CN109654929B - A high-efficiency heat storage device and its manufacturing method - Google Patents

Abstract

The invention provides a high-efficiency heat storage device and a manufacturing method thereof, wherein the high-efficiency heat storage device includes a heat-conducting shell, and a uniform-temperature chamber, a high-temperature heat-storage chamber, and a low-temperature heat-storage chamber are sequentially stacked in the heat-conducting shell from top to bottom, The uniform temperature cavity is filled with gas-liquid phase change material, and the high temperature heat storage cavity is filled with high melting point solid-liquid phase change material, and the first heat conduction corrugated plate is sandwiched between the upper and lower inner walls of the high temperature heat storage cavity; the low temperature heat storage cavity The interior is filled with a low melting point solid-liquid phase change material, and a second heat conduction corrugated plate is sandwiched between the upper and lower inner walls of the low temperature heat storage cavity. When the electronic components are working, the heat is first transferred to the uniform temperature chamber and its upper and lower walls. When the gas-liquid phase change material phase changes and gasifies, the gas absorbs the heat generated by the electronic components and quickly spreads to the entire uniform temperature chamber. At this time, the solid-liquid phase change material The heat released by the liquefaction of the gas in the uniform temperature chamber can be simultaneously absorbed on the entire surface of the partition, and the heat conduction and heat storage of the present invention can be manifested.

Description

A high-efficiency heat storage device and its manufacturing method

technical field

The invention relates to the technical field of heat storage devices, in particular to a high-efficiency heat storage device and a manufacturing method thereof.

Background technique

Modern electronic components are advancing towards high-density, micro-volume system integration at an explosive speed, so high power consumption or high heat flux has become a stumbling block to stable system operation and performance improvement. How to manage high heat flux in a small space has become a key issue in improving the performance of electronic components.

Especially in some fields of application of short-term high-power electronic components, such as lasers, missiles, etc., a large amount of heat is often generated in a short time, but there is not enough space and weight resources to set up heat sinks to conduct heat away, so now There is an urgent need for a device that can store heat quickly and efficiently to eliminate the problem of overheating of electronic components.

Contents of the invention

Aiming at the deficiencies of the prior art, the invention provides a high-efficiency heat storage device and a manufacturing method thereof.

A high-efficiency heat storage device, characterized in that it includes a heat-conducting shell, and a uniform temperature cavity, a high-temperature heat storage cavity, and a low-temperature heat storage cavity are sequentially stacked in the heat-conducting shell from top to bottom; the high-temperature heat storage cavity The inside is filled with the first solid-liquid phase change material, and the first heat-conducting corrugated plate is clamped between the upper and lower inner walls of the high-temperature heat storage chamber; the low-temperature heat storage chamber is filled with the second solid-liquid phase change material, A second heat-conducting corrugated plate is sandwiched between the upper and lower inner walls of the low-temperature heat storage chamber; the gas-liquid phase change material is filled in the temperature equalization chamber, and the vaporization temperature of the gas-liquid phase change material is higher than that of the first A melting point temperature of the solid-liquid phase change material, the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material.

The working principle of the present invention: the electronic components are fitted on the outer surface of the upper inner wall of the temperature chamber, and when the electronic components are working, the liquid state in the temperature chamber changes into a gaseous state, and the gas absorbs the heat of the electronic components quickly during the phase change Spread to the entire temperature chamber, the temperature of the entire temperature chamber is almost isothermal, and the overall temperature of the temperature chamber and its upper and lower walls rises; then the high-melting point solid-liquid phase change material in the high-temperature heat storage chamber reaches the melting point and begins to melt. However, due to the extremely low thermal conductivity of solid-liquid phase change materials (about 0.2-0.5W/m·℃), heat cannot be quickly transferred to low-melting point phase change materials, resulting in that phase change materials cannot be fully utilized; by using the first heat conduction The corrugated plate, the second heat-conducting corrugated plate and the inner wall of the cavity in the heat-conducting shell can melt and absorb heat when the high-melting point phase-change material melts and absorbs heat, and the low-melting point phase-change material also starts to melt and absorb heat, achieving the effect of simultaneously absorbing heat.

Further, the heat-conducting housing includes a cover plate arranged up and down and sealed and fixedly connected, a partition, a high-temperature chamber shell, and a low-temperature chamber shell, and the uniform temperature chamber is formed between the cover plate and the partition plate. The high-temperature heat storage chamber is formed between the partition plate and the high-temperature chamber shell, and the low-temperature heat-storage chamber is formed between the high-temperature chamber shell and the low-temperature chamber shell; the split structure is convenient for assembly and fixed connection.

Further, a liquid-absorbing core and support columns are evenly distributed between the upper and lower inner walls of the uniform temperature chamber, the support columns pass through the liquid-absorbing core, and compression rings are set on the support columns, The compression ring is abutted between the liquid-absorbing core and the lower wall of the uniform temperature chamber; the contact between the liquid-absorbent core and the upper wall of the uniform temperature chamber is more uniform, and the contact between the upper wall of the uniform temperature chamber and the liquid absorption is reduced. Contact resistance between cores.

Further, the upper end of the support column is integrally arranged with the upper wall of the uniform temperature chamber, and a boss is integrally arranged on the lower end surface of the support column, and the boss and the lower wall of the uniform temperature chamber adopt Vacuum brazing welding; After laying solder on the lower end surface of the boss, it is welded with the lower wall of the uniform temperature chamber, which can effectively prevent the solder from contacting the liquid-absorbing core.

Further, the heat-conducting shell, the first heat-conducting corrugated plate and the second heat-conducting corrugated plate are all made of aluminum alloy, the liquid-absorbing core is made of composite sintered wire mesh with different aperture ratios, and the material of the liquid-absorbing core is For stainless steel, copper alloy, aluminum alloy.

Further, the upper wall surface and the side wall surface of the uniform temperature chamber are located in the lower surface of the cover plate, the lower wall surface and the side wall surface of the high-temperature heat storage chamber are located in the upper surface of the high-temperature chamber shell, Both the lower wall surface and the side wall surface of the low temperature heat storage chamber are located in the upper surface of the low temperature chamber shell.

A method for manufacturing a high-efficiency heat storage device, based on the high-efficiency heat storage device, is characterized in that it includes the following steps:

Filling holes are reserved on the cover plate, the high temperature chamber shell and the low temperature chamber shell;

Evacuating the temperature uniform chamber to meet the specified vacuum requirement, filling the gas-liquid phase change material into the uniform temperature chamber;

heating the high-melting point solid-liquid phase change material to a liquid state and filling it into the high-temperature heat storage chamber; heating the low-melting point solid-liquid phase change material to a liquid state and filling it into the low-temperature heat storage chamber;

Seal the filling hole by extrusion welding.

Beneficial effects of the present invention:

(1) The liquid-absorbing core of the uniform temperature chamber is compressed with a compression ring, which increases the contact area between the liquid-absorbent core and the upper wall of the uniform temperature chamber, and at the same time, the compressive force is more uniform and the degree of compression is better, reducing the The contact thermal resistance between the upper wall of the uniform temperature chamber and the liquid-absorbing core improves the heat transfer efficiency.

(2) A boss is designed on the support column, and a solder foil is laid between the top surface of the boss and the partition for vacuum brazing. There is a gap between the boss and the liquid-absorbing core, which can effectively prevent the solder foil from flowing into the liquid-absorbing liquid during welding core, leading to the failure of the wick.

(3) When the electronic components are working, firstly the temperature chamber changes from liquid to gaseous state. During the phase change and gasification, the gas absorbs the heat generated by the electronic components and quickly spreads to the entire temperature chamber. The temperature of the entire temperature chamber is almost isothermal. The overall temperature of the cavity and its upper and lower walls rises. At this time, the high-temperature heat storage layer reaches the melting point, and the high-melting point solid-liquid phase change material begins to melt. However, due to the extremely low thermal conductivity of the solid-liquid phase change material, the heat cannot be quickly transferred to the low melting point. Solid-liquid phase change materials, resulting in phase change materials can not be fully utilized. The high melting point solid-liquid phase change material and the low melting point solid-liquid phase change material are sandwiched between aluminum alloy materials. At the same time, the high-temperature regenerator chamber and the low-temperature regenerator layer chamber are welded with aluminum alloy heat-conducting corrugated plates, using the high thermal conductivity of aluminum alloy (about 160W/m·℃), the high melting point solid-liquid phase change material can melt and absorb heat at the same time that the low melting point solid-liquid phase change material also starts to melt and absorb heat, achieving the effect of simultaneous heat absorption, and solving the solid-liquid phase change The heat storage material is often not fully utilized, and the heat storage efficiency and capacity of the device are improved.

(4) When the electronic components are working, the heat is first transferred to the uniform temperature chamber and its upper and lower walls. When the gas-liquid phase change material phase changes and gasifies, the gas absorbs the heat generated by the electronic components and quickly spreads to the entire uniform temperature chamber. The entire uniform temperature chamber The temperature is almost isothermal. At this time, the high melting point solid-liquid phase change material can simultaneously absorb the heat released by the liquefaction of the gas in the uniform temperature chamber on the entire partition surface, and improve the utilization rate of the phase change material.

Description of drawings

Fig. 1 is the split structural diagram of the present invention;

Fig. 2 is the structural representation of end cap among the present invention;

Fig. 3 is the structural representation of liquid-absorbing core in the present invention;

Fig. 4 is the structural schematic diagram of compression ring in the present invention;

Fig. 5 is the structural representation of dividing plate in the present invention;

Fig. 6 is a schematic structural view of a heat-conducting corrugated plate in the present invention;

Fig. 7 is a structural schematic diagram of the housing of the heat storage chamber in the present invention.

In the figure, 1. Cover plate; 11. Support column; 111. Boss; 2. Liquid-absorbing core; 3. Compression ring; 4. Partition plate; 5. First heat-conducting corrugated plate; 7. The second heat-conducting corrugated plate; 8. The shell of the low temperature chamber; 9. The filling hole.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the orientation terms such as left, middle, right, up, and down in the examples of the present invention are only relative concepts or refer to the normal use state of the product, and should not be considered as restrictive .

As shown in Figure 1, a high-efficiency heat storage device includes a heat-conducting shell, and a uniform temperature chamber, a high-temperature heat storage chamber, and a low-temperature heat The chamber is a vacuum chamber and is filled with a gas-liquid phase change material, and the gas-liquid phase change material may be water, methanol, ethanol, or acetone. A liquid-absorbing core 2 is clamped between the upper and lower inner walls of the uniform temperature chamber; the high-temperature heat storage chamber is filled with a high-melting point solid-liquid phase change material, and is clamped between the upper and lower inner walls of the high-temperature heat storage chamber There is a first heat-conducting corrugated plate 5; the low-temperature heat storage cavity is filled with a low-melting point solid-liquid phase change material, and a second heat-conducting corrugated plate 7 is sandwiched between the upper and lower inner walls of the low-temperature heat storage cavity, as shown in Figure 6 As shown, the structure of the first heat-conducting corrugated plate 5 and the second heat-conducting corrugated plate 7 are the same; the heat-conducting housing includes a cover plate 1 arranged up and down and sealed and fixedly connected, a separator 4, a high-temperature cavity shell 6 and a low-temperature cavity shell body 8, the uniform temperature chamber is formed between the cover plate 1 and the partition plate 4, the high-temperature heat storage chamber is formed between the partition plate 4 and the high-temperature chamber shell 6, and the high-temperature chamber shell The low-temperature heat storage chamber is formed between the body 6 and the low-temperature chamber housing 8. As shown in FIG. 5, the partition plate 4 is a flat plate.

The solid-liquid phase change material can be inorganic phase change material, organic phase change material, composite phase change material, liquid metal, wherein, inorganic phase change material includes crystal water and salts, molten salts, metal; organic phase change material Including paraffins, the melting point of the high-melting solid-liquid phase change material is 50°C~80°C, the melting point range of the low melting point solid-liquid phase change material is 20°C~60°C; the gas-liquid phase change material gas The melting temperature is higher than the melting point temperature of the high melting point solid-liquid phase change material, and the melting point temperature of the high melting point solid-liquid phase change material is higher than the melting point temperature of the low melting point solid-liquid phase change material, and the three have a coupling relationship.

As shown in FIG. 2 , support columns 11 are evenly distributed in the uniform temperature chamber, and the support columns 11 run through the liquid-absorbing core 2 . The partitions 4 are fixedly connected, and the support columns 11 are covered with a compression ring 3, the compression ring 3 is located between the liquid-absorbent core 2 and the partition 4, and the structure of the compression ring 3 is shown in the figure 4, the structure of the liquid-absorbing core 2 is shown in Figure 3; the upper end of the support column 11 is integrally arranged with the cover plate 1, and a protrusion A platform 111, the boss 111 is welded to the partition plate 4 by vacuum brazing. The upper wall surface and the side wall surface of the uniform temperature chamber are all located in the lower surface of the cover plate 1, that is, a first groove is opened in the lower surface of the cover plate, and the bottom surface and the side surface of the first groove are namely Respectively, the upper wall surface and the side wall surface of the temperature uniform chamber. The upper surface of the cover plate 1 is the installation position of the electronic components; as shown in FIG. 7, the high temperature heat storage chamber shell and the low temperature heat storage chamber shell have the same structure, The lower wall surface and the side wall surface of the high-temperature heat storage chamber are all located in the upper surface of the high-temperature chamber casing 6, that is, the upper surface of the high-temperature chamber casing 6 is provided with a second groove, and the second groove The bottom surface and side surfaces of the high temperature storage chamber are respectively the lower wall surface and the side wall surface, and the lower surface of the high temperature chamber shell 6 is a plane; the lower wall surface and the side wall surface of the low temperature heat storage chamber are located in the low temperature chamber In the upper surface of the housing 8, that is, the upper surface of the low-temperature chamber housing 8 is provided with a third groove, and the bottom surface and side surfaces of the third groove are respectively the lower wall surface and the side wall surface of the low-temperature heat storage chamber. , the lower surface of the low temperature chamber shell 8 is a plane.

Wherein, the heat-conducting shell, the first heat-conducting corrugated plate 5 and the second heat-conducting corrugated plate 7 are all made of aluminum alloy, and the liquid-absorbing core 5 is formed by composite sintering of screens with different aperture ratios. The material is stainless steel, copper alloy, aluminum alloy, etc.

A method for manufacturing a high-efficiency heat storage device, based on the high-efficiency heat storage device, comprises the following steps:

Step 1: Prepare the cover plate, partition, high-temperature chamber shell, low-temperature chamber shell, liquid-absorbing core, compression ring, first heat-conducting corrugated plate and second heat-conducting corrugated plate; wherein, the compression ring is a metal ring , its material is aluminum alloy, stainless steel, etc.; step 2: reserve filling holes on the cover plate, high temperature chamber shell and low temperature chamber shell; step 3: assemble the components in step 1 and carry out as required Vacuum brazing, the vacuum brazing temperature is 600°C~610°C, so as to form the uniform temperature chamber, high temperature heat storage chamber, and low temperature heat storage chamber; Step 4: Check the uniform temperature chamber, high temperature heat storage chamber, low temperature heat storage chamber The pressure resistance performance of the hot chamber; step 5: vacuumize the uniform temperature chamber, and after reaching the specified vacuum degree requirement, the vacuum degree generally requires 1.33×10 ^-3 Pa, and fill the gas-liquid phase change material into the The uniform temperature chamber, the liquid filling amount is about 25% of the volume of the uniform temperature chamber; step 6: heat the high-melting point solid-liquid phase change material to the liquid state and fill it into the high-temperature heat storage chamber, and the low-melting point The solid-liquid phase change material is heated to a liquid state and filled into the low-temperature heat storage chamber; step 7: sealing the filling hole by extrusion welding.

Wherein, in the step 1, there is a margin on the outside of the cover plate, the partition, the high-temperature chamber shell and the low-temperature chamber shell; it is used for the treatment of the shape; in the step 3, before the assembly, the The cover plate, partition, high-temperature chamber shell, low-temperature chamber shell, compression ring, first heat-conducting corrugated plate and second heat-conducting corrugated plate are deoxidized, degreased and dried, and the liquid-absorbing core is drying.

The basic principles, main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments. What are described in the above-mentioned embodiments and the description only illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will also have Variations and improvements are possible, which fall within the scope of the claimed invention. The protection scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A heat storage device, characterized in that: it includes a heat conduction shell, and a uniform temperature cavity, a high temperature heat storage cavity and a low temperature heat storage cavity are stacked sequentially from top to bottom in the heat conduction shell; the high temperature heat storage The cavity is filled with a first solid-liquid phase change material, and a first heat-conducting corrugated plate is sandwiched between the upper and lower inner walls of the high-temperature heat storage cavity; the low-temperature heat storage cavity is filled with a second solid-liquid phase change material, A second heat-conducting corrugated plate is clamped between the upper and lower inner walls of the low-temperature heat storage chamber; the gas-liquid phase change material is filled in the temperature uniform chamber, and the vaporization temperature of the gas-liquid phase change material is higher than that of the The melting point temperature of the first solid-liquid phase change material, the melting point temperature of the first solid-liquid phase change material is higher than the melting point temperature of the second solid-liquid phase change material. 2. A heat storage device according to claim 1, characterized in that: the heat conduction shell includes a cover plate, a partition plate, a high-temperature cavity shell, and a low-temperature cavity shell that are arranged up and down and are sealed and fixedly connected. The uniform temperature chamber is formed between the cover plate and the partition plate, the high-temperature heat storage chamber is formed between the partition plate and the high-temperature chamber shell, and the high-temperature heat storage chamber is formed between the high-temperature chamber shell and the low-temperature chamber shell. The low temperature heat storage chamber. 3. A heat storage device according to claim 1 or 2, characterized in that: a liquid-absorbing core and support columns are evenly distributed between the upper and lower inner walls of the uniform temperature chamber, and the support columns penetrate through the The liquid-absorbing core and the supporting column are both covered with a compression ring, and the compression ring is abutted between the liquid-absorbing core and the lower wall of the uniform temperature chamber. 4. A heat storage device according to claim 3, characterized in that: the upper end of the support column is integrated with the upper wall of the temperature uniform chamber, and the lower end surface of the support column is integrally provided with The boss, the boss and the lower wall of the uniform temperature chamber are welded by vacuum brazing. 5. A heat storage device according to claim 4, characterized in that: the heat-conducting shell, the first heat-conducting corrugated plate and the second heat-conducting corrugated plate are all made of aluminum alloy, and the liquid-absorbing cores have different apertures High-efficiency wire mesh composite sintering, the material of the liquid-absorbing core is stainless steel, copper alloy, aluminum alloy. 6. A method for manufacturing a thermal storage device, based on the high-efficiency thermal storage device according to claim 5, characterized in that it comprises the following steps: Filling holes are reserved on the cover plate, the high temperature chamber shell and the low temperature chamber shell; Evacuating the temperature uniform chamber to meet the specified vacuum requirement, filling the gas-liquid phase change material into the uniform temperature chamber; heating the high-melting point solid-liquid phase change material to a liquid state and filling it into the high-temperature heat storage chamber; heating the low-melting point solid-liquid phase change material to a liquid state and filling it into the low-temperature heat storage chamber; Seal the filling hole by extrusion welding.