preferred embodiments of the disclosure, not to limit the disclosure, all essences in the disclosure
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of disclosure protection.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711009285.5A CN109714925A (en) | 2017-10-25 | 2017-10-25 | Electronic equipment and its packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711009285.5A CN109714925A (en) | 2017-10-25 | 2017-10-25 | Electronic equipment and its packaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109714925A true CN109714925A (en) | 2019-05-03 |
Family
ID=66252042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711009285.5A Pending CN109714925A (en) | 2017-10-25 | 2017-10-25 | Electronic equipment and its packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109714925A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111526684A (en) * | 2019-07-02 | 2020-08-11 | 昆山联滔电子有限公司 | Product for preventing adhesive layer from deterioration and manufacturing method thereof |
| CN114112919A (en) * | 2020-08-31 | 2022-03-01 | 深圳市帝迈生物技术有限公司 | Optical flow cell assembly, optical detection device and sample analysis apparatus |
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- 2017-10-25 CN CN201711009285.5A patent/CN109714925A/en active Pending
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|---|---|---|---|---|
| TWM287549U (en) * | 2005-08-03 | 2006-02-11 | Universal Scient Ind Co Ltd | Electronic product having rotation-type lens |
| JP2011239099A (en) * | 2010-05-07 | 2011-11-24 | Nec Casio Mobile Communications Ltd | Waterproof apparatus and electronic equipment |
| CN102543525A (en) * | 2012-01-16 | 2012-07-04 | 广东步步高电子工业有限公司 | Key device for mobile communication terminal and mobile communication terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111526684A (en) * | 2019-07-02 | 2020-08-11 | 昆山联滔电子有限公司 | Product for preventing adhesive layer from deterioration and manufacturing method thereof |
| CN111526684B (en) * | 2019-07-02 | 2021-11-19 | 昆山联滔电子有限公司 | Product for preventing adhesive layer from deterioration and manufacturing method thereof |
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| CN114112919A (en) * | 2020-08-31 | 2022-03-01 | 深圳市帝迈生物技术有限公司 | Optical flow cell assembly, optical detection device and sample analysis apparatus |
| CN114112919B (en) * | 2020-08-31 | 2024-04-05 | 深圳市帝迈生物技术有限公司 | Optical flow cell assembly, optical detection device and sample analysis device |
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| PB01 | Publication | ||
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Application publication date: 20190503 |