CN109702356A - A method of laser cutting covering protection film glass - Google Patents
A method of laser cutting covering protection film glass Download PDFInfo
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- CN109702356A CN109702356A CN201910020266.5A CN201910020266A CN109702356A CN 109702356 A CN109702356 A CN 109702356A CN 201910020266 A CN201910020266 A CN 201910020266A CN 109702356 A CN109702356 A CN 109702356A
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- 239000011521 glass Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000003698 laser cutting Methods 0.000 title abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 103
- 230000001681 protective effect Effects 0.000 claims abstract description 28
- 238000000608 laser ablation Methods 0.000 claims abstract description 24
- 238000010030 laminating Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims description 20
- 239000002699 waste material Substances 0.000 claims description 9
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 abstract description 7
- 239000012634 fragment Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000638 solvent extraction Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 82
- 239000000463 material Substances 0.000 description 14
- 230000009471 action Effects 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000087 laser glass Substances 0.000 description 3
- 239000006058 strengthened glass Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000289 melt material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
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- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention discloses a kind of methods for being cut by laser covering protection film glass, comprising: position to be cut is selected on film laminating glass plate；First laser is used to treat cutting part in a manner of laser ablation along cutting track processing is preset, to remove protective film, clear out that reserved ultrafast laser is hidden to cut Cutting Road；Using second laser along the hidden Cutting Road of cutting of reserved ultrafast laser to the stealthy cutting of glass progress.In this method; machine cuts in the prior art are replaced using laser cutting; first first laser is used to remove protective film in a manner of laser ablation before glass-cutting; it can be to avoid causing to damage to glass surface in cutting process; the scuffing rate and pollution rate of glass surface can be reduced, production yield is improved；In glass-cutting, the energy of laser beam by it is a kind of it is non-contacting in a manner of cutting carried out to glass can be avoided the generations of clast, fragment and hallrcuts, and the intensity for being cut by laser edge is to want stronger compared with traditional scribing and partitioning scheme, without carrying out subsequent finishing.
Description
Technical field
The present invention relates to laser application technique field, in particular to a kind of method for being cut by laser covering protection film glass.
Background technique
Hard alloy or diamond cutter are generallyd use in traditional film covered glass cutting means, cutting process is specifically divided
The surface of glass is set to generate a Crack with diamond point of a knife or hard alloy grinding wheel for two steps: the first step；Second step,
Glass is separated along fault line using mechanical means.
However, carrying out scribing and cutting using this method, it will lead to the generation of clast, fragment and microcrack, make cutting edge
The strength reduction on edge, to need to carry out one of cleaning process again.
Therefore, the generation for how avoiding clast in cutting process, fragment and hallrcuts is that those skilled in the art need at present
Technical problems to be solved.
Summary of the invention
In view of this, can be avoided the object of the present invention is to provide a kind of method for being cut by laser covering protection film glass
The generation of clast, fragment and hallrcuts in cutting process.
To achieve the above object, the invention provides the following technical scheme:
A method of laser cutting covering protection film glass, comprising:
Position to be cut is selected on film laminating glass plate；
First laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, with removal
Protective film clears out that reserved ultrafast laser is hidden to cut Cutting Road；
Using second laser glass along the hidden Cutting Road of cutting of the reserved ultrafast laser to the stealthy cutting of glass progress.
Preferably, the first laser is cold laser, and wave-length coverage is 193nm to 355nm.
Preferably, the first laser is ultrafast laser, and wave-length coverage is 355nm to 1064nm laser, and pulse duration range is
1ps to 100fs.
Preferably, the second laser is ultrafast laser, and wavelength 532nm, 1030nm or 1064nm, pulse duration range is
15ps to 100fs.
Preferably, the first laser can be moved along three directions perpendicular to each other；The second laser can be along hanging down two-by-two
Straight three directions movement.
Preferably, the film laminating glass plate is overlay film nonreinforcement glass plate, described to use second laser glass along described pre-
After staying ultrafast laser is hidden to cut Cutting Road to the stealthy cutting of glass progress, this method further include:
Sliver is heated using the cutting track that thermal laser is formed after stealthy cutting, separates finished product with waste material.
Preferably, the thermal laser includes the laser of wavelength 5.3um, 9.3um, 9.6um or 10.6um.
Preferably, the film laminating glass plate is one side film glass plate；
It is described that first laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, with
It removes protective film, clear out the hidden Cutting Road of cutting of reserved ultrafast laser and include:
First laser is used only to set film surface along default cutting track to the position to be cut in a manner of laser ablation
Processing, to set protective film on film surface described in removing, clear out that the reserved ultrafast laser set on film surface is hidden to cut Cutting Road.
Preferably, the film laminating glass plate is two-sided film laminating glass plate；
It is described that first laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, with
It removes protective film, clear out the hidden Cutting Road of cutting of reserved ultrafast laser and include:
First laser is used to set film surface along default cutting rail to the first of the position to be cut in a manner of laser ablation
Mark processing described first sets protective film on film surface, clears out described first and set that reserved ultrafast laser on film surface is hidden to be cut to remove
Cutting Road；
The film laminating glass plate overturn using overturning structure, use first laser in a manner of laser ablation to it is described to
The second of cutting part sets film surface along presetting cutting track processing, described second sets protective film on film surface to remove, clears out institute
It states second and sets that reserved ultrafast laser on film surface is hidden to cut Cutting Road.
In method provided by the invention, machine cuts in the prior art are replaced using laser cutting, glass-cutting it
Preceding that first laser is first used to remove protective film in a manner of laser ablation, laser ablation processing method is a kind of successively to melt material
Change or the mode of gasification removing, the processing method to the selectional restriction very little of material, can to avoid in cutting process to glass
Surface causes to damage, meanwhile, protective film is only eliminated in portion to be cut along default cutting track, still there there are other positions on glass
Protective film is protected, and laser and membrane action region are without heat affecting and carbonization, it is possible to reduce the scuffing rate and dirt of glass surface
Dye rate improves production yield；In glass-cutting, the energy of laser beam by it is a kind of it is non-contacting in a manner of glass is cut,
Avoidable glass is scraped off, and can be avoided the generation of clast, fragment and hallrcuts, and process more cleans, and is cut by laser
The intensity at edge is to want stronger compared with traditional scribing and partitioning scheme, and cut edge is clean and edge quality is preferable, is not necessarily to
Subsequent finishing is carried out, process is relatively simple and cutting efficiency is higher.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the flow chart of the first specific embodiment of method provided by the present invention；
Fig. 2 is the flow chart of second of specific embodiment of method provided by the present invention；
Fig. 3 is the flow chart of the third specific embodiment of method provided by the present invention；
Fig. 4 is the flow chart of the 4th kind of specific embodiment of method provided by the present invention；
Fig. 5 is laser facula schematic diagram in method provided by the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Core of the invention is to provide a kind of method for being cut by laser covering protection film glass, can be avoided in cutting process
The generation of clast, fragment and hallrcuts.
What laser provided by the present invention was cut cuts in a kind of specific embodiment of the method for covering protection film glass, such as Fig. 1 institute
Show, comprising the following steps:
Step S1: position to be cut is selected on film laminating glass plate；
Step S2: being used first laser to be treated cutting part in a manner of laser ablation and processed along cutting track is preset, with
Removal protective film clears out that reserved ultrafast laser is hidden to cut Cutting Road；
Step S3: using second laser glass along the hidden Cutting Road of cutting of reserved ultrafast laser to the stealthy cutting of glass progress.
Wherein, in covering protection film glass plate, glass can be to strengthen or nonreinforcement glass, thickness range can be with are as follows:
0.1mm to 2mm, any value being specifically as follows within the scope of this；Protective film can be one side film or two-sided overlay film.In addition, to
It can be straight line or curve along default cutting track on cutting part, be specifically as follows any special-shaped track.
Wherein, as shown in figure 5, first laser hot spot 1 is typically greater than second laser hot spot 2, reliably to guarantee glass
On cutting position be not present protective film.
Wherein, laser processing technology be using laser beam and matter interaction characteristic to material (including metal with it is non-
Metal) it cut, welded, is surface-treated, being punched, micro Process and a special kind of skill as light source identification object etc..Laser
System of processing generally includes laser, beam delivery system, machining tool, control system and detection vision system, using laser
Corresponding striping and cutting of the laser to film laminating glass plate may be implemented in system of processing.
In the present embodiment, machine cuts in the prior art are replaced using laser cutting, are first used before glass-cutting
First laser removes protective film in a manner of laser ablation, and laser ablation processing method is a kind of material is successively melted or gasified
The mode of removing, the processing method, can be to avoid causing glass surface in cutting process to the selectional restriction very little of material
Damage, meanwhile, protective film is only eliminated in portion to be cut along default cutting track, on glass other positions still have protective film into
Row protection, laser and membrane action region are without heat affecting and carbonization, it is possible to reduce the scuffing rate and pollution rate of glass surface improve
Production yield；In glass-cutting, the energy of laser beam by it is a kind of it is non-contacting in a manner of glass is cut, can avoid glass
It is scraped off, can be avoided the generation of clast, fragment and hallrcuts, process more cleans, and is cut by laser the intensity at edge
It is to want stronger compared with traditional scribing and partitioning scheme, cut edge is clean and edge quality is preferable, without carrying out subsequent fine
Processing, process is relatively simple and cutting efficiency is higher.
On the basis of the above embodiments, first laser can be set to cold laser, more specifically, wave-length coverage can be
193nm to 355nm, any value being specifically as follows within the scope of this.Cold laser photon energy is very high, greater than the taboo of general material
Bandwidth directly interrupts the molecular link of film when acting on thin-film material, and the heat of generation is seldom, laser action region heat
Influence very little, ablation effect is preferable.
Or first laser can be set to ultrafast laser, more specifically, wave-length coverage can be for 355nm extremely
1064nm laser, any value being specifically as follows within the scope of this, pulse duration range can be 1ps to 100fs, be specifically as follows the model
Enclose interior any value.The ultrafast laser peak power is very high, pulse width, is less than general material thermal diffusion with the time of material effects
Time (1ps), when acting on thin-film material, since film thermal diffusion time is about 1PS, laser functions the time and is lower than
Thermal diffusion time, heat also have not enough time to spread, and almost empty calory generates, and the heat affecting of laser action region is very little, ablation
Effect is preferable.
On the basis of any of the above-described implementation, second laser can be ultrafast laser, specifically, wavelength 532nm,
1030nm or 1064nm, pulse duration range are 15ps to 100fs, any value being specifically as follows within the scope of this.Second laser setting
For ultrafast laser, stealthy cutting can be reliably realized.Laser stealth cutting technique is by ultrafast laser light beam through material, material
Inside modifies, and forms the modification aperture of a fixed spacing, suitable spacing is selected according to the thickness of glass or material, between general
Away from for 3um to 8um.For strengthening the strengthened glass of depth 20um or more, after ultrafast laser modification the thermal stress that generates be enough by
Glass finished-product is separated with waste material, finished product laser action region rough overshoot 100nm to 500nm after separation, and chipping is less than 10um.Its
In, rough overshoot is determined by laser pulse width, and the narrower rough overshoot of pulsewidth is smaller；Chipping determines that hot spot is smaller by spot size after focusing
Chipping is smaller.
Based on any of the above embodiments, first laser can be moved along three directions perpendicular to each other；Second laser
It can be moved along three directions perpendicular to each other, so as to adapt to the Cutting Road of any direction and shape.
Based on any of the above embodiments, when film laminating glass plate is overlay film nonreinforcement glass plate, referring to FIG. 2,
After step s 3, further includes:
Step S4: sliver is heated using the cutting track that thermal laser is formed after stealthy cutting, separates finished product with waste material.
Wherein, as shown in figure 5, as the first embodiment: 1 > thermal laser hot spot of first laser hot spot, 3 > second swashs
Light hot spot 2.For this three kinds of hot spots, since second laser carries out stealthy cutting, second laser hot spot 2 is usually minimum, and first swashs
Light hot spot 1 is maximum, and can reliably guaranteeing cutting position, there is no protective films.As another embodiment: thermal laser hot spot 3 is big
In first laser hot spot 1, it is cut into the big Cutting Road of width specific heat laser spot diameter back and forth using by first laser hot spot 1,
It avoids causing the film of covering of Cutting Road two sides to be ablated to compared with cutting road width due to heat shock optical beam spot diameter.
Thermal laser is a kind of noncontact procession along Cutting Road processing, and generating thermal stress with temperature difference makes finished product and waste material
It is detached from, other are mechanically decoupled relatively, and the stability of separation can be improved, improve the yield of finished product.In addition, by step S1 to step
S4, whole process are all made of laser processing, and laser facula is small after light beam focuses, and cutting accuracy is high.Specifically, second laser uses
When ultrafast laser, for overlay film nonreinforcement glass plate, after ultrafast laser modification the thermal stress that generates may be not enough to by glass at
Product are separated with waste material, separately need the external thermal stress for being further added by thermal laser generation that can go to guarantee separating effect.
Specifically thermal laser may include the laser of wavelength 5.3um, 9.3um, 9.6um or 10.6um, in addition, thermal laser can
To be pulse mode or continuous mode, it can control thermal stress size by changing laser power, make glass finished-product and waste material point
From, while the intensity of glass itself is not reduced.
Based on any of the above embodiments, when film laminating glass plate is one side film glass plate, referring to FIG. 3, step
Rapid S2 can specifically include:
Step S20: the film surface that sets for using first laser only to treat cutting part in a manner of laser ablation is cut along default
Track processing sets protective film on film surface, clears out that the reserved ultrafast laser that sets on film surface is hidden to cut Cutting Road to remove.
For one side film strengthened glass, cuts process and be followed successively by step S1, step S20 and step S3 these three steps；
For one side film nonreinforcement glass, cuts process and is followed successively by this four steps of step S1, step S20, step S3 and step S4,
Process sequence can not overturn.
Or when film laminating glass plate is two-sided film laminating glass plate, referring to FIG. 4, step S2 can specifically include:
Step S21: it uses first laser to treat the first of cutting part in a manner of laser ablation and set film surface and is cut along default
Track processing is cut, first protective film on film surface is set to remove, clears out first and set that reserved ultrafast laser on film surface is hidden to be cut earnestly
Road；
Step S22: film laminating glass plate is overturn using overturning structure, first laser is used to treat in a manner of laser ablation
The second of cutting part sets film surface along presetting cutting track processing, second sets protective film on film surface to remove, clears out second and set
Reserved ultrafast laser on film surface is hidden to cut Cutting Road.
For two-sided overlay film strengthened glass, cut process be followed successively by step S1, step S21, step S22 and step S3 this four
A step；For two-sided overlay film nonreinforcement glass, cuts process and be followed successively by step S1, step S21, step S22, step S3 and step
This five steps of rapid S4, process sequence can not overturn.
A kind of concrete application of method provided by the present invention is as follows:
Film covered glass is the double-deck overlay film nonreinforcement glass, thickness are as follows: 0.8mm.
Step S1: position to be cut on selection film laminating glass plate.
Step S21: by position to be cut along default cutting track processing by the way of the ultraviolet nanosecond laser ablation of 355nm
The protective film that removal first sets film surface, clears out that the infrared picosecond laser of reserved 1064nm is hidden to cut Cutting Road；Wherein, ultraviolet nanosecond laser
Device power is 5W, pulsewidth 15ns, and infrared picosecond laser power is 30W, pulsewidth 10PS.Wherein, 355nm ultraviolet laser list
Photon energy is very high, greater than the forbidden bandwidth of general material, when acting on thin-film material, directly interrupts the molecular link of film,
The heat of generation is seldom, and the heat affecting of laser action region is very little.
Step S22: it using overturning structure by glass turning, is cut with the mode of the ultraviolet nanosecond laser ablation of 355nm along default
The protective film that track removal second sets film surface is cut, clears out that the infrared picosecond laser of reserved 1064nm is hidden to cut another side Cutting Road.Wherein,
Ultraviolet nanosecond laser power is 5W, pulsewidth 15ns, and infrared picosecond laser power is 30W, pulsewidth 10PS.
Step S3: using the infrared picosecond laser mobile platform of 1064nm along the ultraviolet nanosecond laser deprotection film cutting of 355nm
Track carries out stealthy cutting.Wherein, ultraviolet nanosecond laser power be 5W, pulsewidth 15ns, infrared picosecond laser power is
30W, pulsewidth 10PS.
Step S4: carrying out heating sliver along the infrared picosecond laser stealth cutting track of 1064nm using 10.6umCO2 laser,
Separate finished product with waste material；Wherein CO2 laser power is 60W, operating mode is continuous mode, infrared picosecond laser power
For 30W, pulsewidth 10PS.Specifically, thermal stress size is controlled by changing laser power, makes glass finished-product and waste material point
From, while the intensity of glass itself is not reduced.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The method of laser cutting covering protection film glass provided by the present invention is described in detail above.Herein
Apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to help
Understand method and its core concept of the invention.It should be pointed out that for those skilled in the art, not taking off
, can be with several improvements and modifications are made to the present invention under the premise of from the principle of the invention, these improvement and modification also fall into this
In invention scope of protection of the claims.
Claims (9)
1. a kind of method for being cut by laser covering protection film glass characterized by comprising
Position to be cut is selected on film laminating glass plate；
First laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, to remove protection
Film clears out that reserved ultrafast laser is hidden to cut Cutting Road；
Using second laser along the hidden Cutting Road of cutting of the reserved ultrafast laser to the stealthy cutting of glass progress.
2. the method according to claim 1, wherein the first laser is cold laser, wave-length coverage 193nm
To 355nm.
3. wave-length coverage is the method according to claim 1, wherein the first laser is ultrafast laser
For 355nm to 1064nm laser, pulse duration range is 1ps to 100fs.
4. the method according to claim 1, wherein the second laser be ultrafast laser, wavelength 532nm,
1030nm or 1064nm, pulse duration range are 15ps to 100fs.
5. the method according to claim 1, wherein the first laser can be transported along three directions perpendicular to each other
It is dynamic；The second laser can be moved along three directions perpendicular to each other.
6. the method according to claim 1, wherein the film laminating glass plate is overlay film nonreinforcement glass plate, institute
It states and is cut after Cutting Road carries out stealthy cutting to glass using second laser along the reserved ultrafast laser is hidden, this method is also wrapped
It includes:
Sliver is heated using the cutting track that thermal laser is formed after stealthy cutting, separates finished product with waste material.
7. according to the method described in claim 6, it is characterized in that, the thermal laser includes wavelength 5.3um, 9.3um, 9.6um
Or the laser of 10.6um.
8. method according to any one of claims 1 to 7, which is characterized in that the film laminating glass plate is one side film glass
Glass plate；
It is described that first laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, with removal
Protective film clears out the hidden Cutting Road of cutting of reserved ultrafast laser and includes:
First laser is used only to process to the film surface that sets at the position to be cut along cutting track is preset in a manner of laser ablation,
To set protective film on film surface described in removing, clear out that the reserved ultrafast laser set on film surface is hidden to cut Cutting Road.
9. method according to any one of claims 1 to 7, which is characterized in that the film laminating glass plate is two-sided overlay film glass
Glass plate；
It is described that first laser is used to process to the position to be cut along default cutting track in a manner of laser ablation, with removal
Protective film clears out the hidden Cutting Road of cutting of reserved ultrafast laser and includes:
It uses first laser to set film surface to the first of the position to be cut in a manner of laser ablation to add along cutting track is preset
Work described first sets protective film on film surface, clears out described first and set that reserved ultrafast laser on film surface is hidden to be cut earnestly to remove
Road；
The film laminating glass plate is overturn using overturning structure, uses first laser in a manner of laser ablation to described to be cut
The second of position sets film surface along presetting cutting track processing, described second sets protective film on film surface to remove, clears out described the
Two set that reserved ultrafast laser on film surface is hidden to cut Cutting Road.
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| CN201910020266.5A CN109702356A (en) | 2019-01-09 | 2019-01-09 | A method of laser cutting covering protection film glass |
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| CN201910020266.5A CN109702356A (en) | 2019-01-09 | 2019-01-09 | A method of laser cutting covering protection film glass |
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