CN109592892A - A kind of laser processing of glass - Google Patents
A kind of laser processing of glass Download PDFInfo
- Publication number
- CN109592892A CN109592892A CN201811416346.4A CN201811416346A CN109592892A CN 109592892 A CN109592892 A CN 109592892A CN 201811416346 A CN201811416346 A CN 201811416346A CN 109592892 A CN109592892 A CN 109592892A
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- 239000011521 glass Substances 0.000 title claims abstract description 123
- 238000012545 processing Methods 0.000 title claims abstract description 29
- 238000005520 cutting process Methods 0.000 claims abstract description 74
- 238000003698 laser cutting Methods 0.000 claims abstract description 56
- 238000005516 engineering process Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 9
- 230000035882 stress Effects 0.000 claims description 5
- 230000008646 thermal stress Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 238000003672 processing method Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011121 hardwood Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of laser processing of glass, include the following steps: to choose corresponding laser cutting head, adjusts laser optical path and confirm cutting glass by laser sample focus；Suitable parameters of laser cutting is chosen according to glass sample type and thickness；Map file is cut by Software Create, so that glass sample is prolonged the movement of map file path by linear motor movement and is cut by laser, to obtain the structural glass cutting sample of corresponding map file shape cutting；The glass aftertreatment technologies such as cleaning, reinforcing, the silk-screen of full page are carried out to structural glass cutting sample again, the small pieces glass finished-product of certain shapes is finally obtained using specific sliver mode.This glass laser processing method of the present invention substantially increases the yield of small pieces glass finished-product and efficiency is made, while also reducing laser processing board small fixture production design difficulty and cost.
Description
Technical field
The invention belongs to technical field of laser processing, and in particular to a kind of laser processing of glass.
Background technique
Laser cutting industrial application starts from phase early 1970s, cuts non-penetrating slot, snaps piece for hardwood plate in early days
Equal fields, develop with industrial technology, have been widely used in various metals and nonmetallic cutting field.Glass belong to high rigidity,
Dystectic fragile material, general processing method difficulty has met process requirements, and Solid Laser Precise Cutting Technology is used to cut glass
Glass can significantly improve the surface quality of glass.
Structural glass sample is mainly directly passed through automatic production line and moves to by traditional cutting glass by laser technology to be contained
There is CO2Laser platform under cut after directly sliver small pieces glass sample is made, then by large batch of in producing line
Small automatic fixture collects small pieces glass sample, then carries out the postprocessing working procedures such as glass cleaning, reinforcing, silk-screen；And will be big
Block glass sample needs the small fixture of preparation high-volume during cutting collection into pieces, increases the design difficulty of board, also increases
The investment of production cost；On the other hand, small pieces glass sample cleaned, strengthened, the post-processing such as silk-screen when, it is easy to pollute and
The edge and section for damaging glass, largely increase the difficulty of clamping and reduce production and processing efficiency, while also making
At raw material losses.In recent years, the fast development of electronic product, the fragile materials such as glass are in microelectronics, optical fiber, Novel electric
Using rising year by year in source, steel market, and guarantee growth rate 20%, urgent need new process be made instead of traditional complexity,
High-cost manufacture craft.
Summary of the invention
The object of the present invention is to provide a kind of laser processings of glass, laser machine compared to traditional glass, reduce
The production of the small fixture of board high-volume, reduces glass aftertreatment technology and period and clamping difficulty is made, improve glass
Finished product yield.
The technical solution of the present invention is to provide a kind of laser processings of glass, include the following steps:
1) laser cutting head adaptable therewith is chosen according to the thickness of glass sample, and laser cutting head is installed, and adjusts laser
The outgoing laser beam optical path of cutting head, makes laser beam perpendicular to glass sample surface；
2) depth of cut that glass sample is not exclusively cut through is preset；
3) according to preset glass sample depth of cut coarse positioning laser cutting head focal position；
4) laser beam focuses on glass sample by the laser cutting head of coarse positioning, adjusts and determines that the laser of laser cutting head is cut
Parameter is cut, makes to generate the crackle for prolonging cut direction on glass sample between laser pulse spot caused by laser beam；
5) after determining parameters of laser cutting, the glass-cutting piece of different depths of cut is obtained by mobile cutting focal position, and
Glass-cutting depth and laser cutting head position are accurately positioned according to the cutting section displaing micro picture of glass-cutting piece；
6) it is cut according to the laser that the pinpoint laser cutting head position of step 5) and glass-cutting depth and step 4) determine
Parameter is cut, using cutting map file shape required by cutting software editor, movable glass sample makes it prolong cutting map file shape road
Diameter movement is cut by laser, and the structural glass cutting sample of corresponding map file shape cutting is obtained；
7) the structural glass cutting sample full page of step 6) cleaned, strengthened, obtained after the aftertreatment technology of silk-screen wait split
Piece strengthens material, then carries out sliver processing to get the small pieces glass finished-product of cutting map file shape.
Further, the focusing focal length of the laser cutting head is higher than the thickness of glass sample.
Further, the focal position of the laser cutting head determines method: laser beam is acted on table on glass sample
Face is cut, and is controlled laser cutting head by digital control system and is taken the air line cutting on glass sample surface, after the completion of cutting every time,
Laser cutting head moves down certain step pitch along glass sample thickness direction, while platform carries out lateral shift certain distance, often
It is cut again after secondary movement in place, above procedure is repeated, until front and back sides penetrate glass sample and dotted one under microscope
Stop when cause, with microscope record each step pitch corresponding to cutting microscopic cross-section depth, according to preset depth of cut institute
Laser cutting head focal position can be obtained in corresponding step pitch.
Further, the parameters of laser cutting includes laser cutting power, Burst quantity and laser pulse spot spacing.
Further, sliver processing applies the mechanical sliver side of mechanical stress progress using to structural glass cutting sample
Formula.
Further, sliver processing applies laser thermal stress progress laser to structural glass cutting sample using laser and splits
Sheet mode.
Further, when laser cutting power is less than acquisition not fully penetrated structural glass cutting sample when sliver is handled
It is cut by laser power.
Further, laser used in being cut by laser uses infrared picosecond laser.
Compared with prior art, beneficial effects of the present invention:
The focus of laser cutting head is located at the certain depth of glass sample by the laser processing of this glass provided by the invention
Degree is chosen suitable laser parameter combination and is cut, and makes still to keep whole shape that can lead to again after the completion of glass sample cutting
After the aftertreatment technologies such as over cleaning, reinforcing, silk-screen, sliver obtains large batch of pieces of glass finished product later, is added using the technique
Work mode substantially increases the yield of small pieces glass finished-product and efficiency is made, while also reducing the laser processing small-sized folder of board
Tool production design difficulty and cost.
The present invention is described in further details below with reference to attached drawing.
Detailed description of the invention
Fig. 1 is the schematic diagram for being cut by laser focus in the present invention and being located at glass sample different depth；
Fig. 2 be in the present invention glass sample through be cut by laser rear surface displaing micro picture；
Fig. 3 is that glass sample splits cross-section diagram after being cut by laser in the present invention；
Fig. 4 is the structural schematic diagram for strengthening material in the present invention to sliver；
Fig. 5 is the structural glass cutting sample laser sliver schematic diagram of map file shape cutting.
Description of symbols: 1, laser beam；2, glass sample；3, laser pulse spot；4, crackle；5, glass sample cuts through portion
Point；6, glass sample does not cut through part；7, strengthen to sliver and expect；8, small pieces glass finished-product；9, laser sliver cutting track line；
10, waste part.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
The laser processing for present embodiments providing a kind of glass, includes the following steps:
(1) laser cutting head adaptable therewith, under normal circumstances, selected laser are chosen according to the thickness of glass sample 2
The focusing focal length of cutting head is higher than the thickness of glass sample 2.After choosing suitable laser cutting head installation, laser cutting head is adjusted
Outgoing laser beam optical path, make laser beam 1 perpendicular to glass sample surface.
And wherein, it is cut by laser used laser and uses infrared picosecond laser；Glass sample 2 is placed in vacuum simultaneously
Above absorption platform, there are vacuum absorption holes several different, after opening vacuum, 2 meeting of glass sample above vacuum absorbing platform
It is tightly adsorbed on vacuum absorbing platform, prevents it from moving in process.
(2) depth of cut that glass sample 2 is not exclusively cut through is preset, preset depth of cut needs to be convenient for the whole of later period
Body aftertreatment technology, while 6 sliver of part is not cut through convenient for glass sample；Such as the glass sample 2 of 0.5mm thickness, it presets it and cuts
Depth 0.4mm or so is cut, the depth for retaining 0.1mm or so is not cut through.
(3) according to preset glass sample depth of cut coarse positioning laser cutting head focal position, focal position is determined
Method is specific as follows: cutting as shown in Figure 1, laser beam 1 is acted on 2 upper surface of glass sample, passes through digital control system control
Laser cutting head processed takes the air line cutting on 2 surface of glass sample, and every time after the completion of cutting, laser cutting head is thick along glass sample 2
Degree direction moves down certain step pitch, and such as 0.05mm or so, while vacuum absorbing platform carries out lateral shift certain distance 0.1mm
Left and right is cut again after movement in place every time, above procedure is repeated, until front and back sides penetrate glass sample 2 under microscope
And stop when dotted consistent, it is right to record each step pitch position (corresponding to laser cutting head height and position) institute with microscope
The cutting microscopic cross-section depth answered, to obtain depth of cut control corresponding under different laser cutting head height and positions
Table compares the depth of cut table of comparisons, laser cutting head focal position can be obtained further according to preset depth of cut.
(4) it as shown in Fig. 2, laser beam 1 focuses on glass sample 2 by the laser cutting head of coarse positioning, adjusts and determines
The parameters of laser cutting of laser cutting head makes on glass sample 2 between laser pulse spot 3 caused by laser beam 1 since pulse is rushed
It hits directly to crack and extends to form the high-visible crackle 4 of cut direction, prepare for later period sliver technique.
And in this course, the output power of the laser is 10~20W, when laser power is too low, front and back sides
Laser pulse spot 3 is uniform in size but flawless generates, if power is excessively high, 2 surface of glass sample or the back side will appear nigrescence and burns
Hurt phenomenon；The laser output frequency is 50~100KHz, and cooperation power can get more appropriate single pulse energy, if swashing
Crackle is not formed between light pulse point 3, then can suitably reduce power, increases Burst quantity, can produce crackle, in such condition
Under, if cannot still crack, then it can continue to shorten 3 spacing of laser pulse spot, until the generation of crackle 4；Adjusting laser
Cutting parameter causes in 4 forming process of crackle, can suitably increase or decrease performance number and laser output Burst quantity
Controlling for 3~6,3 spacing of laser pulse spot is that 3~10um etc. matches each other to obtain optimal parameters of laser cutting, the above parameter
Debugging is for obtaining the necessary condition of preferable seminess and later period preferable sliver.
(5) after determining parameters of laser cutting, with reference to the depth of cut table of comparisons, difference is obtained by mobile cutting focal position
The glass-cutting piece of depth of cut, at the same time, optimization can fine tuning parameters of laser cutting appropriate with reach optimum Cutting effect
Fruit；Then glass-cutting depth and laser cutting head position are accurately positioned according to the cutting section displaing micro picture of glass-cutting piece.
(6) it is determined according to the pinpoint laser cutting head position of step (5) and glass-cutting depth and step (4)
Parameters of laser cutting so that map file size is corresponded to vacuum suction using cutting map file shape required by cutting software editor
Glass sample 2 on platform makes glass sample 2 prolong cutting map file profiling path then by the mobile linear motor of control system
Movement is cut by laser, and the structural glass cutting sample of full wafer cutting is obtained.As shown in figure 3, the structural glass of the cutting is cut
Cutting sample includes that glass sample cuts through part 5 and glass sample and do not cut through part 6.
(7) the structural glass cutting sample full page of step (6) cleaned, strengthened, being obtained after the aftertreatment technology of silk-screen
Strengthen material 7 to sliver to as shown in Figure 4, then treats sliver and strengthen 7 progress sliver processing of material to get the small of cutting map file shape
Sheet glass finished product 8.
Wherein, following sliver mode can be used for strengthening material 7 to sliver: one is mechanical slivers, pass through front and back sides
Mechanical thimble applies mechanical stress along laser emitting mouth face, so that it is split, cuts since structural glass cutting sample has been subjected to laser
It cuts, thus only needs lesser mechanical stress that can carry out sliver, sliver is easy to operate；Another kind is to use laser cutting side again
Formula carries out sliver, as shown in figure 5, suitable laser spot and parameter is selected to cut 8 gap of small pieces glass finished-product along laser sliver
It cuts trajectory line 9 and carries out single cut, due to strengthening the release of 7 internal mechanical stresses of material after strengthening to sliver, sliver can be treated
Strengthen the waste part 10 on material 7 in addition to small pieces glass finished-product 8 to be crushed, to obtain small pieces glass finished-product 8；Swash at this time
Light cutting power is cut by laser power when being less than above-mentioned acquisition structural glass cutting sample.
In addition, since glass sample can cut different depth according to the depth of cut table of comparisons in the present embodiment, it can
To select the glass sample of multiple groups different depth, glass sample is only internal to produce corresponding extension crackle after cutting,
Itself still has certain anti-pressure ability, can effectively prevent its separation that falls off during aftertreatment technology, and this implementation
This cutting mode of example can also prevent from needing to prevent ink contamination glass section from leading by jig when small pieces glass sample silk-screen
Cause product bad；Finally by the final conjunction of the determining cutting of the complexity of fragment and finished product sliver during after-processing technology
Suitable depth value, the present invention are tested when different-thickness glass sample is cut, and do not cut through part accounting at 5~15%, effect
It is optimal.
The foregoing examples are only illustrative of the present invention, does not constitute the limitation to protection scope of the present invention, all
It is within being all belonged to the scope of protection of the present invention with the same or similar design of the present invention.
Claims (8)
1. a kind of laser processing of glass, which comprises the steps of:
1) laser cutting head adaptable therewith is chosen according to the thickness of glass sample, and laser cutting head is installed, and adjusts laser
The outgoing laser beam optical path of cutting head, makes laser beam perpendicular to glass sample surface；
2) depth of cut that glass sample is not exclusively cut through is preset；
3) according to preset glass sample depth of cut coarse positioning laser cutting head focal position；
4) laser beam focuses on glass sample by the laser cutting head of coarse positioning, adjusts and determines that the laser of laser cutting head is cut
Parameter is cut, makes to generate the crackle for prolonging cut direction on glass sample between laser pulse spot caused by laser beam；
5) after determining parameters of laser cutting, the glass-cutting piece of different depths of cut is obtained by mobile cutting focal position, and
Glass-cutting depth and laser cutting head position are accurately positioned according to the cutting section displaing micro picture of glass-cutting piece；
6) it is cut according to the laser that the pinpoint laser cutting head position of step 5) and glass-cutting depth and step 4) determine
Parameter is cut, using cutting map file shape required by cutting software editor, movable glass sample makes it prolong cutting map file shape road
Diameter movement is cut by laser, and the structural glass cutting sample of corresponding map file shape cutting is obtained；
7) the structural glass cutting sample full page of step 6) cleaned, strengthened, obtained after the aftertreatment technology of silk-screen wait split
Piece strengthens material, then carries out sliver processing to get the small pieces glass finished-product of cutting map file shape.
2. the laser processing of glass as described in claim 1, it is characterised in that: the focusing focal length of the laser cutting head
Higher than the thickness of glass sample.
3. the laser processing of glass as described in claim 1, it is characterised in that: the focal position of the laser cutting head
It determines method: laser beam being acted on into glass sample upper surface and is cut, laser cutting head is controlled in glass by digital control system
Glass sample surfaces take the air line cutting, and every time after the completion of cutting, laser cutting head moves down centainly along glass sample thickness direction
Step pitch, while platform carries out lateral shift certain distance, is cut after movement in place again every time, repeats above procedure, directly
Under to microscope front and back sides penetrate glass sample and it is dotted consistent when stopping, with microscope record each step pitch corresponding to cut
Microscopic cross-section depth is cut, according to step pitch corresponding to preset depth of cut, laser cutting head focal position can be obtained.
4. the laser processing of glass as described in claim 1, it is characterised in that: the parameters of laser cutting includes laser
Cutting power, Burst quantity and laser pulse spot spacing.
5. the laser processing of glass as described in claim 1, it is characterised in that: sliver processing, which uses, cuts structural glass
It cuts sample and applies the mode that mechanical stress carries out mechanical sliver.
6. the laser processing of glass as described in claim 1, it is characterised in that: sliver processing is using laser to bulk
Glass-cutting sample applies the mode that laser thermal stress carries out laser sliver.
7. the laser processing of glass as claimed in claim 6, it is characterised in that: laser cutting power is small when sliver processing
Power is cut by laser when obtaining not fully penetrated structural glass cutting sample.
8. the laser processing of glass as described in claim 1, it is characterised in that: laser used in being cut by laser is adopted
With infrared picosecond laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811416346.4A CN109592892A (en) | 2018-11-26 | 2018-11-26 | A kind of laser processing of glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811416346.4A CN109592892A (en) | 2018-11-26 | 2018-11-26 | A kind of laser processing of glass |
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| CN109592892A true CN109592892A (en) | 2019-04-09 |
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ID=65960353
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| CN201811416346.4A Pending CN109592892A (en) | 2018-11-26 | 2018-11-26 | A kind of laser processing of glass |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110646875A (en) * | 2019-09-26 | 2020-01-03 | 东莞市微科光电科技有限公司 | Optical filter manufacturing method |
| CN110711937A (en) * | 2019-11-14 | 2020-01-21 | 安徽同兴科技发展有限责任公司 | Parameter determination method for laser focusing of cutting machine |
| CN111302613A (en) * | 2020-04-13 | 2020-06-19 | 武汉吉事达科技股份有限公司 | Picosecond laser cutting method for ultra-thick glass |
| CN111453982A (en) * | 2020-04-02 | 2020-07-28 | 大族激光科技产业集团股份有限公司 | Method for cutting glass material by laser |
| CN114590994A (en) * | 2020-12-02 | 2022-06-07 | 苏州市灵通玻璃制品有限公司 | Production process of arc-shaped glass |
| CN115159828A (en) * | 2022-06-13 | 2022-10-11 | 武汉华工激光工程有限责任公司 | Laser cutting method and system for ground glass |
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| CN115383499A (en) * | 2022-09-21 | 2022-11-25 | 无锡昂峰机械有限公司 | Machining system for machining lathe bed of laser cutting machine and machining method thereof |
| CN115521054A (en) * | 2022-10-25 | 2022-12-27 | 深圳市益铂晶科技有限公司 | Laser splitting method for chemically toughened glass |
| CN115647620A (en) * | 2022-12-28 | 2023-01-31 | 歌尔股份有限公司 | Laser processing method |
| CN116282875A (en) * | 2023-03-21 | 2023-06-23 | 伯恩光学(惠州)有限公司 | Laser cutting method for three-dimensional curved glass |
| CN118684425A (en) * | 2024-08-20 | 2024-09-24 | 江苏纳帝电子科技有限公司 | A touch screen glass panel intelligent cutting system |
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