CN109668346B - Novel semiconductor refrigeration heat dissipation module - Google Patents
Novel semiconductor refrigeration heat dissipation module Download PDFInfo
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- CN109668346B CN109668346B CN201711462036.1A CN201711462036A CN109668346B CN 109668346 B CN109668346 B CN 109668346B CN 201711462036 A CN201711462036 A CN 201711462036A CN 109668346 B CN109668346 B CN 109668346B
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- heat
- heat dissipation
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- heat pipe
- semiconductor refrigeration
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a novel semiconductor refrigeration and heat dissipation module, which comprises a semiconductor refrigeration sheet, a cold plate arranged at the cold end of the semiconductor refrigeration sheet and a heat radiator arranged at the hot end of the semiconductor refrigeration sheet, wherein the heat radiator is a heat pipe radiator, a heat dissipation fan is arranged on the front end surface of the heat radiator, and the heat radiator comprises a base and a fin group arranged on the base.
Description
Technical Field
The invention relates to the field of semiconductor refrigeration, in particular to a novel semiconductor refrigeration heat dissipation module with high space utilization rate and good heat dissipation effect.
Background
The refrigerating capacity and efficiency of the semiconductor refrigerator mainly depend on the temperature and temperature difference of the cold and hot surfaces, and because of the Peltier effect, one end of the semiconductor element can refrigerate and the other end can heat, so if the semiconductor element is used for refrigerating, the heat at the other end must be rapidly dissipated, and once the semiconductor refrigerator is used for refrigerating, the thermal resistance of the hot surface is too high, so the refrigerating efficiency is reduced. At present, many products have high power and high heat density, and the heat dissipation space is limited, so that the heat dissipation condition is poor, and therefore, how to dissipate the high-density heat in the limited space is a very critical problem for refrigerating the products.
Disclosure of Invention
The invention mainly solves the technical problem that the cooling efficiency is reduced due to poor heat dissipation condition of the existing semiconductor cooler; the novel semiconductor refrigeration heat dissipation module is high in space utilization rate and good in heat dissipation effect.
In order to solve the technical problems, the invention mainly adopts the following technical scheme:
the invention relates to a novel semiconductor refrigeration and heat dissipation module, which comprises a semiconductor refrigeration sheet, a cold plate arranged at the cold end of the semiconductor refrigeration sheet and a heat radiator arranged at the hot end of the semiconductor refrigeration sheet, wherein the heat radiator is a heat pipe radiator, a heat pipe group consisting of a plurality of heat pipes is arranged on the heat radiator, a heat dissipation fan is arranged on the front end surface of the heat radiator, the heat radiator comprises a base and a fin group arranged on the base, the bottom surface of the base is attached to the hot end of the semiconductor refrigeration sheet, the fin group comprises a plurality of heat dissipation fins which are vertical to the surface of the base and abut against the surface of the base, air flow channels are formed by cavities between adjacent heat dissipation fins, the heat dissipation fan corresponds to the air flow channels, through holes are arranged on the heat dissipation fins, the heat pipes are matched with the, the water conservancy diversion design of cooperation radiating air current, the windage of radiating air current that has significantly reduced, the heat pipe makes the heat that comes from semiconductor refrigeration piece and transmit the base transmit fin upper portion better, and the temperature of downside on balanced base front and back portion and the radiating fin has guaranteed the homogeneity of whole radiator temperature, makes the heat of the highest radiator back end downside of temperature be unlikely to produce and piles up, gives out away better, and the radiating effect is good, and refrigeration efficiency is high, and space utilization is high.
Preferably, the upper surface of the base is provided with a plurality of grooves, the heat pipes are matched with the grooves and embedded in the grooves, and the heat pipes are embedded in the grooves of the base, so that heat on the base can be quickly and directly conducted out through the heat pipes, and the base is prevented from influencing the heat dissipation effect due to uneven heat dissipation caused by temperature difference.
Preferably, the cross section of the groove is in a semicircular arc shape, the heat pipe is horizontally arranged in the groove, the lower half part of the heat pipe body is embedded in the groove, the bottom edges of the heat dissipation fins are provided with a plurality of semicircular notches, the notches correspond to the corresponding heat pipes and are attached to the upper half part of the heat pipe body, a semi-buried heat pipe design is adopted, heat on the base is quickly conducted to the upper parts of the heat dissipation fins through the heat pipes, the other parts of the heat dissipation fins can be matched with the contact heat conduction of the bottom edges of the heat dissipation fins and the base through the heat exchange of the pipe walls of the heat pipes, the heat dissipation effect of the lower parts of the heat dissipation.
Preferably, the heat pipe set comprises a plurality of flat U-shaped heat pipes and vertical U-shaped heat pipes, two straight sections of the flat U-shaped heat pipes are embedded in the grooves and are respectively positioned at the front part and the rear part of the base, one straight section of each vertical U-shaped heat pipe is embedded in the groove, the other straight section of each vertical U-shaped heat pipe penetrates through the through hole of the corresponding heat dissipation fin, the flat U-shaped heat pipes and the vertical U-shaped heat pipes are matched for use, heat at the front part and the rear part of the base is quickly and effectively conducted by the flat U-shaped heat pipes, the temperature difference at the front part and the rear part of the base is balanced, heat on the base is quickly and effectively conducted to the upper parts of the heat dissipation fins by the vertical U-shaped heat pipes, the temperatures of the upper side and the lower side of the fin set are balanced, the position and shape of the heat pipes are.
Preferably, the front half part of the fin group is provided with a cover plate which encloses the front half part of the fin group, the rear end surface of the fin group is inclined, the cover plate forms a front section flow channel of the radiator to ensure that air flow guided by the radiating fan horizontally flows along the air flow channel of the fin group, the air flow is prevented from being shunted from the top surface of the front half part of the fin group to reduce the radiating efficiency of the rear part of the fin group, the rear end surface of the fin group is inclined to ensure that radiating air flow is smoothly guided out from the upper part of the rear end of the fin group, and the wind resistance caused by air flow turning is reduced.
Preferably, the rear end edge of the heat dissipation fin is bent and covers the corresponding airflow channel to seal the rear end surface of the fin group, and a rear plate structure may be arranged to seal the rear end surface of the fin group.
Preferably, the front end surface of the fin group is further provided with a fan support, the fan support is of a frame structure, the front frame surface of the fan support is fixedly connected with the cooling fan, the rear frame surface of the fan support is fixedly connected with the front end surface of the cover plate, and the fan support facilitates fixing of the cooling fan.
Preferably, the bottom surface of the frame of the fan support is inclined, the front frame surface of the fan support is larger than the rear frame surface, and the bottom of the fan support is inclined, so that the flow guide effect can be effectively achieved, the wind resistance of airflow flowing into the fan support by the cooling fan is reduced, and the cooling efficiency is improved.
Preferably, the rear end surface and the top surface of the radiating fins are provided with a plurality of buckles which are used for clamping the radiating fins and correspond to the radiating fins one by one, and the buckles can improve the structural strength of the rear parts of the radiating fins, keep the air flow channel smooth and ensure good radiating effect.
The invention has the beneficial effects that: the module adopts the form of side direction air inlet and top air outlet, the water conservancy diversion design of cooperation radiating air current, the windage of radiating air current has significantly reduced, vertical U-shaped heat pipe makes the heat that comes from the semiconductor refrigeration piece and transmit the base to fin upper portion better, the temperature of downside on the fin of balanced heat dissipation, the great surface area of make full use of radiating fin, and the temperature of base front and back end can be balanced to the U-shaped heat pipe of flat putting, with the higher temperature conduction of base rear end to base front end, the homogeneity of whole base temperature has been guaranteed, the heat pipe design of multiple structure, can prevent that the thermal part of radiator from piling up and the temperature difference, the heat can distribute away better, the radiating effect is good, high refrigeration efficiency, high space utilization.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention.
Fig. 2 is an exploded schematic view of the structure of fig. 1.
Fig. 3 is a side schematic view of the structure of fig. 1.
In the figure, 1, a semiconductor refrigerating sheet, 2, a cold plate, 3, a radiator, 31, a base, 32, a fin group, 33, a cover plate, 4, a heat pipe group, 41, a flat U-shaped heat pipe, 42, a vertical U-shaped heat pipe, 5, a radiating fan, 6, a heat insulation plate and 7, a fan support are arranged.
Detailed Description
The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings.
Example (b): the novel semiconductor refrigeration and heat dissipation module of the embodiment is shown in fig. 1, fig. 2 and fig. 3, and comprises a semiconductor refrigeration sheet 1, a cold plate 2 arranged at the cold end of the semiconductor refrigeration sheet and a heat sink 3 arranged at the hot end of the semiconductor refrigeration sheet, wherein the heat sink is a heat pipe heat sink, the heat sink is provided with a heat pipe group 4 consisting of a plurality of heat pipes, a heat dissipation fan 5 is arranged on the front end surface of the heat sink, a heat insulation plate 6 is designed between the cold plate and the base, the heat sink comprises a base 31 and a fin group 32 arranged on the base, the bottom surface of the base is attached to the hot end of the semiconductor refrigeration sheet, the fin group comprises a plurality of heat dissipation fins which are vertical to the surface of the base and abut against the surface of the base, cavities between adjacent heat dissipation fins form air flow channels, the heat dissipation fan corresponds to the air, the cross section of the groove is in a semicircular arc shape, the heat pipe set comprises a flat U-shaped heat pipe 41 and four vertical U-shaped heat pipes 42, two straight sections of the flat U-shaped heat pipes are embedded in the groove and are respectively positioned at the front part and the rear part of the base, one straight section of each of the four vertical U-shaped heat pipes is embedded in the groove, the other straight section of each of the four vertical U-shaped heat pipes is arranged in the through hole of the radiating fin in a penetrating manner, the lower straight sections of the two vertical U-shaped heat pipes are positioned at the inner side of the U-shaped shape of the flat U-shaped heat pipe, the lower straight sections of the other two vertical U-shaped heat pipes are positioned at the outer side of the U-shaped shape of the flat U-shaped heat pipe, the positions of the heat pipes are determined according to the arrangement of the isotherms of the radiator, the temperature difference between the two sections of the U-shaped heat pipes is ensured to be maximum, the effective conduction, the other parts of the bottom edges of the radiating fins are abutted against the surface of the base, the front half part of the fin group is provided with a cover plate 33 which encloses the front half part of the fin group, the rear end surface of the fin group is inclined, the rear end edge of the radiating fins is bent and covers corresponding airflow channels, the rear end surface of the fin group is provided with two groups of buckles which are used for clamping the radiating fins and correspond to the radiating fins one by one, the top surface of the fin group is provided with a group of same buckles, the front end surface of the fin group is provided with a fan support 7 which is of a frame structure, the front frame surface of the fan support is fixedly connected with the radiating fan, the rear frame surface of the fan support is fixedly connected with the front end surface of the cover plate, the bottom surface of the frame is inclined, and the front frame.
When in refrigeration, the cold plate of the refrigeration and heat dissipation module is attached to a refrigeration object, the cold quantity of the cold end is transferred to the refrigeration object through the cold plate, the heat transfer between the cold plate and the base of the radiator is reduced under the protection of the heat insulation plate, the heat of the hot end is directly contacted with the bottom edge of the heat dissipation fin through the surface of the bottom plate and is transferred to the upper part of the heat dissipation fin on one hand, the heat of the hot end is contacted with the bottom edge of the heat dissipation fin through the upper half part of the tube body of the semi-buried heat pipe and is transferred to the upper part of the heat dissipation fin on the other hand, meanwhile, the heat is transferred to the upper part of the heat dissipation fin through the action of the vertical U-shaped heat pipe, because the heat pipe is arranged at an isotherm, the temperature difference between two straight sections of the heat pipe is maximum, the heat conduction effect is best, meanwhile, under the action of the heat dissipation fan, because the new trend comes in can constantly be heated, the radiator can demonstrate the low difference in temperature of front portion temperature and the high difference in temperature of rear portion, therefore the design of the flat U-shaped heat pipe that puts on the base can be anterior with the heat transfer at base rear portion to the base, has effectively reduced the base difference in temperature to can give out more heats.
In the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "longitudinal", "lateral", "inner", "outer", etc. indicate the direction or positional relationship based on the directions or positional relationships shown in the drawings, which are only for convenience of description and understanding of the technical solutions of the present invention, and the above description is not intended to limit the present invention, and the present invention is not limited to the examples described above, and changes, modifications, additions or substitutions made by those skilled in the art within the spirit and scope of the present invention should be considered as the protection scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor refrigeration heat dissipation module which characterized in that: the module adopts the design of lateral air inlet and upward air outlet, and comprises a semiconductor refrigerating sheet (1), a cold plate (2) arranged at the cold end of the semiconductor refrigerating sheet and a radiator (3) arranged at the hot end of the semiconductor refrigerating sheet, the radiator is a heat pipe radiator, a heat pipe group (4) consisting of a plurality of heat pipes is arranged on the radiator, a radiating fan (5) is arranged on the front end surface of the radiator, the radiator comprises a base (31) and a fin group (32) arranged on the base, the bottom surface of the base is attached to the hot end of the semiconductor refrigerating sheet, the fin group comprises a plurality of radiating fins which are vertical to the surface of the base and abut against the surface of the base, air flow channels are formed in cavities between adjacent radiating fins, the radiating fan corresponds to the air flow channels, through holes are arranged on the radiating fins, the heat pipe is matched with the through hole and penetrates through the through hole, and a heat insulation plate (6) is arranged between the cold plate and the base; the front half part of the fin group (32) is provided with a cover plate (33) which encloses the front half part of the fin group, and the rear end surface of the fin group is inclined; the rear end edges of the radiating fins are bent and cover the corresponding airflow channels.
2. The semiconductor refrigeration heat dissipation module of claim 1, wherein: the upper surface of the base (31) is provided with a plurality of grooves, and the heat pipe is matched with the grooves and embedded in the grooves.
3. The semiconductor refrigeration heat dissipation module of claim 2, wherein: the cross section of the groove is in a semicircular arc shape, the heat pipe is horizontally arranged in the groove, the lower half part of the heat pipe body is embedded in the groove, the bottom edges of the heat dissipation fins are provided with a plurality of semicircular notches, and the notches correspond to the corresponding heat pipes and are attached to the upper half part of the heat pipe body.
4. The semiconductor refrigeration and heat dissipation module according to claim 2 or 3, wherein: the heat pipe set (4) comprises a plurality of flat U-shaped heat pipes (41) and vertical U-shaped heat pipes (42), two straight sections of the flat U-shaped heat pipes are embedded in the grooves and are respectively positioned at the front part and the rear part of the base (31), one straight section of each vertical U-shaped heat pipe is embedded in the groove, and the other straight section of each vertical U-shaped heat pipe penetrates through the through hole of the corresponding heat dissipation fin.
5. The semiconductor refrigeration heat dissipation module of claim 1, wherein: the front end face of the fin group (32) is also provided with a fan support (7), the fan support is of a frame structure, the front frame face of the fan support is fixedly connected with the radiating fan (5), and the rear frame face of the fan support is fixedly connected with the front end face of the cover plate.
6. The semiconductor refrigeration heat dissipation module of claim 5, wherein: the bottom surface of the fan support (7) is inclined, and the front frame surface of the fan support is larger than the rear frame surface.
7. The semiconductor refrigeration heat dissipation module of claim 1, wherein: the rear end surface and the top surface of the fin group are provided with a plurality of buckles which are used for clamping the radiating fins and correspond to the radiating fins one by one.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711462036.1A CN109668346B (en) | 2017-12-28 | 2017-12-28 | Novel semiconductor refrigeration heat dissipation module |
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| CN201711462036.1A CN109668346B (en) | 2017-12-28 | 2017-12-28 | Novel semiconductor refrigeration heat dissipation module |
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| CN109668346A CN109668346A (en) | 2019-04-23 |
| CN109668346B true CN109668346B (en) | 2020-12-15 |
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| US11849562B2 (en) | 2022-02-24 | 2023-12-19 | International Business Machines Corporation | Hybrid in-drawer computer equipment cooling device |
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| CN115951769B (en) * | 2023-03-10 | 2023-05-09 | 山东合众智远信息技术有限公司 | Heat abstractor for computer CPU |
| CN117030790B (en) * | 2023-09-13 | 2024-06-14 | 河南省科学院 | Working performance testing device for semiconductor refrigerating sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2590170Y (en) * | 2002-12-10 | 2003-12-03 | 技嘉科技股份有限公司 | radiator structure |
| CN2770091Y (en) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | Radiator |
| CN2785322Y (en) * | 2005-03-19 | 2006-05-31 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN100592850C (en) * | 2005-10-26 | 2010-02-24 | 富准精密工业(深圳)有限公司 | Heat pipe radiation device |
| CN100534282C (en) * | 2006-07-21 | 2009-08-26 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN201181135Y (en) * | 2008-01-22 | 2009-01-14 | 宁波隆兴电信设备制造有限公司 | Semiconductor refrigerator and use thereof |
| CN201336783Y (en) * | 2008-12-26 | 2009-10-28 | 奇鋐科技股份有限公司 | Heat radiating fin array structure and heat radiating module thereof |
| CN201555482U (en) * | 2009-09-29 | 2010-08-18 | 上海北大方正科技电脑系统有限公司 | Heat tube radiator |
| CN202677290U (en) * | 2012-06-18 | 2013-01-16 | 联想(北京)有限公司 | Electronic terminal host and radiator thereof |
| CN204555412U (en) * | 2015-04-14 | 2015-08-12 | 中国电子科技集团公司第四十四研究所 | Semiconductor cooler for heat dissipation structure |
| CN206741417U (en) * | 2017-04-20 | 2017-12-12 | 东莞永腾电子制品有限公司 | It is a kind of that there is the radiator for quickly changeing structure |
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