CN109659288A - A kind of combination radiator - Google Patents
A kind of combination radiator Download PDFInfo
- Publication number
- CN109659288A CN109659288A CN201811623766.XA CN201811623766A CN109659288A CN 109659288 A CN109659288 A CN 109659288A CN 201811623766 A CN201811623766 A CN 201811623766A CN 109659288 A CN109659288 A CN 109659288A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- radiating
- module
- room temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of combination radiator, including first substrate and radiating subassembly, and heating module and the radiating subassembly are mounted on the first substrate;The radiating subassembly includes profile radiating module and heat pipe cooling module, the profile radiating module includes at least two heat-sink units, the first collection heat space is formed between two heat-sink units, the heat pipe cooling module is at least partially disposed in the first collection heat space.When in use, for example low temperature environment, profile radiating module can be in the first collection heat space thermal-arrests, to promote heat pipe cooling module to work, Lai Tigao radiating efficiency, meanwhile, it can also reduce the volume of combination radiator;For example hot environment then undertakes main heat dissipation task by heat pipe cooling module, to guarantee the radiating efficiency under hot environment;The combination radiator of this form can keep higher radiating efficiency in more wide in range temperature range, and cost is relatively low, convenient for promoting the use of.
Description
Technical field
The present invention relates to technical field of heat dissipation, and in particular to a kind of combination radiator.
Background technique
The structure species of existing radiator are single, and using there is its limitation, application range is relatively narrow, and heat dissipation effect is general.
Therefore, how a kind of scheme is provided, is still those skilled in the art's technology urgently to be resolved to overcome drawbacks described above
Problem.
Summary of the invention
The purpose of the present invention is being to provide a kind of combination radiator, the combination radiator is in more wide in range humidity province
It is interior to can have higher radiating efficiency.
In order to solve the above technical problems, the present invention provides a kind of combination radiator, including first substrate and radiating subassembly,
Heating module and the radiating subassembly are mounted on the first substrate;The radiating subassembly includes profile radiating module and heat pipe
Radiating module, the profile radiating module include at least two heat-sink units, form the first thermal-arrest between two heat-sink units
Space, the heat pipe cooling module are at least partially disposed in the first collection heat space.
When in use, as being in low temperature environment, work is first begin to by profile radiating module, heating module is generated
Conduct heat away is into the air of surrounding, at this point, the first temperature collected in heat space between two heat-sink units can be improved, with
There is provided the operating temperature of the condition of satisfaction for heat pipe cooling module, then, heat pipe cooling module start to work, heat pipe cooling module compared with
Profile radiating module thermal resistance it is smaller, the volume when reaching identical heat radiation power can be smaller, can be avoided entire combination
The excessive increase of radiator volume;And if being in hot environment, main heat dissipation can be undertaken by heat pipe cooling module
Task, to guarantee the radiating efficiency under hot environment.
In this way, combination radiator provided by the present invention can have more wide in range temperature applicable range, either exist
Cold winter still during the broiling summer can keep higher heat radiation power, moreover, said combination radiator
Overall dimensions can substantially reduce again compared with single Section Bar Heat Sinks, can preferably adapt to the installation in the confined space, can
The excessive increase of equipment size caused by avoiding because of installation radiator.
In addition, profile radiating module is compared with heat pipe cooling module, cost is relatively low, and the organic assembling of the two can not only open up
The temperature applicable range of wide heat pipe cooling module, at the same time it can also reduce the cost of single heat pipe cooling module.That is,
The cost of combination radiator provided by the present invention is also lower, can be convenient for popularization and use.
Optionally, each heat-sink unit is circumferentially to be enclosed the first collection heat space.
Optionally, the heat pipe cooling module stretches out the first collection heat space far from the end of the first substrate.
Optionally, the heat pipe cooling module includes several Cryo Heat Tubes and several room temperature heat pipes, each Cryo Heat Tube,
The room temperature heat pipe is connected with the first substrate;The Cryo Heat Tube, the room temperature heat pipe are arranged with several radiating fins
Piece, each radiating fin is in the same direction and is spaced setting, forms the first ventilating duct between adjacent two radiating fin.
Optionally, the place face of the U-shaped central axes of the Cryo Heat Tube, the room temperature heat pipe is parallel to each other, and the two edge
Same direction alternate intervals arrangement;The second collection heat space is formed between the Cryo Heat Tube of adjacent two.
Optionally, the Cryo Heat Tube and the room temperature heat pipe share the radiating fin.
Optionally, the Cryo Heat Tube is identical with the quantity of the room temperature heat pipe, wherein a Cryo Heat Tube and one
Room temperature heat pipe described in root fits, to form one group of heat pipe;In the same direction, heat pipe interval described in each group is arranged.
Optionally, the heat-sink unit includes the second substrate and several blades for being installed on the second substrate, each described
Blade is in the same direction and is spaced setting, forms the second ventilating duct between adjacent two blade.
Optionally, first ventilating duct, second ventilating duct are opposite with the blower of peripheral hardware.
Optionally, heat conductive pad is provided between the heating module and the first substrate.
Detailed description of the invention
Fig. 1 be Section Bar Heat Sinks be used alone when heat radiation power with environment temperature change curve;
Fig. 2 be room temperature heat pipe, Cryo Heat Tube be used alone when heat radiation power with environment temperature change curve;
Fig. 3 be heating module at different ambient temperatures needed for heat radiation power;
Fig. 4 is a kind of structural schematic diagram of specific embodiment of combination radiator provided by the present invention;
Fig. 5 is the top view of Fig. 4;
Fig. 6 is a kind of structural schematic diagram of combination of room temperature heat pipe and Cryo Heat Tube;
Fig. 7 is the structural schematic diagram of another combination of room temperature heat pipe and Cryo Heat Tube;
Fig. 8 is that combination radiator provided by the present invention is being used alone with room temperature heat pipe, Cryo Heat Tube, Section Bar Heat Sinks
When heat radiation power with variation of ambient temperature comparison diagram;
Fig. 9 is the comparison of heat radiation power needed for the heat radiation power and heating module of combination radiator provided by the present invention
Figure.
The reference numerals are as follows by Fig. 1-9:
1 first substrate;
2 radiating subassemblies, 21 profile radiating modules, 21a heat-sink unit, 21b first collect heat space, 211 the second substrates, 212
Blade, the second ventilating duct of 212a, 22 heat pipe cooling modules, 221 Cryo Heat Tubes, 222 room temperature heat pipes, 223 radiating fins, 223a
One ventilating duct;
3 heating modules.
Specific embodiment
It is with reference to the accompanying drawing and specific real in order to make those skilled in the art more fully understand technical solution of the present invention
Applying example, the present invention is described in further detail.
It is described herein it is " several " be that exponential quantity is uncertain multiple, it is usually more than two;And when using " several " table
When showing the quantity of certain several component, it is not offered as the correlation of these components quantitatively.
The words such as " first " described herein, " second ", be merely for convenience of description scheme same or like two with
On structure or component, be not offered as certain particular determination to sequence.
Please refer to Fig. 1-3, Fig. 1 be Section Bar Heat Sinks when being used alone heat radiation power with environment temperature change curve
Figure, Fig. 2 are that for heat radiation power with the change curve of environment temperature, Fig. 3 is fever when being used alone for room temperature heat pipe, Cryo Heat Tube
Module at different ambient temperatures needed for heat radiation power.
As described in the background section, in the prior art, the structure species of radiator are single, using there are limitation,
If the radiator of this single form (in such as outdoor environment, becomes in the biggish environment of temperature change from summer to winter temperature
Change larger) it is interior in use, the heat radiation power in certain temperature sections is lower, it is difficult to it satisfies the use demand.
By taking Section Bar Heat Sinks commonly used in the prior art and heat-pipe radiator as an example, heat dissipation of the embodiment of the present invention with regard to the two
Relationship between power and environment temperature is studied.
As shown in Figure 1, Section Bar Heat Sinks are primarily referred to as the mental sections radiator such as aluminium, copper, its advantage is that it is at low cost, and its
Heat-sinking capability will not fail at low ambient temperatures, especially within the scope of -15 DEG C or less of temperature, can still keep higher heat dissipation
Power.But the heat-sinking capability of Section Bar Heat Sinks can but be gradually decreased with the raising of temperature, in 30 DEG C or more of hot environment
In, heat-sinking capability is extremely low.Moreover, the thermal resistance of Section Bar Heat Sinks is big, when unit area heat flow density is larger, just can not
Meeting cooling requirements, further to increase its heat-sinking capability, the volume of required profile is larger, and is limited by installation space,
The volume of radiator tends not to excessive.
The advantages of heat-pipe radiator can be divided into room temperature heat pipe and Cryo Heat Tube again, both form radiators is the capacity of heat transmission
By force, thermal resistance is small, also can satisfy cooling requirements when unit area heat flow density is big, and therefore, heat radiation power can be made very
Greatly.But in heated tube radiator the physical characteristics such as cooling medium phase transformation influence, room temperature heat pipe and Cryo Heat Tube are in low temperature ring
When heat sinking function has failure under border, i.e. failpoint, as shown in Fig. 2, the failpoint of room temperature heat pipe is substantially at -15 DEG C, and
For the failpoint of Cryo Heat Tube substantially at -35 DEG C, this just significantly limits the use of the two at low ambient temperatures.Moreover, low temperature
The thermal resistance of heat pipe is larger compared with room temperature heat pipe, and under conditions of reaching same heat radiation power, the volume of Cryo Heat Tube compares room temperature again
Big more of heat pipe.
However, for the IGBT in high voltage control cabinet, (Insulated Gate Bipolar Transistor, that is, insulate
Grid bipolar junction transistor) for the high-power components such as module, rectifier bridge or diode (led) module, at work, it is necessary in time
The heat of generation is distributed, otherwise may will lead to the damage of high-power component, influences the normal operation of equipment.Such as figure
Shown in 3, when being applied to outdoor, the either hot environment in the low temperature environment in winter or summer, above-mentioned high-power component
Required heat radiation power is substantially consistent, and therefore, this just needs a kind of to all have higher dissipate in wide temperature range
The radiator of thermal power, and its volume can't be excessive, to adapt to limited installation space in high voltage control cabinet.
For this purpose, specifically please referring to Fig. 4-7 the embodiment of the invention provides a kind of combination radiator, Fig. 4 is institute of the present invention
A kind of structural schematic diagram of specific embodiment of combination radiator is provided, Fig. 5 is the top view of Fig. 4, and Fig. 6 is room temperature heat pipe
With a kind of structural schematic diagram of combination of Cryo Heat Tube, Fig. 7 is another combination of room temperature heat pipe and Cryo Heat Tube
Structural schematic diagram.
As shown in Figure 4, Figure 5, which includes first substrate 1 and radiating subassembly 2, heating module 3 and heat dissipation
Component 2 is mounted on first substrate 1, the opposite two sides of first substrate 1 can be specifically respectively arranged in, to avoid radiating subassembly 2
Installation connection between heating module 3 and other component is caused to interfere, it is also possible to provide relatively solely for heating module 3
Vertical installation space, so that the air flowing in 3 place side space of heating module can form the second air-cooled cooling side to it
Formula, and then accelerate the cooling to heating module 3.
Above-mentioned radiating subassembly 2 may include profile radiating module 21 and heat pipe cooling module 22, and profile radiating module 21 can
To include at least two heat-sink unit 21a, when for two, two heat-sink units 21 can be oppositely arranged, the two heat-sink units
The first collection heat space 21b can be formed between 21a, heat pipe cooling module 22 can at least partly be located at the first collection heat space
In 21b.
When in use, as being in low temperature environment, work is first begin to by profile radiating module 21, heating module 3 is produced
Raw conduct heat away is into the air of surrounding, at this point, first between two opposite heat-sink unit 21a collects in heat space 21b
Temperature can be improved, to provide the operating temperature of the condition of satisfaction for heat pipe cooling module 22, then, heat pipe cooling module 22 is opened
Beginning work, heat pipe cooling module 22 are smaller compared with the thermal resistance of profile radiating module 21, the volume when reaching identical heat radiation power
Can be smaller, it can be avoided the excessive increase of entire combination radiator volume;And if being in hot environment, it can be by heat
Pipe radiating module 22 undertakes main heat dissipation task, to guarantee the radiating efficiency under hot environment.
In this way, combination radiator provided by the present invention can have more wide in range temperature applicable range, either exist
Cold winter still during the broiling summer can keep higher heat radiation power, moreover, said combination radiator
Overall dimensions can substantially reduce again compared with single Section Bar Heat Sinks, can preferably adapt to the installation in the confined space, can
The excessive increase of equipment size caused by avoiding because of installation radiator.
In addition, profile radiating module 21 is compared with heat pipe cooling module 22, cost is relatively low, and the organic assembling of the two not only may be used
To widen the temperature applicable range of heat pipe cooling module 22, at the same time it can also reduce the cost of single heat pipe cooling module 22.?
That is the cost of combination radiator provided by the present invention is also lower, it can be convenient for popularization and use.
In specific scheme, as shown in Figure 6, Figure 7, the quantity of heat-sink unit 21a can be three or more, and each heat dissipation
Unit 21a can circumferentially, and to be enclosed the first above-mentioned collection heat space 21b, i.e. profile radiating module 21 can divide
It is distributed in the periphery of heat pipe cooling module 22, the first collection heat space 21b can be circumferentially closed space.Using this structure,
In low temperature environment, first collection heat space 21b in temperature more can quickly improve, can shorten heat pipe cooling module 22 into
Enter the time of working condition, and the combination radiator is allowed more to be rapidly introduced into the working condition of high efficiency and heat radiation.
It is only this it is appreciated that profile radiating module 21 is set to the periphery of heat pipe cooling module 22 to form a circle
A kind of preferred embodiment of inventive embodiments, can not be as the practical range to combination radiator provided by the present invention
It limits, in the specific implementation, those skilled in the art can also be using other schemes to each heat-sink unit 21a and heat pipe heat radiation
The relative position of module 22 is adjusted, as long as guaranteeing that profile radiating module 21 can form the first collection heat space 21b and heat pipe
Radiating module 22 can be at least partially disposed in first collection heat space 21b.
In addition, the embodiment of the present invention does not limit the quantity of above-mentioned profile radiating module 21 and heat pipe cooling module 22 yet,
Wherein, it (includes the combination of more Cryo Heat Tubes 221 and room temperature heat pipe 222, specifically that heat pipe cooling module 22, which can be only one,
Referring to being hereinafter described), at this point, can be only located at the heat pipe cooling module 22 opposite by the heat-sink unit 21a of profile radiating module 21
Two sides, can also be located at heat pipe cooling module 22 three sides, or can also as in aforementioned schemes be located at heat pipe heat radiation
The periphery of module 22 is to form a circle;Heat pipe cooling module 22 or multiple, for two, the two heat pipe heat radiation moulds
Block 22 can be installed in same first collection heat space 21b, can also be installed in the first different collection heat space 21b, be worked as peace
When loaded on the first different collection heat space 21b, each heat-sink unit 21a can be enclosed " day " font, two heat pipe cooling modules
22 can be installed in two cavitys of " day " word, and each heat-sink unit 21a can also arrange to form " three " font, two heat pipe heat radiations
Module 22 can be respectively arranged between adjacent two transverse part of " three " word.
In conjunction with Fig. 4, end of the heat pipe cooling module 22 far from first substrate 1 can stretch out the first collection heat space 21b, i.e., hot
Pipe radiating module 22 can partially be located in the first collection heat space 21b, and another part can then stretch out the first collection heat space
21b, heat pipe cooling module 22 have efficient thermally conductive function, it is convenient to collect heat in heat space 21b from first for first
It passes in collection heat space 21b to radiate;And profile radiating module can also further be reduced using this structure
21 size can provide more installation spaces for the radiating fin 223 of heat pipe cooling module 22.
One heat pipe cooling module 22 may include several Cryo Heat Tubes 221 and several room temperature heat pipes 222, Cryo Heat Tube
221, room temperature heat pipe 222 can U-shaped or L-type etc., for U-shaped, each Cryo Heat Tube 221, room temperature heat pipe 222 be caned should
U-shaped bottom is connected with first substrate 1, and Cryo Heat Tube 221, room temperature heat pipe 222 can be arranged with several radiating fins
223, to improve the heat dissipation effect of the two.With continued reference to FIG. 4, each radiating fin 223 can be in the same direction and be spaced setting, adjacent two
The first ventilating duct 223a can be formed between radiating fin 223, when being provided with blower, the first ventilating duct 223a can be with blower
Relatively, enter air-flow caused by blower swimmingly in the first ventilating duct 223a, and along first ventilating duct 223a
Flowing, to take away heat caused by heat pipe cooling module 22.
In a kind of scheme, Cryo Heat Tube 221, room temperature heat pipe 222 the place faces of U-shaped central axes can be parallel to each other,
And the two alternate intervals (preferably at equal intervals) can arrange in the same direction, and using Fig. 6 as visual angle, i.e. a Cryo Heat Tube 221
It is arranged between two room temperature heat pipes 222, a room temperature heat pipe 222 is arranged between two Cryo Heat Tubes 221.Using this side
Case, when working at low ambient temperatures, with the raising of temperature in the first collection heat space 21b, Cryo Heat Tube 221 can be introduced into work
Make state, the heat that adjacent two Cryo Heat Tube 221 is given out can form the second collection heat space between again, cooperation the
The heat accumulated in one collection heat space 21b, can quickly improve the temperature around room temperature heat pipe 222, so that room temperature heat pipe 222
It can promptly start to work, to cooperate Cryo Heat Tube 221, profile radiating module 21 to carry out high efficiency and heat radiation.
Further, Cryo Heat Tube 221 and room temperature heat pipe 222 can share radiating fin 223, when Cryo Heat Tube 221 is opened
When beginning work, the heat distributed can pass in thermo-conducting manner room temperature heat pipe 222 by radiating fin 223, by
Very fast in the heat transfer rate of radiating fin 223, the ambient enviroment of room temperature heat pipe 222 can quickly reach operating temperature (- 15
DEG C or more), allow room temperature heat pipe 222 quickly to enter working condition.
Here, the embodiment of the present invention does not limit the Cryo Heat Tube 221 and room temperature heat pipe 222 for sharing radiating fin 223
Quantity can be adjacent a Cryo Heat Tube 221 and a room temperature heat pipe 222 and share radiating fin 223, is also possible to adjacent
More Cryo Heat Tubes 221 and Duo Gen room temperature heat pipe 222 share radiating fin 223, in the specific implementation, those skilled in the art
It can according to actual needs and the convenience etc. of installation is set.
In another scheme, as shown in fig. 7, the quantity of Cryo Heat Tube 221 and room temperature heat pipe 222 can be identical, wherein
A piece Cryo Heat Tube 221 and a room temperature heat pipe 222 can fit, to form one group of heat pipe, in the same direction, each group heat pipe
Setting can be spaced.Using this scheme, since Cryo Heat Tube 221, room temperature heat pipe 222 fit, when Cryo Heat Tube 221 starts
When work, the heat of Cryo Heat Tube 221 can be directly passed to room temperature heat pipe 222, the heat transfer rate of heat pipe in thermo-conducting manner
Very fast, room temperature heat pipe 222 and Cryo Heat Tube 221 can almost start to work in the same time, high with more quick realization
Effect heat dissipation.
It is to be appreciated that an adjacent Cryo Heat Tube 221 and a room temperature heat pipe 222 fits using as one group of heat pipe
Scheme is only a kind of exemplary description of the embodiment of the present invention, can not be as to combination radiator provided by the present invention
The restriction of practical range can also be affixed in the specific implementation using greater number of Cryo Heat Tube 221, room temperature heat pipe 222
The scheme of conjunction, but this point is also required to take into account the convenience of installation, and in practical operation, those skilled in the art can be according to practical feelings
Condition is configured.
It is all that Cryo Heat Tube 221,222 two kinds of room temperature heat pipe are included with heat pipe cooling module 22 in above each scheme
The structure type for carrying out opposite heat tube radiating module 22 for heat pipe is described;However, in fact, heat pipe cooling module 22 can also be with
Only including one of Cryo Heat Tube 221, room temperature heat pipe 222, such as: it can only include room temperature heat pipe 222, at this point, the first collection
Heat space 21b, which needs to gather more heats, can make room temperature heat pipe 222 enter working condition, and required time is relatively long;
Alternatively, can also only include Cryo Heat Tube 221, since the thermal resistance of Cryo Heat Tube 221 is relatively larger, to reach identical heat dissipation
Efficiency, only the volume of the heat pipe cooling module 22 including Cryo Heat Tube 221 can be larger.Conversely, using aforementioned Low Temperature Thermal
The heat pipe cooling module 22 that pipe 221 and room temperature heat pipe 222 are composed, not only can more be rapidly introduced into working condition, but also can
It is the preferred embodiment of the embodiment of the present invention to reduce volume;Certainly, other schemes are not precluded in the embodiment of the present invention.
For profile radiating module 21, heat-sink unit 21a may include the second substrate 211 and be installed on the second base
Several blades 212 of plate 211, the second substrate 211 are installing component, can be fixed on first substrate 1, and each blade 212 can be with
In the same direction and it is spaced setting, the second ventilating duct 212a can be formed between adjacent two blade 212, when being equipped with blower, the second ventilation
Road 212a can also be opposite with blower, and air-flow caused by blower is smoothly entered in the second ventilating duct 212a, and
It is flowed along the second ventilating duct 212a, to take away the heat that profile radiating module 21 is come out.
In practical applications, the size of each heat-sink unit 21a can also be different, using Fig. 4 as visual angle, top heat-sink unit,
The size of lower section heat-sink unit in left and right directions, which can be greater than, to be connected between top heat-sink unit and lower section heat-sink unit
Heat-sink unit 21a (the heat-sink unit 21a extended from top to bottom in attached drawing), to vacate more installations for radiating fin 223
Space.
, it is emphasized that the embodiment of the present invention does not limit the application scenarios of the combination radiator, i.e., the fever is not limited
The specific type of module 3.When be applied to high voltage control cabinet when, the heating module 3 can for IGBT module above-mentioned, rectifier bridge,
Diode (led) module or electrode plate etc., the surface of the heating module 3 of this form and out-of-flatness, during installation, be not easy with
First substrate 1 is in close contact, and influences heat dissipation effect.
For this purpose, in embodiments of the present invention, heat conductive pad can be arranged (in figure not between heating module 3 and first substrate 1
Show), which specifically can be using the preparation of the soft materials such as silica gel, in a manner of it will pass through press fitting, to guarantee the mould that generates heat
The close contact of block 3, heat conductive pad and first substrate 1, and then can guarantee and effectively conduct heat between three.Heating module 3 and first
It can be specifically fixed by the connector of the forms such as screw, bolt between substrate 1, to guarantee heating module 3 and the first base
Connection reliability between plate 1.
Fig. 8, Fig. 9 are please referred to, Fig. 8 is that combination radiator provided by the present invention and room temperature heat pipe, Cryo Heat Tube, profile dissipate
When being used alone, for heat radiation power with the comparison diagram of variation of ambient temperature, Fig. 9 is combination radiator provided by the present invention to hot device
Heat radiation power and heating module needed for heat radiation power comparison diagram.
As shown in Figure 8, Figure 9, combination radiator provided by the present invention is at more wide in range (- 35 DEG C -45 of temperature range
DEG C) in can radiating efficiency with higher, and be higher than heating module 3 required for heat radiation power, be adapted to winter substantially
Cold snap and the hot environment of summer, to meet radiating requirements.
The above is only the preferred embodiment of the present invention, it is noted that those skilled in the art are come
It says, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of combination radiator, which is characterized in that including first substrate (1) and radiating subassembly (2), heating module (3) and
The radiating subassembly (2) is mounted on the first substrate (1);
The radiating subassembly (2) includes profile radiating module (21) and heat pipe cooling module (22), the profile radiating module
(21) two heat-sink units (21a) are included at least, form the first collection heat space (21b), institute between two heat-sink units (21a)
Heat pipe cooling module (22) is stated to be at least partially disposed in first collection heat space (21b).
2. combining radiator according to claim 1, which is characterized in that each heat-sink unit (21a) is circumferentially
To be enclosed first collection heat space (21b).
3. combining radiator according to claim 2, which is characterized in that the heat pipe cooling module (22) is far from described the
First collection heat space (21b) is stretched out in the end of one substrate (1).
4. radiator is combined described in any one of -3 according to claim 1, which is characterized in that the heat pipe cooling module (22)
Including several Cryo Heat Tubes (221) and several room temperature heat pipes (222), each Cryo Heat Tube (221), the room temperature heat pipe
(222) it is connected with the first substrate (1);
The Cryo Heat Tube (221), the room temperature heat pipe (222) are arranged with several radiating fins (223), each radiating fin
Piece (223) is in the same direction and is spaced setting, forms the first ventilating duct (223a) between adjacent two radiating fin (223).
5. combining radiator according to claim 4, which is characterized in that the Cryo Heat Tube (221), the room temperature heat pipe
(222) the place face of U-shaped central axes is parallel to each other, and the two in the same direction arrange by alternate intervals;
The second collection heat space is formed between the Cryo Heat Tube of adjacent two (221).
6. combining radiator according to claim 5, which is characterized in that the Cryo Heat Tube (221), the room temperature heat pipe
(222) radiating fin (223) are shared.
7. combining radiator according to claim 4, which is characterized in that the Cryo Heat Tube (221) and room temperature heat
The quantity for managing (222) is identical, wherein and a Cryo Heat Tube (221) and a room temperature heat pipe (222) fit, with
Form one group of heat pipe;
In the same direction, heat pipe interval described in each group is arranged.
8. combining radiator according to claim 4, which is characterized in that the heat-sink unit (21a) includes the second substrate
(211) several blades (212) of the second substrate (211) are installed on and, each blade (212) in the same direction and is spaced setting,
The second ventilating duct (212a) is formed between adjacent two blade (212).
9. combining radiator according to claim 8, which is characterized in that first ventilating duct (223a), described second
Ventilating duct (212a) is opposite with the blower of peripheral hardware.
10. combining radiator according to claim 4, which is characterized in that the heating module (3) and the first substrate
(1) heat conductive pad is provided between.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811623766.XA CN109659288A (en) | 2018-12-28 | 2018-12-28 | A kind of combination radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811623766.XA CN109659288A (en) | 2018-12-28 | 2018-12-28 | A kind of combination radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109659288A true CN109659288A (en) | 2019-04-19 |
Family
ID=66117279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811623766.XA Pending CN109659288A (en) | 2018-12-28 | 2018-12-28 | A kind of combination radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109659288A (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02229455A (en) * | 1989-03-02 | 1990-09-12 | Furukawa Electric Co Ltd:The | Apparatus of heat pipe system |
US20010001981A1 (en) * | 1997-10-20 | 2001-05-31 | William G. Kratz, Jr. | Heat pipe type cooler |
TW200802757A (en) * | 2006-06-13 | 2008-01-01 | Taiwan Semiconductor Mfg | Heat sink, integrated circuit package and the method of fabricating thereof |
US20110100604A1 (en) * | 2009-10-30 | 2011-05-05 | Fujitsu Limited | Heat radiating device and manufacturing method of heat radiating device |
CN202304514U (en) * | 2010-07-02 | 2012-07-04 | 日立电线株式会社 | Heat-pipe cooling device and vehicle control device employing same |
US20160102920A1 (en) * | 2014-10-08 | 2016-04-14 | Mersen Canada Toronto Inc. | Heat pipe assembly with bonded fins on the baseplate hybrid |
CN205646057U (en) * | 2016-03-15 | 2016-10-12 | 上海工程技术大学 | Car battery package heat pipe reason device based on heat transfer system |
-
2018
- 2018-12-28 CN CN201811623766.XA patent/CN109659288A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02229455A (en) * | 1989-03-02 | 1990-09-12 | Furukawa Electric Co Ltd:The | Apparatus of heat pipe system |
US20010001981A1 (en) * | 1997-10-20 | 2001-05-31 | William G. Kratz, Jr. | Heat pipe type cooler |
TW200802757A (en) * | 2006-06-13 | 2008-01-01 | Taiwan Semiconductor Mfg | Heat sink, integrated circuit package and the method of fabricating thereof |
US20110100604A1 (en) * | 2009-10-30 | 2011-05-05 | Fujitsu Limited | Heat radiating device and manufacturing method of heat radiating device |
CN202304514U (en) * | 2010-07-02 | 2012-07-04 | 日立电线株式会社 | Heat-pipe cooling device and vehicle control device employing same |
US20160102920A1 (en) * | 2014-10-08 | 2016-04-14 | Mersen Canada Toronto Inc. | Heat pipe assembly with bonded fins on the baseplate hybrid |
CN205646057U (en) * | 2016-03-15 | 2016-10-12 | 上海工程技术大学 | Car battery package heat pipe reason device based on heat transfer system |
Non-Patent Citations (1)
Title |
---|
周志敏,纪爱华: "《漫步LED世界 驱动电路设计篇》", 31 January 2013, 北京:国防工业出版社 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102570289B (en) | Temperature controlling and heat radiating system for optical fiber coupling module | |
CN108766946B (en) | Liquid cooling heat abstractor and motor controller | |
WO2017036283A1 (en) | Semiconductor refrigerating device for circulation cooling system | |
CN202259595U (en) | Heating and cooling module applied to battery | |
CN112885798B (en) | Integrated phase change heat transfer element liquid cooling heat radiation module for server | |
CN110475466B (en) | Air-cooled radiator and electrical equipment | |
CN103629851A (en) | Air-cooling and liquid-cooling dual-purpose radiator | |
CN104035459A (en) | Frequency converter and method for controlling temperature of frequency converter | |
CN106711110A (en) | Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator) | |
CN106455423A (en) | Low-flow resistance mean-temperature radiator for rail transit converter | |
CN202351605U (en) | Projector and radiating device | |
CN102446878A (en) | Semiconductor refrigerating device | |
CN210838441U (en) | Heat dissipation device applied to semiconductor laser | |
CN109659288A (en) | A kind of combination radiator | |
CN107421014A (en) | Air conditioner cooling device, method and air conditioner | |
CN101296600A (en) | Heat radiation assembly and electronic device using same | |
CN113677159B (en) | Water-cooling and air-cooling compatible heat dissipation device | |
WO2020019579A1 (en) | Liquid cooling heat radiating apparatus and motor controller | |
CN201748700U (en) | A flue gas condenser | |
CN107995837A (en) | Air-cooled, water cooling two uses radiator | |
CN209299652U (en) | A kind of air-cooled radiator using aluminium extruded Formula V C quick conductive | |
CN114071955A (en) | Cooling device and electronic equipment containing the same | |
CN203984859U (en) | A kind of cooling system of electronic load | |
CN208300186U (en) | Air-cooled/water cooling two uses radiator | |
CN209299654U (en) | Compressor test equipment and controller heat abstractor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190419 |