CN109521587A - Substrate structure - Google Patents
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- CN109521587A CN109521587A CN201910002410.2A CN201910002410A CN109521587A CN 109521587 A CN109521587 A CN 109521587A CN 201910002410 A CN201910002410 A CN 201910002410A CN 109521587 A CN109521587 A CN 109521587A
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- circuit board
- substrate structure
- bonding
- bonding layer
- bonding pads
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Abstract
A substrate structure includes a first circuit board, a plurality of first bonding pads, a bonding layer, and a second circuit board. The first circuit board is provided with a peripheral area, and the peripheral area is positioned at the periphery of the first circuit board. The first bonding pads are arranged in the peripheral area at intervals, and a first gap is formed between every two adjacent first bonding pads. The bonding layer is arranged on the first circuit board and covers the first bonding pads and the first gaps. The second circuit board is connected to the first circuit boards through the bonding layers. The second circuit boards are provided with a plurality of second bonding pads which are respectively arranged corresponding to the first bonding pads and electrically connected with the first bonding pads. Wherein, a second gap is arranged between two adjacent second bonding pads, and the second gaps are smaller than the first gaps. After the substrate structure is used for a long time, the bonding layer can effectively prevent moisture or oxygen from entering, so that the substrate structure can not only avoid the corrosion of the first bonding pad, but also have better bonding adhesion.
Description
The application is to apply on 07 08th, 2014, entitled " board structure ", application No. is
201410322554.3 Chinese invention patent application divisional application
Technical field
The present invention, can be with the board structure of a circuit board electrical connection especially in regard to one kind about a kind of board structure.
Background technique
With the development of science and technology flat display apparatus is widely used in various fields, such as liquid crystal display dress
It sets, figure is frivolous, low power consumption and the advantageous characteristics such as radiationless because having, and gradually replaces conventional cathode ray tube aobvious
Showing device, and be applied in the electronic product of numerous species, such as mobile phone, portable multimedia device, laptop
Or tablet computer etc..
Wherein, for controlling the element on thin film transistor base plate, in order to which signal will be controlled by external control circuit
Plate is sent to the element being set on glass substrate, generally a joint sheet can be arranged prior to the edge of thin film transistor base plate
(bonding pads), after being coated with one layer of conducting resinl on joint sheet, hot press corresponding with control circuit board progress makes
Control signal can be sent on thin film transistor base plate by control circuit board, conducting resinl and joint sheet by outside, whereby to member
The movement that part is controlled.
However, the conducting resinl for engaging joint sheet with control circuit board is only simply covered in the prior art
On joint sheet, after prolonged use, conducting resinl possibly can not effectively stop moisture or oxygen to enter and contact joint gasket,
The corrosion of joint sheet is caused, so that problem occurs in the transmitting of control signal, in turn results in the failure of equipment.
Summary of the invention
It is an object of the present invention to provide a kind of board structures, keep away in addition to can effectively prevent moisture or oxygen from entering joint sheet
Exempt to cause except corrosion, can also have preferably engagement adherence.
The technical solution of the present invention is to provide a kind of board structure, which includes a first circuit board, Duo Ge
One joint sheet, a bonding layer and a second circuit board.First circuit board has a peripheral region, and peripheral region is located at first circuit board
Periphery.These the first joint sheet intervals are configured at peripheral region, and have between one first between two these adjacent first joint sheets
Gap.Bonding layer is set on first circuit board, and covers these first joint sheets and these first gaps.Second circuit board passes through
Bonding layer is connect with first circuit board, second circuit board have multiple second joint sheets, and these second joint sheets respectively with this
A little first joint sheets are correspondingly arranged and are electrically connected, wherein have one second gap, and the between two these adjacent second joint sheets
Two gaps are less than the first gap.
In one embodiment, bonding layer has multiple first curved edges.
In one embodiment, these first curved edges correspond respectively between these first gaps.
In one embodiment, first circuit board is printed circuit board.
In one embodiment, first circuit board is flexible printed wiring board.
In one embodiment, these maximum widths of the first curved edge in the direction of one of them are greater than corresponding
The maximum width of first gap in the direction.
In one embodiment, first circuit board also has an element configuring area, these first joint sheets have neighbouring element
Multiple first edges of configuring area, and bonding layer covers these first edges.
In one embodiment, these first joint sheets have more the multiple second edges opposite with these first edges, and
Bonding layer covers these second edges.
In one embodiment, first circuit board also has an element configuring area, and circuit structure or element are set to element and match
Set area.
In one embodiment, circuit structure includes multiple driving electrodes and multiple sensing electrodes, is respectively arranged at element and matches
Set area；And multiple thin film transistor (TFT)s and multiple pixel electrodes, it is respectively arranged at element configuration area.
Technical solution of the present invention also provides another board structure, which includes a first circuit board, multiple
First joint sheet and a plurality of conducting wire, a bonding layer and a second circuit board.First circuit board has a peripheral region, periphery position
In the periphery of first circuit board.These first joint sheets and these conductor configurations in peripheral region, and these first joint sheets and this
A little conducting wires are electrically connected.Bonding layer is set on first circuit board, and covers these the first joint sheets.Second circuit board is logical
Bonding layer is crossed to connect with first circuit board, second circuit board have multiple second joint sheets, and these second joint sheets respectively with
These first joint sheets are correspondingly arranged and are electrically connected.The width of these the second joint sheets is greater than the width of these conducting wires.
From the above, because in board structure of the invention, the peripheral region of first substrate is adjacent to the periphery in element configuration area,
And these the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.In addition, connecing
It closes layer to be set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area
With multiple first curved edges.These first joint sheets and these gaps are covered by bonding layer, and adjacent to element configuration
The bonding layer in area has multiple first curved edges, so that bonding layer can more fully protect the first joint sheet.Therefore, compared to
The prior art, for board structure of the invention after long-time use, bonding layer can effectively stop moisture or oxygen to enter, because
This can more have preferably engagement adherence other than it can avoid the corrosion of the first joint sheet.
Detailed description of the invention
For the above objects, features and advantages of the present invention can be clearer and more comprehensible, below in conjunction with attached drawing to tool of the invention
Body embodiment elaborates, in which:
Figure 1A is a kind of schematic top plan view of board structure of present pre-ferred embodiments.
Figure 1B is the enlarged schematic partial view of the board structure of Figure 1A.
Fig. 1 C is the schematic cross-sectional view of straight line A-A in Figure 1B.
Fig. 2A is the enlarged schematic partial view of the board structure of another state sample implementation of the present invention.
Fig. 2 B is the schematic cross-sectional view of straight line B-B in Fig. 2A.
Main element symbol description
1,1a: board structure
11: first substrate
111: element configuration area
112: peripheral region
12: the first joint sheets
13,13a: bonding layer
131: the first curved edges
132: the second curved edges
14: the second substrate
141: the second joint sheets
A-A, B-B: straight line
C: conducting wire
E1: first edge
E2: second edge
L1, L2: maximum width
X, Y, Z: direction
Specific embodiment
Hereinafter with reference to correlative type, illustrate the board structure according to present pre-ferred embodiments, wherein identical element will
It is illustrated with identical reference marks.The diagram of all state sample implementations of the present invention only illustrate, do not represent full-size(d) with than
Example.
It please refers to shown in Figure 1A to Fig. 1 C, wherein Figure 1A is a kind of vertical view of board structure 1 of present pre-ferred embodiments
Schematic diagram, Figure 1B is the enlarged schematic partial view of the board structure 1 of Figure 1A, and Fig. 1 C is in Figure 1B, and the section view of straight line A-A is illustrated
Figure.
Board structure 1 includes a first substrate 11, multiple first joint sheets 12 and a bonding layer 13.In addition, this implementation
The board structure 1 of example further includes a second substrate 14.But, in order to clearly illustrate the present invention, Figure 1A only shows first substrate 11
With the relativeness of the second substrate 14, other elements (these first joint sheets 12, bonding layer 13 and these conducting wires are not shown
C), and the second substrate 14 that Figure 1B is shown is to be represented by dotted lines it.In addition, Figure 1A system is by taking two the second substrates 14 as an example.
First substrate 11 has an element configuring area (being commonly called as in face) 111 and a peripheral region (being commonly called as outside face) 112, peripheral region
112 are adjacent to the periphery in element configuration area 111.In the present embodiment, element configuration area 111 is located at the middle area of first substrate 11
Domain, and be the region of circuit structure setting, peripheral region 112 is then surrounded on the periphery in element configuration area 111.Wherein, first substrate
11 can for made by light-permeable material, material be, for example, glass, quartz or the like, plastics, rubber, glass fibre or other
High molecular material；Alternatively, first substrate 11 also can for made by opaque material, and e.g. metal-glass fiber composite plate,
Metal-ceramic composite plate or printed circuit board or other materials, are not intended to limit.Special one is mentioned that, element configuration area 111 is
Its region being arranged for circuit structure or element (device) is indicated, if the place of conducting wire is only arranged for conduction merely
It is not element configuration area 111 of the present invention.For example, as shown in Figure 1A, if it is more in being arranged in element configuration area 111
A driving electrodes and when multiple sensing electrodes (Tx and Rx that are commonly called as) can make first substrate 11 become one with touch function
Substrate.Alternatively, in various embodiments, if in thin film transistor (TFT) or picture are arranged in the element configuration area 111 of first substrate 11
When the elements such as plain electrode, then first substrate 11 can become a thin film transistor base plate and be applied to plane and show on device.
As shown in Figure 1B and Fig. 1 C, these first joint sheets 12 interval is configured at peripheral region 112, and two it is adjacent these first
There is a gap (gap) between joint sheet 12.In the present embodiment, it is configured on the peripheral region 112 of 11 lower left side of first substrate
There is the first multiple joint sheets 12, and these first joint sheets 12 are configured along a direction interval X, so that two adjacent first engagements
All there is a gap between pad 12.Wherein, the plan view shape of the first joint sheet 12 is such as, but not limited to square, and for example
But it is not limited to transparency conducting layer (such as ITO or IZO) to be formed, and can be matched by conducting wire C (material is, for example, copper) with element
Set the element electrical connection being arranged in area 111.
Bonding layer 13 is for example set on first substrate 11 with coating method, and be completely covered these first joint sheets 12 and
These gaps.Wherein, bonding layer 13 can be such as, but not limited to anisotropic conducting rubber (Anisotropic Conductive
Film,ACF).Anisotropic conducting rubber is synthesized by resin and conducting particles, is mainly used for connecting two kinds of different substrate materials and line
Road.Anisotropic conducting rubber has upper and lower electrically conducting, but the characteristic of left and right plane insulation, and have it is excellent it is damp proof, then, lead
The functions such as electricity and insulation.In various embodiments, bonding layer 13 also can be adhesion glue).
In the present embodiment, these first joint sheets 12 have multiple first edges of neighbouring element configuring area 111
(edge) E1, and these first edges E1 is completely covered in bonding layer 13.Bonding layer 13 is in addition to covering all these the first engagements
Except gap between these first edges E1 of pad 12 and these first joint sheets 12, bonding layer 13 is also toward element configuration area
111 direction extends, and has multiple first curved edges 131 adjacent to the edge of the bonding layer in element configuration area 111 13.
Wherein, these first curved edges 131 correspond respectively between these gaps.Preferably, these first curved edges 131 and this
A little gaps are to correspond, and the vertex of each the first curved edge 131 corresponds respectively to the middle position in a gap.
" curved edge " of the present invention is not necessarily arc-shaped edge, as long as the vertex of curved edge is compared with two sides song outstanding
Wire shaped edge is all the so-called curved edge of the present invention.
In addition, maximum width L1 of these first curved edges 131 of one of them along direction X, is greater than corresponding gap
Along the maximum width L2 of direction X.The present embodiment is big along the maximum width L1 of direction X with each first curved edge 131
In corresponding gap along the maximum width L2 of direction X.Certainly, in various embodiments, can also part the first arc-shaped side
The maximum width L1 of edge 131 is greater than corresponding gap along the maximum width L2 of direction X, but first curved edge of another part
131 maximum width L1 is less than or equal to corresponding gap along the maximum width L2 of direction X.
The second substrate 14 is connect by bonding layer 13 with first substrate 11.In this, the second substrate 14 for example utilizes thermo-compression bonding
Together in first substrate 11.Wherein, the second substrate 14 has multiple second joint sheets 141, and these second joint sheets 141 are distinguished
It is correspondingly arranged and is electrically connected with these first joint sheets 12.Pass through the second joint sheet 141 and corresponding first joint sheet, 12 phase
To setting, and by bonding layer 13, the first joint sheet 12 can be made to be electrically connected with the second joint sheet 141, to carry out the transmitting of signal.
The second substrate 14 of the present embodiment is such as, but not limited to flexible printed wiring board (Flexible Print Circuit, FPC),
And the material of the second joint sheet 141 is, for example, copper.But, in other examples, the second substrate 14 can also be other patterns
Circuit board, such as printed circuit board (PCB) or Rigid Flex.Therefore, electric signal can pass through conducting wire C, the first joint sheet
12, bonding layer 13 and the second joint sheet 141 are transmitted between first substrate 11 and the second substrate 14.
Hold, be set on first substrate 11 by bonding layer 13, and be completely covered these first joint sheets 12 and these
Gap, and there are multiple first curved edges 131 adjacent to the bonding layer in element configuration area 111 13, so that bonding layer 13 can be compared with
Completely protect the first joint sheet 12.Therefore, compared to the prior art, the board structure 1 of the present embodiment by using for a long time
Afterwards, bonding layer 13 can effectively stop moisture or oxygen to enter, therefore, other than it can avoid the corrosion of the first joint sheet 12,
Can more have and preferably engage adherence with the second substrate 14.
In addition, referring to figure 2. shown in A and Fig. 2 B, wherein Fig. 2A is the board structure 1a of another state sample implementation of the present invention
Enlarged schematic partial view, and Fig. 2 B is the schematic cross-sectional view of straight line B-B in Fig. 2A.
With the board structure 1 of Figure 1A primary difference is that, in board structure 1a, these first joint sheets 12 have with
Its these first edge E1 opposite multiple second edge E2 (second edge E2 is far from element configuration area 111), and these second
Edge E2 and the edge for being not located at first substrate 11, but in the region of peripheral region 112, therefore, bonding layer 13a can be past separate
Element configuration area 111 extends and covers these second edges E2.In addition, the bonding layer 13a far from element configuration area 111 is with more
A second curved edge 132 (also in the region of peripheral region 112).Wherein, the first curved edge 131 and the second curved edge
132 systems relative configuration, quantity can be identical or not identical.It is with identical, and for for one-to-one in this.By in these
The bonding layer 13a of the opposite sides of one joint sheet 12 all has curved edge, can more effectively stop moisture or oxygen enter and
Contact these the first joint sheets 12.
In addition, the other technical characteristics of board structure 1a can refer to the similar elements of board structure 1, repeated no more in this.
It is further mentioned that, above-mentioned board structure 1 (or 1a) can be applied to such as touch panel, display panel or touch-control
On display panel, or it can also be applied on the board structure of other forms.
By taking touch panel as an example, when if plug-in (Out-Cell) formula touch panel, then first substrate is, for example, a glass
Substrate, and the circuit structure being arranged in element configuration area can (include multiple driving electrodes and multiple sensings for touch control sensing circuit
Electrode).Therefore, can by with touch control sensing circuit board structure and a display panel be combined into as a touch-control display panel
(a protection glass (Cover Lens) can be set again to protect touch-control display panel).But, in the aspect of OGS formula touch panel
In, the first substrate itself with touch control sensing circuit is protective substrate, and is not required to that Cover Lens separately is arranged.
When being externally embedded to the aspect of (On-Cell) formula touch panel, first substrate is, for example, a colored optical filtering substrates, and circuit
Structure is touch control sensing circuit, and is formed directly on the outer surface of colored optical filtering substrates, and and thin film transistor base plate
It is combined into as a touch-control display panel (the two can a sandwiched liquid crystal layer).
In the aspect of embedded (In-Cell) formula touch panel, first substrate is, for example, colored optical filtering substrates, and circuit knot
Structure is touch control sensing circuit, and can be formed directly in colored optical filtering substrates relative on a side surface of thin film transistor base plate；
Alternatively, first substrate can also be thin film transistor base plate, and circuit structure is touch control sensing circuit, and can be formed directly in film
Transistor base is on a side surface of colored optical filtering substrates.
In addition, in another embodiment, first substrate is, for example, thin film transistor base plate, and circuit structure is, for example, to show
Circuit structure (includes array architecture of thin film transistor and other elements), and therefore, board structure can be applied to display panel, such as
On liquid crystal display (LCD) panel or Organic Light Emitting Diode (OLED) display panel, to control film crystal by the second substrate
Circuit element on pipe substrate.
In conclusion the peripheral region of first substrate is adjacent to the periphery in element configuration area because in board structure of the invention,
And these the first joint sheet intervals are configured at peripheral region, and have a gap between two these adjacent first joint sheets.In addition, connecing
It closes layer to be set on first substrate, and covers these first joint sheets and these gaps, and the bonding layer of neighbouring element configuring area
With multiple first curved edges.These first joint sheets and these gaps are covered by bonding layer, and adjacent to element configuration
The bonding layer in area has multiple first curved edges, so that bonding layer can more fully protect the first joint sheet.Therefore, compared to
The prior art, for board structure of the invention after long-time use, bonding layer can effectively stop moisture or oxygen to enter, because
This can more have preferably engagement adherence other than it can avoid the corrosion of the first joint sheet.
Although the present invention is disclosed as above with preferred embodiment, however, it is not to limit the invention, any this field skill
Art personnel, without departing from the spirit and scope of the present invention, when can make a little modification and perfect therefore of the invention protection model
It encloses to work as and subject to the definition of the claims.
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910002410.2A CN109521587A (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410322554.3A CN105242424B (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
| CN201910002410.2A CN109521587A (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410322554.3A Division CN105242424B (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109521587A true CN109521587A (en) | 2019-03-26 |
Family
ID=55040114
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410322554.3A Active CN105242424B (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
| CN201910002410.2A Pending CN109521587A (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410322554.3A Active CN105242424B (en) | 2014-07-08 | 2014-07-08 | Substrate structure |
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| Country | Link |
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| CN101526676A (en) * | 2008-03-06 | 2009-09-09 | 北京京东方光电科技有限公司 | Pin bonding structure |
| CN102314009A (en) * | 2011-09-09 | 2012-01-11 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
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Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4968665B2 (en) * | 2006-04-18 | 2012-07-04 | Ｎｌｔテクノロジー株式会社 | Flat display panel and connection structure |
| US8035789B2 (en) * | 2007-03-19 | 2011-10-11 | Sony Corporation | Mounting structure, electro-optical device, input device, method of manufacturing mounting structure, and electronic apparatus |
| CN204065604U (en) * | 2014-07-08 | 2014-12-31 | 群创光电股份有限公司 | Substrate structure |
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2014
- 2014-07-08 CN CN201410322554.3A patent/CN105242424B/en active Active
- 2014-07-08 CN CN201910002410.2A patent/CN109521587A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| JP2007165744A (en) * | 2005-12-16 | 2007-06-28 | Epson Imaging Devices Corp | Semiconductor device, mounting structure, electrooptical device, method of manufacturing semiconductor device, method of manufacturing mounting structure, method of manufacturing electrooptical device, and electronic equipment |
| KR20090055163A (en) * | 2007-11-28 | 2009-06-02 | 엘지디스플레이 주식회사 | Display device and manufacturing method thereof |
| JP2009158766A (en) * | 2007-12-27 | 2009-07-16 | Panasonic Corp | Wiring board and connection method |
| CN101526676A (en) * | 2008-03-06 | 2009-09-09 | 北京京东方光电科技有限公司 | Pin bonding structure |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105242424A (en) | 2016-01-13 |
| CN105242424B (en) | 2019-02-12 |
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