CN109599481A - DFPN ties double water conservancy diversion refrigerators and its cabinet - Google Patents
DFPN ties double water conservancy diversion refrigerators and its cabinet Download PDFInfo
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- CN109599481A CN109599481A CN201811610212.6A CN201811610212A CN109599481A CN 109599481 A CN109599481 A CN 109599481A CN 201811610212 A CN201811610212 A CN 201811610212A CN 109599481 A CN109599481 A CN 109599481A
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- 239000001301 oxygen Substances 0.000 claims description 11
- -1 polysiloxane Polymers 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 8
- 239000005864 Sulphur Substances 0.000 claims description 8
- 229910052787 antimony Inorganic materials 0.000 claims description 8
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 229910052573 porcelain Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052785 arsenic Inorganic materials 0.000 claims description 7
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 238000004378 air conditioning Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
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- PZZYQPZGQPZBDN-UHFFFAOYSA-N aluminium silicate Chemical compound O=[Al]O[Si](=O)O[Al]=O PZZYQPZGQPZBDN-UHFFFAOYSA-N 0.000 description 4
- 229910000323 aluminium silicate Inorganic materials 0.000 description 4
- 235000012211 aluminium silicate Nutrition 0.000 description 4
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000002457 bidirectional effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
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- 206010063385 Intellectualisation Diseases 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to electrical equipment fields, it discloses DFPN and ties double water conservancy diversion refrigerators, including thermoelectric couple to (1), thermoelectric couple passes through flow deflector (2) to the two sides of (1) respectively and is fixed with hot end tile (3) and cold end tile (4), the side of hot end tile (3) is fixedly connected with flow deflector (2), the other side of hot end tile (3) is fixed with the first radiator (5), the side of cold end tile (4) is fixedly connected with flow deflector (2), the other side of cold end tile (4) is fixed with the second radiator (6), it is further fixed on the cold conduction cooling part (7) of storage, it is coupled between hot end tile (3) and the first radiator (5) by liquid silica gel.Refrigerator of the present invention can replace discrete heating, refrigeration system；The temperature difference range of refrigerator from 90 DEG C-it is 130 DEG C subzero, using two-region be isolated method make cooling and heating type improved efficiency 15%-20%, using mineral it is thermally conductive sliding silica gel can be reduced 90% or more failure rate.
Description
Technical field
The present invention relates to electrical equipment fields more particularly to DFPN to tie double water conservancy diversion refrigerators and its cabinet.
Background technique
Energy-saving and emission-reduction become the hot spot of the concern of country, the same weight of energy-saving and emission-reduction work of electric power and telecommunications industry IT industry again
It is same urgent, the task of energy-saving and emission-reduction will be made to implement to links, the concept of environmental protection and technology is made to extend to electric power electricity
The entire industry chain of letter.Therefore our independent researches first DFPN of China ties bidirectional guide intelligence refrigerator model machine.It is thorough
Bottom changes the mode of current refrigerator, ties bidirectional guide intelligence refrigerator technology using DFPN, can not only save a large amount of
Electric power, and effectively avoid pollution discharge and ambient noise.The refrigerator height by international and domestic numerous colleagues at present
Concern.
DFPN ties bidirectional guide refrigerator, just refers to using semiconductor electronic chip as refrigeration unit, is dissipated by recycling
The refrigerating and heating combined equipment that hot systems are set up can satisfy the use such as production, life, cabinet, cabinet, make air themperature in certain model
Enclose adjustable electronic device.It being compared with common air-conditioning, DFPN ties intelligent refrigerator compressor-free, without refrigerant, no mechanical noise,
Realize environment protecting and power-saving emission reduction truly.Traditional air conditioner carries out mechanical refrigeration by compressor, needs addition
Length of schooling cryogen --- freon, the molecular state by changing freon reach heat absorption and exothermic purpose, once fluorine benefit occurs
High leakage, will seriously destroy atmospheric environment.And DFPN knot refrigerator uses electronic cooling mode, does not need compressor and fluorine benefit
It is high, therefore avoid and pollute the environment.
Since PN junction electronic refrigerator does not have mechanical movement, because without generating additional energy consumption and noise.Through calculating；
The energy consumption that DFPN ties electronic refrigerator is only the 1/5 of existing refrigeration modes.The refrigeration efficiency ratio of PN junction electronic refrigerator can be with
The variation of ambient temperature and change.If outdoor temperature on daytime is 35 DEG C, the Energy Efficiency Ratio of semiconductor intelligent air condition is 2.7, then
When to evening outdoor temperature being 32 DEG C, the Energy Efficiency Ratio of semiconductor intelligent air condition then reaches 5.4, and Energy Efficiency Ratio is bigger, the electricity of saving
It can be more.And the Energy Efficiency Ratio of Ordinary Compression air conditioner be it is fixed, arbitrarily cannot control and change.So with Ordinary Compression
Air conditioner is compared, and PN junction electronic refrigerator can effectively realize energy-saving and emission-reduction.
In terms of human oriented design, PN junction electronic refrigerator also shows that its own advantage.It realizes digital intellectualization
Constant temperature and humidity accurately controls, and relative humidity controls between 55% to 65%, not the dry sensation of traditional air conditioner, and human body sensory is more
It is comfortable.In addition, PN junction electronic refrigerator install it is also very convenient, only need to general pvc pipe by main and auxiliaries into
Row connection, enormously simplifies installation process, has saved cost.
China is the first in the world air-conditioning big producer, and annual output is about 50,000,000, the 2/3 of Zhan Quanqiu total amount.Meanwhile I
The second big country of state or world power consumption, 30% or so of the China air conditioning energy consumption Yi Zhan city energy consumption, summer is in some cities
It has been even more than 50%.If the average efficiency of every air-conditioning improves 20%, the air-conditioning newly bought every year can be saved for country
6,000,000,000 kilowatt hour of electric energy.PN junction electronic refrigerator not only reduces cost, and greatly as a kind of completely new technical solution
Reduce the exploitation of fuel source and the discharge of carbon dioxide, effectively inhibits the aggravation of greenhouse effects, be conducive to environmental protection.
It is estimated that the electricity saved is equivalent to Three Gorges water power within 1 year if all changing the air-conditioning in the whole nation into semiconductor intelligent air condition
It stands 2.5 times of generated energy.
PN junction electronic refrigerator technology is only answered because of low efficiency, complex manufacturing technology and the reasons such as at high cost all the time
For high-tech areas such as space flight, military project, scientific researches.And We conducted high-end technology optimization designs, realize the double of DFPN knot
The reliability that equipment is improved to water conservancy diversion refrigerator technology has or has surmounted the economy of conventional compression air conditioner, comfort
And practicability, it is green product, represents the developing direction of energy saving Refrigeration Technique from now on.
Application number CN201510312007.1 is patent of invention, discloses a kind of autonomous type semiconductor refrigerating cabinet and its control
Method processed, system include energy-storage system, semiconductor refrigeration system and control system；Energy-storage system include solar photovoltaic assembly and
Battery；Semiconductor refrigeration system includes circulating fan, cold end substrate, cold end flow guide bar, conducting element, hot end flow guide bar and heat
End group plate；Control system includes photosensitive element, temperature sensor and controller.Invention directly utilizes sun power generation driving semiconductor
Refrigeration system operation greatly reduces the energy consumption for cooling of outdoor cabinet without consuming alternating current refrigeration；It can be answered simultaneously to be provided when having a power failure
The warm standby that plunges cold source, keeps the stability of system higher.But it is to pacify that semiconductor refrigeration system, which is installed on cabinet body side,
It is application of the conventional semiconductor refrigeration system on cabinet, due to can also in refrigeration system and cabinet outside cabinet shell
Heat exchange occurs, refrigeration effect is low, waste of energy；In the cold and hot exchange of refrigerator, expand with heat and contract with cold, heat-conducting effect is bad
In the case of, the flexible of thermoelectric couple pair is influenced by other component, affects refrigerator service life.
In addition the cold conduction cooling part material of the storage of prior art semiconductor refrigeration system is common metal piece, the effect of thermal conductivity
Generally, make thermally conductive refrigerating efficiency not high, it is therefore desirable to which a kind of effect of the cold conduction cooling part material of raising storage, thermoelectric couple are free to energy
Flexible, the better DFPN of integrally cooling effect ties double water conservancy diversion refrigerators.
Summary of the invention
The present invention is unable to the not high disadvantage of free extension, thermally conductive refrigerating efficiency for refrigerator in the prior art, provides
DFPN ties double water conservancy diversion refrigerators and its cabinet.
In order to solve the above-mentioned technical problem, the present invention is addressed by following technical proposals:
DFPN ties double water conservancy diversion refrigerators, including thermoelectric couple pair, the two sides of thermoelectric couple pair are fixed by flow deflector respectively
There are hot end tile and cold end tile, the side of hot end tile is fixedly connected with flow deflector, and the other side of hot end tile is fixed with
The side of one radiator, cold end tile is fixedly connected with flow deflector, and the other side of cold end tile is fixed with the second radiator, cold end
It is further fixed on the cold conduction cooling part of storage between tile and the second radiator, is joined between hot end tile and the first radiator by liquid silica gel
Knot.It is very small that DFPN ties double water conservancy diversion refrigerator thermal inertias, the cooling and warming time quickly, in the feelings of the good cold end zero load of hot-side heat dissipation
Under condition, as soon as being powered less than minute, cooling piece can reach maximum temperature difference.Reversed use of DFPN cooling piece is exactly thermo-electric generation,
Semiconductor chilling plate applies in general to middle low-temperature space power generation.
Preferably, by mass percentage, mineral liquid silica gel includes following component:
Preferably, mineral porcelain powder mixture is the mixture of aluminium silicate mineral matter powder and ceramic powders, poly- silicon oxygen
Alkane mixture is organopolysiloxane, a variety of mixtures in diorganopolysiloxaneand；Drying retardant is oiliness drying retardant.Using
The thermally conductive sliding silica gel of mineral can be reduced 90% or more failure rate.Polysiloxane mixture is a variety of organopolysiloxanes composition
The organopolysiloxane and one kind of the mixture or one or more of mixture or a variety of diorganopolysiloxaneands composition
Or the mixture of more than one diorganopolysiloxaneand composition.
The mineral liquid silica gel that has been used in combination between hot end tile and radiator is coupled, the main work of mineral liquid silica gel
With being to keep refrigerator capable of expansion and contraction, present invention adds nonmetallic mineral Heat Conduction Materials, improve the rate of heat dispation of liquid silica gel,
To making mineral liquid silica gel in the cold and hot exchange of refrigerator, the thermoelectric couple that expands with heat and contract with cold to free extension all around not
It is impacted, substantially prolong refrigerator service life.
Preferably, by mass percentage, storing up cold conduction cooling part material includes following element composition: copper 99.90%-
99.94%, silver 0.04%-0.09%, phosphorus 0-0.003%, bismuth 0-0.002%, antimony 0-0.004%, arsenic 0-0.004%, iron
0.004%-0.006%, nickel 0-0.006%, lead 0.004%-0.006%, sulphur 0.004%-0.006%, tin 0-0.006%,
Zinc 0-0.006%, oxygen 0%-0.006%.The purity is high of cold conduction cooling part material is stored up, tissue is fine and closely woven, and oxygen content is extremely low, pore-free,
It is trachoma, loose, store up cold conduction cooling part as a kind of quick-cooling, heating transmitting medium, advanced alloy, high-effective conductive body, hot-working when production
900~1050 DEG C of temperature, the quality that cold conduction cooling part is stored up under same volume also weighs about 20% than ordinary steel, is six times of magnesium.It leads
Hot property is splendid, and reheated forging and stamping and heat treatment process, electrode is non-directional, has good thermoelectricity conductive performance, and has anti-
Lose weatherability.
Preferably, the double water conservancy diversion refrigerator working principles of DFPN knot are: when one piece of N-type semiconductor material and one piece of p-type half
Conductor material is coupled to galvanic couple clock synchronization, and the transfer of energy can be generated by connecting DC current in this circuit, and electric current is partly led by N-type
The side that body material flows to p-type semiconductor material absorbs heat, becomes cold end；N-type semiconductor material is flowed to by p-type semiconductor material
The side of material discharges heat, becomes hot end；P-type semiconductor material and N-type semiconductor material form thermoelectric couple pair；Pass through change
The size and N-type of electric current, p-type semiconductor material element logarithm control heat absorption and exothermic size.
Cabinet, cabinet are equipped with DFPN and tie double water conservancy diversion refrigerators, and cabinet includes cabinet shell, refrigeration cabinet and heat dissipation tank
Body, it is heat-insulated by cabinet thermal insulation areas between refrigeration cabinet and heat radiation box, the thermal insulation areas PN is equipped in cabinet thermal insulation areas, DFPN knot is double
Water conservancy diversion refrigerator is mounted in cabinet shell or outside cabinet shell.DFPN ties double water conservancy diversion refrigerators and is divided into cabinet built-in type and cabinet
Fitted outside.The built-in exterior of DFPN knot refrigerator, which can be embodied in built-in type, can directly produce cabinet, and fitted outside can be to
Cabinet through production or at work carries out upgrading.The combination of different modes all uses two-region heat-insulated, improves DFPN
Refrigerator application efficiency is tied, DFPN knot refrigerator failure rate is substantially reduced.
DFPN ties the power very little of the single cooling module of double water conservancy diversion refrigerators, but is combined into pile, with the electricity of same type
If the method for heap series and parallel is combined into refrigeration system, power can be very big, therefore refrigeration work consumption can accomplish that several milliwatts arrive
The range of upper myriawatt is applied in different fields, and there are two types of functions for modular refrigerating appliance, can freeze and heat, but heat effect
Rate is very high, is always larger than 1, can replace discrete heating system and refrigeration system.
Preferably, hot end tile, the first radiator are mounted in cabinet thermal insulation areas, thermoelectric couple is heat-insulated to PN is mounted on
In area, cold end tile, the cold conduction cooling part of storage, the second radiator are mounted in refrigeration cabinet.Refrigeration is made using the method that two-region is isolated
Pyrogenicity improved efficiency 15%-20%.
It is mounted in cabinet shell preferably, DFPN ties double water conservancy diversion refrigerators, refrigeration cabinet and heat radiation box are all located at
In cabinet shell.When the double water conservancy diversion refrigerators of DFPN knot are mounted in cabinet shell, cabinet is divided into the cabinet of two sides, refrigeration cabinet
It is additionally provided with thermal insulation areas between heat radiation box, three different regions will be divided into cabinet, have also been additionally provided in cabinet shell
Outlet air, air-intake device are used to improve the effect or heat dissipation of conduction heat.
It is mounted on outside cabinet shell preferably, DFPN ties double water conservancy diversion refrigerators, DFPN ties the quantity of double water conservancy diversion refrigerators
For one or more, refrigeration cabinet is located on the inside of cabinet shell, and heat radiation box is located on the outside of cabinet shell.DFPN knot is double to lead
When stream refrigerator is mounted on outside cabinet shell, it can be used refrigerator as room conditioning, using room as cabinet, refrigerator
Radiating end and cold end be respectively provided inside and outside the room.Refrigerator can realize that Intelligent Dynamic stepless voltage regulation controls, and regulation performance is far high
In common convertible frequency air-conditioner, than 50% or more Ordinary Compression air conditioner economize on electricity, is such as used in electric power telecommunications room, room is freezed
It transform equipment enclosure refrigeration as, economizing on energy and electricity rate can be promoted 80%--90%.
Preferably, cabinet includes electric power distributing cabinet, telecomm base station cabinet, data center's cabinet, elevator control cabinet, Electric Appliance Cabinet.
The DFPN cooling piece that DFPN is tied in double water conservancy diversion refrigerators is electric current transducing matrix part, by the control of input current,
High-precision temperature control can be achieved, add temperature measurement and control means, it is easy to realize remote control, program-controlled, computer control
System, convenient for composition automatic control system.
The present invention has significant technical effect: not needing any refrigerant, can connect due to using above technical scheme
Continuous work, no pollution sources do not have rotary part, will not generate gyroscopic action, and no slide unit is a kind of solid sheet, work
Do not shaken when making, noise, service life it is long, installation is easy；Refrigerator has refrigeration, heating function simultaneously, can replace discrete
Heating system and refrigeration system；The temperature difference range of refrigerator from 90 DEG C-it is 130 DEG C subzero, the present invention use two-region isolation method
Make cooling and heating type improved efficiency 15%-20%, can be reduced 90% or more failure rate using the thermally conductive sliding silica gel of mineral.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of invention.
Fig. 2 is the structural schematic diagram that DFPN ties that double water conservancy diversion refrigerators are mounted in cabinet.
Fig. 3 is the structural schematic diagram that DFPN ties that double water conservancy diversion refrigerators are mounted on outside cabinet.
The toponym that each number designation is referred in the figures above is as follows: where 1-thermoelectric couple is to, 2-water conservancy diversion
Piece, 3-hot end tiles, 4-cold end tiles, the 5-the first radiator, the 6-the second radiator, the 7-cold conduction cooling parts of storage, 8-cabinets,
81-refrigeration cabinets, 82-heat radiation boxes, 83-cabinet thermal insulation areas, the 84-thermal insulation areas PN.
Specific embodiment
Present invention is further described in detail with embodiment with reference to the accompanying drawing.
Embodiment 1
DFPN ties double water conservancy diversion refrigerators, as shown in Figure 1, including thermoelectric couple to 1, thermoelectric couple leads to 1 two sides respectively
It crosses flow deflector 2 and is fixed with hot end tile 3 and cold end tile 4, the side of hot end tile 3 is fixedly connected with flow deflector 2, hot end tile
3 other side is fixed with the first radiator 5, and the side of cold end tile 4 is fixedly connected with flow deflector 2, the other side of cold end tile 4
It is fixed with the second radiator 6, is further fixed on the cold conduction cooling part 7 of storage between cold end tile 4 and the second radiator 6, hot end tile 3 and the
It is coupled between one radiator 5 by liquid silica gel.
By mass percentage, mineral liquid silica gel includes following component:
In the present embodiment, by mass percentage, mineral liquid silica gel includes following component: mineral porcelain powder mixture
40%, polysiloxane mixture 10%, aluminium oxide 30%, aluminium hydroxide 11%, drying retardant 9%.
Mineral porcelain powder mixture is the mixture of aluminium silicate mineral matter powder and ceramic powders, and polysiloxane mixture is
A variety of mixtures in organopolysiloxane, diorganopolysiloxaneand；Drying retardant is oiliness drying retardant.Poly- silicon in the present embodiment
Oxygen alkane mixture is a variety of organopolysiloxanes.
By mass percentage, storing up cold conduction cooling part material includes following element composition: copper 99.90%-99.94%, silver
0.04%-0.09%, phosphorus 0-0.003%, bismuth 0-0.002%, antimony 0-0.004%, arsenic 0-0.004%, iron 0.004%-
0.006%, nickel 0-0.006%, lead 0.004%-0.006%, sulphur 0.004%-0.006%, tin 0-0.006%, zinc 0-
0.006%, oxygen 0%-0.006%.In the present embodiment, storing up cold conduction cooling part material includes following element composition: copper 99.90%, silver
0.064%, phosphorus 0.003%, bismuth 0.001%, antimony 0.002%, arsenic 0.002%, iron 0.004%, nickel 0.004%, lead
0.004%, sulphur 0.004%, tin 0.004%, zinc 0.004%, oxygen 0.004%.
When one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple clock synchronization, connect in this circuit
DC current can generate the transfer of energy, and electric current absorbs heat by the side that N-type semiconductor material flows to p-type semiconductor material,
As cold end；Heat is discharged by the side that p-type semiconductor material flows to N-type semiconductor material, becomes hot end；P-type semiconductor material
Material is with N-type semiconductor material composition thermoelectric couple to 1；By the size and N-type, the member of p-type semiconductor material that change electric current
Part logarithm absorbs heat and exothermic size to control.
Embodiment 2
DFPN ties double water conservancy diversion refrigerators, as shown in Figure 1, including thermoelectric couple to 1, thermoelectric couple leads to 1 two sides respectively
It crosses flow deflector 2 and is fixed with hot end tile 3 and cold end tile 4, the side of hot end tile 3 is fixedly connected with flow deflector 2, hot end tile
3 other side is fixed with the first radiator 5, and the side of cold end tile 4 is fixedly connected with flow deflector 2, the other side of cold end tile 4
It is fixed with the second radiator 6, is further fixed on the cold conduction cooling part 7 of storage between cold end tile 4 and the second radiator 6, hot end tile 3 and the
It is coupled between one radiator 5 by liquid silica gel.
By mass percentage, mineral liquid silica gel includes following component:
In the present embodiment, by mass percentage, mineral liquid silica gel includes following component: mineral porcelain powder mixture
42%, polysiloxane mixture 15%, aluminium oxide 20%, aluminium hydroxide 10%, drying retardant 13%.
Mineral porcelain powder mixture is the mixture of aluminium silicate mineral matter powder and ceramic powders, and polysiloxane mixture is
A variety of mixtures in organopolysiloxane, diorganopolysiloxaneand；Drying retardant is oiliness drying retardant.Poly- silicon in the present embodiment
Oxygen alkane mixture is a variety of organopolysiloxanes, diorganopolysiloxaneand.
By mass percentage, storing up cold conduction cooling part material includes following element composition: copper 99.90%-99.94%, silver
0.04%-0.09%, phosphorus 0-0.003%, bismuth 0-0.002%, antimony 0-0.004%, arsenic 0-0.004%, iron 0.004%-
0.006%, nickel 0-0.006%, lead 0.004%-0.006%, sulphur 0.004%-0.006%, tin 0-0.006%, zinc 0-
0.006%, oxygen 0%-0.006%.In the present embodiment, storing up cold conduction cooling part material includes following element composition: copper 99.94%, silver
0.04%, bismuth 0.001%, antimony 0.002%, arsenic 0.002%, iron 0.005%, lead 0.005%, sulphur 0.005%.
DFPN ties double water conservancy diversion refrigerator working principles: when one piece of N-type semiconductor material and one piece of p-type semiconductor material connection
Form galvanic couple clock synchronization, the transfer of energy can be generated by connecting DC current in this circuit, and electric current is flowed to by N-type semiconductor material
The side of p-type semiconductor material absorbs heat, becomes cold end；It is released by the side that p-type semiconductor material flows to N-type semiconductor material
Thermal discharge becomes hot end；P-type semiconductor material and N-type semiconductor material composition thermoelectric couple are to 1；By changing the big of electric current
Small and N-type, p-type semiconductor material element logarithm come control heat absorption and exothermic size.
Embodiment 3
DFPN ties double water conservancy diversion refrigerators, as shown in Figure 1, including thermoelectric couple to 1, thermoelectric couple leads to 1 two sides respectively
It crosses flow deflector 2 and is fixed with hot end tile 3 and cold end tile 4, the side of hot end tile 3 is fixedly connected with flow deflector 2, hot end tile
3 other side is fixed with the first radiator 5, and the side of cold end tile 4 is fixedly connected with flow deflector 2, the other side of cold end tile 4
It is fixed with the second radiator 6, is further fixed on the cold conduction cooling part 7 of storage between cold end tile 4 and the second radiator 6, hot end tile 3 and the
It is coupled between one radiator 5 by liquid silica gel.
By mass percentage, mineral liquid silica gel includes following component:
In the present embodiment, by mass percentage, mineral liquid silica gel includes following component: mineral porcelain powder mixture
50%, polysiloxane mixture 14%, aluminium oxide 20%, aluminium hydroxide 9%, drying retardant 7%.
Mineral porcelain powder mixture is the mixture of aluminium silicate mineral matter powder and ceramic powders, and polysiloxane mixture is
A variety of mixtures in organopolysiloxane, diorganopolysiloxaneand；Drying retardant is oiliness drying retardant.Poly- silicon in the present embodiment
Oxygen alkane mixture is a variety of diorganopolysiloxanecompositions.
By mass percentage, storing up cold conduction cooling part material includes following element composition: copper 99.90%-99.94%, silver
0.04%-0.09%, phosphorus 0-0.003%, bismuth 0-0.002%, antimony 0-0.004%, arsenic 0-0.004%, iron 0.004%-
0.006%, nickel 0-0.006%, lead 0.004%-0.006%, sulphur 0.004%-0.006%, tin 0-0.006%, zinc 0-
0.006%, oxygen 0%-0.006%.In the present embodiment, storing up cold conduction cooling part material includes following element composition: copper 99.90%, silver
0.54%, phosphorus 0.001%, bismuth 0.001%, antimony 0.002%, iron 0.006%, nickel 0.006%, lead 0.006%, sulphur 0.006%,
Tin 0.006%, zinc 0.006%, oxygen 0.006%.
DFPN ties double water conservancy diversion refrigerator working principles: when one piece of N-type semiconductor material and one piece of p-type semiconductor material connection
Form galvanic couple clock synchronization, the transfer of energy can be generated by connecting DC current in this circuit, and electric current is flowed to by N-type semiconductor material
The side of p-type semiconductor material absorbs heat, becomes cold end；It is released by the side that p-type semiconductor material flows to N-type semiconductor material
Thermal discharge becomes hot end；P-type semiconductor material and N-type semiconductor material composition thermoelectric couple are to 1；By changing the big of electric current
Small and N-type, p-type semiconductor material element logarithm come control heat absorption and exothermic size.
Embodiment 4
Cabinet, as shown in Fig. 2, cabinet, which is equipped with DFPN, ties double water conservancy diversion refrigerators, cabinet includes cabinet shell 8, refrigeration case
Body 81 and heat radiation box 82, heat-insulated by cabinet thermal insulation areas 83 between refrigeration cabinet 81 and heat radiation box 82, cabinet thermal insulation areas 83
Interior to be equipped with the thermal insulation areas PN 84, DFPN ties double water conservancy diversion refrigerators and is mounted in cabinet shell 8.
Hot end tile 3, the first radiator 5 are mounted in cabinet thermal insulation areas 83, and thermoelectric couple is mounted on the thermal insulation areas PN 84 to 1
Interior, cold end tile 4, the cold conduction cooling part 7 of storage, the second radiator 6 are mounted in refrigeration cabinet 81.Refrigeration cabinet 81 and heat radiation box 82
It is all located in cabinet shell 8.
Embodiment 5
Cabinet, as shown in figure 3, cabinet, which is equipped with DFPN, ties double water conservancy diversion refrigerators, cabinet includes cabinet shell 8, refrigeration case
Body 81 and heat radiation box 82, heat-insulated by cabinet thermal insulation areas 83 between refrigeration cabinet 81 and heat radiation box 82, cabinet thermal insulation areas 83
It is interior to be equipped with the thermal insulation areas PN 84.
Hot end tile 3, the first radiator 5 are mounted in cabinet thermal insulation areas 83, and thermoelectric couple is mounted on the thermal insulation areas PN 84 to 1
Interior, cold end tile 4 has the cold conduction cooling part 7 of storage, the second radiator 6 to be mounted in refrigeration cabinet 81.
DFPN ties double water conservancy diversion refrigerators and is mounted on outside cabinet shell 8, and the quantity that DFPN ties double water conservancy diversion refrigerators is two, causes
Ice chest body 81 is located at 8 inside of cabinet shell, and heat radiation box 82 is located at 8 outside of cabinet shell.
Cabinet includes electric power distributing cabinet, telecomm base station cabinet, data center's cabinet, elevator control cabinet, Electric Appliance Cabinet.
Embodiment 6
The property of cold conduction cooling part is stored up in 20 DEG C of at a temperature of measurement, obtains following result:
| Embodiment 1 | Embodiment 2 | Embodiment 3 | |
| Density g/cm | 8.9 | 9.2 | 9.3 |
| Specific gravity g/mm | 8.79 | 8.99 | 9.02 |
| Thermal coefficient w/ (m.k) | 393.1 | 396.4 | 396.3 |
| Resistivity Ω mm2/m | 0.016 | 0.018 | 0.019 |
The conductive and heat conductive effect for storing up cold conduction cooling part has greatly improved compared with the prior art, and DFPN is made to tie refrigerator system efficiency
Rise 15%.
In short, the foregoing is merely presently preferred embodiments of the present invention, it is all according to equalization made by scope of the present invention patent
Variation and modification, shall all be covered by the patent of the invention.
Claims (10)
1.DFPN ties double water conservancy diversion refrigerators, including thermoelectric couple is to (1), it is characterised in that: thermoelectric couple distinguishes the two sides of (1)
It is fixed with hot end tile (3) and cold end tile (4) by flow deflector (2), the side and flow deflector (2) of hot end tile (3) are fixed
Connection, the other side of hot end tile (3) are fixed with the first radiator (5), and the side and flow deflector (2) of cold end tile (4) are fixed
Connection, the other side of cold end tile (4) are fixed with the second radiator (6), between cold end tile (4) and the second radiator (6) also
It is fixed with the cold conduction cooling part (7) of storage, is coupled between hot end tile (3) and the first radiator (5) by mineral liquid silica gel.
2. DFPN according to claim 1 ties double water conservancy diversion refrigerators, it is characterised in that: by mass percentage, mineral liquid
Body silica gel includes following component:
3. DFPN according to claim 2 ties double water conservancy diversion refrigerators, it is characterised in that: mineral porcelain powder mixture is manosil AS
The mixture of salt mineral powders and ceramic powders, polysiloxane mixture are organopolysiloxane, diorganopolysiloxaneand
In a variety of mixtures；Drying retardant is oiliness drying retardant.
4. DFPN according to claim 1 ties double water conservancy diversion refrigerators, which is characterized in that by mass percentage, Chu Leng is led
Cold part (7) material includes following element composition: copper 99.90%-99.94%, silver 0.04%-0.09%, phosphorus 0-0.003%, bismuth
0-0.002%, antimony 0-0.004%, arsenic 0-0.004%, iron 0.004%-0.006%, nickel 0-0.006%, lead 0.004%-
0.006%, sulphur 0.004%-0.006%, tin 0-0.006%, zinc 0-0.006%, oxygen 0%-0.006%.
5. DFPN according to claim 1 ties double water conservancy diversion refrigerators, it is characterised in that: when one piece of N-type semiconductor material and
One piece of p-type semiconductor material is coupled to galvanic couple clock synchronization, in this circuit connect DC current generate energy transfer, electric current by
The side that N-type semiconductor material flows to p-type semiconductor material absorbs heat, becomes cold end；N-type is flowed to by p-type semiconductor material
The side of semiconductor material discharges heat, becomes hot end；P-type semiconductor material and N-type semiconductor material form thermoelectric couple pair
(1)；Heat absorption and exothermic size are controlled by the element logarithm of the size and N-type of change electric current, p-type semiconductor material.
6. cabinet, it is characterised in that: cabinet is equipped with DFPN described in claim 1-5 and ties double water conservancy diversion refrigerators, and cabinet includes
Cabinet shell (8), refrigeration cabinet (81) and heat radiation box (82), pass through cabinet between refrigeration cabinet (81) and heat radiation box (82)
Thermal insulation areas (83) is heat-insulated, is equipped with the thermal insulation areas PN (84) in cabinet thermal insulation areas (83), and DFPN ties double water conservancy diversion refrigerators and is mounted on cabinet
In shell (8) or cabinet shell (8) outside.
7. cabinet according to claim 6, it is characterised in that: hot end tile (3), the first radiator (5) are mounted on cabinet
In thermal insulation areas (83), thermoelectric couple is mounted in the thermal insulation areas PN (84) (1), and cold end tile (4) has the cold conduction cooling part (7) of storage, the
Second radiator (6) is mounted in refrigeration cabinet (81).
8. cabinet according to claim 7, it is characterised in that: DFPN ties double water conservancy diversion refrigerators and is mounted on cabinet shell (8)
Interior, refrigeration cabinet (81) and heat radiation box (82) are all located in cabinet shell (8).
9. cabinet according to claim 7, it is characterised in that: DFPN ties double water conservancy diversion refrigerators and is mounted on cabinet shell (8)
Outside, it is one or more that DFPN, which ties the quantity of double water conservancy diversion refrigerators, and refrigeration cabinet (81) is located on the inside of cabinet shell (8),
Heat radiation box (82) is located on the outside of cabinet shell (8).
10. cabinet according to claim 6, it is characterised in that: cabinet includes electric power distributing cabinet, telecomm base station cabinet, data
Central cabinet, elevator control cabinet, Electric Appliance Cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811610212.6A CN109599481A (en) | 2018-12-27 | 2018-12-27 | DFPN ties double water conservancy diversion refrigerators and its cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811610212.6A CN109599481A (en) | 2018-12-27 | 2018-12-27 | DFPN ties double water conservancy diversion refrigerators and its cabinet |
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| Publication Number | Publication Date |
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ID=65963653
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| CN201811610212.6A Pending CN109599481A (en) | 2018-12-27 | 2018-12-27 | DFPN ties double water conservancy diversion refrigerators and its cabinet |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2758663Y (en) * | 2004-12-14 | 2006-02-15 | 中国电子科技集团公司第十八研究所 | High-efficient temp different electric cold/heat air conditioner |
| US20080236643A1 (en) * | 2007-04-02 | 2008-10-02 | Li John H | Thermoelectric composite semiconductor |
| CN201269667Y (en) * | 2008-09-02 | 2009-07-08 | 胡振辉 | Semiconductor refrigerating device |
| CN102506515A (en) * | 2011-09-21 | 2012-06-20 | 中国电子科技集团公司第十八研究所 | Small-sized high-reliability thermoelectric refrigerator |
| CN107722922A (en) * | 2017-09-12 | 2018-02-23 | 苏州东诚欣电子有限公司 | Heat-conducting glue |
-
2018
- 2018-12-27 CN CN201811610212.6A patent/CN109599481A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2758663Y (en) * | 2004-12-14 | 2006-02-15 | 中国电子科技集团公司第十八研究所 | High-efficient temp different electric cold/heat air conditioner |
| US20080236643A1 (en) * | 2007-04-02 | 2008-10-02 | Li John H | Thermoelectric composite semiconductor |
| CN201269667Y (en) * | 2008-09-02 | 2009-07-08 | 胡振辉 | Semiconductor refrigerating device |
| CN102506515A (en) * | 2011-09-21 | 2012-06-20 | 中国电子科技集团公司第十八研究所 | Small-sized high-reliability thermoelectric refrigerator |
| CN107722922A (en) * | 2017-09-12 | 2018-02-23 | 苏州东诚欣电子有限公司 | Heat-conducting glue |
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Application publication date: 20190409 |