CN109518260A - Electroplating auxiliary plate and electroplating system using same - Google Patents
Electroplating auxiliary plate and electroplating system using same Download PDFInfo
- Publication number
- CN109518260A CN109518260A CN201710841944.5A CN201710841944A CN109518260A CN 109518260 A CN109518260 A CN 109518260A CN 201710841944 A CN201710841944 A CN 201710841944A CN 109518260 A CN109518260 A CN 109518260A
- Authority
- CN
- China
- Prior art keywords
- electroplating
- plating
- anode
- accessory plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 22
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 230000005684 electric field Effects 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 9
- 229910021645 metal ion Inorganic materials 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 230000036647 reaction Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The electroplating auxiliary plate is mainly provided with a non-conductive plate body arranged between the anode and the surface to be plated, the electroplating auxiliary plate shields the anode part to form a shielding area, the electroplating auxiliary plate is provided with at least one shielding part facing the anode, and the shielding part can block the flow between the electroplating solution at the shielding area and the electroplating solution at other areas of the electroplating bath, namely, the metal coating can be prevented from depositing on the surface to be plated opposite to the shielding area by a more positive and reliable means, and the electroplating auxiliary plate has the capability of adjusting the electric field distribution during electroplating.
Description
Technical field
The present invention is especially a kind of with more positive, reliable in relation to a kind of plating accessory plate and using its electroplating system
Means adjust the plating accessory plate of field distribution and metal ion diffusion path when plating.
Background technique
Plating be a kind of cell reaction, using cell reaction a kind of metal-plated on another metallic surface, with shape
At one layer of metal shell film, such process is known as being electroplated by we.And electroplating technology is widely applied to various different use
On the way and in different field.From decorative use of the early stage based on beauty, such as have glossiness film in formation one on vessel surface,
Gradually develop to and be applied to high-tech industry now, as semiconductor processing procedure in, be now indispensable one in scientific and technological industry
Item technology.
In general, the process of electroplating technology includes providing an an electroplating bath, electroplate liquid, a cathode, an anode, one to be plated
Object and a plating metal.Wherein electroplate liquid, cathode, anode, object to be plated and plating metal are all located in electroplating bath, and to be plated
Object and cathode couple, and plating metal is then coupled with anode.Configured in this way, when bestowing an applied voltage V between cathode and anode, electricity
Plating metal ion M+ can be precipitated in plating metal, and set electron e- is then assembled on object surface to be plated.This positively charged plating metal from
Sub- M+ can be attracted by the negative electrical charge of electronics e- institute band, flow to object surface to be plated as medium (medium) with electroplate liquid.When
When plating metal ion M+ arrives at object surface to be plated, metallic atom will be formed in conjunction with electronics e-, and be deposited on object to be plated
Surface forms electroplated metal layer.When plating metal is precipitated completely or stops applying applied voltage V, electroplating reaction just stops.
The electroplating system being currently known can then divide into dissolubility anodization system and not according to plating metal presentation mode
Dissolve anodization system.In insoluble anode electroplating system, when electric current flow to anode bottom from anode top, electricity
Flow can successively decrease because of resistance, in other words, at anode top, due to the metal larger, more by electric current herein
Ion is decomposed release, and the gold few therefore less compared with the electric current by top position by electric current that lower portion is passed through
Belong to ion to be decomposed and releases, and then generates in electroplating bath electric force lines distribution and uneven (i.e. the Density Distribution of electric current is not
Uniformly) the phenomenon that.This phenomenon will cause product position, and coating is relatively at the big region of the higher i.e. current density of the density of electric fluxline
Thickness, otherwise it is that then coating is relatively thin in current density small region that product position is lower in the density of electric fluxline, so that product table
The film thickness uniformity of face coating is bad, and coating in uneven thickness most probably influences follow-up process or product efficiency, and then reduces
Overall process yield.
Therefore occur on the market it is a kind of powered respectively with multiple anodes and generate required current density respectively, it is uniform to reach
The effect of plating mainly provides a kind of multianode control device such as TaiWan, China patent announcement I 530593, collocation
One cathodic connection uses, and the cathodic connection is electrically connected at one side of substrate, which includes: a sun
Pole mould group, comprising each other side by side and between be separated by most anode networks of a spacing；And a power supply control mould group, electrically connect respectively
It is connected to the respectively anode network, which powers respectively to the respectively anode network, needed for respectively the anode network generates respectively
Current density, the current density that each anode network can be made to obtain respectively, the cathode electricity obtained respectively with substrate different location
It is complimentary to one another, to carry out uniformly-coating to substrate.
The effect of although above-mentioned habit has multianode technology and can achieve uniformly-coating, and control field distribution；So, whole more
Anodic control apparatus structure composition is complex, and cost is also relatively high；Furthermore due to the edge effect of anode network, so that positive
The current density in polar net limit will increase instead, so actually still needing to adjust offer respectively optionally with power supply control Mo Zu
To the electric current of each anode network, so causes and use upper inconvenience.
Summary of the invention
In view of this, the present invention provides a kind of plating accessory plate and the electroplating system using it, especially one kind is with more
Actively, reliably means adjust the plating accessory plate of field distribution and metal ion diffusion path when plating.
Accessory plate is electroplated in the present invention and is applied to electroplating system, is nonconducting plate body, and the plate body has at least side
Face, this is equipped with a covering at least at one side, which protrudes from one predetermined altitude of plate body surface.
In a preferred embodiment, it is further provided with a driving mould group, links with the plating accessory plate, can drive
Plating accessory plate displacement.
In a preferred embodiment, the covering is fixed on the plate body using a fixing piece.
According to the second aspect of the invention, a kind of electroplating system is provided, suitable for an object to be plated is electroplated, the plating
System includes at least:
One electroplating bath, for installing electroplate liquid；
One cathode is set to the electroplating bath and couples the object to be plated；
An at least anode is set to the electroplating bath and couples a plating metal, and the anode surface is to the one of the object to be plated to surfacing；With
And
At least one above-mentioned plating accessory plate, is located at the anode and should be between surfacing, the covering court of the plating accessory plate
To in the anode, which is filled in the gap between the plating accessory plate and the anode.
In a preferred embodiment, the medial surface of the electroplating bath is equipped with an at least guide groove, for plugging the electricity
Plate accessory plate.
In another preferred embodiment, the plating accessory plate has the guide edge for penetrating with the guide groove
Portion, and the shielding portion inside the electroplating bath is extended to by the guiding edge, and the covering is then located at the shielding portion at least
Side.
In more preferable specific embodiment, the shielding portion is further provided at least one opening, and the opening is for the sun
Pole part is exposed.
Detailed description of the invention
Fig. 1 show the structural perspective that accessory plate first embodiment is electroplated in the present invention.
Fig. 2 show the stereogram exploded view that accessory plate second embodiment is electroplated in the present invention.
Fig. 3 show the structural schematic diagram of electroplating system in the present invention.
Fig. 4 show the structural perspective that accessory plate second embodiment is electroplated in the present invention.
Figure number explanation:
Accessory plate 10 is electroplated
Plate body 11
Side 111
Guide edge 112
Shielding portion 113
Opening 114
Covering 12
Fixing piece 13
Electroplating bath 21
Guide groove 211
Electroplate liquid 22
Cathode 23
Anode 24
Shaded areas 24a
Non-obstructing region 24b
Object 30 to be plated
To surfacing 31
The coat of metal 40.
Specific embodiment
Refering to Figure 1, plating accessory plate 10 of the invention is nonconducting plate body 11, plating accessory plate of the invention
Applied in electroplating system, plate body 11 need to be as that can resist the erosion of electroplate liquid and not generate made by the material of electroplating reaction.
These materials have dielectric property or the composite material to include dielectricity coating, to prevent the current potential induced in electroplating bath
Variation causes metal plating on plating accessory plate, or generates chemical reaction with plating accessory plate and pollute electroplate liquid.Plating
The material of accessory plate is including but not limited to being plastics, such as polypropylene, polyethylene, polyvinyl chloride, fluoropolymer, polytetrafluoroethylene (PTFE)
(polytetrafluoroethylene, PTFE) or polyvinylidene fluoride (polyvinylidene fluoride).The material
Material can stop power line to pass through.The power line is the rail that negative ions make displacement under the action of an external electric field in electroplate liquid
Road is known as power line.
And the plate body 11 has an at least one side 111, in embodiment as shown in the figure, plate body 11 be rectangle and there are four having
Side 111, although this specification illustrates and schema is painted the shape of plate body 11 as rectangle, which can have affiliated technology to lead
Have various other shapes known to usually intellectual in domain.This is equipped with a covering 12, the covering at least at one side 111
12 protrude from 11 surface of plate body, one predetermined altitude.In a preferred embodiment, which can be with the plate
Body 11 is made into integration.
In another preferred embodiment, as shown in Fig. 2, the covering 12 is fixed on the plate using a fixing piece 13
Body 11.Although this specification illustrates and schema is painted the structure that fixing piece 13 is configured as screw, which can have institute
Belong to and has various other fixed structures known to usually intellectual in technical field.And the covering 12 and plate body 11 are similarly not
Conductive material, and can be as made by the material mentioned in above-mentioned plate body specific embodiment.
Plating accessory plate of the invention is suitable for being arranged in electroplating system, to adjust field distribution when plating, with more
The coat of metal deposition of specific region is prevented for positive, reliable means.In the specific embodiment of the electroplating system, such as scheme
Shown in 3, which is included at least: an electroplating bath 21 is for installing electroplate liquid 22；One cathode 23 is set to the electroplating bath 21 simultaneously
Couple the object 30 to be plated；An at least anode 24 is set to the electroplating bath 21 and couples a plating metal, and the anode 24 is in face of should be to
The one of plating object 30 is to surfacing 31；Cathode 23 and an at least anode 24 are set in electroplating bath 21, and at least local soaking is in plating
In liquid 22.Separately there is power supply (not shown) to supply at least an anode 24 and 23 positive electricity of cathode and negative electricity respectively, passes through plating to be formed
The power line of liquid 22.Anode 24 may include dissolubility anode and insoluble anode, in a preferred embodiment, sun
Pole 24 is insoluble anode, be used to conduct electric current, and the metal ion in electroplate liquid 22 is supplemented with metal salt.No
Dissolubility anode is usually good electric conductor, and chemical action and foul solution will not be generated with electroplate liquid 22 will not be by
It corrodes.
In a preferred embodiment, pairs of anode 24 can be respectively placed in inside electroplating bath 21 relative to yin
The two sides of pole 23, and the object to be plated 30 for being intended to be electroplated is hung in cathode 23, make respectively in anode 24 and 23 input current of cathode
In the state of, enable the electroplate liquid 22 in electroplating bath 21 that depositing is precipitated because of cell reaction in the metal ion of cathode terminal, to metal
Ion forms deposition and plates in the coat of metal 40 on 30 surface of object to be plated after the reduction of cathode 23.
Plating accessory plate 10 is set in electroplating bath 21, is located at the anode 24 and is somebody's turn to do to which between surfacing 31, which is assisted
24 part of anode is covered and forms shaded areas 24a and non-obstructing region 24b by plate 10, the plate body 11 of the plating accessory plate 10
It is slightly parallel to wait for surfacing 31 in this, and the covering 12 of the plating accessory plate 10, toward the anode 24, which is filled in
Gap between the plating accessory plate 10 and the anode 24.In a preferred embodiment, the height of the covering 12 can
To be equal to the gap size being slightly less than between the plating accessory plate 10 and the anode 24, and the length of covering 12 can be equal to and be slightly less than
The width of the electroplating bath 21.
Wherein, be electroplated accessory plate 10 plate body 11 can stop portions power line formation, change original field distribution, add
The variation of 21 internal electric field of electroplating bath distribution, the power line of 30 part of object especially to be plated have improved not after plating accessory plate 10
Again compared with other positions be it is close so that homogeneous current distribution on non-obstructing region 24b, is electroplated resulting electroplated metal layer thickness
It can also uniformity；Conversely, do not form power line at shaded areas 24a, and covering 12 be filled in the plating accessory plate 10 with
Gap between the anode 24, can block the flowing between the electroplate liquid at shaded areas 24a and the electroplate liquid in other regions of electroplating bath,
It allows at shaded areas 24a and causes the stagnation of electroplate liquid, and the cell reaction difficulty at shaded areas 24a significantly increases, make opposite
Shaded areas 24a's can not have coat of metal deposition to surfacing 31, allow plated body to surfacing 31 can local deposits have metal
Coating 40, user can more be had according to the shape of change plating accessory plate needed for it or relative to the position to surfacing
The coat of metal of specific position or specific shape.And above-mentioned plating accessory plate 10 is in addition to can reach the electric field point when adjustment plating
Outside the ability of cloth, the diffusion path of metal ion in electroplate liquid also can adjust, allow the uniform film thickness of plated body surface metal plating layer
Degree is promoted, and achievees the purpose that uniformly-coating.
In a preferred embodiment, the medial surface of the electroplating bath 21 is equipped with an at least guide groove 211, such as Fig. 4 institute
Show, for plugging the plating accessory plate 10, the opposite avris of the plate body 11 2 of the plating accessory plate 10 has for penetrating with this
The guiding edge 112 of guide groove 211, and the shielding portion 113 inside the electroplating bath is extended to by the guiding edge 112, and the screening
Shield 12 is then located at at least side of the shielding portion 113, which is further provided at least one opening 114, the opening
114 is exposed for the non-obstructing region 24b of the anode 24, and the position of the opening 114 and shape then carry out electricity relative to surfacing
The position of the formed coat of metal and shape after plating.In above-mentioned preferred embodiment, 11 2 relative edge side of plate body is led
Draw edge 112 to be inserted in guide groove 211, and the bottom surface of 113 bottom side of shielding portion of plate body 11 then contact plating slot 21, therefore only need to be in
A covering 12 is arranged in 113 top side of shielding portion of plate body 11, can obstruct the electricity at the opposite shaded areas 24a of shielding portion 113
Flowing between plating solution and the electroplate liquid in other regions of electroplating bath.In another preferred embodiment, plate body 11 of the present invention
If shielding portion 113 be moved to other positions, such as when up moving, 113 bottom side of shielding portion has no contact plating slot 21 at this time
Bottom surface, and allow and electroplate liquid of the shaded areas 24a at this and constitute communicating state between the electroplate liquid in other regions of electroplating bath, then
113 bottom side of shielding portion further can be provided with covering 12, use and have the function that obstruct completely.
In another preferred embodiment, the present invention is further provided with a driving mould group (not shown), with the electricity
Plate accessory plate connection, can drive the plating accessory plate be displaced, change by an automated manner plating accessory plate relative to
The position of surfacing.
Claims (8)
1. a kind of plating accessory plate, which is characterized in that be suitable for setting in an electroplating system, be nonconducting plate body, and the plate body
With at least one side, this is at least equipped with a covering at one side, which protrudes from one predetermined altitude of plate body surface.
2. plating accessory plate as described in claim 1, which is characterized in that be equipped with a driving mould group, connect with the plating accessory plate
Knot drives the plating accessory plate to be displaced.
3. plating accessory plate as claimed in claim 1 or 2, which is characterized in that the covering is fixed on this using a fixing piece
Plate body.
4. a kind of electroplating system, which is characterized in that suitable for an object to be plated is electroplated, which is included at least:
One electroplating bath, for installing electroplate liquid；
One cathode is set to the electroplating bath and couples the object to be plated；
An at least anode is set to the electroplating bath and couples a plating metal, and the anode surface is to the one of the object to be plated to surfacing；With
And
At least one plating accessory plate as claimed in claim 1 or 2 is located at the anode and is somebody's turn to do to which between surfacing, which is assisted
The covering of plate waits for surfacing toward this, which is filled in the plating accessory plate and should be to the gap between surfacing.
5. electroplating system as claimed in claim 4, which is characterized in that the covering is fixed on the plate body using a fixing piece.
6. electroplating system as claimed in claim 4, which is characterized in that the medial surface of the electroplating bath is equipped with an at least guide groove, with
For plugging the plating accessory plate.
7. electroplating system as claimed in claim 6, which is characterized in that the plating accessory plate has for penetrating with leading for the guide groove
Draw edge, and the shielding portion inside the electroplating bath is extended to by the guiding edge, and the covering is then located at the shielding portion
At least side.
8. electroplating system as claimed in claim 7, which is characterized in that the shielding portion is equipped at least one opening, and the opening is for being somebody's turn to do
It is exposed to surfacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710841944.5A CN109518260A (en) | 2017-09-18 | 2017-09-18 | Electroplating auxiliary plate and electroplating system using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710841944.5A CN109518260A (en) | 2017-09-18 | 2017-09-18 | Electroplating auxiliary plate and electroplating system using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109518260A true CN109518260A (en) | 2019-03-26 |
Family
ID=65767491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710841944.5A Pending CN109518260A (en) | 2017-09-18 | 2017-09-18 | Electroplating auxiliary plate and electroplating system using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109518260A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113136573A (en) * | 2020-01-17 | 2021-07-20 | 先丰通讯股份有限公司 | Chemical deposition system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054701A (en) * | 2007-02-08 | 2007-10-17 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| CN200999265Y (en) * | 2007-02-08 | 2008-01-02 | 上海美维科技有限公司 | Baffle plate for electric plating |
| CN101323967A (en) * | 2007-06-11 | 2008-12-17 | Umgabs株式会社 | Electropolating hangers |
| CN201785535U (en) * | 2010-07-12 | 2011-04-06 | 中国电子科技集团公司第二研究所 | Anode shielding adjustment mechanism in electroplating bath |
| CN202440559U (en) * | 2012-02-29 | 2012-09-19 | 邦迪管路系统有限公司 | Belt material electroplating device |
| CN103046105A (en) * | 2011-10-13 | 2013-04-17 | 三星电机株式会社 | Plating apparatus |
| CN207828440U (en) * | 2017-09-18 | 2018-09-07 | 先丰通讯股份有限公司 | Electroplating system |
-
2017
- 2017-09-18 CN CN201710841944.5A patent/CN109518260A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101054701A (en) * | 2007-02-08 | 2007-10-17 | 上海美维科技有限公司 | Method of increasing electroplating evenness |
| CN200999265Y (en) * | 2007-02-08 | 2008-01-02 | 上海美维科技有限公司 | Baffle plate for electric plating |
| CN101323967A (en) * | 2007-06-11 | 2008-12-17 | Umgabs株式会社 | Electropolating hangers |
| CN201785535U (en) * | 2010-07-12 | 2011-04-06 | 中国电子科技集团公司第二研究所 | Anode shielding adjustment mechanism in electroplating bath |
| CN103046105A (en) * | 2011-10-13 | 2013-04-17 | 三星电机株式会社 | Plating apparatus |
| CN202440559U (en) * | 2012-02-29 | 2012-09-19 | 邦迪管路系统有限公司 | Belt material electroplating device |
| CN207828440U (en) * | 2017-09-18 | 2018-09-07 | 先丰通讯股份有限公司 | Electroplating system |
Non-Patent Citations (2)
| Title |
|---|
| 李学伟: "《金属材料工程实践教程》", 30 March 2014, 哈尔滨工业大学出版社 * |
| 梁志杰，臧永华: "《刷镀技术实用指南》", 30 August 1988, 中国建筑工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113136573A (en) * | 2020-01-17 | 2021-07-20 | 先丰通讯股份有限公司 | Chemical deposition system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2615009C1 (en) | Device for application of metal film and method of application of metal film | |
| US8926820B2 (en) | Working electrode design for electrochemical processing of electronic components | |
| US9708724B2 (en) | Anode unit and plating apparatus having such anode unit | |
| US9745665B2 (en) | Method and apparatus for electrolytically depositing a deposition metal on a workpiece | |
| KR20120129125A (en) | Electroplating apparatus for semiconductor substrate and method the same | |
| CN102534733B (en) | Electroplanting device and electro-plating method | |
| US9945043B2 (en) | Electro chemical deposition apparatus | |
| KR20020047236A (en) | Method and device for the electrolytic treatment of electrically conducting structures which are insulated from each other and positioned on the surface of electrically insulating film materials and use of the method | |
| CN109518260A (en) | Electroplating auxiliary plate and electroplating system using same | |
| CN115058759A (en) | Electroplating equipment and coating machine | |
| CN207828440U (en) | Electroplating system | |
| TWI664321B (en) | Eletroplating auxiliary plate and electroplating system provided with same | |
| US20030155231A1 (en) | Field adjusting apparatus for an electroplating bath | |
| TWM555362U (en) | Plating auxiliary board and plating system using the same | |
| KR20070077870A (en) | Vertical plating device and plating method | |
| CN107761158A (en) | A kind of electroplating device and electro-plating method | |
| CN107955958A (en) | The metal plating device of wafer | |
| JP6893849B2 (en) | Plating equipment for printed wiring boards and metal jigs | |
| Tutashkonko et al. | Light induced silver and copper plating on silver screen-printed contacts of silicon solar cells | |
| KR101420865B1 (en) | Metal Plating Device | |
| CN203238337U (en) | Electroplating device | |
| TWM461147U (en) | Electroplating apparatus | |
| KR20100066988A (en) | Uniform pating method for pcb | |
| CN115976607B (en) | Electroplating equipment and electroplating method | |
| TWI884924B (en) | Fluid generator, deposition device and material deposition method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190326 |