CN109708848A - Test fixtures and machines - Google Patents
Test fixtures and machines Download PDFInfo
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- CN109708848A CN109708848A CN201910123243.7A CN201910123243A CN109708848A CN 109708848 A CN109708848 A CN 109708848A CN 201910123243 A CN201910123243 A CN 201910123243A CN 109708848 A CN109708848 A CN 109708848A
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- Prior art keywords
- heat transfer
- transfer block
- test fixture
- spring needle
- circuit board
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- 238000012360 testing method Methods 0.000 title claims abstract description 85
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000012546 transfer Methods 0.000 claims description 73
- 239000004065 semiconductor Substances 0.000 claims description 30
- 238000001816 cooling Methods 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000003321 amplification Effects 0.000 abstract description 12
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000002360 explosive Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
This application provides a kind of test fixture and boards, are related to jig technical field, and test fixture includes: pedestal, circuit board and the first spring needle；One end of first spring needle and circuit board electrical connection, the other end is for connecting product to be measured；Conductive column is set on pedestal, and circuit board is electrically connected with conductive column；Wherein, the first spring needle and conductive column correspond, so that the first spring needle is electrically connected with conductive column.Since the first spring needle is very thin, it connect and is easily damaged with other component, but the application uses the first spring needle and circuit board electrical connection, this is the amplification of first order physics, and circuit board is electrically connected with conductive column again, this is the amplification of second level physics；After the amplification of two-stage physics, original first spring needle contact is become into conductive column contact, the area of contact point increases, and when connection can guarantee that contact is good, ensures that the signal output end of test fixture and platform body effectively quickly connects.
Description
Technical field
This application involves jig technical fields, more particularly, to a kind of test fixture and board.
Background technique
The center processing optical test of small spare part is concentrated mainly on two stages, wherein the test in mould group stage is aobvious
It obtains particularly important.The nucleus module of test is jig, it directly influences the reliability of test.
However, existing jig is there are the technical problem of some keys, for example, spare part very little, be unable to ensure its with it is outer
Boundary's test equipment effectively quickly connects；Alternatively, small spare part is during the test, heat can be generated, temperature is caused to increase, into
And it not can guarantee and accurately test required temperature.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of test fixture and board, to solve above-mentioned technology
One of problem.
In a first aspect, this application provides a kind of test fixtures, comprising: pedestal, circuit board and the first spring needle；
One end of first spring needle and the circuit board electrical connection, the other end is for connecting product to be measured；The bottom
Conductive column is set on seat, the circuit board is electrically connected with the conductive column；
Wherein, first spring needle and the conductive column correspond, so that first spring needle and the conduction
Column electrical connection.
With reference to first aspect, this application provides the first possible embodiments of first aspect, wherein further include with
The radiating subassembly of the product connection to be measured；
Wherein, the radiating subassembly includes heat transfer block and semiconductor cooler, at least partly surface of the heat transfer block with
The product connection to be measured, the heat transfer block are connect far from the one side of the product to be measured with the semiconductor cooler.
The possible embodiment of with reference to first aspect the first, second this application provides first aspect are possible
Embodiment, wherein further include the fixed block with jack, the fixed block is arranged on the circuit board, and described solid
Determine setting first spring needle in the jack of block.
The possible embodiment of with reference to first aspect the first or second of possible embodiment, this application provides
The third possible embodiment of first aspect, wherein the heat transfer block includes the first heat transfer block interconnected and second
Heat transfer block, and the volume of first heat transfer block is greater than the volume of second heat transfer block；
Wherein, one side of second heat transfer block far from first heat transfer block is connect with the product to be measured.
The possible embodiment of with reference to first aspect the first or second of possible embodiment or the third possibility
Embodiment, this application provides the 4th kind of possible embodiments of first aspect, wherein in first heat transfer block
One end opens up notch, and second heat transfer block is vertically erected on the notch of first heat transfer block；
It further include thermocouple, one end of the thermocouple passes through the notch and second heat transfer block of first heat transfer block
Connection, the other end of the thermocouple pass through the semiconductor cooler and connect with the circuit board.
The possible embodiment of with reference to first aspect the first or second of possible embodiment or the third possibility
Embodiment or the 4th kind of possible embodiment, this application provides the 5th kind of possible embodiment of first aspect,
It wherein, further include fixing seat, one end of the fixing seat is set on second heat transfer block, for fixing the thermocouple；
The other end of the fixing seat is connect by bolt with first heat transfer block, is attached to first biography for fixed
The aluminium paper on heat block surface.
The possible embodiment of with reference to first aspect the first or second of possible embodiment or the third possibility
Embodiment or the 4th kind of possible embodiment or the 5th kind of possible embodiment, this application provides first aspects
6th kind of possible embodiment, wherein further include cooling fin, the cooling fin is connect with the semiconductor cooler.
The possible embodiment of with reference to first aspect the first or second of possible embodiment or the third possibility
Embodiment or the 4th kind of possible embodiment or the 5th kind of possible embodiment or the 6th kind of possible embodiment,
This application provides the 7th kind of possible embodiments of first aspect, wherein further include frame, the frame have with it is described
The identical groove of bottom surface size of pedestal, the pedestal setting is in the groove；It is corresponding to the frame in the pedestal
Blind hole is opened up on position, and elastic component and housing screw are fitted in the blind hole.
Second aspect, this application provides a kind of board, including platform body and test fixture as described above, the surveys
The conductive column of examination jig is electrically connected with the signal output end of the platform body by second spring needle.
In conjunction with second aspect, this application provides the first possible embodiments of second aspect, wherein in the frame
Connecting hole is set in one of them of frame and the platform body, connector is set on another；
The connecting hole is used cooperatively with the connector, so that the platform body is connect with the frame.
The application provides a kind of test fixture and board, wherein test fixture includes: pedestal, circuit board and the first spring
Needle；One end of first spring needle and circuit board electrical connection, the other end is for connecting product to be measured；Conductive column is set on pedestal, electricity
Road plate is electrically connected with conductive column；Wherein, the first spring needle and conductive column correspond, so that the first spring needle is electrically connected with conductive column
It connects.It since the first spring needle is very thin, connect and is easily damaged with other component, but the application uses the first spring needle and circuit board
Electrical connection, this is the amplification of first order physics, and circuit board is electrically connected with conductive column again, this is the amplification of second level physics；By two-stage
After physics amplification, original first spring needle contact is become into conductive column contact, the area of contact point increases, can be with when connection
Guarantee that contact is good, ensures that the signal output end of test fixture and platform body effectively quickly connects.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Attached drawing is described in detail below.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows the structural schematic diagram of test fixture provided by the embodiment of the present application Yu assembling product to be measured；
Fig. 2 shows the structural schematic diagrams of test fixture provided by the embodiment of the present application；
Fig. 3 shows the explosive view of test fixture provided by the embodiment of the present application；
Fig. 4 shows the first sectional view of test fixture provided by the embodiment of the present application Yu assembling product to be measured；
Fig. 5 shows second of sectional view of test fixture provided by the embodiment of the present application Yu assembling product to be measured；
Fig. 6 shows the partial structural diagram of test fixture provided by the embodiment of the present application；
Fig. 7 shows the explosive view of the floating bolt of test fixture provided by the embodiment of the present application.
Icon: 1- test fixture；101- pedestal；102- circuit board；The first spring needle of 103-；104- conductive column；105- is passed
Heat block；The first heat transfer block of 1051-；The second heat transfer block of 1052-；1053- notch；106- semiconductor cooler；107- fixed block；
1071- jack；108- thermocouple；109- fixing seat；1091- bolt；110- cooling fin；111- frame；1111- groove；1112-
Blind hole；1113- connecting hole；112- elastic component；113- housing screw；2-VCSEL mould group.
Specific embodiment
To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
Middle attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.The application being usually described and illustrated herein in the accompanying drawings is real
The component of example is applied to arrange and design with a variety of different configurations.Therefore, the implementation of the invention to providing in the accompanying drawings below
The detailed description of example is not intended to limit the range of claimed invention, but is merely representative of selected implementation of the invention
Example.Based on the embodiment of the present invention, those skilled in the art are obtained all without making creative work
Other embodiments shall fall within the protection scope of the present invention.
In the description of the embodiment of the present application, it should be noted that term " center ", "upper", "lower", "left", "right",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings,
Either the invention product using when the orientation or positional relationship usually put, be merely for convenience of the description present invention and simplification retouched
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, and
It cannot be understood as indicating or implying relative importance.
In addition, the terms such as term "horizontal", "vertical" are not offered as requiring component abswolute level or pendency, but can be slightly
Low dip.It is not to indicate that the structure has been had to if "horizontal" only refers to that its direction is more horizontal with respect to for "vertical"
It is complete horizontal, but can be slightly tilted.
In the description of the embodiment of the present application, it is also necessary to which explanation is unless specifically defined or limited otherwise, term
" setting ", " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
As shown in FIG. 1 to FIG. 7, Fig. 1 shows test fixture provided by the embodiment of the present application and assembling product to be measured
Structural schematic diagram；Fig. 2 shows the structural schematic diagrams of test fixture provided by the embodiment of the present application；Fig. 3 shows the application
The explosive view of test fixture provided by embodiment；Fig. 4 shows test fixture provided by the embodiment of the present application and production to be measured
The first sectional view of product assembling；Fig. 5 shows the of test fixture provided by the embodiment of the present application and assembling product to be measured
Two kinds of sectional views；Fig. 6 shows the partial structural diagram of test fixture provided by the embodiment of the present application；Fig. 7 shows this
Apply for the explosive view of the floating bolt of test fixture provided by embodiment.
A kind of test fixture 1, comprising: pedestal 101, circuit board 102 and the first spring needle 103；
One end of first spring needle 103 is electrically connected with circuit board 102, and the other end is for connecting product to be measured；On pedestal 101
Conductive column 104 is set, and circuit board 102 is electrically connected with conductive column 104；
Wherein, the first spring needle 103 is corresponded with conductive column 104, so that the first spring needle 103 and 104 electricity of conductive column
Connection.
Product to be measured in the embodiment of the present application is VCSEL mould group 2, and the test of VCSEL mould group 2 is concentrated mainly on two ranks
Section, first be wafer test, second be the mould group stage test.Mould group is integrated rear product, and detection seems more
It is important.The nucleus module of test is test fixture 1, it directly influences the reliability of test.However, existing test fixture 1
There are the technical problems of some keys, for example, 2 very little of VCSEL mould group, is unable to ensure it and effectively quickly connects with extraneous test equipment
It connects；Alternatively, VCSEL mould group 2 is during the test, heat can be generated, temperature is caused to increase, and then not can guarantee and accurately test
Required temperature.Based on this, the test fixture 1 in the embodiment of the present application is electrically connected by using the first spring needle 103 with circuit board 102
It connects, this is the amplification of first order physics；Circuit board 102 is electrically connected with conductive column 104 again, this is the amplification of second level physics；By two
After grade physics amplification, original the first spring needle 103 contact being become into conductive column 104 and is contacted, the area of contact point increases,
VCSEL mould group 2 can guarantee that contact is good when connecting, ensure that test fixture 1 and the signal output end of platform body have
Effect quickly connection；In addition to this, can also connect and it is non-contact disconnect between toggle；Finally, can keep away
Exempt to damage the first spring needle 103.
You need to add is that conductive column 104 uses copper post, copper post is widely used in all kinds of wiring boards of Computer connector
Assembling and electronic field.And the application of spring needle is also widely, to be not only mobile phone, many works in the electronic device
Journey instrument all uses this spring needle, there is this pogo pin connectors, can replace accessory at any time, increases and uses function；Into
And VCSEL mould group 2 is connected using spring needle, and connect with extraneous test machine by copper post, facilitate the performance hair of instrument
It waves, realizes multi-functional.Circuit board 102 avoids the mistake of artificial wiring, and can realize electronic component insert or mount automatically,
Automatic tin soldering, automatic detection, ensure that the quality of electronic equipment, improve labor productivity, reduce costs, and convenient for dimension
It repairs.Based on this, the first spring needle 103 can be directly inserted on circuit board 102, and by packaged on circuit board 102
Route is connect with copper post, is connect to preferably realize the first spring needle 103 with copper post.The effect of pedestal 101 is mainly solid
Determine conductive column 104, and places other components.
Specifically, one end of the first spring needle 103 connects VCSEL mould group 2, and the other end connects circuit board 102, circuit board
102 connect with conductive column 104；Further, the first spring needle 103 is corresponded with conductive column 104 and circuit board 102 is made
For intermediate medium, it can be ensured that the first spring needle 103 is electrically connected with conductive column 104.To which extraneous electric current passes through conductive column 104
It is transmitted to the first spring needle 103, then is passed in VCSEL mould group 2, realizes the intercommunication of electricity with information.
It should be noted that the embodiment of the present application is so that test fixture 1 is applied in VCSEL mould group 2 as an example, but not merely
It is confined to this, is not just repeated one by one herein.
It preferably, further include the radiating subassembly being connect with product to be measured；
Wherein, radiating subassembly includes heat transfer block 105 and semiconductor cooler 106, at least partly surface of heat transfer block 105 with
Product connection to be measured, one side of the heat transfer block 105 far from product to be measured are connect with semiconductor cooler 106.
It should be noted that semiconductor cooler 106 is made of the Peltier effect using semiconductor material.So-called amber
That note effect refers to that, when the galvanic couple that DC current is made up of two kinds of semiconductor materials, one end is absorbed heat, and one end is exothermic existing
As.When there is electric current to flow through from semiconductor cooler 106, the heat that electric current generates can be passed from the side of semiconductor cooler 106
To the other side, " heat " side and " cold " side are generated on semiconductor cooler 106, here it is the heating of semiconductor cooler 106 and
Refrigeration principle.According to this principle, semiconductor cooler 106 is applied in test fixture 1, heat is made it have and carries function
Can, the speed and direction of size of current and direction influence heat transfer.
In the embodiment of the present application, VCSEL mould group 2 and heat transfer block 105 connect, heat transfer block 105 and semiconductor refrigerating
Device 106 connects；VCSEL mould group 2 generates heat when testing, and by heat transfer block 105, heat is passed to semiconductor cooler
106, semiconductor cooler 106 forces heat to carry, so that heat be distributed.
It preferably, further include the fixed block 107 with jack 1071, fixed block 107 is arranged on circuit board 102, and
First spring needle 103 is set in the jack 1071 of fixed block 107.
The shape of fixed block 107 is determined that in the embodiment of the present application, fixed block 107 is by the concrete shape of circuit board 102
T-shaped block；It is provided with multiple jacks 1071 on fixed block 107, the first spring needle 103 is set in jack 1071, due to first
Spring needle 103 is very thin, is inserted into the jack 1071 of fixed block 107, can protect the first spring needle 103 and be not damaged, no
It only ensure that the first spring needle 103 is preferably contacted with VCSEL mould group 2, also extend the service life of the first spring needle 103.
Preferably, heat transfer block 105 includes the first heat transfer block 1051 interconnected and the second heat transfer block 1052, and first passes
The volume of heat block 1051 is greater than the volume of the second heat transfer block 1052；
Wherein, the second heat transfer block 1052 is connect far from the one side of the first heat transfer block 1051 with product to be measured.
In the embodiment of the present application, the first heat transfer block 1051 is mainly used for radiating, the second heat transfer block 1052 and product to be measured
Contact, when the volume of the first heat transfer block 1051 is greater than the volume of the second heat transfer block 1052, heat dissipation area is larger, contacts with air
Area it is larger, thus heat distribute more rapidly.
Preferably, notch 1053 is opened up in one end of the first heat transfer block 1051, the second heat transfer block 1052 is vertically erected at the
On the notch 1053 of one heat transfer block 1051；
It further include thermocouple 108, one end of thermocouple 108 passes through notch 1053 and the second heat transfer of the first heat transfer block 1051
Block 1052 connects, and the other end of thermocouple 108 passes through semiconductor cooler 106 and connect with circuit board 102.
It should be noted that the basic principle of 108 thermometric of thermocouple is that two kinds of heterogeneity material conductor compositions are closed back
Road there is thermo-electromotive force between both ends at this time when both ends are there are just having electric current when temperature gradient, in circuit to pass through.Two kinds
Heterogeneity homogeneous conductor is thermode, and the higher one end of temperature is working end, and the lower one end of temperature is free end, free end
It is generally under some stationary temperature.It follows that one end that thermocouple 108 is contacted with the second heat transfer block 1052 is work
End, one end that thermocouple 108 is connect with circuit board 102 are free end, and in turn, thermocouple 108 can be used to detect temperature and control
Current signal processed.
When test fixture 1 works at different temperature, need to control temperature using thermocouple 108.For example, test
Jig 1 needs tested in the environment of 10 DEG C, after energization, electric current by conductive column 104 flow into the first spring needle 103, then into
Enter VCSEL mould group 2, the laser radiation device of 2 the inside of VCSEL mould group generates laser, while generating heat, and thermocouple 108 detects
After temperature increases, the heat dissipation of semiconductor cooler 106 can be controlled, 10 DEG C are reduced the temperature to, to reach being precisely controlled for temperature.
It preferably, further include fixing seat 109, one end of fixing seat 109 is set on the second heat transfer block 1052, for fixing
Thermocouple 108；
The other end of fixing seat 109 is connect by bolt 1091 with the first heat transfer block 1051, is attached to the first biography for fixation
The aluminium paper on 1051 surface of heat block.
As described above, there are two the effects of fixing seat 109, first is that fixed thermocouple 108, guarantees itself and the second heat transfer block
1052 preferably contacts；Second is that the fixed aluminium paper for being attached to 1051 surface of the first heat transfer block, aluminium paper can help the first heat transfer block 1051
Preferably heat dissipation.
It preferably, further include cooling fin 110, cooling fin 110 is connect with semiconductor cooler 106.
In the embodiment of the present application, cooling fin 110 is connect with semiconductor cooler 106, and cooling fin 110 is folded in pedestal
Between 101 and semiconductor cooler 106, so that test fixture 1 be assisted to radiate.
In turn, heat is removed using heat transfer block 105, semiconductor cooler 106 and cooling fin 110, reaches the essence of temperature
Quasi- control.
It preferably, further include frame 111, frame 111 has groove 1111 identical with the bottom surface size of pedestal 101, bottom
Seat 101 is arranged in groove 1111；Blind hole 1112 is opened up on the corresponding position of pedestal 101 and frame 111, by elastic component 112
It is fitted in blind hole 1112 with housing screw 113.
In the embodiment of the present application, elastic component 112 uses spring, and spring and housing screw 113 are fitted in blind hole 1112
It is interior.Floating bolt design is applied in test fixture 1, is the flatness in order to adjust test fixture 1, it is ensured that VCSEL mould group 2
Upper surface well contacted with the first spring needle 103 and heat transfer block 105, it is ensured that heat transfer block 105 contacts good with VCSEL mould group 2
It is good, effectively transmit heat.
In addition, can integrate in a test fixture 1 in each structure feature in each embodiment of the application, it can also
To be to be also possible to two or more structure features in one test fixture 1 of each structure feature individualism and integrate
In one test fixture 1.
Based on the same technical idea, the embodiment of the present application also provides a kind of board, including platform body (is not shown in figure
Out) and test fixture 1, the conductive column 104 of test fixture 1 and the signal output end of platform body pass through second spring needle (in figure
It is not shown) electrical connection.
The conductive column 104 of test fixture 1 is electrically connected with the signal output end of platform body by second spring needle, thus real
The intercommunication and control of existing electricity and information.
Because test fixture 1 has above-mentioned technical effect, the board with the test fixture 1 is also having the same
Technical effect.
Preferably, connecting hole 1113 is set in one of them of frame 111 and platform body, is arranged on another and connects
Fitting (not shown)；
Connecting hole 1113 is used cooperatively with connector, so that platform body is connect with frame 111.
In the embodiment of the present application, connecting hole 1113 is set on frame 111, connector is set in platform body, is led to
Being used cooperatively for connecting hole 1113 and connector is crossed, platform body and frame 111 are linked together, thus by test fixture 1
It is arranged in platform body.
Compared with the existing technology, present invention has the advantage that
The application provides a kind of test fixture and board, wherein test fixture is by using the first spring needle and circuit board
Electrical connection, this is the amplification of first order physics；Circuit board is electrically connected with conductive column again, this is the amplification of second level physics；By two-stage
After physics amplification, original the first spring needle contact is become into conductive column contact, the area of contact point increases, VCSEL mould group
It can guarantee that contact is good when connection, ensure that the signal output end of test fixture and platform body effectively quickly connects；
In addition to this, can also connect and it is non-contact disconnect between toggle.Due to the meeting in test of VCSEL mould group
Heat is generated, in turn, VCSEL mould group and heat transfer block are connected, heat transfer block and semiconductor cooler connect；VCSEL
Mould group generates heat when testing, and by heat transfer block, heat is passed to semiconductor cooler, and semiconductor cooler forces heat
It carries to cooling fin, so that cooling fin distributes heat, reaches being precisely controlled for temperature.In addition to this, it will float
Screw designs are applied in test fixture, and the flatness of test fixture is adjusted, it is ensured that the upper surface of VCSEL mould group and the first spring
Needle and heat transfer block well contact, it is ensured that heat transfer block and VCSEL module contact are good, and then effectively transmit heat.In summary,
The test fixture of the application meets the test of VCSEL mould group for signal transmission and accurate temperature controlled requirement, so that it is guaranteed that
The reliability of test data.
Finally, it should be noted that embodiment described above, only a specific embodiment of the invention, to illustrate the present invention
Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair
It is bright to be described in detail, those skilled in the art should understand that: anyone skilled in the art
In the technical scope disclosed by the present invention, it can still modify to technical solution documented by previous embodiment or can be light
It is readily conceivable that variation or equivalent replacement of some of the technical features；And these modifications, variation or replacement, do not make
Corresponding technical solution essence be detached from technical solution of the present invention spirit and scope, should all cover protection scope of the present invention it
It is interior.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. a kind of test fixture characterized by comprising pedestal, circuit board and the first spring needle；
One end of first spring needle and the circuit board electrical connection, the other end is for connecting product to be measured；On the pedestal
Conductive column is set, and the circuit board is electrically connected with the conductive column；
Wherein, first spring needle and the conductive column correspond, so that first spring needle and conductive column electricity
Connection.
2. test fixture according to claim 1, which is characterized in that further include the heat dissipation group being connect with the product to be measured
Part；
Wherein, the radiating subassembly includes heat transfer block and semiconductor cooler, at least partly surface of the heat transfer block with it is described
Product connection to be measured, the heat transfer block are connect far from the one side of the product to be measured with the semiconductor cooler.
3. test fixture according to claim 2, which is characterized in that further include the fixed block with jack, the fixation
Block is arranged on the circuit board, and first spring needle is arranged in the jack of the fixed block.
4. test fixture according to claim 2, which is characterized in that the heat transfer block includes the first heat transfer interconnected
Block and the second heat transfer block, and the volume of first heat transfer block is greater than the volume of second heat transfer block；
Wherein, one side of second heat transfer block far from first heat transfer block is connect with the product to be measured.
5. test fixture according to claim 4, which is characterized in that notch is opened up in one end of first heat transfer block,
Second heat transfer block is vertically erected on the notch of first heat transfer block；
It further include thermocouple, one end of the thermocouple passes through the notch of first heat transfer block and second heat transfer block connects
It connects, the other end of the thermocouple passes through the semiconductor cooler and connect with the circuit board.
6. test fixture according to claim 5, which is characterized in that it further include fixing seat, an end cap of the fixing seat
It is located on second heat transfer block, for fixing the thermocouple；
The other end of the fixing seat is connect by bolt with first heat transfer block, is attached to first heat transfer block for fixation
The aluminium paper on surface.
7. test fixture according to claim 2, which is characterized in that it further include cooling fin, the cooling fin and described half
The connection of conductor refrigerator.
8. test fixture according to claim 1, which is characterized in that further include frame, the frame has and the bottom
The identical groove of bottom surface size of seat, the pedestal setting is in the groove；In the corresponding positions of the pedestal and the frame
It sets and opens up blind hole, elastic component and housing screw are fitted in the blind hole.
9. a kind of board, which is characterized in that including platform body and test fixture as claimed in claim 8, the test is controlled
The conductive column of tool is electrically connected with the signal output end of the platform body by second spring needle.
10. board according to claim 9, which is characterized in that in one of them of the frame and the platform body
Upper setting connecting hole, is arranged connector on another；
The connecting hole is used cooperatively with the connector, so that the platform body is connect with the frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN110873636A (en) * | 2020-01-19 | 2020-03-10 | 常州纵慧芯光半导体科技有限公司 | A temperature control test fixture for laser emission module |
| CN112304484A (en) * | 2019-07-31 | 2021-02-02 | 和硕联合科技股份有限公司 | Torque test equipment and its positioning seat for the object to be tested |
| CN113721125A (en) * | 2021-05-31 | 2021-11-30 | 荣耀终端有限公司 | Logistics device and test system |
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