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CN109564853B - Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and substrate processing method - Google Patents

Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and substrate processing method Download PDF

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Publication number
CN109564853B
CN109564853B CN201780047626.XA CN201780047626A CN109564853B CN 109564853 B CN109564853 B CN 109564853B CN 201780047626 A CN201780047626 A CN 201780047626A CN 109564853 B CN109564853 B CN 109564853B
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substrate
photographing
section
unit
image data
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CN109564853A (en
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柏山真人
C·佩丘莱斯基
森田彰彦
松尾友宏
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Robotics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention holds a substrate by a rotation holding portion in a manner that the substrate can rotate. In the first photographing, the photographing section photographs the substrate held by the rotation holding section, thereby generating first image data representing an image of the substrate. After the first photographing is performed, the substrate is rotated by a predetermined angle by the rotation holding portion. When the substrate is rotated and then the second photographing is performed, the photographing section photographs the substrate held by the rotation holding section, thereby generating second image data representing an image of the substrate. Based on the first image data and the second image data, whether the surface state of the substrate is defective or not is determined.

Description

Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and substrate processing method
Technical Field
The present invention relates to a substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method for inspecting a substrate.
Background
In a substrate processing apparatus, a substrate horizontally supported by a spin chuck is rotated. In this state, a coating film is formed on the entire surface of the substrate by spraying a coating liquid such as a resist liquid onto the central portion of the upper surface of the substrate. The coating film is developed after being exposed to light to form a predetermined pattern on the coating film. Here, if the surface of the substrate is uneven, the exposed state of each portion of the substrate becomes uneven, and processing failure of the substrate occurs. Therefore, the surface state of the substrate may be inspected.
Patent document 1 describes a substrate processing apparatus having a surface inspection processing unit. In the surface inspection processing unit, illumination light is continuously irradiated to a radius area on a substrate, and reflected light from the substrate is received by a CCD (charge coupled device: charge-coupled device) line sensor. In this state, the entire surface of the substrate is irradiated with illumination light by one rotation of the substrate, and the distribution of the brightness of the reflected light of the entire surface of the substrate is obtained as surface image data based on the light receiving amount distribution of the CCD line sensor. Based on the surface image data, it is determined whether the surface state of the substrate is normal.
Patent document 1: japanese patent laid-open No. 2011-66049.
Disclosure of Invention
Problems to be solved by the invention
In the inspection, it is preferable to detect defects in the surface state of the substrate with high accuracy. Therefore, it is desirable to realize an inspection apparatus and method capable of detecting defects in the surface state of a substrate with higher accuracy than in the past.
The invention aims to provide a substrate inspection device, a substrate processing device, a substrate inspection method and a substrate processing method, which can detect the defects of the surface state of a substrate with high precision.
Means for solving the problems
(1) A substrate inspection apparatus according to an embodiment of the present invention includes: the image processing apparatus includes a rotation holding portion that rotatably holds a substrate, an imaging portion that is provided to image the substrate held by the rotation holding portion, a first imaging control portion that controls the imaging portion to generate first image data for representing an image of the substrate when the first imaging is performed, a first rotation control portion that controls the rotation holding portion to rotate the substrate by only a predetermined angle after the first imaging is performed, a second imaging control portion that controls the imaging portion to generate second image data for representing an image of the substrate when the second imaging is performed after the first rotation control portion rotates the substrate, and a determination portion that determines whether or not the surface state of the substrate is defective based on the first image data and the second image data.
In the substrate inspection apparatus, the substrate is rotatably held by the rotation holding portion. In the first photographing, the substrate held by the rotation holding section is photographed, thereby generating first image data representing an image of the substrate. After the first photographing is performed, the substrate is rotated by a predetermined angle by the rotation holding portion. When the substrate is rotated and then the second photographing is performed, the substrate held by the rotation holding unit is photographed, and thereby second image data representing an image of the substrate is generated. Based on the first image data and the second image data, whether the surface state of the substrate is defective or not is determined.
According to this structure, the surface of the substrate represented by the first image data and the surface of the substrate represented by the second image data are different in terms of gloss and the like. Therefore, when a defect exists on the surface of the substrate, the possibility that the defect appears clearly in an image represented by at least one of the first image data and the second image data increases. Thus, defects in the surface state of the substrate can be detected with high accuracy.
(2) The photographing section may further include: a light projecting section that emits light that extends longer than the diameter of the substrate in a first direction, and a light receiving section that receives reflected light from the substrate and generates first image data or second image data based on the amount of received light; the substrate inspection apparatus further includes: the image pickup apparatus includes a light projecting section for projecting light from a light source, a rotation holding section for holding the light emitted from the light source, a relative movement section provided so that the light projecting section and the rotation holding section can move relatively in a second direction intersecting the first direction or a third direction opposite to the second direction so that the light from the light projecting section is irradiated to the whole of one surface of the substrate, a first movement control section for controlling the relative movement section so that the light projecting section and the rotation holding section move relatively in the second direction when the first image is taken, and a second movement control section for controlling the relative movement section so that the light projecting section and the rotation holding section move relatively in the third direction when the second image is taken.
In this case, the relative movement unit reciprocates the substrate and the imaging unit relatively, thereby generating first imaging data and second imaging data. Further, the entire surface of the substrate can be photographed by a small photographing unit. By doing so, the first photographing data and the second photographing data can be obtained in a short time, and the volume of the substrate inspection apparatus can be reduced.
(3) The relative movement portion may include a movement holding portion that holds the rotation holding portion and moves the rotation holding portion in the second direction or the third direction with respect to the photographing portion. In this case, the entire surface of the substrate can be photographed with a simple structure.
(4) The light projecting portion and the light receiving portion may be disposed separately and independently. In this case, the degree of freedom in arrangement of the imaging unit can be improved.
(5) The substrate inspection apparatus may further include: and a second rotation control unit that controls the rotation holding unit so that the substrate is oriented in a specific direction before the first imaging is performed, based on the orientation of the substrate determined by the direction determination unit. Thus, a plurality of substrates can be inspected uniformly.
(6) The substrate inspection apparatus may further include: a notch detecting section that detects a notch of the substrate rotated by the third rotation control section; the direction determination unit determines the orientation of the substrate based on the rotation angle of the substrate when the notch detection unit detects the notch of the substrate. In this case, the orientation of the substrate can be accurately determined with a simple structure.
(7) The first rotation control unit controls the rotation holding unit so that the orientation of the substrate when the first image is taken is not parallel to the orientation of the substrate when the second image is taken. By doing so, in the case where there is a defect on the surface of the substrate, the possibility that the defect appears clearly in the image represented by the first image data or the second image data can be further improved.
(8) The predetermined angle may be an angle which is an odd multiple of 90 degrees. In this case, the case of the surface of the substrate represented by the first image data is greatly different from the case of the surface of the substrate represented by the second image data. By doing so, in the case where there is a defect on the surface of the substrate, the possibility that the defect appears clearly in the image represented by the first image data or the second image data can be further improved.
(9) Another embodiment of the present invention provides a substrate processing apparatus, comprising: the substrate inspection apparatus according to an embodiment of the present invention inspects a surface state of a substrate on which a coating film is formed by the film forming portion, and a conveying mechanism conveys the substrate between the film forming portion and the substrate inspection apparatus.
In this substrate processing apparatus, a coating film is formed on the surface of a substrate by supplying a coating liquid to the surface by a film forming section. The substrate having the coating film formed on the surface thereof by the film forming portion is conveyed by a conveying mechanism. The surface state of the substrate conveyed by the conveying mechanism is inspected by the inspection device.
In the substrate inspection apparatus, the substrate is rotatably held by the rotation holding portion. In the first photographing, the substrate held by the rotation holding section is photographed, thereby generating first image data representing an image of the substrate. After the first photographing is performed, the substrate is rotated by a predetermined angle by the rotation holding portion. When the substrate is rotated and then the second photographing is performed, the substrate held by the rotation holding unit is photographed, and thereby second image data representing an image of the substrate is generated. Based on the first image data and the second image data, whether the surface state of the substrate is defective or not is determined.
According to this structure, the surface of the substrate represented by the first image data and the surface of the substrate represented by the second image data are different in terms of gloss and the like. Therefore, when a defect exists on the surface of the substrate, the possibility that the defect appears clearly in an image represented by at least one of the first image data and the second image data increases. Thus, defects in the surface state of the substrate can be detected with high accuracy.
(10) A substrate inspection method according to still another embodiment of the present invention includes: the substrate is rotatably held by a rotation holding unit, first image data for representing an image of the substrate is generated by photographing the substrate held by the rotation holding unit at the time of first photographing, the substrate is rotated by a predetermined angle by the rotation holding unit after the first photographing is performed, second image data for representing an image of the substrate is generated by photographing the substrate held by the rotation holding unit at the time of second photographing after the substrate is rotated, and the presence or absence of a surface state of the substrate is determined based on the first image data and the second image data.
According to the substrate inspection method, the substrate is rotatably held by the rotation holding portion. In the first photographing, the substrate held by the rotation holding section is photographed, thereby generating first image data representing an image of the substrate. After the first photographing is performed, the substrate is rotated by a predetermined angle by the rotation holding portion. When the substrate is rotated and then the second photographing is performed, the substrate held by the rotation holding unit is photographed, and thereby second image data representing an image of the substrate is generated. Based on the first image data and the second image data, whether the surface state of the substrate is defective or not is determined.
According to this method, the surface of the substrate represented by the first image data and the surface of the substrate represented by the second image data are different in terms of gloss and the like. Therefore, when a defect exists on the surface of the substrate, the possibility that the defect appears clearly in an image represented by at least one of the first image data and the second image data increases. Thus, defects in the surface state of the substrate can be detected with high accuracy.
(11) A substrate processing method according to still another embodiment of the present invention includes: the substrate inspection method according to claim 10, wherein the film forming portion supplies the coating liquid to the surface of the substrate to form the coating film on the surface, the substrate having the coating film formed on the surface by the film forming portion is conveyed by the conveying mechanism, and the surface state of the substrate conveyed by the conveying mechanism is inspected.
According to this substrate processing method, a coating film is formed on the surface of a substrate by supplying a coating liquid to the surface of the substrate by a film forming section. The substrate having the coating film formed on the surface thereof by the film forming portion is conveyed by a conveying mechanism. The surface state of the substrate conveyed by the conveying mechanism is inspected by the substrate inspection method.
According to the above substrate inspection method, the substrate is rotatably held by the rotation holding portion. In the first photographing, the substrate held by the rotation holding section is photographed, thereby generating first image data representing an image of the substrate. After the first photographing is performed, the substrate is rotated by a predetermined angle by the rotation holding portion. When the substrate is rotated and then the second photographing is performed, the substrate held by the rotation holding unit is photographed, and thereby second image data representing an image of the substrate is generated. Based on the first image data and the second image data, whether the surface state of the substrate is defective or not is determined.
According to this method, the surface of the substrate represented by the first image data is different from the surface of the substrate represented by the second image data in terms of gloss or the like. Therefore, when a defect exists on the surface of the substrate, the possibility that the defect appears clearly in an image represented by at least one of the first image data and the second image data increases. Thus, defects in the surface state of the substrate can be detected with high accuracy.
Effects of the invention
According to the present invention, defects in the surface state of the substrate can be detected with high accuracy.
Drawings
Fig. 1 is a perspective view showing an external appearance of a substrate inspection apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic side view showing the internal configuration of the substrate inspection apparatus.
Fig. 3 is a schematic plan view showing the internal configuration of the substrate inspection apparatus.
Fig. 4 is a block diagram showing the configuration of an in-situ controller for controlling the substrate inspection apparatus.
Fig. 5 is a diagram for explaining an operation of the substrate inspection apparatus.
Fig. 6 is a diagram for explaining an operation of the substrate inspection apparatus.
Fig. 7 is a flowchart showing an operation of the main control unit of the field controller of fig. 4 in the inspection process.
Fig. 8 is a flowchart showing an operation of the main control unit of the field controller of fig. 4 in the inspection process.
Fig. 9 is a schematic plan view showing a substrate processing apparatus provided with the substrate inspection apparatus of fig. 1.
Fig. 10 is a schematic side view showing the internal configuration of the coating processing section, developing processing section, and cleaning and drying processing section of fig. 9.
Fig. 11 is a plan view showing the configuration of the coating processing unit.
Fig. 12 is a schematic side view showing the internal configuration of the heat treatment section and the cleaning/drying treatment section in fig. 9.
Fig. 13 is a schematic side view showing an internal configuration of the conveying section.
Detailed Description
(1) Structure of substrate inspection device
A substrate inspection apparatus, a substrate processing apparatus, a substrate inspection method, and a substrate processing method according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an magneto-optical disk, a substrate for a photomask, or the like. The substrate used in the present embodiment has an outer peripheral portion at least a part of which is circular. For example, the outer peripheral portion other than the notch for positioning has a circular shape.
Fig. 1 is a perspective view showing an external appearance of a substrate inspection apparatus 200 according to an embodiment of the present invention. Fig. 2 is a schematic side view showing the internal configuration of the substrate inspection apparatus 200. Fig. 3 is a schematic plan view showing the internal configuration of the substrate inspection apparatus 200. As shown in fig. 1 and 2, the substrate inspection apparatus 200 includes a housing portion 210, a light projecting portion 220, a reflecting portion 230, a light receiving portion 240, a rotation driving portion 250, a moving portion 260, and a notch detecting portion 270. The light projecting unit 220, the reflecting unit 230, and the light receiving unit 240 constitute the imaging unit 1. The imaging unit 1, the rotation driving unit 250, the moving unit 260, and the notch detecting unit 270 are housed in the case unit 210.
As shown in fig. 1, the case portion 210 includes a substantially rectangular bottom surface portion 211 and four substantially rectangular side surface portions 212 to 215. The side surfaces 212 and 214 are located at both ends in the longitudinal direction of the bottom surface 211, and the side surfaces 213 and 215 are located at both ends in the width direction of the bottom surface 211. By doing so, the housing portion 210 has a substantially rectangular upper opening. The housing portion 210 may further include an upper surface portion closing the upper opening.
Hereinafter, the width direction of the bottom surface portion 211 is simply referred to as the width direction, and the longitudinal direction of the bottom surface portion 211 is referred to as the front-rear direction. In the front-rear direction, the direction from the side surface 214 toward the side surface 212 is defined as the front, and the opposite direction is defined as the rear. A slit-shaped opening 216 for conveying the substrate W between the outside and the inside of the case portion 210 is formed in a portion from the side surface portion 212 to the front of the side surface portion 213.
The light projecting portion 220 includes, for example, one or a plurality of light sources, and is mounted on the inner surfaces of the side surface portions 213 and 215 of the housing portion 210 so as to extend in the width direction. As will be described later, the substrate W to be inspected is carried into the case 210 from the opening 216 and passes under the light projecting unit 220. The light projecting section 220 projects strip-shaped light having a width larger than the diameter of the substrate W obliquely downward and rearward.
The reflecting portion 230 includes, for example, a mirror surface, and the reflecting portion 230 is attached to the inner surfaces of the side surface portions 213 and 215 of the housing portion 210 so as to extend in the width direction rearward of the light projecting portion 220. As shown in fig. 2, the strip light emitted obliquely downward and rearward by the light projecting section 220 is reflected obliquely upward and rearward by the substrate W. The reflection unit 230 reflects the band-shaped light reflected by the substrate W from the rear side in a substantially horizontal direction.
The light receiving portion 240 is mounted on the bottom surface portion 211 of the housing portion 210, rearward of the reflecting portion 230. The light receiving unit 240 is, for example, a camera, and includes a plurality of lenses and a color CCD (charge coupled device) line sensor. The light receiving unit 240 receives the band-shaped light reflected by the reflection unit 230, and generates image data based on pixel data corresponding to the light receiving amount of each pixel. The image data is composed of a plurality of pixel data corresponding to a plurality of pixels.
As shown in fig. 2, the rotation driving unit 250 is, for example, a spin chuck, and the rotation driving unit 250 includes a driving device 251 and a rotation holding unit 252. The driving device 251 is, for example, an electric motor, and the driving device 251 has a rotation shaft 251a. The driving device 251 is provided with an encoder, not shown. The rotation holding portion 252 is mounted on the front end of the rotation shaft 251a of the driving device 251, and is driven to rotate about the vertical axis while holding the substrate W to be inspected.
As shown in fig. 3, the moving portion 260 includes a plurality of (two in this example) guide members 261 and a movement holding portion 262. The plurality of guide members 261 are attached to the bottom surface portion 211 of the housing portion 210 in a state of being separated in the width direction so as to extend in the front-rear direction in parallel. The movement holding portion 262 moves in the front-rear direction along the plurality of guide members 261 while holding the rotation driving portion 250.
The notch detection portion 270 is, for example, a reflective photoelectric sensor including a light projecting element and a light receiving element, and is attached to the front upper portion of the inner surface of the side surface portion 215 of the housing portion 210. When the peripheral edge portion of the substrate W as the inspection object is located below the notch detection portion 270, the notch detection portion 270 emits light downward and receives reflected light from the substrate W. Here, when the notch is formed in the portion of the substrate W located below the notch detection section 270, the light receiving amount of the notch detection section 270 decreases. The notch detecting section 270 detects whether or not the substrate W is notched based on the amount of light received from the substrate W rotated by the rotation driving section 250. In addition, a transmissive photosensor may be used as the notch detection portion 270.
(2) Operation of substrate inspection apparatus
Fig. 4 is a block diagram showing a configuration of a field controller 400 for controlling the substrate inspection apparatus 200. As shown in fig. 4, the field controller 400 includes a main control unit 401, a storage unit 402, an imaging control unit 410, a rotation control unit 420, a movement control unit 430, a direction determination unit 440, and a defect determination unit 450.
The main control unit 401 includes, for example, a CPU (central processing unit). The storage unit 402 includes, for example, a nonvolatile memory or a hard disk, and stores an inspection program for executing an inspection process. The main control unit 401 executes the inspection program stored in the storage unit 402 to realize the functions of the imaging control unit 410, the rotation control unit 420, the movement control unit 430, the direction determination unit 440, and the defect determination unit 450.
The imaging control unit 410 controls the operation of the imaging unit 1. The rotation control section 420 acquires an output signal from an encoder of the driving device 251 (fig. 2) of the rotation driving section 250, detects a rotation angle of the driving device 251 (rotation angle of the substrate W), and acquires a determination result of the orientation of the substrate W from the direction determination section 440. The rotation control unit 420 controls the operation of the rotation driving unit 250 based on the rotation angle of the driving device 251 or the orientation of the substrate W. The movement control unit 430 controls the operation of the movement unit 260.
The direction determination unit 440 controls the operation of the notch detection unit 270. The direction determining unit 440 obtains the detection result of the notch by the notch detecting unit 270, and obtains the rotation angle of the driving device 251 detected by the rotation control unit 420, and determines the orientation of the substrate W based on the rotation angle of the driving device 251 when the notch of the substrate W is detected. The defect determination unit 450 acquires image data from the imaging unit 1, and determines whether or not the surface state of the substrate W is defective based on the image data. The determination result of the defect determination unit 450 is stored in the storage unit 402.
Fig. 5 and 6 are diagrams for explaining the operation of the substrate inspection apparatus 200. In fig. 5 (a) and (b) and fig. 6 (a) and (b), the left side shows a plan view of the substrate inspection apparatus 200, and the right side shows a schematic view of the substrate W to be inspected. In the present embodiment, the substrate W after the development processing is inspected. Therefore, as shown on the right side of fig. 5 (a) to 6 (b), a plurality of chips CH as products are formed on the surface of the substrate W.
In the initial state, as shown in fig. 5 (a), the rotation driving portion 250 is located at the front inside the housing portion 210. In this state, the substrate W to be inspected is carried into the housing 210 through the opening 216 by a carrying mechanism (for example, a carrying mechanism 137 or a carrying mechanism 138 of fig. 13 described later) of the substrate W, and held by the rotation driving unit 250.
Here, while the substrate W is rotated one turn by the rotation driving part 250, light is emitted from the notch detecting part 270 toward the peripheral edge of the substrate W, and the reflected light is received by the notch detecting part 270. By doing so, the notch NT of the substrate W is detected. The direction determination unit 440 in fig. 4 determines the direction of the substrate W. Thereafter, the substrate W is rotated by the rotation driving unit 250 so that the substrate W faces a specific direction.
Next, as shown by the open arrow in fig. 5 (b), the substrate W is moved rearward by the moving portion 260. At this time, the band-shaped light emitted from the light projecting section 220 is scanned relatively in the front-rear direction on the substrate W so that the substrate W passes under the light projecting section 220. By this, the entire substrate W is irradiated with the band-shaped light. The band-shaped light sequentially reflected from the substrate W is reflected by the reflection part 230 and guided to the light receiving part 240. In this way, first image data representing an image of the entire surface of the substrate W is generated.
Next, as shown by the thick arrow in fig. 6 (a), the substrate W is rotated by 90 degrees by the rotation driving section 250. Thereafter, as shown by the open arrow in fig. 6 (b), the substrate W is moved to the front initial position by the moving portion 260. At this time, the substrate W passes under the light projecting section 220 again, and second image data representing an image of the entire surface of the substrate W is generated in the same manner as in the operation (b) in fig. 5. Based on the generated first data and second data, the defect determination unit 450 in fig. 4 determines whether or not the substrate W is defective. The defect determination unit 450 may determine whether or not the substrate W is defective at any time.
(3) Inspection process
Fig. 7 and 8 are flowcharts showing the operation of the main control unit 401 of the field controller 400 of fig. 4 during the inspection process. The inspection process performed by the main control unit 401 will be described with reference to the substrate inspection apparatus 200 of fig. 1 and 2, the field controller 400 of fig. 4, and the flowchart of fig. 7.
First, the main control unit 401 moves the rotation driving unit 250 to an initial position of the front part in the housing unit 210 by the moving unit 260 (step S1). In addition, when the rotation driving unit 250 is located at the initial position in the initial state, the process of step S1 is omitted. Here, the substrate W to be inspected after the development process is carried into the housing 210 by the carrying mechanism through the opening 216. The main control unit 401 holds the loaded substrate W by the rotation driving unit 250 (step S2).
The main control unit 401 rotates the substrate W by the rotation driving unit 250 (step S3), and detects the rotation angle of the substrate W (step S4). Then, the main control unit 401 irradiates the peripheral edge portion of the substrate W with light by the notch detection unit 270 (step S5), and receives the light from the substrate W (step S6). The processing of steps S3 to S6 is performed substantially simultaneously.
The main control section 401 determines whether or not the notch NT of the substrate W is detected by the notch detection section 270 based on the result of the processing of steps S3 to S6 (step S7). When the notch NT of the substrate W is detected, the main control section 401 determines the orientation of the substrate W based on the rotation angle of the substrate W when the notch NT is detected (step S8). In step S7, when the notch NT of the substrate W is not detected, the process proceeds to step S9.
In step S9, the main control unit 401 determines whether or not the substrate W has rotated 360 degrees (step S9). When the substrate W is not rotated 360 degrees, the process returns to step S3, and the processes from step S3 to step S8 are repeated. When the substrate W has been rotated 360 degrees, the main control unit 401 rotates the substrate W by the rotation driving unit 250 so that the substrate W is oriented in a specific direction (step S10).
Next, the main control unit 401 moves the substrate W backward together with the rotation driving unit 250 by the moving unit 260 (step S11). Here, the substrate W passes under the light projecting section 220. The main control unit 401 irradiates the substrate W with the band-shaped light by the imaging unit 1 (step S12), and receives the band-shaped light from the substrate W (step S13). The processing of steps S11 to S13 is performed substantially simultaneously. The main control unit 401 generates first image data by the imaging unit 1 based on the results of the processing in steps S11 to S13 (step S14). Further, the main control section 401 rotates the substrate W by 90 degrees by the rotation driving section 250 (step S15).
Then, the substrate W is moved forward (initial position) by the moving unit 260 together with the rotation driving unit 250 (step S16). Here, the substrate W passes under the light projecting section 220 again. The main control unit 401 irradiates the substrate W with the band-shaped light by the imaging unit 1 (step S17), and receives the band-shaped light from the substrate W (step S18). The processing of steps S16 to S18 is performed substantially simultaneously. The main control unit 401 generates second image data by the imaging unit 1 based on the results of the processing in steps S16 to S18 (step S18).
The main control unit 401 determines whether or not the surface state of the substrate W is defective based on the generated first image data and second image data (step S20). Finally, the main control unit 401 stores the determination result of whether or not there is a defect in the surface state of the substrate W in the storage unit 402 of fig. 4 (step S21), and ends the inspection process.
(4) Substrate processing apparatus
Fig. 9 is a schematic plan view of the substrate processing apparatus 100 provided with the substrate inspection apparatus 200 of fig. 1. In fig. 9 and the subsequent predetermined drawings, arrows indicating the X direction, Y direction, and Z direction orthogonal to each other are labeled for the sake of specifying the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.
As shown in fig. 9, the substrate processing apparatus 100 includes an index module 11, a coating module 12, a developing module 13, a cleaning and drying processing module 14A, and a carry-in/out module 14B. The interface module 14 is constituted by a purge/dry processing module 14A and a carry-in/out module 14B. The exposure device 15 is disposed adjacent to the carry-in/out module 14B.
The index module 11 includes a plurality of carrier placement units 111 and a conveyance unit 112. Each carrier placement portion 111 accommodates therein a carrier 113 that accommodates a plurality of substrates W in multiple layers. The conveying unit 112 is provided with a main controller 114 and a conveying mechanism 115. The main controller 114 controls various components of the substrate processing apparatus 100. The transport mechanism 115 transports the substrate W while holding the substrate W.
The coating module 12 includes a coating processing unit 121, a conveying unit 122, and a heat treatment unit 123. The coating processing unit 121 and the heat processing unit 123 are provided so as to face each other with the conveying unit 122 interposed therebetween. Between the transport unit 122 and the index module 11, substrate placement units PASS1 to PASS4 (see fig. 13) are provided for placing the substrates W. The transport unit 122 is provided with transport mechanisms 127 and 128 (see fig. 13) for transporting the substrate W.
The developing module 13 includes a developing process portion 131, a conveying portion 132, and a heat process portion 133. The development processing unit 131 and the heat processing unit 133 are provided so as to face each other with the conveyance unit 132 interposed therebetween. Substrate placement units PASS 5 to PASS8 for placing the substrates W are provided between the conveyance unit 132 and the conveyance unit 122 (see fig. 13). The transport unit 132 is provided with transport mechanisms 137 and 138 (see fig. 13) for transporting the substrate W.
The cleaning and drying module 14A includes cleaning and drying units 161 and 162 and a conveying unit 163. The cleaning and drying units 161 and 162 are provided so as to face each other with the conveying unit 163 interposed therebetween. The conveying unit 163 is provided with conveying mechanisms 141 and 142.
Placement and buffer portions P-BF1 and P-BF2 are provided between the conveying portion 163 and the conveying portion 132 (see FIG. 13). The placement and buffer sections P-BF1 and P-BF2 are configured to accommodate a plurality of substrates W.
A substrate placement unit PASS 9 and a placement/cooling unit P-CP (described later) are provided between the conveying mechanisms 141 and 142 so as to be adjacent to the carry-in/out module 14B (see fig. 13). The placement/cooling portion P-CP has a function (e.g., a cooling plate) of cooling the substrate W. In the placement/cooling section P-CP, the substrate W is cooled to a temperature suitable for the exposure process. The carry-in/carry-out module 14B is provided with a carrying mechanism 143. The transport mechanism 143 carries the substrate W into and out of the exposure device 15.
(5) Coating processing unit and developing processing unit
Fig. 10 is a schematic side view showing the internal configuration of the coating processing unit 121, the developing processing unit 131, and the cleaning and drying processing unit 161 in fig. 9. As shown in fig. 10, the coating processing unit 121 is provided with coating processing chambers 21, 22, 23, 24 in a hierarchical manner. A coating processing unit 129 is provided in each of the coating processing chambers 21, 22, 23, 24. The developing process portion 131 is provided with developing process chambers 31, 32, 33, 34 in a hierarchical manner. A development process unit 139 is provided in each of the development process chambers 31, 32, 33, 34.
Fig. 11 is a plan view showing the configuration of the coating processing unit 129. As shown in fig. 10 and 11, each coating processing unit 129 includes a standby section 20, a plurality of spin chucks 25, a plurality of shields 27, a plurality of processing liquid nozzles 28, a nozzle conveying mechanism 29, and a plurality of edge rinse nozzles 30. In the present embodiment, two spin chucks 25, the shroud 27, and the edge rinse nozzles 30 are provided for each of the coating process units 129.
Each spin chuck 25 is rotationally driven by a driving device (e.g., an electric motor), not shown, while holding the substrate W. The shroud 27 is provided so as to surround the periphery of the spin chuck 25. Various treatment liquids are supplied from a treatment liquid reservoir, not shown, to the respective treatment liquid nozzles 28 through treatment liquid pipes. When the processing liquid is not supplied to the substrate W in standby, each processing liquid nozzle 28 is inserted into the standby section 20. When the processing liquid is supplied to the substrate W, any one of the processing liquid nozzles 28 in the standby section 20 is held by the nozzle carrying mechanism 29 and carried to the upper side of the substrate W.
The spin chuck 25 rotates and ejects the processing liquid from the processing liquid nozzle 28, thereby applying the processing liquid to the rotated substrate W. In the present embodiment, the coating processing units 129 of the coating processing chambers 22 and 24 in fig. 10 supply a processing liquid for antireflection film (hereinafter referred to as an antireflection liquid) from the processing liquid nozzle 28 to the substrate W. The coating processing units 129 of the coating processing chambers 21 and 23 supply a processing liquid for a resist film (hereinafter referred to as a resist liquid) from the processing liquid nozzle 28 to the substrate W.
The edge rinse nozzle 30 moves from a predetermined standby position to the vicinity of the peripheral edge of the substrate W. Here, the peripheral edge portion of the substrate W refers to a region of a fixed width along the outer peripheral portion of the substrate W on the surface of the substrate W. The spin chuck 25 rotates and ejects a rinse liquid from the edge rinse nozzle 30 toward the peripheral edge of the rotated substrate W, so that the peripheral edge of the processing liquid applied to the substrate W is dissolved. In this way, the processing liquid at the peripheral edge of the substrate W is removed.
As shown in fig. 10, the development processing unit 139 includes a plurality of spin chucks 35 and a plurality of shields 37, as in the coating processing unit 129. As shown in fig. 9, the developing unit 139 includes two slit nozzles 38 for discharging the developer, and a moving mechanism 39 for moving the slit nozzles 38 in the X direction. The developing process unit 139 rotates the spin chuck 35 using a driving device not shown. By this, the substrate W is rotated. The slit nozzle 38 supplies the developer to each of the substrates W while moving. In this way, the development process of the substrate W is performed.
A plurality of (4 in this example) cleaning and drying process units SD1 are provided in the cleaning and drying process section 161. In the cleaning and drying process unit SD1, the substrate W is cleaned and dried before the exposure process.
(6) Heat treatment section
Fig. 12 is a schematic side view showing the internal configuration of the heat treatment sections 123 and 133 and the cleaning and drying treatment section 162 in fig. 9. As shown in fig. 12, the heat treatment section 123 includes an upper heat treatment section 101 provided above and a lower heat treatment section 102 provided below. A plurality of heat treatment units PHP, a plurality of adhesion-enhancing treatment units PAHP, and a plurality of cooling units CP are provided in the upper heat treatment portion 101 and the lower heat treatment portion 102.
A field controller 300 is provided at the uppermost portion of the heat treatment section 123. The field controller 300 controls the operations of the coating processing unit 121, the conveying unit 122, and the heat treatment unit 123 based on instructions from the main controller 114 in fig. 9.
In the heat treatment unit PHP, a heating treatment and a cooling treatment of the substrate W are performed. In the adhesion enhancing treatment unit PAHP, an adhesion enhancing treatment for improving the adhesion between the substrate W and the antireflection film is performed. Specifically, in the adhesion enhancing treatment unit PAHP, an adhesion enhancing agent such as HMDS (hexamethyldisilazane) is applied to the substrate W, and the substrate W is subjected to a heat treatment. The cooling unit CP performs a cooling process for the substrate W.
The heat treatment section 133 has an upper heat treatment section 103 provided above and a lower heat treatment section 104 provided below. The upper heat treatment unit 103 and the lower heat treatment unit 104 are provided with a cooling unit CP, a plurality of heat treatment units PHP, an edge exposure unit EEW, and a substrate inspection apparatus 200. The heat treatment unit PHP of the upper heat treatment unit 103 and the lower heat treatment unit 104 is configured to be capable of carrying the substrate W into the heat treatment unit PHP from the cleaning and drying treatment module 14A.
The field controller 400 of fig. 4 is provided at the uppermost portion of the heat treatment section 133. The in-situ controller 400 controls the operations of the substrate inspection apparatus 200 and the operations of the development processing unit 131, the conveying unit 132, and the heat treatment unit 133 based on instructions from the main controller 114 in fig. 9.
In the edge exposure portion EEW, an exposure process (edge exposure process) is performed on the peripheral edge portion of the substrate W. By performing the edge exposure process on the substrate W, the resist film on the peripheral edge of the substrate W is removed in the subsequent development process. In this way, when the peripheral edge portion of the substrate W is in contact with another portion after the development process, the resist film on the peripheral edge portion of the substrate W is prevented from being peeled off and becoming fine particles. In the substrate inspection apparatus 200, the surface state of the substrate W after the development process is inspected.
A plurality of (five in this example) cleaning and drying process units SD2 are provided in the cleaning and drying process section 162. In the cleaning and drying process unit SD2, the substrate W after the exposure process is cleaned and dried.
(7) Conveying part
Fig. 13 is a schematic side view showing the internal configuration of the conveying units 122, 132, 163. As shown in fig. 13, the conveying section 122 includes an upper conveying chamber 125 and a lower conveying chamber 126. The conveying section 132 has an upper conveying chamber 135 and a lower conveying chamber 136. The upper conveyance chamber 125 is provided with a middle conveyance mechanism 127, and the lower conveyance chamber 126 is provided with a conveyance mechanism 128. Further, a conveyance mechanism 137 is provided in the upper conveyance chamber 135, and a conveyance mechanism 138 is provided in the lower conveyance chamber 136.
The coating chambers 21 and 22 (fig. 10) face the upper heat treatment unit 101 (fig. 12) through the upper conveying chamber 125, and the coating chambers 23 and 24 (fig. 10) face the lower heat treatment unit 102 (fig. 12) through the lower conveying chamber 126. The developing chambers 31 and 32 (fig. 10) face the upper heat treatment section 103 (fig. 12) through the upper conveying chamber 135, and the developing chambers 33 and 34 (fig. 10) face the lower heat treatment section 104 (fig. 12) through the lower conveying chamber 136.
Substrate placement units PASS 1 and PASS 2 are provided between the transfer unit 112 and the upper transfer chamber 125, and substrate placement units PASS 3 and PASS 4 are provided between the transfer unit 112 and the lower transfer chamber 126. Substrate placement units PASS 5 and PASS 6 are provided between the upper transfer chamber 125 and the upper transfer chamber 135, and substrate placement units PASS 7 and PASS 8 are provided between the lower transfer chamber 126 and the lower transfer chamber 136.
A placement and buffer section P-BF1 is provided between the upper conveyance chamber 135 and the conveyance section 163, and a placement and buffer section P-BF2 is provided between the lower conveyance chamber 136 and the conveyance section 163. The transfer unit 163 includes a substrate placement unit PASS 9 and a plurality of placement/cooling units P-CP adjacent to the carry-in/out module 14B.
The placement and buffer portion P-BF1 is configured to be capable of carrying in and carrying out the substrate W by the carrying mechanism 137 and the carrying mechanism 141 (fig. 9). The placement and buffer portion P-BF2 is configured to be capable of carrying in and out the substrate W by the carrying mechanism 138 and the carrying mechanism 141 (fig. 9). The substrate placing portion PASS 9 and the placing and cooling portion P-CP are configured to be capable of carrying in and out the substrate W by the carrying mechanisms 141 and 142 (fig. 9) and the carrying mechanism 143.
The substrates W transported from the index module 11 to the coating module 12 are placed in the substrate placement units PASS 1 and PASS 3, and the substrates W transported from the coating module 12 to the index module 11 are placed in the substrate placement units PASS2 and PASS 4.
The substrates W transported from the coating module 12 to the developing module 13 are placed in the substrate placement units PASS 5 and PASS7, and the substrates W transported from the developing module 13 to the coating module 12 are placed in the substrate placement units PASS 6 and PASS 8.
The substrates W transported from the developing module 13 to the rinse/dry process module 14A are placed in the placement/buffer portions P-BF1 and P-BF 2. The substrate W transported from the purge/dry process module 14A to the carry-in/out module 14B is placed in the placement/cooling unit P-CP. The substrate W transported from the carry-in/out module 14B to the purge/dry process module 14A is placed in the substrate placement portion PASS 9.
The transfer mechanism 127 transfers the substrate W between the coating chambers 21 and 22 (fig. 10), the substrate placement units PASS 1, PASS2, PASS 5, PASS 6, and the upper heat treatment unit 101 (fig. 12). The transfer mechanism 128 transfers the substrate W between the coating chambers 23 and 24 (fig. 10), the substrate placement units PASS 3, PASS4, PASS7, PASS8, and the lower heat treatment unit 102 (fig. 12).
The transfer mechanism 137 transfers the substrate W between the developing chambers 31 and 32 (fig. 10), the substrate placing portions PASS 5 and PASS6, the placing and buffer portion P-BF1, and the upper heat treatment portion 103 (fig. 12). The transfer mechanism 138 transfers the substrate W between the developing chambers 33 and 34 (fig. 10), the substrate placing portions PASS 7 and PASS 8, the placing and buffer portion P-BF2, and the lower heat treatment portion 104 (fig. 12).
(8) Substrate processing
The substrate processing will be described with reference to fig. 9, 10, 12, and 13. A carrier 113 accommodating an unprocessed substrate W is placed in the carrier placement section 111 (fig. 9) of the index module 11. The transfer mechanism 115 transfers the unprocessed substrates W from the carrier 113 to the substrate placement units PASS 1 and PASS 3 (fig. 13). Then, the transfer mechanism 115 transfers the processed substrates W placed in the substrate placement units PASS 2 and PASS 4 (fig. 13) to the carrier 113.
In the coating module 12, the conveyance mechanism 127 (fig. 13) conveys the unprocessed substrate W placed in the substrate placement section PASS 1 to the adhesion enhancing processing unit PAHP (fig. 12), the cooling unit CP (fig. 12), and the coating processing chamber 22 (fig. 10) in this order. Next, the transfer mechanism 127 sequentially transfers the substrate W in the coating chamber 22 to the heat treatment unit PHP (fig. 12), the cooling unit CP (fig. 12), the coating chamber 21 (fig. 10), the heat treatment unit PHP (fig. 12), and the substrate placement unit PASS 5 (fig. 13).
In this case, after the adhesion strengthening treatment is performed on the substrate W in the adhesion strengthening treatment unit PAHP, the substrate W is cooled to a temperature suitable for forming the antireflection film in the cooling unit CP. Next, in the coating chamber 22, an antireflection film is formed on the substrate W by the coating processing unit 129 (fig. 10). Next, after the heat treatment of the substrate W in the heat treatment unit PHP, the substrate W is cooled to a temperature suitable for forming a resist film in the cooling unit CP. Next, in the coating process chamber 21, a resist film is formed on the substrate W by the coating process unit 129 (fig. 10). Thereafter, the substrate W is subjected to heat treatment in the heat treatment unit PHP, and the substrate W is placed in the substrate placement portion PASS 5.
The transfer mechanism 127 transfers the substrate W after the development process and the inspection process placed in the substrate placement unit PASS 6 (fig. 13) to the substrate placement unit PASS 2 (fig. 13).
The conveyance mechanism 128 (fig. 13) conveys the unprocessed substrate W placed in the substrate placement section PASS 3 to the adhesion enhancing processing unit PAHP (fig. 12), the cooling unit CP (fig. 12), and the coating processing chamber 24 (fig. 10) in this order. Next, the transfer mechanism 128 sequentially transfers the substrate W in the coating chamber 24 to the heat treatment unit PHP (fig. 12), the cooling unit CP (fig. 12), the coating chamber 23 (fig. 10), the heat treatment unit PHP (fig. 12), and the substrate placement unit PASS 7 (fig. 13).
The transfer mechanism 128 (fig. 13) transfers the substrate W after the development process and the inspection process placed in the substrate placement unit PASS 8 (fig. 13) to the substrate placement unit PASS 4 (fig. 13). The processing contents of the substrates W in the coating chambers 23, 24 (fig. 10) and the lower heat treatment section 102 (fig. 12) are the same as the processing contents of the substrates W in the coating chambers 21, 22 (fig. 10) and the upper heat treatment section 101 (fig. 12), respectively.
In the developing module 13, the transfer mechanism 137 (fig. 13) sequentially transfers the substrate W after the formation of the resist film placed in the substrate placement portion PASS 5 to the edge exposure portion EEW (fig. 12) and the placement/buffer portion P-BF1 (fig. 13). In this case, the edge exposure portion EEW performs an edge exposure process on the substrate W. The substrate W after the edge exposure treatment is placed in the placement/buffer portion P-BF1.
The transfer mechanism 137 (fig. 13) takes out the substrate W after the exposure process and the heat process from the heat treatment unit PHP (fig. 12) adjacent to the cleaning and drying process module 14A. The transfer mechanism 137 sequentially transfers the substrate W to any one of the cooling unit CP (fig. 12), the developing chambers 31 and 32 (fig. 10), the heat treatment unit PHP (fig. 12), the substrate inspection apparatus 200 (fig. 12), and the substrate placement portion PASS 6 (fig. 13).
In this case, the substrate W is cooled to a temperature suitable for the development process in the cooling unit CP, and then the development process of the substrate W is performed in either one of the development process chambers 31 and 32 by the development process unit 139. Thereafter, the substrate W is subjected to heat treatment in the heat treatment unit PHP. Then, the substrate inspection apparatus 200 performs an inspection process of the substrate W, and places the substrate W in the substrate placement portion PASS 6.
The transfer mechanism 138 (fig. 13) sequentially transfers the substrate W after the resist film is formed, which is placed in the substrate placement portion PASS 7, to the edge exposure portion EEW (fig. 12) and the placement/buffer portion P-BF2 (fig. 13).
The transfer mechanism 138 (fig. 13) then takes out the substrate W after the exposure process and the heat process from the heat treatment unit PHP (fig. 12) adjacent to the interface module 14. The transfer mechanism 138 sequentially transfers the substrate W to any one of the cooling unit CP (fig. 12), the developing chambers 33 and 34 (fig. 10), the heat treatment unit PHP (fig. 12), the substrate inspection apparatus 200 (fig. 12), and the substrate placement unit PASS 8 (fig. 13). The processing contents of the substrates W in the developing chambers 33, 34 and the lower heat treatment section 104 are the same as the processing contents of the substrates W in the developing chambers 31, 32 and the upper heat treatment section 103, respectively.
In the cleaning and drying module 14A, the substrate W placed in the placement and buffer areas P-BF1 and P-BF2 (fig. 13) is sequentially transferred to the cleaning and drying unit SD1 (fig. 10) and the placement and cooling unit P-CP (fig. 13) by the transfer mechanism 141 (fig. 9). In this case, after the cleaning and drying process of the substrate W is performed in the cleaning and drying process unit SD1, the substrate W is cooled in the placing and cooling portion P-CP to a temperature suitable for the exposure process by the exposure device 15 (fig. 9).
The transfer mechanism 142 (fig. 9) sequentially transfers the substrate W subjected to the exposure process placed in the substrate placement portion PASS 9 (fig. 13) to the cleaning and drying process unit SD2 (fig. 12) and the heat process unit PHP (fig. 12) of the upper heat process portion 103 or the lower heat process portion 104. In this case, after the cleaning and drying process of the substrate W in the cleaning and drying process unit SD2, the post-exposure baking (PEB, post exposure bake) process is performed in the heat process unit PHP.
In the carry-in/carry-out module 14B, the transport mechanism 143 (fig. 9) transports the substrate W before the exposure process placed in the placement/cooling section P-CP (fig. 13) to the exposure device 15. Then, the transfer mechanism 143 (fig. 9) takes out the substrate W after the exposure processing from the exposure device 15, and transfers the substrate W to the substrate placement unit PASS 9 (fig. 13).
(9) Effects of
In the substrate inspection apparatus 200 of the present embodiment, the first image data is generated by photographing the substrate W held by the rotation holding portion 252 by the photographing portion 1. Then, the substrate W is rotated by a predetermined angle by the rotation holding portion 252. After the rotation of the substrate W, the second image data is generated by photographing the substrate W held by the rotation holding portion 252 by the photographing portion 1. Based on the first image data and the second image data, whether the surface state of the substrate W is defective or not is determined.
According to this configuration, the surface of the substrate W represented by the first image data and the surface of the substrate W represented by the second image data are different in terms of gloss and the like. Therefore, when there is a defect on the surface of the substrate W, there is an increased possibility that the defect appears clearly in an image represented by at least one of the first image data and the second image data. In this way, defects in the surface state of the substrate W can be detected with high accuracy. Further, since the inspection is performed in a state where the orientations of the plurality of substrates W are aligned, the plurality of substrates W can be inspected uniformly.
In the present embodiment, the substrate W and the imaging unit 1 are reciprocally moved in the front-rear direction by the moving unit 260, whereby the first imaging data and the second imaging data are generated. Further, the entire surface of the substrate W can be photographed by the small photographing unit 1. By doing so, the first photographing data and the second photographing data can be obtained in a short time, and the volume of the substrate inspection apparatus 200 can be reduced.
(10) Other embodiments
(a) In the above embodiment, the inspection process is performed after the development process, but the present invention is not limited thereto. The inspection process may also be performed before or after, for example, the edge exposure process, or at other points in time.
(b) In the above embodiment, the rotation angle of the substrate W in the process of step S15 is 90 degrees, but the present invention is not limited thereto. The rotation angle of the substrate W may be a desired angle. In this case, the rotation angle of the substrate W is preferably an angle other than an integer multiple of 180 degrees, and more preferably an angle of an odd multiple of 90 degrees.
In this case, the case of the surface of the substrate W represented by the first image data is greatly different from the case of the surface of the substrate W represented by the second image data. By doing so, in the case where there is a defect on the surface of the substrate W, the possibility of the defect clearly appearing in the image represented by the first image data or the second image data can be further improved.
(c) In the above embodiment, the substrate W is rotated so that the substrate W is oriented in a specific direction in step S10, but the present invention is not limited thereto. When the substrate processing apparatus 100 is configured to carry the substrate W into the substrate inspection apparatus 200 in a specific direction, the processes of step S3 to step S10 may be omitted, and the notch detection unit 270 may not be provided in the substrate inspection apparatus 200. Similarly, when the inspection process can be performed with the substrate W oriented in any direction, the processes of step S3 to step S10 may be omitted, and the notch detection unit 270 may not be provided in the substrate inspection apparatus 200.
(d) In the above embodiment, the light projecting section 220 and the light receiving section 240 of the imaging section 1 are separately and independently configured, but the present invention is not limited to this. The light projecting section 220 and the light receiving section 240 of the imaging section 1 may be integrally formed.
(e) In the above embodiment, the reflecting section 230 is provided in the imaging section 1, but the present invention is not limited to this. When the light receiving unit 240 is configured to directly receive the band-shaped light from the substrate W, the reflection unit 230 may not be provided in the imaging unit 1.
(f) In the above embodiment, the moving unit 260 is configured to move the rotation driving unit 250 (substrate W) in the front-rear direction with respect to the imaging unit 1, but the present invention is not limited thereto. The moving unit 260 may be configured to move the imaging unit 1 in the front-rear direction relative to the rotation driving unit 250. Therefore, the moving unit 260 may be configured to move the imaging unit 1 in the front-rear direction with respect to the rotation driving unit 250.
(g) In the above embodiment, the imaging unit 1 and the rotation driving unit 250 are relatively moved, but the present invention is not limited thereto. When the imaging area of the imaging unit 1 is larger than the entire surface of the substrate W, the imaging unit 1 and the rotation driving unit 250 may not be relatively moved, and the moving unit 260 may not be provided in the substrate inspection apparatus 200.
(h) In the above embodiment, the substrate inspection apparatus 200 is provided in the heat treatment section 133 of the substrate processing apparatus 100, but the present invention is not limited thereto. The substrate inspection apparatus 200 may be provided in other places such as the coating module 12 of the substrate processing apparatus 100. Alternatively, the substrate inspection apparatus 200 may be provided separately for performing the inspection process on the substrate, instead of being provided in the substrate processing apparatus 100.
(11) Correspondence between each constituent element of the embodiment and each element of the embodiment
The following describes examples of the correspondence between each constituent element of the embodiments and each element of the embodiments, but the present invention is not limited to the following examples.
In the above embodiment, the substrate W is an example of a substrate, the rotation holding portion 252 is an example of a rotation holding portion, the imaging portion 1 is an example of an imaging portion, and the imaging control portion 410 is an example of a first imaging control portion and a second imaging control portion. The rotation control unit 420 is an example of the first to third rotation control units, the defect determination unit 450 is an example of the determination unit, the substrate inspection apparatus 200 is an example of the substrate inspection apparatus, the light projection unit 220 is an example of the light projection unit, and the light receiving unit 240 is an example of the light receiving unit.
The movement unit 260 is an example of a relative movement unit, the movement control unit 430 is an example of a first movement control unit and a second movement control unit, the movement holding unit 262 is an example of a movement holding unit, and the direction determination unit 440 is an example of a direction determination unit. The notch detecting section 270 is an example of a notch detecting section, the coating processing unit 129 is an example of a film forming section, the conveying mechanisms 127, 128, 137, 138 are examples of conveying mechanisms, and the substrate processing apparatus 100 is an example of a substrate processing apparatus.
As each constituent element of the embodiments, other various elements having the structure or function described in the embodiments may be used.
Industrial applicability
The invention can be effectively used for checking the surfaces of various substrates.

Claims (12)

1. A substrate inspection apparatus includes:
a rotation holding part for holding the substrate in a manner that the substrate can rotate,
an imaging section configured to image the substrate held by the rotation holding section, including a light projecting section that emits light extending longer than a diameter of the substrate in a first direction, and a light receiving section that receives reflected light from the substrate and generates first image data or second image data representing an image of the substrate based on the light receiving amount,
a relative movement section configured to relatively move the imaging section and the rotation holding section in a second direction intersecting the first direction or a third direction opposite to the second direction so that the light from the light projecting section is irradiated to the entire surface of one surface of the substrate,
a first movement control unit that controls the relative movement unit so that the imaging unit and the rotation holding unit move relatively in the second direction when the first imaging is performed,
A first photographing control section that controls the photographing section to generate the first image data when the first photographing is performed,
a first rotation control unit that controls the rotation holding unit to rotate the substrate by a predetermined angle after the first imaging is performed,
a second movement control unit that controls the relative movement unit so that the imaging unit and the rotation holding unit move relatively in the third direction when the first rotation control unit rotates the substrate and then performs a second imaging,
a second photographing control section that controls the photographing section to generate the second image data when the second photographing is performed, and
and a determination unit configured to determine whether or not the surface state of the substrate is defective based on the first image data and the second image data.
2. The substrate inspection apparatus according to claim 1, wherein,
the relative movement portion includes a movement holding portion that holds the rotation holding portion and moves the rotation holding portion in the second direction or the third direction with respect to the photographing portion.
3. The substrate inspection apparatus according to claim 1 or 2, wherein,
the light projecting section and the light receiving section are independently arranged.
4. A substrate inspection apparatus includes:
a rotation holding part for holding the substrate in a manner that the substrate can rotate,
an imaging unit configured to image the substrate held by the rotation holding unit,
a first photographing control section that controls the photographing section to generate first image data representing an image of the substrate when performing a first photographing,
a first rotation control unit that controls the rotation holding unit to rotate the substrate by a predetermined angle after the first imaging is performed,
a second photographing control section that controls the photographing section to generate second image data representing an image of the substrate when the first photographing control section rotates the substrate and performs a second photographing, and
a determination unit configured to determine whether or not the surface state of the substrate is defective based on the first image data and the second image data,
the first rotation control unit controls the rotation holding unit so that the orientation of the substrate at the time of the first photographing is not parallel to the orientation of the substrate at the time of the second photographing.
5. A substrate inspection apparatus includes:
a rotation holding part for holding the substrate in a manner that the substrate can rotate,
An imaging unit configured to image the substrate held by the rotation holding unit,
a first photographing control section that controls the photographing section to generate first image data representing an image of the substrate when performing a first photographing,
a first rotation control unit that controls the rotation holding unit to rotate the substrate by a predetermined angle after the first imaging is performed,
a second photographing control section that controls the photographing section to generate second image data representing an image of the substrate when the first photographing control section rotates the substrate and performs a second photographing, and
a determination unit configured to determine whether or not the surface state of the substrate is defective based on the first image data and the second image data,
the predetermined angle is an angle that is an odd multiple of 90 degrees.
6. The substrate inspection apparatus according to any one of claims 1, 2, 4, 5, further comprising:
a direction determination unit configured to determine an orientation of the substrate held by the rotation holding unit, and
and a second rotation control unit that controls the rotation holding unit based on the orientation of the substrate determined by the orientation determination unit so as to orient the substrate in a specific orientation before the first imaging is performed.
7. The substrate inspection apparatus according to claim 6, further comprising:
a third rotation control part for controlling the rotation holding part to rotate the substrate at least one turn before the second rotation control part rotates the substrate, and
a notch detecting section that detects a notch of the substrate rotated by the third rotation control section;
the direction determination section determines the orientation of the substrate based on the rotation angle of the substrate when the notch detection section detects the notch of the substrate.
8. A substrate processing apparatus includes:
a film forming section for supplying a coating liquid to the surface of the substrate to thereby form a coating film on the surface,
the substrate inspection apparatus according to any one of claims 1 to 7, wherein the surface state of the substrate on which the coating film is formed by the film forming portion is inspected, and
and a conveying mechanism for conveying the substrate between the film forming part and the substrate inspection device.
9. A substrate inspection method, comprising:
a step of holding the substrate by a rotation holding part in a manner that the substrate can rotate,
a step of emitting light extending longer than the diameter of the substrate in the first direction by the light emitting section of the photographing section,
A step of relatively moving the imaging unit and the rotation holding unit in a second direction intersecting the first direction by a relative movement unit so that the light from the light projecting unit irradiates the entire surface of one surface of the substrate during the first imaging,
a step of receiving reflected light from the substrate held by the rotation holding section by a light receiving section of the photographing section and photographing the substrate at the time of the first photographing, thereby generating first image data for representing an image of the substrate based on the light receiving amount,
a step of rotating the substrate by a predetermined angle by the rotation holding unit after the first photographing is performed,
a step of relatively moving the imaging unit and the rotation holding unit in a third direction opposite to the second direction by the relative movement unit so that the light from the light projecting unit is irradiated to the entire surface of the substrate when the second imaging is performed after the substrate is rotated,
a step of receiving reflected light from the substrate held by the rotation holding section by the light receiving section and performing imaging at the time of performing the second imaging, thereby generating second image data representing an image of the substrate based on the light receiving amount, and
And determining whether the surface state of the substrate is defect-free based on the first image data and the second image data.
10. A substrate inspection method, comprising:
a step of holding the substrate by a rotation holding part in a manner that the substrate can rotate,
a step of photographing the substrate held by the rotation holding section at the time of performing the first photographing, thereby generating first image data representing an image of the substrate,
a step of rotating the substrate by a predetermined angle by the rotation holding unit after the first photographing is performed,
a step of photographing the substrate held by the rotation holding section to generate second image data representing an image of the substrate when the second photographing is performed after the substrate is rotated, and
determining whether or not the surface state of the substrate is defective based on the first image data and the second image data;
in the step of rotating the substrate, the substrate is rotated so that the orientation of the substrate at the time of performing the first photographing is not parallel to the orientation of the substrate at the time of performing the second photographing.
11. A substrate inspection method, comprising:
A step of holding the substrate by a rotation holding part in a manner that the substrate can rotate,
a step of photographing the substrate held by the rotation holding section at the time of performing the first photographing, thereby generating first image data representing an image of the substrate,
a step of rotating the substrate by a predetermined angle by the rotation holding unit after the first photographing is performed,
a step of photographing the substrate held by the rotation holding section to generate second image data representing an image of the substrate when the second photographing is performed after the substrate is rotated, and
determining whether or not the surface state of the substrate is defective based on the first image data and the second image data;
the predetermined angle is an angle that is an odd multiple of 90 degrees.
12. A substrate processing method, comprising:
a step of supplying a coating liquid to the surface of the substrate by the film forming section, thereby forming a coating film on the surface,
a step of conveying the substrate, the surface of which is coated with the coating film formed by the film forming part, by a conveying mechanism, and
the substrate inspection method according to any one of claims 9 to 11, wherein the surface state of the substrate conveyed by the conveying mechanism is inspected.
CN201780047626.XA 2016-09-02 2017-04-03 Substrate inspection apparatus, substrate processing apparatus, substrate inspection method, and substrate processing method Active CN109564853B (en)

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7122192B2 (en) * 2018-08-21 2022-08-19 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM
JP7146528B2 (en) * 2018-08-28 2022-10-04 株式会社Ｓｃｒｅｅｎホールディングス Substrate inspection device, substrate processing device, substrate inspection method, and substrate processing method
JP7090005B2 (en) * 2018-10-05 2022-06-23 東京エレクトロン株式会社 Board processing equipment and inspection method
JP7153521B2 (en) * 2018-10-05 2022-10-14 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND INSPECTION METHOD
WO2020133542A1 (en) * 2018-12-29 2020-07-02 深圳配天智能技术研究院有限公司 Inspection apparatus and inspection method
JP7294818B2 (en) * 2019-01-29 2023-06-20 株式会社Ｓｃｒｅｅｎホールディングス Substrate inspection device, substrate processing device, substrate inspection method, and substrate processing method
JP7261052B2 (en) * 2019-03-26 2023-04-19 株式会社Ｓｃｒｅｅｎホールディングス SUBSTRATE PROCESSING APPARATUS AND TRANSPORT CONTROL METHOD THEREOF
KR20220006560A (en) * 2019-05-08 2022-01-17 도쿄엘렉트론가부시키가이샤 Bonding apparatus, bonding system and bonding method
JP7360687B2 (en) * 2019-05-21 2023-10-13 株式会社昭和電気研究所 Wafer inspection equipment
JP2021048322A (en) * 2019-09-19 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス Substrate transferring apparatus and substrate transfer method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102338990A (en) * 2010-07-16 2012-02-01 东京毅力科创株式会社 Substrate processing apparatus, substrate processing method and non-transitory computer storage medium
JP2012194059A (en) * 2011-03-16 2012-10-11 Tokyo Electron Ltd Image creation method, substrate inspection method, recording medium with program for executing image creation method or substrate inspection method recorded thereon, and substrate inspection device
CN103718210A (en) * 2011-08-03 2014-04-09 雅马哈发动机株式会社 Tdi sensor, image capturing device, component mounting apparatus, component testing apparatus, and substrate inspection apparatus
JP2014190797A (en) * 2013-03-27 2014-10-06 Tokushima Densei Kk Defect inspection device for silicon wafer
JP2016025293A (en) * 2014-07-24 2016-02-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate holding inspection method and substrate processing apparatus
JP2016061683A (en) * 2014-09-18 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス Inspection device and substrate processing device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6128810A (en) * 1984-07-20 1986-02-08 Hitachi Ltd Mask pattern observation method
JP2002071576A (en) * 2000-09-04 2002-03-08 Sharp Corp Visual inspection apparatus and visual inspection method
JP2008064595A (en) * 2006-09-07 2008-03-21 Olympus Corp Substrate inspecting device
JP2010034133A (en) * 2008-07-25 2010-02-12 Just:Kk Crack detecting device for polycrystalline silicon wafer
JP5410212B2 (en) 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus, substrate processing system, and inspection peripheral exposure apparatus
JP3178129U (en) * 2012-06-21 2012-08-30 東京エレクトロン株式会社 Board inspection equipment
JP5717711B2 (en) * 2012-12-07 2015-05-13 東京エレクトロン株式会社 Substrate reference image creation method, substrate defect inspection method, substrate reference image creation apparatus, substrate defect inspection unit, program, and computer storage medium
JP2015185648A (en) * 2014-03-24 2015-10-22 株式会社Ｓｃｒｅｅｎホールディングス Positional deviation detection method, positional deviation detection device, drawing device and substrate examination device
JP2015219162A (en) * 2014-05-20 2015-12-07 株式会社サキコーポレーション Inspection device
JP5837150B2 (en) * 2014-07-01 2015-12-24 東京エレクトロン株式会社 Substrate processing method and recording medium storing program for executing the substrate processing method
JP6244329B2 (en) * 2015-05-12 2017-12-06 東京エレクトロン株式会社 Substrate inspection method, substrate processing system, and computer storage medium

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102338990A (en) * 2010-07-16 2012-02-01 东京毅力科创株式会社 Substrate processing apparatus, substrate processing method and non-transitory computer storage medium
JP2012194059A (en) * 2011-03-16 2012-10-11 Tokyo Electron Ltd Image creation method, substrate inspection method, recording medium with program for executing image creation method or substrate inspection method recorded thereon, and substrate inspection device
CN103718210A (en) * 2011-08-03 2014-04-09 雅马哈发动机株式会社 Tdi sensor, image capturing device, component mounting apparatus, component testing apparatus, and substrate inspection apparatus
JP2014190797A (en) * 2013-03-27 2014-10-06 Tokushima Densei Kk Defect inspection device for silicon wafer
JP2016025293A (en) * 2014-07-24 2016-02-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate holding inspection method and substrate processing apparatus
JP2016061683A (en) * 2014-09-18 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス Inspection device and substrate processing device

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