Disclosure of Invention
In order to solve the problems, the color film substrate and the manufacturing method thereof are provided, which can ensure that the box thicknesses of the display area and the non-display area are consistent under the condition of not increasing the box thickness of the display area, and solve the problem of poor peripheral display. Meanwhile, a semi-permeable mask technology is used, no new manufacturing process is added, and the economical efficiency is guaranteed.
The invention discloses a color film substrate, which comprises: the display area comprises a first black matrix, pixel areas defined by the first black matrix, a color resistance layer located in each pixel area, and a first planarization layer covering the color resistance layer, the color resistance layer partially covers the first black matrix, the non-display area comprises a second black shading layer laid on the whole surface, an underlayer covering the second black shading layer, and a second planarization layer covering the underlayer, and the total height of the underlayer and the second black shading layer is equal to the height of the color resistance layer.
Preferably, the first black matrix and the second black light-shielding layer are formed at the same time, and the first planarizing layer and the second planarizing layer are integrally formed and formed at the same time.
Preferably, the pixel region includes a plurality of sub-pixel regions, and the color resist layer includes a plurality of single-color resist layers, each single-color resist layer corresponding to one sub-pixel region.
Preferably, the underlayer is a third black light-shielding layer, the second black light-shielding layer and the third black light-shielding layer are integrally formed, and the first black matrix, the second black light-shielding layer and the third black light-shielding layer are formed simultaneously.
Preferably, the underlayer is a virtual pixel layer, and the virtual pixel layer and the color resistance layer are formed simultaneously.
Preferably, the virtual pixel layer is a single color resist layer or a combination of a plurality of single color resist layers.
Preferably, the cushion layer is a third planarizing layer, the third planarizing layer is integrally formed with the second planarizing layer, and the third planarizing layer, the second planarizing layer, and the first planarizing layer are formed at the same time.
The invention also provides a method for manufacturing the color film substrate, which comprises the following steps: the method comprises the following steps:
s1, forming a black matrix material layer on the glass substrate;
s2, exposing the black matrix material layer through a semi-transparent mask plate, wherein the semi-transparent mask plate comprises a full-transparent area positioned in the non-display area, and a semi-transparent area and a full-shading area positioned in the display area;
s3, forming a second black shading layer and a third black shading layer in the non-display area and a first black matrix in matrix arrangement in the display area through developing and baking;
s4, forming a plurality of single color resistance layers on the display area, wherein the single color resistance layers form the color resistance layers, and the height of one single color resistance layer is equal to the total height of the second black shading layer and the third black shading layer;
and S5, paving a flattening layer material on the whole surface of the third black shading layer and the color resistance layer, and forming a first flattening layer positioned in the display area and a second flattening layer positioned in the non-display area.
Preferably, the black matrix material layer, the monochromatic color resist layer and the planarization layer are all negative materials.
Preferably, the light transmittance of the full transmission region is 100%, the light transmittance of the full shielding region is 0%, and the light transmittance of the semi-transmission region is 10-30%.
The invention also provides a method for manufacturing the color film substrate, which comprises the following steps: the method comprises the following steps:
s1, forming a black matrix material layer on the glass substrate;
s2, exposing, developing and baking the black matrix material layer through a mask plate to form a second black shading layer located in the non-display area and a first black matrix located in the display area, wherein the second black shading layer is laid on the whole surface of the non-display area, the first black matrix is arranged in the display area in an array mode, and the second black shading layer and the first black matrix are identical in height;
s3, sequentially forming each single-color resistance layer, exposing, developing and baking the single-color resistance layer through a semi-transparent mask plate, wherein the semi-transparent mask plate comprises a full-shading area and a full-transparent area which are positioned in a display area, and a semi-transparent area and a full-shading area which are positioned in a non-display area, the single or multiple single-color resistance layers form color resistance layers positioned in the display area, the single or multiple single-color resistance layers are positioned in a virtual pixel layer of the non-display area, and the height of one single-color resistance layer is equal to the total height of the virtual pixel layer and the second black shading layer;
s4, laying a planarization layer material on the entire surface of the color resist layer and the dummy pixel layer and simultaneously forming a first planarization layer and a second planarization layer.
Preferably, the black matrix material layer, the monochromatic color resist layer and the planarization layer are all negative materials.
Preferably, the light transmittance of the full transmission region is 100%, the light transmittance of the full shielding region is 0%, and the light transmittance of the semi-transmission region is 10-30%.
The invention also provides a method for manufacturing the color film substrate, which comprises the following steps: the method comprises the following steps:
s1, forming a black matrix material layer on the glass substrate;
s2, exposing, developing and baking the black matrix material layer through a mask plate to form a second black shading layer located in the non-display area and a first black matrix located in the display area, wherein the second black shading layer is laid on the whole surface of the non-display area, the first black matrix is arranged in the display area in an array mode, and the second black shading layer and the first black matrix are identical in height;
s3, forming a plurality of single color resistance layers on the display area, and forming the single color resistance layers into color resistance layers;
and S4, laying a planarization layer material on the color resistance layer and the second black shading layer, and exposing, developing and baking the planarization layer material through a semi-transparent mask plate, wherein the semi-transparent mask plate comprises a semi-transparent area positioned in the display area and a full-transparent area positioned in the non-display area, and a first planarization layer positioned in the display area, a third planarization layer positioned in the non-display area and a second planarization layer are formed at the same time.
Preferably, the black matrix material layer, the monochromatic color resist layer and the planarization layer are all negative materials.
Preferably, the light transmittance of the total transmission region is 100%, and the light transmittance of the semi-transmission region is 10-30%.
Compared with the prior art, the color film substrate has the advantages that the display area and the non-display area are smooth under the condition that the thickness of the display area is not increased, and the problem of poor peripheral display can be solved through the color film substrate. The invention also provides a method for manufacturing the color film substrate by using the semi-permeable mask, and by using the semi-permeable mask, the production process can be reduced, and the economic benefit can be improved.
Detailed Description
The present invention is further illustrated by the following detailed description in conjunction with the accompanying drawings, it is to be understood that such embodiments are merely illustrative of and not restrictive on the broad invention, and that various equivalent modifications of the invention may occur to those skilled in the art upon reading the appended claims.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. In this document, "one" means not only "only one" but also a case of "more than one".
The first embodiment is as follows:
fig. 2 is a schematic structural view of a color filter substrate according to a first embodiment of the present invention, including: the display area 1 comprises a plurality of first black matrixes 5 arranged in a matrix mode, a plurality of pixel areas defined by the first black matrixes 5, a color resistance layer 6 located in each pixel area, and a first planarization layer 8 covering the color resistance layer 6, wherein the color resistance layer 6 partially covers the first black matrixes 5, and the non-display area 2 is located around the display area 1. The non-display region 2 includes a second black light-shielding layer 9, an underlayer covering the second black light-shielding layer 9, and a second planarization layer 13 covering the underlayer.
The color filter substrate further comprises a plurality of support pillars 3 arranged on the first planarization layer 8 and the second planarization layer 13.
In this embodiment, each pixel region includes three sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region. The color resist layer 6 includes a red color resist layer 71, a green color resist layer 72, and a blue color resist layer 73, wherein the green color resist layer 72 is located between the red color resist layer 71 and the blue color resist layer 73. The red color resist layer 71 corresponds to a red sub-pixel region, the green color resist layer 72 corresponds to a green sub-pixel region, the blue color resist layer 73 corresponds to a blue sub-pixel region, and the red color resist layer 71, the green color resist layer 72 and the blue color resist layer 73 respectively partially cover corresponding parts of the first black matrix 5.
The underlayer is a third black light-shielding layer 10, the second black light-shielding layer 9 and the third black light-shielding layer 10 are integrally formed, the first black matrix 5, the second black light-shielding layer 9 and the third black light-shielding layer 10 are simultaneously formed, and the second black light-shielding layer 9 and the third black light-shielding layer 10 are formed by being laid on the whole surface and are not arranged in a matrix manner.
The total height of the third black light-shielding layer 10 and the second black light-shielding layer 9 is greater than the height of the first black matrix 5, and the total height of the third black light-shielding layer 10 and the second black light-shielding layer 9 is equal to the height of one of the color resist layers, in this embodiment, the total height of the third black light-shielding layer 10 and the second black light-shielding layer 9 is equal to the height of the green color resist layer 72, and in other embodiments, the total height of the third black light-shielding layer 10 and the second black light-shielding layer 9 is equal to the height of the red color resist layer 71 or the blue color resist layer 73.
The first planarizing layer 8 and the second planarizing layer 13 are integrally formed and formed at the same time.
It should be noted that each pixel region may further include four sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, a blue sub-pixel region, and a white sub-pixel region. The color resistance layer 6 correspondingly comprises four single-color resistance layers, and the total height of the third black shading layer 10 and the second black shading layer 9 is equal to the height of one single-color resistance layer.
Example two:
fig. 3 is a schematic structural view of a color filter substrate according to a second embodiment of the present invention, including: the display area 1 comprises a plurality of first black matrixes 5 arranged in a matrix mode, a plurality of pixel areas defined by the first black matrixes 5, a color resistance layer 6 located in each pixel area, and a first planarization layer 8 covering the color resistance layer 6, wherein the color resistance layer 6 partially covers the first black matrixes 5, and the non-display area 2 is located around the display area 1. The non-display region 2 includes a second black light-shielding layer 9, an underlayer covering the second black light-shielding layer 9, and a second planarization layer 13 covering the underlayer.
The color filter substrate further comprises a plurality of support pillars 3 arranged on the first planarization layer 8 and the second planarization layer 13.
In this embodiment, each pixel region has three sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region. The color resist layer 6 includes a red color resist layer 71, a green color resist layer 72, and a blue color resist layer 73, wherein the green color resist layer 72 is located between the red color resist layer 71 and the blue color resist layer 73. The red color resist layer 71 corresponds to a red sub-pixel region, the green color resist layer 72 corresponds to a green sub-pixel region, the blue color resist layer 73 corresponds to a blue sub-pixel region, and the red color resist layer 71, the green color resist layer 72 and the blue color resist layer 73 respectively partially cover corresponding parts of the first black matrix 5.
The underlayer is a virtual pixel layer 11, and the virtual pixel layer 11 and the color resistance layer 6 are formed simultaneously. The dummy pixel layer 11 also includes a red color resist layer 111, a green color resist layer 112, and a blue color resist layer 113.
The height of the first black matrix is equal to that of the second black shading layer 9, and the second black matrix 9 is formed by paving the whole surface and is not arranged in a matrix.
The height of the red resist layer 111 of the non-display area is equal to the height of the red resist layer 71 of the display area minus the height of the first black matrix 5, the height of the green resist layer 112 of the non-display area is equal to the height of the green resist layer 72 of the display area minus the height of the first black matrix 5, and the height of the blue resist layer 113 of the non-display area is equal to the height of the blue resist layer 73 of the display area minus the height of the first black matrix 5.
The first planarizing layer 8 and the second planarizing layer 13 are integrally formed and formed at the same time.
The dummy pixel layer 11 may be a single color resist layer of the red resist layer 111, the green resist layer 112, and the blue resist layer 113, may also be a mixture of two or three color resist layers, and further may be formed by stacking the red resist layer 111, the green resist layer 112, and the blue resist layer 113 in a vertical direction.
The order of formation of the red, green, and blue resist layers 71, 72, 73 in the display region 1 and the red, green, and blue resist layers 111, 112, 113 in the non-display region 2 may be adjusted as necessary.
It should be noted that each pixel region may further include four sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, a blue sub-pixel region, and a white sub-pixel region. The color resistance layer 6 correspondingly comprises four single-color resistance layers, and the height of one color resistance layer in the non-display area is equal to the height of the corresponding color resistance layer in the display area minus the height of the first black matrix 5.
Example three:
fig. 4 is a schematic structural view of a third embodiment of the present invention, a color film substrate, including: the display area 1 comprises a plurality of first black matrixes 5 arranged in a matrix mode, a plurality of pixel areas defined by the first black matrixes 5, a color resistance layer 6 located in each pixel area, and a first planarization layer 8 covering the color resistance layer 6, wherein the color resistance layer 6 partially covers the first black matrixes 5, and the non-display area 2 is located around the display area 1. The non-display region 2 includes a second black light-shielding layer 9, an underlayer covering the second black light-shielding layer 9, and a second planarization layer 13 covering the underlayer.
The color filter substrate further comprises a plurality of support pillars 3 arranged on the first planarization layer 8 and the second planarization layer 13.
The cushion layer is a third planarizing layer 12, and the third planarizing layer 12 and the second planarizing layer 13 are integrally formed.
Wherein the height of the first black matrix 5 is equal to the height of the second black light-shielding layer 9. The height of the third planarizing layer 12 is equal to the height of the color resist layer 6 minus the first black matrix 5.
The first planarizing layer 8 and the second planarizing layer 13 are integrally formed and formed at the same time.
In this embodiment, each pixel region includes three sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, and a blue sub-pixel region. The color resist layer 6 includes a red color resist layer 71, a green color resist layer 72, and a blue color resist layer 73, wherein the green color resist layer 72 is located between the red color resist layer 71 and the blue color resist layer 73. The red color resist layer 71 corresponds to a red sub-pixel region, the green color resist layer 72 corresponds to a green sub-pixel region, the blue color resist layer 73 corresponds to a blue sub-pixel region, and the red color resist layer 71, the green color resist layer 72 and the blue color resist layer 73 respectively partially cover corresponding parts of the first black matrix 5.
For convenience of description, the red, green, blue, and white resists are collectively referred to as a monochrome resist.
Example four:
fig. 5 to 6 are schematic diagrams of a manufacturing method of a color filter substrate structure according to an embodiment of the present invention, the manufacturing method of the color filter substrate includes: the method comprises the following steps:
s1, forming a black matrix material layer 20 on the glass substrate 4;
s2, exposing the black matrix material layer 20 through a semi-transparent mask 19, wherein the semi-transparent mask 19 comprises a full-transparent area 16 located in the non-display area 2, and a semi-transparent area 17 and a full-shading area 18 located in the display area 1;
s3, forming a second black light-shielding layer 9 and a third black light-shielding layer 10 in the non-display region 2 and a first black matrix 5 in a matrix arrangement in the display region 1 by development and baking;
s4, forming a plurality of single color resists 21 on the display area 1, respectively, the plurality of single color resists 21 forming the color resist 6 in layers, and one of the single color resists 21 having a height equal to the total height of the second black light-shielding layer 9 and the third black light-shielding layer 10;
s5, a planarizing layer material 22 is applied over the entire surfaces of the third black light-shielding layer 10 and the color resist layer 6 to form a first planarizing layer 8 in the display region 1 and a second planarizing layer 13 in the non-display region 2.
Preferably, the black matrix material layer 20, the single-color resist layer 21, and the planarization layer material 22 are all negative materials.
Preferably, the light transmittance of the total transmissive region 16 is 100%, the light transmittance of the total shielding region 18 is 0%, and the light transmittance of the semi-transmissive region 17 is 10-30%.
Example five:
fig. 7 to 9 are schematic diagrams of a manufacturing method of a color filter substrate structure according to an embodiment of the present invention, in which the manufacturing method of a color filter substrate includes: the method comprises the following steps:
s1, forming a black matrix material layer 20 on the glass substrate 4;
s2, exposing, developing and baking the black matrix material layer 20 through a mask plate to form a second black shading layer 9 located in the non-display area 2 and a first black matrix 5 located in the display area 1, wherein the second black shading layer 9 is laid on the whole surface of the non-display area 2, the first black matrixes 5 are arranged in the display area 1 in an array mode, and the second black shading layer 9 and the first black matrixes 5 are the same in height;
s3, sequentially forming each single-color resistance layer 21, exposing, developing and baking the single-color resistance layer 21 through a semi-transparent mask 19, wherein the semi-transparent mask 19 comprises a full-shading area 18 and a full-shading area 16 positioned in the display area 1 and a semi-transparent area 17 and a full-shading area 18 positioned in the non-display area 2, the multiple single-color resistance layers 21 form a color resistance layer 6 positioned in the display area 1, a single or multiple single-color resistance layers 21 form a virtual pixel layer positioned in the non-display area 2, and the height of the single-color resistance layer 21 of one display area 1 is equal to the total height of the virtual pixel layer 11 and the second black shading layer 9;
s4, the planarizing layer material 22 is laid over the entire surface of the color resist layer 6 and the dummy pixel layer 11 and the first planarizing layer 8 and the second planarizing layer 13 are formed at the same time.
Preferably, the black matrix material layer 20, the single color resist layer 21 and the planarization layer material 22 are all negative materials.
Preferably, the light transmittance of the total transmissive region 16 is 100%, the light transmittance of the total shielding region 18 is 0%, and the light transmittance of the semi-transmissive region 17 is 10-30%.
In this embodiment, the dummy pixel layer 11 may be formed of a single color resist layer, and when the red resist layer 71 is exposed, the non-display area 2 is entirely exposed by the semi-transmissive area 17, so that the entire red resist layer 111 is formed on the second black light-shielding layer 5, and when the green resist layer 72 and the blue resist layer 73 are exposed, the non-display area is exposed by the full-shielding area 18, so that the single color dummy pixel layer 11 is formed. Compared with the scheme, the design of the mask in the non-display area 2 is simple, and the cost of the mask is reduced.
Similarly, the virtual pixel layer 11 may also be exposed by stacking three layers, when exposing the red color resist layer 71, the semi-transmissive region 17 is used in the non-display region 2 for exposure, the transmittance of the semi-transmissive region 17 is between 3% and 10%, so as to form a whole red color resist layer 111, and when subsequently exposing the green color resist layer 72 and the blue color resist layer 73, the semi-transmissive region 17 with a small transmittance is also used for exposure, so as to achieve the vertical stacking of the red color resist layer 111, the green color resist layer 112 and the blue color resist layer 113.
Example six:
fig. 10 to 11 are schematic diagrams of a manufacturing method of a three-color film substrate structure according to an embodiment of the present invention, a manufacturing method of a color film substrate: the method comprises the following steps:
s1, forming a black matrix material layer 20 on the glass substrate 4;
s2, exposing, developing and baking the black matrix material layer 20 through a mask to form a second black shading layer 9 in the non-display area 2 and a first black matrix 5 in the display area 1, wherein the second black shading layer 9 is laid on the whole surface in the non-display area 2, the first black matrixes 5 are arranged in the display area 1 in an array mode, and the second black shading layer 9 and the first black matrixes 5 are the same in height;
s3, forming a plurality of single color resist layers 21 on the display area, the plurality of single color resist layers 21 forming a resist layer 6;
s4, laying the planarization layer material 22 on the color resist layer 6 and the second black shading layer 9, exposing, developing and baking the planarization layer material 22 through the semi-transparent mask 19, the semi-transparent mask 19 includes the semi-transparent region 17 in the display region 1 and the full-transparent region 16 in the non-display region 2, and simultaneously forming the first planarization layer 8 in the display region 1 and the third planarization layer 12 and the second planarization layer 13 in the non-display region 2.
Preferably, the black matrix material layer 20, the single color resist layer 21 and the planarization layer material 22 are all negative materials.
Preferably, the light transmittance of the total transmissive region 16 is 100%, and the light transmittance of the semi-transmissive region 17 is 10-30%.
It should be noted that each pixel region may further include four sub-pixel regions, which are a red sub-pixel region, a green sub-pixel region, a blue sub-pixel region, and a white sub-pixel region. The color resistance layer 6 correspondingly comprises four single-color resistance layers, and the height of the third flattening layer 12 is equal to the height of the single-color resistance layer minus the height of the first black matrix 5.
Although the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the details of the foregoing embodiments, and various equivalent changes (such as number, shape, position, etc.) may be made to the technical solution of the present invention within the technical spirit of the present invention, and these equivalent changes are all within the protection scope of the present invention.