CN109664017A - Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning - Google Patents
Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning Download PDFInfo
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- CN109664017A CN109664017A CN201811595135.1A CN201811595135A CN109664017A CN 109664017 A CN109664017 A CN 109664017A CN 201811595135 A CN201811595135 A CN 201811595135A CN 109664017 A CN109664017 A CN 109664017A
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- 238000012545 processing Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000012544 monitoring process Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title description 13
- 238000005286 illumination Methods 0.000 claims abstract description 29
- 238000002310 reflectometry Methods 0.000 claims abstract description 5
- 238000002834 transmittance Methods 0.000 claims abstract description 4
- 238000013461 design Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 6
- 230000004075 alteration Effects 0.000 abstract description 3
- 238000003754 machining Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
为解决传统定位测量装置相机观测范围较小和成像质量不高的问题，本发明提供了一种实现激光扫描加工监测和加工定位的装置及方法、激光加工设备。实现激光扫描加工监测和加工定位的装置包括反射镜、CCD相机和环形照明光源；反射镜设置在激光加工设备中场镜的出光口，用于将从场镜出射的激光束反射至工件上；CCD相机设置在反射镜的上方；环形照明光源设置在反射镜的反射光路上，环形照明光源中部通孔用于激光束通过；环形照明光源光线波长与激光束波长不相等；反射镜为半透半反的镜片，对激光束有99％以上的平均反射率，对环形照明光源发出的照明光线有90％以上的平均透过率。利用CCD相机直接成像，避免了传统方案中引入远心场镜造成的像差，成像质量更高。
In order to solve the problems of small observation range and low imaging quality of the traditional positioning measuring device, the present invention provides a device and method for realizing laser scanning processing monitoring and processing positioning, and laser processing equipment. The device for realizing laser scanning processing monitoring and processing positioning includes a reflector, a CCD camera and a ring illumination light source; the reflector is arranged at the light outlet of the field lens in the laser processing equipment, and is used to reflect the laser beam emitted from the field lens to the workpiece; The CCD camera is set above the reflector; the ring lighting source is set on the reflected light path of the reflector, and the through hole in the middle of the ring lighting source is used for the laser beam to pass through; the light wavelength of the ring lighting source is not equal to the wavelength of the laser beam; the reflector is semi-transparent The semi-reflective lens has an average reflectivity of more than 99% for the laser beam, and an average transmittance of more than 90% for the illumination light emitted by the ring lighting source. Using the CCD camera for direct imaging avoids the aberration caused by the introduction of the telecentric field lens in the traditional solution, and the imaging quality is higher.
Description
Technical field
The invention belongs to technical field of laser processing, are related to a kind of dress for realizing laser scanning manufacturing monitoring and processing positioning
It sets and method, laser process equipment.
Background technique
Since laser processing technology has the advantages that contactless stress, machining accuracy height, control easy to automate, because
And using more and more extensive in terms of thin-wall part, the processing with fine microstructure part, gradually instead of original machining
Technology becomes a kind of important fine microstructure processing technology.In laser processing procedure, the positioning accuracy and feature of workpiece are detected
Precision is the important technology index of laser process equipment, and an important factor for decision final workpiece processing quality.
Laser processing monitoring and processing positioning, mainly there is two kinds of coaxial method positioning measurement and paraxonic method positioning measurement.
Traditional coaxial method positioning measuring device, laser beam and camera lens part are coaxial, since scanning galvanometer enters
The limitation for the factors such as optical port diameter, scanning galvanometer lens dimension and CCD camera lens and inspection surface distance of camera lens are remote, so that the sight of camera
It is smaller to survey range；Simultaneously as telecentricity field lens can attract optical aberration, existing on camera imaging quality influences.
Traditional paraxonic method positioning measuring device, camera lens form an angle with inspection surface, are formed by image presence
Distortion, imaging precision be not high.
Summary of the invention
Traditional positioning measuring device camera observation scope is smaller and the not high technical problem of image quality in order to solve, this hair
It is bright to provide a kind of device and method, laser process equipment for realizing laser scanning manufacturing monitoring and processing positioning.
The technical scheme is that
The device for realizing laser scanning manufacturing monitoring and processing positioning, is characterized in that including reflecting mirror, CCD phase
Machine and ring illumination light source；
The light-emitting window of field lens in laser process equipment is arranged in reflecting mirror, and the laser beam for will be emitted from the field lens is anti-
It is incident upon on workpiece；The top of reflecting mirror is arranged in CCD camera；Ring illumination light source is arranged on the reflected light path of reflecting mirror, ring
The middle through-hole of shape lighting source passes through for laser beam；The wavelength of the wavelength of light of ring illumination light source and laser beam not phase
Deng；
The reflecting mirror is semi-transparent semi-reflecting eyeglass, has 99% or more average reflectance to laser beam, to ring illumination
The illuminating ray that light source issues has 90% or more mean transmissivity.
Further, the reflecting mirror is large format reflecting mirror, can cover sweeping for the laser beam being emitted from galvanometer and field lens
Retouch range.
Further, to improve image quality, the axis of the ring illumination light source is parallel with the camera axis.
Further, the intensity of illumination of ring illumination light source is adjustable, and device is made to be suitable for a variety of processing operating conditions, is conducive to workpiece
The identification of benchmark.
Invention also provides a kind of devices positioned based on above-mentioned realization laser scanning manufacturing real-time monitoring and processing
The method for carrying out laser processing real-time monitoring, is characterized in that, comprising steps of
1) outgoing beam of field lens is reflexed on workpiece to be machined using reflecting mirror, is laser machined；
2) workpiece to be machined is illuminated using ring illumination light source；
3) CCD camera captured in real-time workpiece to be machined surface image；
4) extract machined characteristic size from workpiece to be machined surface image, and by the machined characteristic size of extraction with
Design value compares, if deviation in threshold range, continues to laser machine with current process parameter；If deviation is not in threshold value
In range, then the deviation for adjusting technological parameter is returned.
The present invention also provides it is a kind of based on above-mentioned realization laser scanning manufacturing real-time monitoring and processing positioning device into
The method of row processing positioning, is characterized in that, comprising steps of
1) workpiece to be machined is illuminated using ring illumination light source；
2) it shoots to obtain workpiece to be machined surface image using CCD camera；
3) eigencenter is extracted from workpiece to be machined surface image；
4) by eigencenter compared with the central region of CCD camera, the central region of eigencenter and CCD camera is obtained
Deviation；
3) deviation obtained according to step 4) adjusts CCD camera position, makes the view of workpiece to be machined position and CCD camera
Yezhong heart position consistency.
The present invention still further provides a kind of laser process equipment, including laser Machining head；The laser Machining head includes
Field lens and scanning galvanometer；The light-emitting window of scanning galvanometer is arranged in field lens；It is characterized in that further include that above-mentioned realization laser is swept
Retouch the device of processing monitoring and processing positioning.
Further, the field lens is fixedly connected with scanning galvanometer.
Further, plating is formed with the anti-reflection film for having 96% transmitance to laser on the field lens, on the scanning galvanometer
Plating is formed with the Anti-reflective coating for having 96% reflectivity to laser.
The beneficial effects of the present invention are:
1, the present invention field lens rear end be arranged a reflecting mirror, while on the mirror side setting CCD Observation camera, it can be achieved that
Characteristic point finds accurately in the monitoring of process, processing positioning and process；Since CCD Observation camera is after field lens,
Scanning galvanometer and field lens eyeglass greatly improve total and set without the concern for the plated film demand of lighting source wave band light
The flexibility that the flexibility of meter and lighting source wave band are chosen, while also reducing cost.
2, the lighting source that the present invention can select as needed monitoring effect best.
3, it using CCD camera direct imaging, is not avoided with the eyeglass of curvature between workpiece to be machined and CCD camera
Aberration caused by telecentricity field lens is introduced in traditional scheme, image quality is higher, and there are errors to need in practical adjustment or camera focal plane
When adjusting, the position of CCD camera need to be only adjusted, is adjusted more convenient.
4, CCD camera visual field of the present invention is able to achieve large-scale observation not by the constraint of scanning galvanometer light inlet diameter, can
Position between observational characteristic size and feature.
5, it can be improved based on existing process equipment, improving cost is low.
6, the present invention can be such that camera focal plane is overlapped with workpiece to be machined upper surface, make by adjusting the position of CCD camera
Image quality amount reaches best.
Detailed description of the invention
Fig. 1 is the schematic illustration of laser process equipment of the present invention, is set since improvement of the invention only relates to laser processing
For the improvement of the field lens of middle laser Machining head, scanning galvanometer and its rear end optical path, to laser process equipment other component and its company
It connects relationship not to be changed, thus illustrates only the part improved and be related in figure；In laser process equipment other components and its
Connection relationship, technical staff can refer to published document CN201710082418.5.
Description of symbols:
1- realizes the device of laser scanning manufacturing monitoring and processing positioning；11-CCD camera, 12- reflecting mirror, 13- annular are shone
Mingguang City source；2- field lens, 3- laser processing beam, 4- scanning galvanometer, 5- workpiece.
Specific embodiment
Below in conjunction with attached drawing, the invention will be further described.
As shown in Figure 1, laser process equipment includes scanning galvanometer 4, field lens 2 and monitors for realizing laser scanning manufacturing
With the device 1 of processing positioning；The device 1 that positioning is monitored and processed for realizing laser scanning manufacturing includes CCD camera 11, reflection
Mirror 12 and ring illumination light source 13.
Field lens 2 is arranged at the light-emitting window of scanning galvanometer 4, realizes laser processing beam in two-dimensional square by scanning galvanometer 4
Upward adjusting；Reflecting mirror 12 is arranged at the light-emitting window of field lens 2, is added for reflexing to the laser beam being emitted from field lens 2
On the workpiece 5 of work, laser machined；The top of reflecting mirror 12 is arranged in CCD camera 11, for shooting workpiece to be machined surface
Image carries out laser scanning manufacturing process monitoring and processing positioning；The reflected light of reflecting mirror 12 is arranged in ring illumination light source 13
On the road, and between workpiece 5 and reflecting mirror 12, the middle through-hole of ring illumination light source 13 passes through for laser processing beam；
The wavelength of light of ring illumination light source 13 and the wavelength of laser processing beam are unequal；The intensity of illumination of ring illumination light source 13 can
It adjusts, in order to adjust the field luminance of CCD camera 11；Reflecting mirror 12 is semi-transparent semi-reflecting eyeglass, has higher reflection to laser beam
Rate has stronger transmitance to the light that ring illumination light source issues.Laser energy can be wasted in view of reflectivity is not high, thoroughly
Cross that rate is not high to will affect image quality, reflecting mirror 12 should be 99% or more, to ring illumination light to the average reflectance of laser beam
The average transmittance for the illuminating ray that source issues should be 90% or more.
In order to fall in laser processing beam in reflecting mirror always, laser processing beam capacity usage ratio, reflecting mirror are improved
12 use large format reflecting mirror, and area can cover the scanning range of scanning galvanometer.
Based on the device 1 of the monitoring of realization laser scanning manufacturing and processing positioning shown in FIG. 1, carry out laser machining real-time prison
The process of survey is as follows:
1) outgoing beam of field lens is reflexed on workpiece to be machined using reflecting mirror, is laser machined；
2) workpiece to be machined is illuminated using ring illumination light source；
3) CCD camera captured in real-time workpiece to be machined surface image；
4) extract machined characteristic size from workpiece to be machined surface image, and by the machined characteristic size of extraction with
Design value compares, if deviation in threshold range, does not return to any value, laser process equipment still with current process parameter after
It is continuous to be laser machined；If deviation not in threshold range, is returned to the control system of laser process equipment for adjusting work
The deviation of skill parameter.
The method that machined characteristic size is extracted from workpiece to be machined surface image can use document
Method disclosed in CN201610195473.0 is realized.
Based on the device 1 of the monitoring of realization laser scanning manufacturing and processing positioning shown in FIG. 1, the process of positioning is processed such as
Under:
1) workpiece to be machined is illuminated using ring illumination light source；
2) it shoots to obtain workpiece to be machined surface image using CCD camera；
3) eigencenter is extracted from workpiece to be machined surface image；
4) by eigencenter compared with the central region of CCD camera, the central region of eigencenter and CCD camera is obtained
Deviation；
3) deviation obtained according to step 4) adjusts CCD camera position, makes the view of workpiece to be machined position and CCD camera
Yezhong heart position consistency.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811595135.1A CN109664017A (en) | 2018-12-25 | 2018-12-25 | Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811595135.1A CN109664017A (en) | 2018-12-25 | 2018-12-25 | Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning |
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| Publication Number | Publication Date |
|---|---|
| CN109664017A true CN109664017A (en) | 2019-04-23 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811595135.1A Withdrawn CN109664017A (en) | 2018-12-25 | 2018-12-25 | Realize device and method, the laser process equipment of laser scanning manufacturing monitoring and processing positioning |
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| CN (1) | CN109664017A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421253A (en) * | 2019-07-22 | 2019-11-08 | 廊坊西波尔钻石技术有限公司 | Laser scanning system and laser engraving system with it |
| CN110465751A (en) * | 2019-08-29 | 2019-11-19 | 伊欧激光科技（苏州）有限公司 | A kind of wafer laser system of processing |
| CN110560890A (en) * | 2019-09-06 | 2019-12-13 | 廊坊西波尔钻石技术有限公司 | Imaging system of laser processing head and laser processing equipment with same |
| CN111766690A (en) * | 2020-07-24 | 2020-10-13 | 苏州天准科技股份有限公司 | Alignment imaging equipment and laser direct imaging system |
| CN112285922A (en) * | 2020-12-24 | 2021-01-29 | 北京瑞通科悦科技有限公司 | A laser beam control device and control method thereof |
| WO2022152318A1 (en) * | 2021-01-18 | 2022-07-21 | 北京镭科光电科技有限公司 | Laser based on vcsel imaging and coaxial visualization design |
| CN115346036A (en) * | 2022-10-17 | 2022-11-15 | 江苏富乐华半导体科技股份有限公司 | Illumination positioning method for copper-clad ceramic substrate |
| CN115922075A (en) * | 2022-11-18 | 2023-04-07 | 湖北三江航天红峰控制有限公司 | An automatic positioning paraxial confocal laser welding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421253A (en) * | 2019-07-22 | 2019-11-08 | 廊坊西波尔钻石技术有限公司 | Laser scanning system and laser engraving system with it |
| CN110465751A (en) * | 2019-08-29 | 2019-11-19 | 伊欧激光科技（苏州）有限公司 | A kind of wafer laser system of processing |
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| CN110560890A (en) * | 2019-09-06 | 2019-12-13 | 廊坊西波尔钻石技术有限公司 | Imaging system of laser processing head and laser processing equipment with same |
| CN111766690A (en) * | 2020-07-24 | 2020-10-13 | 苏州天准科技股份有限公司 | Alignment imaging equipment and laser direct imaging system |
| CN112285922A (en) * | 2020-12-24 | 2021-01-29 | 北京瑞通科悦科技有限公司 | A laser beam control device and control method thereof |
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| WO2022152318A1 (en) * | 2021-01-18 | 2022-07-21 | 北京镭科光电科技有限公司 | Laser based on vcsel imaging and coaxial visualization design |
| CN115346036A (en) * | 2022-10-17 | 2022-11-15 | 江苏富乐华半导体科技股份有限公司 | Illumination positioning method for copper-clad ceramic substrate |
| CN115922075A (en) * | 2022-11-18 | 2023-04-07 | 湖北三江航天红峰控制有限公司 | An automatic positioning paraxial confocal laser welding device |
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