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CN109616421A - A kind of intelligent power module processing method and intelligent power module - Google Patents

A kind of intelligent power module processing method and intelligent power module Download PDF

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Publication number
CN109616421A
CN109616421A CN201811388473.8A CN201811388473A CN109616421A CN 109616421 A CN109616421 A CN 109616421A CN 201811388473 A CN201811388473 A CN 201811388473A CN 109616421 A CN109616421 A CN 109616421A
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China
Prior art keywords
power module
finished product
semi
intelligent power
coupling agent
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CN201811388473.8A
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Inventor
史哲豪
胡智裕
王琇如
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Great Team Backend Foundry Dongguan Co Ltd
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Great Team Backend Foundry Dongguan Co Ltd
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Priority to CN201811388473.8A priority Critical patent/CN109616421A/en
Publication of CN109616421A publication Critical patent/CN109616421A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention discloses an intelligent power module processing method, which comprises the following steps: step S1, preparing a coating material, wherein the coating is a diamino silane coupling agent; step S2, providing a power module semi-finished product, and carrying out core loading and routing on the lead frame to form a power module semi-finished product to be packaged; step S3, coating adhesion, wherein the diamino silane coupling agent is arranged on the packaging surface of the semi-finished product of the power module to be packaged; and step S4, packaging, namely packaging the semi-finished product of the power module to be packaged by adopting packaging resin. In the scheme, the diamino silane coupling agent coating is added on the semi-finished product of the power module, so that 4-5kgf/cm can be added2The adhesive force makes the lead frame and the chip and the packaging resin not easy to generate layering phenomenon, thereby improving the reliability and quality of the product.

Description

A kind of intelligent power module processing method and intelligent power module
Technical field
It is processed the present invention relates to semiconductor field more particularly to a kind of intelligent power module processing method and using this method The intelligent power module of formation.
Background technique
IPM (Intelligent Power Module), i.e. intelligent power module, not only device for power switching and driving Circuit integration is together.But also it has been internally integrated overvoltage, the fault detection circuits such as overcurrent and overheat, and letter can be will test Number it is sent to CPU.It is made of the gate drive circuit and fast protection circuit of the tube core of high-speed low-power-consumption and optimization.Even if hair Raw load accident situation or improper use, it is also ensured that IPM itself is not damaged.IPM generally uses IGBT as power switch member Part is internally integrated the integrated morphology of current sensor and driving circuit.IPM is easy to use to win increasingly with its high reliability Big market is particularly suitable for the frequency converter and various inverters of driving motor, is frequency control, metallurgical machinery, and electric power is led Draw, servo-drive, the ideal power electronic devices of one kind of frequency-conversion domestic electric appliances.
In the prior art intelligent power module product due to the cohesive force between encapsulating material and lead frame it is poor, passing through Lamination can occur between reliability test post package resin and lead frame.
Summary of the invention
The purpose of the embodiment of the present invention is: providing a kind of intelligent power module processing method, is able to solve existing skill Above-mentioned technical problem present in art.
In order to achieve the above object, the invention adopts the following technical scheme:
A kind of intelligent power module processing method is provided, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
As a kind of optimal technical scheme of the intelligent power module processing method, the diamino silanes coupling agent Using:
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane；
Or, N-2- (aminoethyl) -3- aminopropyltriethoxy dimethoxysilane；
Or, N-2- (aminoethyl) -3- aminopropyl trimethoxysilane.
As a kind of optimal technical scheme of the intelligent power module processing method, the step S1 coating material Preparation includes:
Step S11,5 parts -10 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 15-45 minutes.
As a kind of optimal technical scheme of the intelligent power module processing method, the step S2 and step S3 it Between further include:
Step S21, it cleans: plasma-based cleaning operation is carried out to the power module semi-finished product.
As a kind of optimal technical scheme of the intelligent power module processing method, the step S3 coating attachment tool Body are as follows: by the infiltration of power module semi-finished product 1-5 minutes in the diamino silanes coupling agent.
As a kind of optimal technical scheme of the intelligent power module processing method, the step S3 coating attachment tool Body are as follows: the diamino silanes coupling agent is coated on to the package surface of the power module semi-finished product.
As a kind of optimal technical scheme of the intelligent power module processing method, the step S3 further include:
Step S31, it dries, is toasted to the power module semi-finished product after coating adheres to are completed.
As a kind of optimal technical scheme of the intelligent power module processing method, the temperature of the baking is 120- Between 130 DEG C.
As a kind of optimal technical scheme of the intelligent power module processing method, the time of the baking is 1-5 Minute.
On the other hand, a kind of intelligent power module is provided, intelligent power module processing method as described above is used to add Work forms.
The invention has the benefit that by increasing diamino silanes coupling agent on power module semi-finished product in this programme Coating can increase 4-5kgf/cm2Bonding force, so that being not susceptible to be layered between lead frame and chip and potting resin Phenomenon, therefore production reliability and product quality can be improved.
Detailed description of the invention
The present invention will be further described in detail below based on the drawings and embodiments.
Fig. 1 is intelligent power module processing method flow chart described in the embodiment of the present invention.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below It will the technical scheme of the embodiment of the invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those skilled in the art exist Every other embodiment obtained under the premise of creative work is not made, shall fall within the protection scope of the present invention.
In the description of the present invention unless specifically defined or limited otherwise, term " connected " should make broad sense ", " fixation " It shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or is integral；It can be mechanical connection, It is also possible to be electrically connected；It can be directly connected, can also can be inside two elements indirectly connected through an intermediary The interaction relationship of connection or two elements.For the ordinary skill in the art, on being understood with concrete condition State the concrete meaning of term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower" It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above " Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of First feature horizontal height is less than second feature.
Embodiment one:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
By increasing diamino silanes coupling agent coating on power module semi-finished product in this programme, 4- can be increased 5kgf/cm2Bonding force so that being not susceptible to lamination between lead frame and chip and potting resin, therefore can mention High product reliability and product quality.
Embodiment two:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent uses:
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane；
It is prepared by the step S1 coating material
Step S11,5 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 15 minutes.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Embodiment three:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent uses:
N-2- (aminoethyl) -3- ammonia octyl trimethyl oxysilane；
It is prepared by the step S1 coating material
Step S11,7 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 30 minutes.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Example IV:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent uses:
N-2- (aminoethyl) -3- aminopropyl trimethoxysilane.
It is prepared by the step S1 coating material
Step S11,10 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 45 minutes.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Embodiment five:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent can use:
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane；
Or, N-2- (aminoethyl) -3- aminopropyltriethoxy dimethoxysilane；
Or, N-2- (aminoethyl) -3- aminopropyl trimethoxysilane；
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane is used in the present embodiment.
It is prepared by the step S1 coating material
Step S11,5 parts -10 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Preferably, 5 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water in the present embodiment；
Step S12, it stirs 15-45 minutes；
Preferably, it is stirred 30 minutes in the present embodiment.
Further, between the step S2 and step S3 further include:
Step S21, it cleans: plasma-based cleaning operation is carried out to the power module semi-finished product.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Embodiment six:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The step S3 coating attachment specifically: by the infiltration of power module semi-finished product in the diamino silanes coupling agent 1-5 minutes.
Preferably, power module semi-finished product are infiltrated 3 minutes in the diamino silanes coupling agent in the present embodiment.
Specifically, the step S3 further include:
Step S31, it dries, is toasted to the power module semi-finished product after coating adheres to are completed.
The temperature of the baking is between 120-130 DEG C.
Preferably, the temperature of baking described in the present embodiment is 125 DEG C.
The time of the baking is 1-5 minutes.
Preferably, the time of the baking is 3 minutes.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Embodiment seven:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent can be used:
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane；
Or, N-2- (aminoethyl) -3- aminopropyltriethoxy dimethoxysilane；
Or, N-2- (aminoethyl) -3- aminopropyl trimethoxysilane.
The specific diamino silanes coupling agent described in the present embodiment uses N-2- (aminoethyl) -3- aminopropyltriethoxy diformazan Oxysilane；
It is prepared by the step S1 coating material
Step S11,10 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 45 minutes.
Between the step S2 and step S3 further include:
Step S21, it cleans: plasma-based cleaning operation is carried out to the power module semi-finished product.
The step S3 coating attachment specifically: by the infiltration of power module semi-finished product in the diamino silanes coupling agent 5 minutes.
The step S3 further include:
Step S31, it dries, is toasted to the power module semi-finished product after coating adheres to are completed.
The temperature of the baking is 130 DEG C.
The time of the baking is 5 minutes.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
Embodiment eight:
As shown in Figure 1, the present embodiment provides a kind of intelligent power module processing methods, comprising the following steps:
Step S1, prepared by coating material, and the coating is diamino silanes coupling agent；
Step S2, provide power module semi-finished product, in carry out upper core on lead frame, routing forms power module to be packaged Semi-finished product；
Step S3, coating adheres to, and the diamino silicon is arranged in the package surface of the power module semi-finished product to be packaged Alkane coupling agent；
Step S4, it encapsulates, the power module semi-finished product to be packaged is packaged using potting resin.
The diamino silanes coupling agent uses:
N-2- (aminoethyl) -8- ammonia octyl trimethyl oxysilane；
Or, N-2- (aminoethyl) -8- aminopropyltriethoxy dimethoxysilane；
Or, N-2- (aminoethyl) -8- aminopropyl trimethoxysilane.
The specific diamino silanes coupling agent described in the present embodiment uses N-2- (aminoethyl) -3- aminopropyltriethoxy diformazan Oxysilane；
It is prepared by the step S1 coating material
Step S11,5 parts of diamino silanes coupling agent is dissolved in 1000 parts of deionized water；
Step S12, it stirs 15 minutes.
Between the step S2 and step S3 further include:
Step S21, it cleans: plasma-based cleaning operation is carried out to the power module semi-finished product.
Step S3 coating attachment specifically: by the diamino silanes coupling agent be coated on the power module half at The package surface of product.
The step S3 further include:
Step S31, it dries, is toasted to the power module semi-finished product after coating adheres to are completed.
The temperature of the baking is 120 DEG C.
The time of the baking is 1 minute.
Meanwhile a kind of intelligent power module being also provided in the present embodiment, it is processed using intelligent power module as described above Method is process.
In the description of this article, it is to be understood that term " on ", "lower", " right side ", etc. orientation or positional relationships be based on Orientation or positional relationship shown in the drawings is merely for convenience of description and simplification and operates, rather than the dress of indication or suggestion meaning It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to limit of the invention System.In addition, term " first ", " second ", are only used to distinguish between description, have no special meaning.
In the description of this specification, the description of reference term " embodiment ", " example " etc. means to combine the embodiment Or example particular features, structures, materials, or characteristics described are included at least one embodiment or example of the invention.? In this specification, schematic expression of the above terms be may not refer to the same embodiment or example.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the embodiments can also be appropriately combined, and forming those skilled in the art can With the other embodiments of understanding.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within Within protection scope of the present invention.

Claims (10)

1.一种智能功率模块加工方法，其特征在于，包括以下步骤：1. A method for processing an intelligent power module, comprising the following steps: 步骤S1、涂层材料制备，所述涂层为二氨基硅烷偶联剂；Step S1, preparation of coating material, the coating is a diaminosilane coupling agent; 步骤S2、提供功率模块半成品，于引线框架上进行上芯、打线形成待封装功率模块半成品；Step S2, providing the semi-finished product of the power module, performing core loading and wire bonding on the lead frame to form the semi-finished product of the power module to be packaged; 步骤S3、涂层附着，于所述待封装功率模块半成品的封装表面设置所述二氨基硅烷偶联剂；Step S3, the coating is attached, and the diaminosilane coupling agent is provided on the packaging surface of the semi-finished product of the power module to be packaged; 步骤S4、封装，采用封装树脂对所述待封装功率模块半成品进行封装。Step S4, encapsulating, using encapsulation resin to encapsulate the semi-finished product of the power module to be encapsulated. 2.根据权利要求1所述的智能功率模块加工方法，其特征在于，所述二氨基硅烷偶联剂采用：2. The method for processing an intelligent power module according to claim 1, wherein the diaminosilane coupling agent adopts: N-2-(氨乙基)-8-氨辛基三甲基氧基硅烷；N-2-(aminoethyl)-8-aminooctyltrimethyloxysilane; 或，N-2-(氨乙基)-3-氨丙基甲基二甲氧基硅烷；Or, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane; 或，N-2-(氨乙基)-3-氨丙基三甲氧基硅烷。Or, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane. 3.根据权利要求1-2中任一项所述的智能功率模块加工方法，其特征在于，所述步骤S1中涂层材料制备包括：3. The method for processing an intelligent power module according to any one of claims 1-2, wherein the preparation of the coating material in the step S1 comprises: 步骤S11、将5份-10份的二氨基硅烷偶联剂溶于1000份的去离子水中；Step S11, dissolving 5 parts to 10 parts of the diaminosilane coupling agent in 1000 parts of deionized water; 步骤S12、搅拌15-45分钟。Step S12, stirring for 15-45 minutes. 4.根据权利要求1-3中任一项所述的智能功率模块加工方法，其特征在于，所述步骤S2与步骤S3之间还包括：4. The method for processing an intelligent power module according to any one of claims 1-3, wherein the step between the step S2 and the step S3 further comprises: 步骤S21、清洗：对所述功率模块半成品进行电浆清洗操作。Step S21, cleaning: performing a plasma cleaning operation on the semi-finished product of the power module. 5.根据权利要求1-4中任一项所述的智能功率模块加工方法，其特征在于，所述步骤S3涂层附着具体为：将功率模块半成品浸润在所述二氨基硅烷偶联剂中1-5分钟。5. The method for processing an intelligent power module according to any one of claims 1-4, wherein the step S3 coating attachment is specifically: soaking the semi-finished product of the power module in the diaminosilane coupling agent 1-5 minutes. 6.根据权利要求1-4中任一项所述的智能功率模块加工方法，其特征在于，所述步骤S3涂层附着具体为：将所述二氨基硅烷偶联剂涂布在所述功率模块半成品的封装表面。6. The method for processing an intelligent power module according to any one of claims 1-4, wherein the step S3 coating attachment is specifically: coating the diaminosilane coupling agent on the power The encapsulation surface of the module semi-finished product. 7.根据权利要求5或6所述的智能功率模块加工方法，其特征在于，所述步骤S3还包括：7. The method for processing an intelligent power module according to claim 5 or 6, wherein the step S3 further comprises: 步骤S31、烘干，对完成涂层附着后的功率模块半成品进行烘烤。Step S31 , drying, and baking the semi-finished product of the power module after the coating is attached. 8.根据权利要求7所述的智能功率模块加工方法，其特征在于，所述烘烤的温度为120-130℃之间。8 . The method for processing an intelligent power module according to claim 7 , wherein the baking temperature is between 120-130° C. 9 . 9.根据权利要求8所述的智能功率模块加工方法，其特征在于，所述烘烤的时间为1-5分钟。9 . The method for processing an intelligent power module according to claim 8 , wherein the baking time is 1-5 minutes. 10 . 10.一种智能功率模块，其特征在于，采用权利要求1-9中任一项所述的智能功率模块加工方法加工而成。10. An intelligent power module, characterized in that, it is processed by the intelligent power module processing method according to any one of claims 1-9.
CN201811388473.8A 2018-11-21 2018-11-21 A kind of intelligent power module processing method and intelligent power module Pending CN109616421A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
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CN102354670A (en) * 2011-10-13 2012-02-15 无锡世一电力机械设备有限公司 Comprehensive surface processing method for improving capsulation reliability of semiconductor
CN102412166A (en) * 2011-10-13 2012-04-11 无锡世一电力机械设备有限公司 Surface nano-film processing method before plastic package of semiconductor package

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1089213A (en) * 1988-12-23 1994-07-13 B.F.谷德里奇公司 The polynorbornene prepreg is laminated to the laminate on the conductive surface
CN1224327A (en) * 1997-08-06 1999-07-28 古尔德电子有限公司 Adhesion enhancement for metal foil
CN1245837A (en) * 1998-08-21 2000-03-01 古尔德电子有限公司 Metal foil with raised bonding capacity for base and its manufacturing method
CN101173159A (en) * 2006-11-02 2008-05-07 比亚迪股份有限公司 A kind of epoxy resin packaging material composition
CN102354670A (en) * 2011-10-13 2012-02-15 无锡世一电力机械设备有限公司 Comprehensive surface processing method for improving capsulation reliability of semiconductor
CN102412166A (en) * 2011-10-13 2012-04-11 无锡世一电力机械设备有限公司 Surface nano-film processing method before plastic package of semiconductor package

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