CN109618502A - A kind of high-gain amplifier module making processing method - Google Patents
A kind of high-gain amplifier module making processing method Download PDFInfo
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- CN109618502A CN109618502A CN201811510358.3A CN201811510358A CN109618502A CN 109618502 A CN109618502 A CN 109618502A CN 201811510358 A CN201811510358 A CN 201811510358A CN 109618502 A CN109618502 A CN 109618502A
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- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 34
- 238000000576 coating method Methods 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 32
- 238000004140 cleaning Methods 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 7
- 238000010586 diagram Methods 0.000 claims description 28
- 239000003990 capacitor Substances 0.000 claims description 25
- 238000009434 installation Methods 0.000 claims description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 235000013351 cheese Nutrition 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 17
- 239000012459 cleaning agent Substances 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 9
- 230000004927 fusion Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 5
- 150000001298 alcohols Chemical class 0.000 claims description 3
- 238000010330 laser marking Methods 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims 1
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The present invention provides a kind of high-gain amplifier module making processing method, includes the following steps: the welding of S1 component, S2 cleaning, the welding of S3 Denso, S4 debugging, S5 brush three-proofing coating, mark, capping.The present invention amplifies the production of device module so that product qualification rate improves by this technique, while fabrication processing is simple, is more suitable for producing in enormous quantities.
Description
Technical field
The present invention relates to the technical fields of microwave module production processing technology, and in particular to a kind of high-gain amplifier module
Make processing method.
Background technique
In modern microwave wireless communication system, information transmission is just rapidly sent out towards multicarrier, large capacity, high speed direction
Exhibition.Microwave amplifier is widely used to the fields such as radar, electronic countermeasure, radio and television in recent years, and microwave amplifier is microwave
The important component of communication equipment, its performance largely influence the quality of communication.The amplifier of function admirable, in addition to essence
Really reasonable circuit and structure design are made to guarantee outer, also to there is good production technology.
For existing L-band 9W high-gain amplifier module during batch production, the qualification rate of product is lower, together
When, the complexity of the technique of production more reduces the throughput rate of product.
Summary of the invention
The present invention provides a kind of high-gain amplifier module making processing method to solve batch proposed in background technique
The low technical problem of amount production qualification rate.
To achieve the above object, the invention provides the following technical scheme: a kind of high-gain amplifier module making processing side
Method includes the following steps: that S1 component welds:
(1) according to the structure of circuit board, corresponding silk-screen halftone is produced；With screen printing net plate by low temperature soldering paste (model:
Sn43Pb43Bi14 it) bites in board pads；Circuit board installation diagram 1 is compareed, is mounted component using automatic placement machine
In circuit board respective pad；
(2) Fig. 2 is welded according to Denso, is installed circuit board in the cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad；
On voltage-stabilizing device U15 to be installed and amplifier U3 cavity, coat low temperature soldering paste (model: Sn43Pb43Bi14), with round end spiral shell
Voltage-stabilizing device U15 is mounted on the corresponding position of cavity by M3 plain cushion, spring washer on silk (M2.5 × 6) pad, with cheese head screw (M2 ×
6) upper M2 plain cushion is padded, amplifier U3 is mounted on the corresponding position of cavity by spring washer；
(3) it is then placed in IPC 810N hot air reflux brazier and is welded.
S2: cleaning
(1) circuit board after welding is cleaned using vapour phase cleaning machine, places it in that fill 60 DEG C of ABZOL CEG CLEANER clear
Hot brew 20 ± 1 minutes in the rinse bath of lotion；
(2) it places after taking out and is scrubbed in the culture dish for filling 60 DEG C of dehydrated alcohols, circuit board element surrounding gap uses
Hairbrush carries out brush cleaning 5 ± 1 minutes；
(3) circuit board is placed again and is toasted 5 ± 1 minutes in 50 DEG C of baking oven；After cleaning up, first assembly is obtained.
S3: Denso welding
(1) Fig. 2 is welded according to Denso, isolator U4 is mounted on cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad
On corresponding position, then isolator joints and circuit board lap-joint are connected on circuit board with electric iron fusion weld tin wire bond；
(2) it is intended to 2 according to Denso diagram, partition 9 is mounted on cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 10) pad
On, briquetting 1 and briquetting 2 are pressed on circuit boards at this time；
(3) it is intended to 2 according to Denso diagram, with M2 plain cushion on cheese head screw (M2 × 6) pad, spring washer by sub-miniature A connector 3,4,5(totally 3
It is a) it is mounted on the corresponding position of cavity, then sub-miniature A connector is connected to circuit board lap-joint with electric iron fusion weld tin wire bond
On circuit board；
(4) it is intended to 2 according to Denso diagram, feedthrough capacitor 6,7(totally 2) is screwed into the phase for being mounted on cavity by the screw thread of itself
It answers on position, is then connected to feedthrough capacitor connector and circuit board lap-joint on circuit board with electric iron fusion weld tin wire bond；
(5) it is intended to 2 according to Denso diagram, earthing rod 8(totally 1) is screwed into the corresponding positions for being mounted on cavity by the screw thread of itself
It sets；
S4: debugging
(1) output power is debugged.According to debugging schematic diagram 3, increases capacitance near amplifier U3 in 0.1pF capacitor, make to export
Peak power is in 39.5 ~ 40.4dBm；Region S1, S2, S3 are to adjust amplifier gain, it is proposed that are used 0.1pF (0603), S3 makes
It is superimposed with 2 0.1pF, shadow region is overlapped using 2 0.1pF (0603) in S2, remaining single welding；
(2) passband fluctuation is debugged.According to debugging schematic diagram 3, the knob of potentiometer U7 is adjusted to the end voltage stabilizing chip U15 output end K
Voltage is to 10V, and output power is in 39.5dBm ~ 40dBm or so, and passband fluctuation can be very big at this time, S4, and S5 yellow area is to adjust
It saves used in flatness, using effect: low side can be made to raise after increasing capacitor in the region S4, height can be made after increasing capacitor in the region S5
End reduces, it is proposed that uses 0.1pF(0603), flatness changes 0.1 ~ 0.2dB, and intert and carries out S4, the welding of capacitor in the region S5
(low side and high-end debugging need to carry out simultaneously).
S5: brush three-proofing coating, mark, capping.
(1) according to three-proofing coating Fig. 4, three-proofing coating brush three-proofing coating on circuit boards is dipped with banister brush；Three are dipped with banister brush
Anti- paint coats one layer in product external surfaces, it is every coat to need to be put into product in baking oven after one side carry out baking half an hour, drying
And then carry out the coating of lower one side.
(2) according to product shape Fig. 5, mark is carried out to cover board with laser marking machine, mark parameter are as follows: laser current:
9.0A, laser frequency to 2.445KHz；
(3) cover board installation is fixed on cavity with the sunk screw of M1.6x4；
Compared with prior art, the beneficial effects of the present invention are:
The present invention is by formulating scientific manufacture craft, i.e. the first welding of progress component, during the welding of component,
The manufacture of wire printing plate, component attachment, the installation of voltage-stabilizing device and amplifier are successively carried out in control Denso welding figure, it is most laggard
The welding of row Reflow Soldering completion component.
Then the circuit board by welding is subjected to multiple cleaning and dried, then the circuit board control Denso after having cleaned
Welding figure successively carries out the installation of isolator, partition, connector, feedthrough capacitor, earthing rod, and treated that circuit board exists by such
Carry out output power debugging, passband fluctuation debugging.
The technique that circuit board after having debugged finally successively is carried out to brush three-proofing coating, mark, capping, more by such technique
Add science practical, product qualification rate improves, and provides powerful guarantee for mass production, fabrication processing is simple, more
It is applicable in and produces in enormous quantities.
Detailed description of the invention
Fig. 1 is circuit board installation diagram of the present invention；
Fig. 2 is Denso welding figure of the present invention；
Fig. 3 is present invention debugging schematic diagram；
Fig. 4 is circuit scrubbing brush three-proofing coating schematic diagram of the present invention；
Fig. 5 is product of the present invention outline drawing.
Main mark meaning in attached drawing are as follows: 1- cavity, 2- circuit board, the first SMA-KFD50 radio frequency connector of 3-, 4- second
SMA-KFD50 radio frequency connector, the 3rd SMA-KFD50 radio frequency connector of 5-, the first feedthrough capacitor of 6-, the second feedthrough capacitor of 7-,
8- earthing rod, 9- partition.
Specific embodiment
Below in conjunction with the attached drawing in inventive embodiments, the technical solution in inventive embodiments is carried out clearly and completely
Description, it is clear that described embodiment is only invention a part of the embodiment, instead of all the embodiments.Based in invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
Belong to the range of invention protection.
Embodiment, please refers to Fig. 1-5, and a kind of high-gain amplifier module making processing method includes the following steps: S1 member
Device welding, S2 cleaning, the welding of S3 Denso, S4 debugging, S5 brush three-proofing coating, mark, capping
The welding of S1 component: it i.e. by circuit board fabrication screen printing net plate, and is corresponded to and is bitten in board pads, then compareed
Circuit board installation diagram 1 carry out component attachment, then by welding circuit board in wall, then successively control Denso weld Fig. 1
The installation for carrying out voltage-stabilizing device and amplifier is finally put to reflow soldering and carries out Reflow Soldering；
S2 cleaning: S1 treated circuit board is successively cleaned by 1. vapour phase cleaning machine, 2. equipped with the rinse bath of cleaning agent
It is middle to carry out hot brew, it 3. scrubs, 4. baking procedure carries out the cleaning of circuit board；
The welding of S3 Denso: the circuit board control Denso after cleaning is welded into Fig. 2 and successively carries out 1. isolator, 2. partition, 3. connects
Head, 4. feedthrough capacitor, the 5. installation of earthing rod；
S4 debugging: 1. output power debugging, 2. passband fluctuation debugging are successively carried out according to debugging schematic diagram；
S5 brush three-proofing coating, mark, capping: carrying out three-proofing coating surface to circuit board with banister brush according to three-proofing coating and coat,
Mark is carried out to cover board according still further to product shape figure, cover board installation is fixed on cavity by last sunk screw.
Embodiment please refers to Fig. 1-2, and the S1 component welding includes that S11 screen printing net plate manufactures, the attachment of S12 component
Board pads, S13 component are welded to connect cavity, and S14 is welded using reflow soldering；
The manufacture of S11 screen printing net plate: it is carried out manufacturing corresponding screen printing net plate according to board structure of circuit；
S12 component mounted board pad: low temperature soldering paste (model: Sn43Pb43Bi14) is bitten in circuit with screen printing net plate
On plate pad, then circuit board installation diagram 1 is compareed, component is mounted in circuit board respective pad using automatic placement machine；
S13 component is welded to connect cavity: Fig. 2 is welded according to Denso, it will with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad
Circuit board is installed in the cavity；On voltage-stabilizing device U15 to be installed and amplifier U3 cavity, coating low temperature soldering paste (model:
Sn43Pb43Bi14), voltage-stabilizing device U15 is mounted on the corresponding of cavity with M3 plain cushion, spring washer on cheese head screw (M2.5 × 6) pad
On position, amplifier U3 is mounted on the corresponding position of cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad；
S14 is welded using reflow soldering: i.e. cavity after the completion of step S13 be placed in IPC 810N hot air reflux brazier into
Row welding.Reflow soldering process parameter is as follows:
Embodiment, 1. vapour phase cleaning machine cleans: the circuit board after welding being carried out preliminary cleaning treatment using vapour phase cleaning machine；
2. carrying out hot brew in the rinse bath equipped with cleaning agent: being placed in the circuit board after the cleaning of vapour phase cleaning machine and add
Have and carries out hot brew processing in the rinse bath of cleaning agent.
3. by after step 2. hot brew circuit board take out: be then placed into the culture dish for filling 60 DEG C of dehydrated alcohols into
Row scrub, and circuit board element surrounding gap carries out brush cleaning 5 ± 1 minutes using hairbrush；
4. baking: 3. circuit board that step is obtained is placed in 50 DEG C of baking oven and toasts 5 ± 1 minutes.
Embodiment, it is described 2. equipped with cleaning agent rinse bath in carry out the cleaning agent used described in hot brew be ABZOL
CEG CLEANER, and cleaning agent is first heated to 60 DEG C of effects, then circuit board is added in rinse bath, and carry out hot brew 20
± 1 minute.
Embodiment, referring to FIG. 2, the 1. isolator: Fig. 2 is welded according to Denso, with M2 on cheese head screw (M2 × 6) pad
Isolator U4 is mounted on the corresponding position of cavity by plain cushion, spring washer, then by isolator joints and the electricity consumption of circuit board lap-joint
Soldering iron melting scolding tin wire bond is connected on circuit board；
2. the partition: it is intended to 2 according to Denso diagram, partition 9 is installed with M2 plain cushion, spring washer on cheese head screw (M2 × 10) pad
On cavity, briquetting 1 and briquetting 2 are pressed on circuit boards at this time；
3. the connector: being intended to 2 according to Denso diagram, with M2 plain cushion on cheese head screw (M2 × 6) pad, spring washer by sub-miniature A connector 3,
4,5(totally 3) it is mounted on the corresponding position of cavity, then by sub-miniature A connector and circuit board lap-joint electric iron fusion weld tin
Wire bond is connected on circuit board；
4. the feedthrough capacitor: being intended to 2 according to Denso diagram, and feedthrough capacitor 6,7(totally 2) is screwed peace by the screw thread of itself
On the corresponding position of cavity, then feedthrough capacitor connector is connected to circuit board lap-joint with electric iron fusion weld tin wire bond
On circuit board；
5. the installation of earthing rod: being intended to 2 according to Denso diagram, earthing rod 8(totally 1) is screwed by the screw thread of itself and is mounted on
On the corresponding position of cavity.
Embodiment, referring to FIG. 3, S4 debugging includes 1. output power debugging and 2. passband fluctuation is debugged；
1. the output power debugging: according to debugging schematic diagram 3, increase capacitance near amplifier U3 in 0.1pF capacitor, make
Peak power is exported in 39.5 ~ 40.4dBm；Region S1, S2, S3 are to adjust amplifier gain, it is proposed that it uses 0.1pF (0603),
S3 is superimposed using 2 0.1pF, and shadow region is overlapped using 2 0.1pF (0603) in S2, remaining single welding；
2. passband fluctuation debugging: according to debugging schematic diagram 3, the knob of potentiometer U7 is adjusted to voltage stabilizing chip U15 output end K
Hold voltage to 10V, output power is in 39.5dBm ~ 40dBm or so, and passband fluctuation can be very big at this time, S4, and S5 yellow area is
It adjusts used in flatness, using effect: low side can be made to raise after increasing capacitor in the region S4, can make after increasing capacitor in the region S5
High-end reduction, it is proposed that use 0.1pF(0603), flatness changes 0.1 ~ 0.2dB, and intert and carries out S4, the weldering of capacitor in the region S5
It connects.
Embodiment, referring to FIG. 3, the 2. passband fluctuation debugging process low and middle-end and high-end debugging need simultaneously into
Row.
Embodiment please refers to Fig. 4-5, and the S5 brush three-proofing coating, mark, capping include that 1. 3. brush three-proofing coating, 2. mark are sealed
Lid;
1. the brush three-proofing coating: according to three-proofing coating Fig. 4, three-proofing coating brush three-proofing coating on circuit boards is dipped with banister brush；Use fur
Brush dips three-proofing coating and coats one layer in product external surfaces, it is every coat need for product to be put into baking oven after one side carry out toasting half it is small
When, dry and then carry out the coating of lower one side；
2. according to product shape Fig. 5, mark the mark: is carried out to cover board with laser marking machine；
It is described 3. to cover: cover board installation being fixed on cavity with the sunk screw of M1.6x4.
Embodiment, referring to FIG. 5, mark parameter during the 2. mark are as follows: laser current: 9.0A, laser frequency is extremely
2.445KHz。
In summary: after using above-mentioned production method, the manufacture craft of product of the present invention is more scientific practical, and product closes
Lattice rate significantly improves, and as mass production provides powerful guarantee, while fabrication processing is simple, and being applicable in more is large quantities of
Amount production.
While there has been shown and described that the embodiment invented, for the ordinary skill in the art, Ke Yili
Solution can carry out a variety of variations, modification, replacement to these embodiments in the case where not departing from the principle and spirit of invention and become
The range of type, invention is defined by the appended claims and the equivalents thereof.
Claims (9)
1. a kind of high-gain amplifier module making processing method, which comprises the steps of: the welding of S1 component,
S2 cleaning, the welding of S3 Denso, S4 debugging, S5 brush three-proofing coating, mark, capping；
The welding of S1 component: it i.e. by circuit board fabrication screen printing net plate, and is corresponded to and is bitten in board pads, then compareed
Circuit board installation diagram 1 carry out component attachment, then by welding circuit board in wall, then successively control Denso weld Fig. 1
The installation for carrying out voltage-stabilizing device and amplifier is finally put to reflow soldering and carries out Reflow Soldering；
S2 cleaning: S1 treated circuit board is successively cleaned by 1. vapour phase cleaning machine, 2. equipped with the rinse bath of cleaning agent
It is middle to carry out hot brew, it 3. scrubs, 4. baking procedure carries out the cleaning of circuit board；
The welding of S3 Denso: the circuit board control Denso after cleaning is welded into Fig. 2 and successively carries out 1. isolator, 2. partition, 3. connects
Head, 4. feedthrough capacitor, the 5. installation of earthing rod；
S4 debugging: 1. output power debugging, 2. passband fluctuation debugging are successively carried out according to debugging schematic diagram；
S5 brush three-proofing coating, mark, capping: carrying out three-proofing coating surface to circuit board with banister brush according to three-proofing coating and coat,
Mark is carried out to cover board according still further to product shape figure, cover board installation is fixed on cavity by last sunk screw.
2. a kind of high-gain amplifier module making processing method according to claim 1, it is characterised in that: the S1 member
Device welding includes that S11 screen printing net plate manufactures, and S12 component mounted board pad, S13 component is welded to connect cavity, S14
It is welded using reflow soldering；
The manufacture of S11 screen printing net plate: it is carried out manufacturing corresponding screen printing net plate according to board structure of circuit；
S12 component mounted board pad: low temperature soldering paste (model: Sn43Pb43Bi14) is bitten in circuit with screen printing net plate
On plate pad, then circuit board installation diagram 1 is compareed, component is mounted in circuit board respective pad using automatic placement machine；
S13 component is welded to connect cavity: Fig. 2 is welded according to Denso, it will with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad
Circuit board is installed in the cavity；On voltage-stabilizing device U15 to be installed and amplifier U3 cavity, coating low temperature soldering paste (model:
Sn43Pb43Bi14), voltage-stabilizing device U15 is mounted on the corresponding of cavity with M3 plain cushion, spring washer on cheese head screw (M2.5 × 6) pad
On position, amplifier U3 is mounted on the corresponding position of cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad；
S14 is welded using reflow soldering: i.e. cavity after the completion of step S13 be placed in IPC 810N hot air reflux brazier into
Row welding.
3. a kind of high-gain amplifier module making processing method according to claim 1, it is characterised in that: 1. vapour phase is clear
Washing machine cleaning: the circuit board after welding is subjected to preliminary cleaning treatment using vapour phase cleaning machine；
2. carrying out hot brew in the rinse bath equipped with cleaning agent: being placed in the circuit board after the cleaning of vapour phase cleaning machine and add
Have and carries out hot brew processing in the rinse bath of cleaning agent；
3. the circuit board after step 2. hot brew is taken out: being then placed into the culture dish for filling 60 DEG C of dehydrated alcohols and brush
It washes, and circuit board element surrounding gap carries out brush cleaning 5 ± 1 minutes using hairbrush；
4. baking: 3. circuit board that step is obtained is placed in 50 DEG C of baking oven and toasts 5 ± 1 minutes.
4. a kind of high-gain amplifier module making processing method according to claim 3, it is characterised in that: described 2. to fill
Having the cleaning agent for carrying out using described in hot brew in the rinse bath of cleaning agent is ABZOL CEG CLEANER, and first will cleaning
Agent is heated to 60 DEG C of effects, then circuit board is added in rinse bath, and carry out hot brew 20 ± 1 minutes.
5. a kind of high-gain amplifier module making processing method according to claim 1, it is characterised in that: it is described 1. every
From device: welding Fig. 2 according to Denso, isolator U4 is mounted on to the phase of cavity with M2 plain cushion, spring washer on cheese head screw (M2 × 6) pad
It answers on position, is then connected to isolator joints and circuit board lap-joint on circuit board with electric iron fusion weld tin wire bond；
2. the partition: it is intended to 2 according to Denso diagram, partition 9 is installed with M2 plain cushion, spring washer on cheese head screw (M2 × 10) pad
On cavity, briquetting 1 and briquetting 2 are pressed on circuit boards at this time；
3. the connector: being intended to 2 according to Denso diagram, with M2 plain cushion on cheese head screw (M2 × 6) pad, spring washer by sub-miniature A connector 3,
4,5(totally 3) it is mounted on the corresponding position of cavity, then by sub-miniature A connector and circuit board lap-joint electric iron fusion weld tin
Wire bond is connected on circuit board；
4. the feedthrough capacitor: being intended to 2 according to Denso diagram, and feedthrough capacitor 6,7(totally 2) is screwed peace by the screw thread of itself
On the corresponding position of cavity, then feedthrough capacitor connector is connected to circuit board lap-joint with electric iron fusion weld tin wire bond
On circuit board；
5. the installation of earthing rod: being intended to 2 according to Denso diagram, earthing rod 8(totally 1) is screwed by the screw thread of itself and is mounted on
On the corresponding position of cavity.
6. a kind of high-gain amplifier module making processing method according to claim 1, it is characterised in that: the S4 tune
Examination includes 1. output power debugging and 2. passband fluctuation is debugged；
1. the output power debugging: according to debugging schematic diagram 3, increase capacitance near amplifier U3 in 0.1pF capacitor, make
Peak power is exported in 39.5 ~ 40.4dBm；Region S1, S2, S3 are to adjust amplifier gain, it is proposed that it uses 0.1pF (0603),
S3 is superimposed using 2 0.1pF, and shadow region is overlapped using 2 0.1pF (0603) in S2, remaining single welding；
2. passband fluctuation debugging: according to debugging schematic diagram 3, the knob of potentiometer U7 is adjusted to voltage stabilizing chip U15 output end K
Hold voltage to 10V, output power is in 39.5dBm ~ 40dBm or so, and passband fluctuation can be very big at this time, S4, and S5 yellow area is
It adjusts used in flatness, using effect: low side can be made to raise after increasing capacitor in the region S4, can make after increasing capacitor in the region S5
High-end reduction, it is proposed that use 0.1pF(0603), flatness changes 0.1 ~ 0.2dB, and intert and carries out S4, the weldering of capacitor in the region S5
It connects.
7. a kind of high-gain amplifier module making processing method according to claim 6, it is characterised in that: the 2. band
Interior fluctuation debugging process low and middle-end and high-end debugging are needed while being carried out.
8. a kind of high-gain amplifier module making processing method according to claim 1, it is characterised in that: the S5 brush
Three-proofing coating, mark, capping include that 1. 3. brush three-proofing coating, 2. mark cover；
1. the brush three-proofing coating: according to three-proofing coating Fig. 4, three-proofing coating brush three-proofing coating on circuit boards is dipped with banister brush；Use fur
Brush dips three-proofing coating and coats one layer in product external surfaces, it is every coat need for product to be put into baking oven after one side carry out toasting half it is small
When, dry and then carry out the coating of lower one side；
2. according to product shape Fig. 5, mark the mark: is carried out to cover board with laser marking machine；
It is described 3. to cover: cover board installation being fixed on cavity with the sunk screw of M1.6x4.
9. a kind of high-gain amplifier module making processing method according to claim 8, it is characterised in that: described 2. to beat
Mark parameter during mark are as follows: laser current: 9.0A, laser frequency to 2.445KHz.
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Application publication date: 20190412 |