CN109671650A - A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer - Google Patents
A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer Download PDFInfo
- Publication number
- CN109671650A CN109671650A CN201811474224.0A CN201811474224A CN109671650A CN 109671650 A CN109671650 A CN 109671650A CN 201811474224 A CN201811474224 A CN 201811474224A CN 109671650 A CN109671650 A CN 109671650A
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- cleaning
- suction nozzle
- particle
- wafer
- circulating liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of circulating liquid formula suction nozzles, and its method for particle in cleaning wafer, circulating liquid formula suction nozzle includes nozzle and suction nozzle, by the opening perpendicular alignmnet crystal column surface of the suction nozzle of the circulating liquid formula suction nozzle and nozzle ring, it is scanned along crystal column surface pattern direction, in the process, cleaning solution is constantly sprayed at crystal column surface by nozzle ring, and then, under the action of outer lateral pressure, suction nozzle siphons away cleaning solution, it is removed therewith by the particle that cleaning solution infiltrates, in cleaning process, mobile circulating liquid formula suction nozzle or mobile wafer, realize scanning of the circulating liquid formula suction nozzle to whole wafer surface, this method, which is avoided that, pours particle in pattern, the particle that simultaneously effective will be embedded in pattern is sucked out, in the horizontal direction pattern will not be caused to scratch, it is identical to the cleaning effect on whole wafer surface.
Description
Technical field:
The invention belongs to technical field of semiconductor device, and in particular to a kind of circulating liquid formula suction nozzle, and its for removing
The method of particle in wafer.
Background technique:
Wafer cleaning is an important procedure in wafer manufacturing process, primarily to removal is attached to having for crystal column surface
Machine compound, metal impurities or particle (particle).The technology and cleanliness of wafer cleaning are related to wafer yield, device
Quality and reliability.In general, wafer cleaning can be divided into wet-cleaning and dry method cleaning.Dry method cleaning uses vapor-phase
Learn object, it is general to promote chemical reaction carry out experience cleaning by providing excitation energy, wherein energy can with heat, plasma or
The forms such as radiation provide.And common wet-cleaning then uses liquid chemicals, such as solvent, acid, surfactants and water, with
The methods of sprinkling, scrub, oxidation, etching removal pollutant.It is usually also needed by ultra-pure after using various chemicals
The wetting of water is cleaned.
The attachment of particle will affect the authenticity of lithography process pattern transfer, or even cause the short circuit of circuit structure.Especially
It is being gradually reduced with line width, various molecule particles and atom influence increasing caused by integrated circuit.In crystalline substance
In circle cleaning process, the removal of particle is most important, and most difficult work.To consider to reduce induction property in cleaning process
Particle source, while also to reduce spontaneous particle.Scrubber in Fig. 1 is a kind of common cleaning equipment 100, packet
Rotary-tray (being not drawn into figure), spray head 101 and rocking bar 102 are included, spray head 101 is fixed on 102 one end of rocking bar, and it is open
Towards 103 surface of wafer.Wafer 103 is fixed on rotary-tray, wafer 103 is rotated with rotary-tray, at the same time, is waved
Bar 102 drives spray head 101 to swing back and forth along the circular arc for crossing 103 center of circle of wafer, and spray head 101 sprays water, and water flow is along wafer 103
Surface flow washes away particle.Although the device can remove most particle, certain effect is obtained, when water flow is flat
When crystal column surface flow wash, in pattern upper surface, the lesser particle of partial size is easy to be punched into pattern row, becomes embedding
Enter the particle in pattern, and the particle being embedded in pattern (pattern) is difficult to be rushed out again to take away, if being rotated in flushing process
Pallet revolving speed is too fast or increases water velocity, may scratch pattern, and even more important is a little rotary flushing process,
The linear special pattern (line shape special map) rotated shown in Fig. 2 can be formed in crystal column surface.In consideration of it, having
Necessity designs a kind of novel method that can effectively remove particle in wafer.
Summary of the invention:
It is an object of the invention to overcome disadvantage of the existing technology, seek particle in a kind of suction type removal wafer
Method, which solve existing cleaning methods, during cleaning, the special pattern of linear rotation easy to form, and insertion
Particle in pattern is difficult to the problem of removing, and improves the removal rate of crystal column surface particle, and it is good to be finally reached raising wafer manufacture
The purpose of rate.
To achieve the goals above, a kind of circulating liquid formula suction nozzle for wafer cleaning of the present invention, including spray
Mouth and suction nozzle, the nozzle constantly spray liquid to crystal column surface, and liquid and particle interact, and then, in outer lateral pressure
Under the action of, the suction nozzle siphons away the liquid of ejection.
Preferably, suction nozzle is located at center, and cricoid nozzle annular is centered around on the outside of suction nozzle, is integrally formed the circulation of formula structure
Liquid-type suction nozzle.
The method of particle in a kind of suction type cleaning wafer of the present invention, by the suction nozzle of the circulating liquid formula suction nozzle
With the opening perpendicular alignmnet crystal column surface of nozzle ring, and along crystal column surface pattern direction scan, in the process, nozzle ring is continuous
Cleaning solution is sprayed at crystal column surface, and then, under the action of outer lateral pressure, suction nozzle siphons away cleaning solution, is soaked by cleaning solution
The particle of profit removes therewith.In cleaning process, mobile circulating liquid formula suction nozzle or mobile wafer realize circulating liquid formula suction nozzle pair
The scanning on whole wafer surface.This method can effectively siphon away the particle in crystal column surface or embedded pattern.
Preferably, nozzle ring is connected with suction nozzle in the other end, realizes recycling for cleaning solution.
Preferably, before the start-up operation of circulating liquid formula suction nozzle, cleaning strategy is determined, specifically includes the following steps:
(1) wafer detection system obtains particle number and distribution on wafer, then will by detecting particle coordinate in wafer
Particle coordinate imports vertical cleaning system；
(2) vertical cleaning system by the specific region in Particle Distribution figure and integrated circuit GDS (graphic data system) into
Row comparison, determines and forbids cleaning area and area capable of washing, and described to forbid cleaning area be the key component identified in GDS, for example, right
Important in certain product SRAM (static memory), then the region SRAM cannot be cleaned；
(3) then vertical cleaning system determines optimal clean route, according to capable of washing according to the Particle Distribution in area capable of washing
The concentration of the particle in area selects intensity and the time of cleaning, and last vertical cleaning system is according to specified cleaning strategy control
Circulating liquid formula suction nozzle work processed.
It, can be most short with scavenging period using the time as optimization aim in step (3) in the calculating process of optimal clean route
Cleaning route as best route, other optimization aims can also be selected according to real work situation.The cleaning strategy, packet
Include cleaning route and the scavenging period and cleaning strength in certain region.
Preferably, the wafer detection system is specially surface scanner, and the vertical cleaning system is that can make
Determine the corresponding program of cleaning strategy, vertical cleaning system is connect with wafer detection system and circulating liquid formula suction nozzle respectively, vertically
Cleaning system, wafer detection system and circulating liquid formula suction nozzle collectively form the device of particle in suction type cleaning wafer.
Compared with prior art, the invention has the following advantages that siphon away particle perpendicular to crystal column surface direction, it will
Traditional horizontal removing method is changed to vertical removing method, avoids pouring particle in pattern, simultaneously effective will be embedded in figure
Particle in case is sucked out, and will not cause to scratch to pattern in the horizontal direction, identical to the cleaning effect on whole wafer surface,
Furthermore according to particle number and Particle Distribution, the cleaning way of different zones is determined.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram of scrubber in the prior art.
Fig. 2 is the special pattern for the linear rotation that crystal column surface is formed after scrubber cleaning in Fig. 1.
Fig. 3 is the structure principle chart of circulating liquid formula suction nozzle involved in embodiment 1.
Specific embodiment:
The invention will be further described by way of example and in conjunction with the accompanying drawings.
Embodiment 1:
As shown in figure 3, a kind of circulating liquid formula suction nozzle for wafer cleaning that the present embodiment is related to, including 2 He of nozzle
Suction nozzle 1, the nozzle 2 constantly spray liquid, and and then, under the action of outer lateral pressure, the suction nozzle 1 inhales the liquid of ejection
It walks.
Preferably, suction nozzle 1 is located at center, and cricoid 2 annular of nozzle is centered around 1 outside of suction nozzle, is integrally formed formula structure
Circulating liquid formula suction nozzle.
The method of particle in a kind of suction type cleaning wafer that the present embodiment is related to, specifically includes the following steps:
(A1) determine cleaning strategy: wafer detection system obtains particle on wafer by detecting particle coordinate in wafer
Number and distribution, then import vertical cleaning system for particle coordinate, and vertical cleaning system is by Particle Distribution figure and integrated circuit GDS
Specific region in (graphic data system) compares, and determines and forbids cleaning area and area capable of washing, described to forbid the cleaning area to be
The key component identified in GDS, for example, important for certain product SRAM (static memory), then the location SRAM
Domain cannot be cleaned, and then vertical cleaning system determines optimal clean route, according to capable of washing according to the Particle Distribution in area capable of washing
The concentration of the particle in area selects the intensity and scavenging period of cleaning；
(A2) start to clean: vertical cleaning system is according to determining cleaning strategy, the work of control loop liquid-type suction nozzle, tool
Body are as follows: by the opening perpendicular alignmnet crystal column surface of the suction nozzle of the circulating liquid formula suction nozzle and nozzle ring, along wafer surface
The scanning of case direction, in the process, cleaning solution is constantly sprayed at crystal column surface by nozzle ring, and then, in the effect of outer lateral pressure
Under, suction nozzle siphons away cleaning solution, is removed therewith by the particle that cleaning solution infiltrates.In cleaning process, mobile circulating liquid formula suction nozzle
Or mobile wafer, realize scanning of the circulating liquid formula suction nozzle to whole wafer surface.This method can effectively siphon away crystal column surface
Or the particle in embedded pattern.
Preferably, one end of nozzle ring and suction nozzle is opening, and nozzle ring is connected with suction nozzle in the other end, is realized
Cleaning solution recycles.
It, can be using the time as optimization aim, when cleaning in the step (A1) in the calculating process of optimal clean route
Between shortest cleaning route as best route, other optimization aims can also be selected according to real work situation.The cleaning
Strategy, including cleaning route and the scavenging period and cleaning strength in certain region.
Preferably, the wafer detection system is specially surface scanner, and the vertical cleaning system is that can make
Determine the corresponding program of cleaning strategy, vertical cleaning system is connect with wafer detection system and circulating liquid formula suction nozzle respectively.
Claims (6)
1. a kind of circulating liquid formula suction nozzle, which is characterized in that including nozzle and suction nozzle, the circulating liquid formula suction nozzle is used for wafer
Cleaning, the nozzle constantly spray liquid to crystal column surface, and liquid and particle interact, and then, in the work of outer lateral pressure
Under, the suction nozzle siphons away the liquid of ejection.
2. circulating liquid formula suction nozzle according to claim 1, which is characterized in that suction nozzle is located at center, cricoid nozzle ring
Shape is centered around on the outside of suction nozzle, is integrally formed the circulating liquid formula suction nozzle of formula structure.
3. a kind of method of the circulating liquid formula suction nozzle described in claim 2 for particle in cleaning wafer, which is characterized in that by institute
The suction nozzle of circulating liquid formula suction nozzle and the opening perpendicular alignmnet crystal column surface of nozzle ring are stated, is swept along crystal column surface pattern direction
It retouches, in the process, cleaning solution is constantly sprayed at crystal column surface by nozzle ring, and and then, under the action of outer lateral pressure, suction nozzle will
Cleaning solution siphons away, and is removed therewith by the particle that cleaning solution infiltrates, in cleaning process, mobile circulating liquid formula suction nozzle or mobile brilliant
Circle realizes scanning of the circulating liquid formula suction nozzle to whole wafer surface.
4. the method according to claim 3 for particle in cleaning wafer, which is characterized in that in circulating liquid formula suction nozzle
Before start-up operation, cleaning strategy is determined, specifically includes the following steps:
(1) wafer detection system obtains particle number and distribution on wafer, then by particle by detecting particle coordinate in wafer
Coordinate imports vertical cleaning system；
(2) vertical cleaning system compares Particle Distribution figure and the specific region in integrated circuit GDS, and determination is forbidden cleaning
Area and area capable of washing, described to forbid cleaning area be the key component identified in GDS；
(3) then vertical cleaning system determines optimal clean route, according to area capable of washing according to the Particle Distribution in area capable of washing
The concentration of particle, selects intensity and the time of cleaning, and last vertical cleaning system is followed according to specified cleaning strategy control
The work of ring liquid-type suction nozzle.
5. the method according to claim 4 for particle in cleaning wafer, which is characterized in that the cleaning strategy, packet
Include cleaning route and the scavenging period and cleaning strength in certain region.
6. the method according to claim 4 for particle in cleaning wafer, which is characterized in that the wafer detection system
For surface scanner, vertical cleaning system is connect with wafer detection system and circulating liquid formula suction nozzle respectively, vertical cleaning
System, wafer detection system and circulating liquid formula suction nozzle collectively form the device of particle in suction type cleaning wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811474224.0A CN109671650A (en) | 2018-12-04 | 2018-12-04 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811474224.0A CN109671650A (en) | 2018-12-04 | 2018-12-04 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109671650A true CN109671650A (en) | 2019-04-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811474224.0A Pending CN109671650A (en) | 2018-12-04 | 2018-12-04 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
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| CN (1) | CN109671650A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420626A (en) * | 2021-12-29 | 2022-04-29 | 至微半导体(上海)有限公司 | A wafer cleaning device capable of improving water film coverage and its working method |
| CN115261944A (en) * | 2022-09-27 | 2022-11-01 | 晟盈半导体设备(江苏)有限公司 | Scanning type pre-wetting system and pre-wetting method for wafer |
| WO2023284188A1 (en) * | 2021-07-16 | 2023-01-19 | 江苏鲁汶仪器有限公司 | Nozzle for wafer scanning, scanning system, and scanning method |
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| CN1221976A (en) * | 1997-12-29 | 1999-07-07 | 西门子公司 | Wafer surface cleaning apparatus and method |
| CN1433053A (en) * | 2002-01-18 | 2003-07-30 | 富士通株式会社 | Semiconductor device manufacturing process and equipment |
| CN204668283U (en) * | 2015-03-02 | 2015-09-23 | K.C.科技股份有限公司 | Chip processing device |
| CN106486392A (en) * | 2015-09-02 | 2017-03-08 | 四川虹视显示技术有限公司 | A kind of remover liquid nozzle |
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| CN108336002A (en) * | 2018-03-16 | 2018-07-27 | 德淮半导体有限公司 | The method of clearing apparatus and cleaning wafer, mechanical arm |
| CN108428644A (en) * | 2017-02-15 | 2018-08-21 | 辛耘企业股份有限公司 | Substrate processing apparatus |
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2018
- 2018-12-04 CN CN201811474224.0A patent/CN109671650A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221976A (en) * | 1997-12-29 | 1999-07-07 | 西门子公司 | Wafer surface cleaning apparatus and method |
| CN1433053A (en) * | 2002-01-18 | 2003-07-30 | 富士通株式会社 | Semiconductor device manufacturing process and equipment |
| CN204668283U (en) * | 2015-03-02 | 2015-09-23 | K.C.科技股份有限公司 | Chip processing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023284188A1 (en) * | 2021-07-16 | 2023-01-19 | 江苏鲁汶仪器有限公司 | Nozzle for wafer scanning, scanning system, and scanning method |
| CN114420626A (en) * | 2021-12-29 | 2022-04-29 | 至微半导体(上海)有限公司 | A wafer cleaning device capable of improving water film coverage and its working method |
| CN115261944A (en) * | 2022-09-27 | 2022-11-01 | 晟盈半导体设备(江苏)有限公司 | Scanning type pre-wetting system and pre-wetting method for wafer |
| CN115261944B (en) * | 2022-09-27 | 2023-02-21 | 晟盈半导体设备(江苏)有限公司 | Scanning type pre-wetting system and pre-wetting method for wafer |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190423 |
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| RJ01 | Rejection of invention patent application after publication |