CN109517200A - A kind of heat-proof silica gel protective film - Google Patents
A kind of heat-proof silica gel protective film Download PDFInfo
- Publication number
- CN109517200A CN109517200A CN201811147872.5A CN201811147872A CN109517200A CN 109517200 A CN109517200 A CN 109517200A CN 201811147872 A CN201811147872 A CN 201811147872A CN 109517200 A CN109517200 A CN 109517200A
- Authority
- CN
- China
- Prior art keywords
- layer
- silica gel
- heat
- protective film
- ceric oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 239000000741 silica gel Substances 0.000 title claims abstract description 80
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 80
- 230000001681 protective effect Effects 0.000 title claims abstract description 31
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims abstract description 38
- 229940044927 ceric oxide Drugs 0.000 claims abstract description 35
- 239000004642 Polyimide Substances 0.000 claims abstract description 10
- 229920001721 polyimide Polymers 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims description 15
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 15
- 238000003756 stirring Methods 0.000 claims description 12
- MJULMZZKFYNTHK-UHFFFAOYSA-N ethenyl(phenyl)silicon Chemical compound C=C[Si]C1=CC=CC=C1 MJULMZZKFYNTHK-UHFFFAOYSA-N 0.000 claims description 7
- 239000003921 oil Substances 0.000 claims description 7
- 229920002050 silicone resin Polymers 0.000 claims description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- 239000005977 Ethylene Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000002671 adjuvant Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000003431 cross linking reagent Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000007774 longterm Effects 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 108010025899 gelatin film Proteins 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 24
- 230000000694 effects Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 229920002545 silicone oil Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000003471 anti-radiation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013499 data model Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 125000005561 phenanthryl group Chemical group 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
- C09D7/67—Particle size smaller than 100 nm
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
- C08K2003/2213—Oxides; Hydroxides of metals of rare earth metal of cerium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Nanotechnology (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of heat-proof silica gel protective films; messenger's silicone protective film includes carrier layer and layer of silica gel; the carrier layer includes polyimide layer; the layer of silica gel includes nano ceric oxide; significantly increase the regularity of layer of silica gel structure; heat-resisting and heating conduction of the invention is increased, heat resisting temperature reaches 350 DEG C, has a good application prospect.
Description
Technical field
The present invention relates to technology field of membrane materials, more particularly, to a kind of heat-proof silica gel protective film.
Background technique
Protective film is usually used in hardware, photoelectricity and printing industry, in the opto-electronic device, especially used in solar device
Protective film often requires it to have excellent heat resistance, relative to common polymethyl methacrylate, polystyrene and poly- carbonic acid
The heat resistance of ester, silicone rubber adhesive is more preferable, and prior art CN102757742A discloses a kind of heat conducting film graphite material, packet
Polyester or polypropylene base film and acrylic acid glue or silica gel glue are included, still there is good performance at 180 DEG C, but such as
Fruit needs higher temperature, then will appear apparent deformation and degumming.
In order to increase the heat resistance of silicone protective film, heat-resistant agent often is added in layer of silica gel, such as graphite powder, silica, oxygen
Change zinc etc., or coat heat-pesistant thin film on carrier, polyimide layer, graphene layer or graphite linings have application.
Ceria is a kind of light rare earth oxide that cheap purposes is extremely wide, and the nanoparticle of ceria is proved to have
UV absorption and catalytic activity, nano ceric oxide, which is added, in discovered in recent years in plastic cement has significant resistance to heat conductivity
Can, and plastic structure can be optimized, so that plastic cement is unlikely to deform at high temperature.
Summary of the invention
In view of prior art scenario, to solve the deficiencies in the prior art, the present invention provides a kind of heat-proof silica gel protective film,
It adopts the following technical scheme that
A kind of heat-proof silica gel protective film, including carrier layer and layer of silica gel, the carrier layer include polyimide layer, the silicon
Glue-line comprises the following components in parts by weight:
Wherein, the high molecular weight ethylene base silicone resin side chain is connected with condensed ring radical, and the phenyl-vinyl silicon oil is by ethylene
Base sealing end, phenyl therein is preferably condensed ring radical, the nano ceric oxide in the layer of silica gel be selected from graininess, hollow ball-shape,
Tubulose, band-like and one of linear or a variety of, the diameter of the nano ceric oxide is 10-30nm, length 30-
3000nm。
Further, the layer of silica gel includes the first layer of silica gel and the second layer of silica gel, and the one side of second layer of silica gel is attached
In on the carrier, first layer of silica gel invests the another side of second layer of silica gel, first layer of silica gel with a thickness of
The shape of 50-75um, the nano ceric oxide of first layer of silica gel are selected from one or both of graininess and hollow ball-shape,
The diameter of the nano ceric oxide of graininess or hollow ball-shape is 10-30nm, the nano ceric oxide of second layer of silica gel
Shape is selected from tubulose, band-like and one of linear or a variety of, and tubulose, the band-like or linear nano ceric oxide diameter are
10-30nm, length 30-3000nm.
Further, the support layer thickness is 35-75um, and the layer of silica gel is with a thickness of 50-150um.
Further, -40-350 DEG C of use temperature range of the heat-proof silica gel protective film, short-term resistance to heat rating are 250-
350 DEG C, long-term resistance to heat rating is 160-230 DEG C.
Further, the carrier layer further includes one of pet layer, antistatic backing, heat-conducting layer and conductive layer or a variety of.
Further, according to above-mentioned heat-proof silica gel protective film, a kind of preparation process is proposed, which is characterized in that including
Following steps:
(1) each component is accurately weighed, is placed in reaction kettle, solvent is added, sequentially adds high molecular weight second under stirring
Alkenyl silicone resin and phenyl-vinyl silicon oil, stir evenly；
(2) continue to sequentially add nano ceric oxide and adjuvant in step (1) resulting reactant under stirring, mix
The hydrogeneous crosslinking agent of phenyl and organic Si catalyst is added after closing uniformly, continues to stir evenly up to silica gel layer composition；
(3) it will be coated in carrier layer by the resulting silica gel layer composition of step (2) up to heat-proof silica gel in dust-free workshop
Protective film.
In conclusion the invention has the following advantages:
1, the organic siliconresin and organic silicone oil that the present invention uses contain phenyl, relative to the organosilicon tree for being free of benzene series
Rouge and organic silicone oil have preferable heat resistance, relative to the phenyl organic siliconresin and organic silicone oil of single phenyl ring, containing more
The condensed ring radical organic siliconresin and organic silicone oil of a phenyl ring have better heat resistance.
2, include polyimide layer in carrier layer of the present invention, dramatically increase the heat resistance of carrier layer, cooperate in layer of silica gel
Condensed ring radical organic siliconresin and condensed ring radical organic silicone oil, heat resistance obtain collaboration enhancing.
3, the nano ceric oxide that the present invention uses has anti-radiation, anti-ageing as inorganic machine filler, nano ceric oxide
Change, catalysis, increases in layer of silica gel and show unexpected heat resistance, the heat resistance of synergistic carriers layer and organosilicon,
The heat resisting temperature of heat-proof silica gel protective film of the present invention reaches 350 DEG C.
4, nano ceric oxide tubulose, the band-like conduction that can increase heat by mutual contact with linear structure,
Show excellent heating conduction.
5, the addition of nano ceric oxide has the function of keeping plastic structure regular fine and close, and nanometer two is added in layer of silica gel
Cerium oxide, layer of silica gel structure is more regular, more there is mechanical strength and toughness, is heated evenly, will not generate it is non-uniform by
Hot spot, regular structure is but also heat is easier to conduct.
Specific embodiment
The present invention is described in further detail below by specific embodiment, but this specific embodiment is only to the present invention
Explanation, be not limitation of the present invention, those skilled in the art can as needed make the present embodiment and not create
The modification of property, but as long as in scope of the presently claimed invention, all by the protection of Patent Law.
Embodiment:
A kind of heat-proof silica gel protective film, including carrier layer and layer of silica gel.
The carrier layer includes polyimide layer, and in the embodiment of not transparency requirement, the carrier layer can be by list
One polyimide layer is constituted, and in certain embodiments, the carrier layer further includes anti-pet layer, electrostatic layer, heat-conducting layer and conduction
One of layer is a variety of, and polyimide layer, antistatic backing, heat-conducting layer or conductive layer can be coated on described by way of coating
On polyimide layer, the support layer thickness is 35-75um.
The layer of silica gel includes that high molecular weight ethylene base silicone resin, phenyl-vinyl silicon oil, phenyl are hydrogeneous organosilicon crosslinked
Agent, organic Si catalyst, nano ceric oxide, solvent and adjuvant, the layer of silica gel is with a thickness of 50-150um, in actual production
In, the thickness of layer of silica gel, which is generally in 25-45um, then this thickness range, to be not only able to achieve function but also can control cost, but at this
In invention, using the thicker layer of silica gel of 50-150um, it is used in and heat resistance is required in higher equipment.
Wherein, the high molecular weight ethylene base silicone resin side chain is connected with condensed ring radical, preferably phenanthryl group；
The phenyl-vinyl silicon oil is the linear molecule by ethenyl blocking, and phenyl therein is preferably condensed ring radical；
Phenyl also preferably condensed ring radical in the hydrogeneous organosilicon cross-linking agent of phenyl, specially phenyl hydrogen-containing siloxane or
Phenyl hydrogen containing siloxane.
Nano ceric oxide in the layer of silica gel is selected from graininess, hollow ball-shape, tubulose, band-like and one of linear
Or it is a variety of, the diameter of the nano ceric oxide is 10-30nm, length 30-3000nm.In certain embodiments, the silicon
Glue-line includes the first layer of silica gel and the second layer of silica gel, and second layer of silica gel is invested on one side in the carrier layer, and described first
Layer of silica gel invests the another side of second layer of silica gel, first layer of silica gel with a thickness of 50-75um, first layer of silica gel
Nano ceric oxide shape be selected from one or both of graininess and hollow ball-shape, the nanometer of graininess or hollow ball-shape
The diameter of ceria is 10-30nm, and the shape of the nano ceric oxide of second layer of silica gel is selected from tubulose, band-like and linear
One of or it is a variety of, tubulose, the band-like or linear nano ceric oxide diameter are 10-30nm, length 30-
3000nm, the tubulose, the band-like or linear nano ceric oxide have more preferable conductibility.
Wherein, in layer of silica gel nano ceric oxide concrete shape and composition, it is right in above-mentioned type and compositing range
Technical effect of the invention does not influence.In actual use, the size of nano ceric oxide is the size of microcosmic nanoparticle
Range, the nano ceric oxide in this size range do not influence technical effect of the invention.
The amount of nano ceric oxide has large effect to technical effect of the invention, and amount cannot play heat-resisting and knot less
The effect of structure optimization, amount is big, then layer of silica gel structure can be made excessively fine and close, heat resisting temperature declines instead.
- 40-350 DEG C of use temperature range of the heat-proof silica gel protective film, short-term resistance to heat rating is 250-350 DEG C, long
Phase resistance to heat rating is 160-230 DEG C, and it is 48h or more that middle or short term is in 6h for a long time.
Size range, temperature range in summary is summarized during a large amount of test, in this data model
In enclosing, the present invention has achievable stable technical effect.
According to above-mentioned heat-proof silica gel protective film propose a kind of preparation process the following steps are included:
(1) each component is accurately weighed, is placed in reaction kettle, solvent is added, sequentially adds high molecular weight second under stirring
Alkenyl silicone resin and phenyl-vinyl silicon oil, stir evenly；
(2) continue to sequentially add nano ceric oxide and adjuvant in step (1) resulting reactant under stirring, mix
The hydrogeneous crosslinking agent of phenyl and organic Si catalyst is added after closing uniformly, continues to stir evenly up to silica gel layer composition；
(3) it will be coated in carrier layer by the resulting silica gel layer composition of step (2) up to heat-proof silica gel in dust-free workshop
Protective film.
Illustrate technical solution of the present invention and technical effect by the following examples.
Heat-proof silica gel protective film preparation process is identical in embodiment 1- embodiment 6, but structure and composition is different, wherein implementing
The layer of silica gel of example 5 and embodiment 6 includes the first layer of silica gel and the second layer of silica gel, and the parts by weight of nano ceric oxide are according to thickness
The pro rate of degree, specific structure and composition are detailed in shown in the following table 1, and the carrier layer structure and composition includes thickness and kind
Class.
Table 1: 6 heat-proof silica gel protective film structure and composition of embodiment 1- embodiment
Using identical preparation process, comparative example 1 is respectively provided with to comparative example 4, wherein phenyl is the benzene of single phenyl ring
Base, the nano ceric oxide diameter in comparative example 4 are 40-60nm, length 60-500nm, and concrete composition is detailed in shown in the following table 2.
Table 2: structure and the raw material composition of 4 silicone protective film of comparative example 1- comparative example.
Performance test
Embodiment and comparative example is tested for the property, taking the area of silicone protective film is 25mm × 50mm, by embodiment
With comparative example be affixed on smooth dustless test glass planar observe its attach effect, then to its peeling force, the attached effect of re-posted and
Heat resistance carries out recruitment evaluation.
Wherein, the peeling force is to peel silicone protective film with 90 ° of angles with the speed of 250mm/min, and test environment is
The protective film through 8kg roll 5 times, after removing after again adherent observation attach effect.
The heat resistance test is heated to heat test plane with 30 DEG C for gradient, every gradient-heated
10min, the deformation temperature of record protection film, testing humidity 60%
The above test result is as shown in table 3.
Table 3: the performance parameter assessment of embodiment and comparative example.
As shown in Table 3, attaching effect of the invention, the attached effect of re-posted and heat resistance reach ideal effect, carrier layer
Polyimide layer, the condensed ring radical of layer of silica gel and the synergistic effect of nano ceric oxide so that layer of silica gel structure optimization, heat resistance
It dramatically increases, has a good application prospect.
Claims (6)
1. a kind of heat-proof silica gel protective film, including carrier layer and layer of silica gel, which is characterized in that the carrier layer includes polyimides
Layer, the layer of silica gel comprise the following components in parts by weight:
Wherein, the high molecular weight ethylene base silicone resin side chain is connected with condensed ring radical, and the phenyl-vinyl silicon oil is sealed by vinyl
End, phenyl therein is preferably condensed ring radical, the nano ceric oxide in the layer of silica gel be selected from graininess, hollow ball-shape, tubulose,
One of band-like and linear or a variety of, the diameter of the nano ceric oxide is 10-30nm, length 30-3000nm.
2. heat-proof silica gel protective film according to claim 1, which is characterized in that the layer of silica gel include the first layer of silica gel and
Second layer of silica gel, second layer of silica gel are invested on one side in the carrier layer, and first layer of silica gel is set to second silicon
The another side of glue-line, first layer of silica gel with a thickness of 50-75um, the shape of the nano ceric oxide of first layer of silica gel
Selected from one or both of graininess and hollow ball-shape, the diameter of the nano ceric oxide of graininess or hollow ball-shape is 10-
30nm, the shape of the nano ceric oxide of second layer of silica gel are selected from tubulose, band-like and one of linear or a variety of, pipe
Shape, the band-like or linear nano ceric oxide diameter are 10-30nm, length 30-3000nm.
3. heat-proof silica gel protective film according to claim 1 or 2, which is characterized in that the support layer thickness is 35-
75um, the layer of silica gel is with a thickness of 50-150um.
4. heat-proof silica gel protective film according to claim 1 or 2, which is characterized in that the heat-proof silica gel protective film makes
With -40-350 DEG C of temperature range, short-term resistance to heat rating is 250-350 DEG C, and long-term resistance to heat rating is 160-230 DEG C.
5. heat-proof silica gel protective film according to claim 1, which is characterized in that the carrier layer further include pet layer, prevent it is quiet
Electric layer, heat-conducting layer and conductive layer.
6. heat-proof silica gel protective film according to claim 1 or 2, proposes a kind of preparation process, which is characterized in that including
Following steps:
(1) each component is accurately weighed, is placed in reaction kettle, solvent is added, sequentially adds high molecular weight ethylene base under stirring
Silicone resin and phenyl-vinyl silicon oil, stir evenly；
(2) continue to sequentially add nano ceric oxide and adjuvant in step (1) resulting reactant under stirring, mixing is equal
The hydrogeneous crosslinking agent of phenyl and organic Si catalyst are added after even, continues to stir evenly up to silica gel layer composition；
(3) it will be coated in carrier layer by the resulting silica gel layer composition of step (2) in dust-free workshop and be protected up to heat-proof silica gel
Film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811147872.5A CN109517200A (en) | 2018-09-29 | 2018-09-29 | A kind of heat-proof silica gel protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811147872.5A CN109517200A (en) | 2018-09-29 | 2018-09-29 | A kind of heat-proof silica gel protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109517200A true CN109517200A (en) | 2019-03-26 |
Family
ID=65772407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811147872.5A Pending CN109517200A (en) | 2018-09-29 | 2018-09-29 | A kind of heat-proof silica gel protective film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109517200A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102757742A (en) * | 2012-07-17 | 2012-10-31 | 宁波激智新材料科技有限公司 | Protective film and preparation method thereof |
| CN104479366A (en) * | 2015-01-05 | 2015-04-01 | 深圳市摩码科技有限公司 | Self-adsorption and self-exhaust silica gel, self-adsorption and self-exhaust silica gel preparation method and tempered glass protection film applying self-adsorption and self-exhaust silica gel |
| CN106633071A (en) * | 2016-12-13 | 2017-05-10 | 沈阳化工大学 | Preparation method of cage like polyvinyl silicone rubber heatproof auxiliary agent containing phenanthrene type phenyl |
| CN106893131A (en) * | 2017-04-28 | 2017-06-27 | 东莞市亚马电子有限公司 | A kind of antistatic heat-proof silica gel skin and its manufacture craft |
| CN206814683U (en) * | 2017-05-26 | 2017-12-29 | 广东顺德莱特尔科技有限公司 | A kind of silica gel protected films of high temperature resistant PI |
-
2018
- 2018-09-29 CN CN201811147872.5A patent/CN109517200A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102757742A (en) * | 2012-07-17 | 2012-10-31 | 宁波激智新材料科技有限公司 | Protective film and preparation method thereof |
| CN104479366A (en) * | 2015-01-05 | 2015-04-01 | 深圳市摩码科技有限公司 | Self-adsorption and self-exhaust silica gel, self-adsorption and self-exhaust silica gel preparation method and tempered glass protection film applying self-adsorption and self-exhaust silica gel |
| CN106633071A (en) * | 2016-12-13 | 2017-05-10 | 沈阳化工大学 | Preparation method of cage like polyvinyl silicone rubber heatproof auxiliary agent containing phenanthrene type phenyl |
| CN106893131A (en) * | 2017-04-28 | 2017-06-27 | 东莞市亚马电子有限公司 | A kind of antistatic heat-proof silica gel skin and its manufacture craft |
| CN206814683U (en) * | 2017-05-26 | 2017-12-29 | 广东顺德莱特尔科技有限公司 | A kind of silica gel protected films of high temperature resistant PI |
Non-Patent Citations (3)
| Title |
|---|
| 宋远周等: ""纳米金属氧化物对苯基硅橡胶耐热性能的影响"", 《化工新型材料》 * |
| 杨华伟著: "《口腔临床修复材料学》", 30 June 2016 * |
| 陈木青主编: "《材料物理实验教程》", 28 February 2018 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4876289B2 (en) | Antistatic silicone release film | |
| TWI754630B (en) | Two-sided differential release paper or two-sided differential release film | |
| KR100672857B1 (en) | Silicone Release Composition and Silicone Release Plastic Film Using the Same | |
| JP2014522436A (en) | Thick film pressure sensitive adhesive and laminated structure made therefrom | |
| WO2014150302A1 (en) | Conductive silicone materials and uses | |
| CN109880523A (en) | Low transfer silicone release agent of a kind of high temperature resistant and preparation method thereof | |
| CN109734943B (en) | Transparent double-sided antistatic ionization type film and preparation method thereof | |
| JP7237854B2 (en) | Solvent-type curable organopolysiloxane composition, release sheet and method for producing the same | |
| CN101185854A (en) | Silicone rubber oxygen-enriched membrane doped with silicon dioxide and preparation method thereof | |
| CN109263210A (en) | A kind of Multifunctional silica gel protective film | |
| JPWO2020050167A5 (en) | ||
| KR20190095869A (en) | Pressure sensitive adhesive sheet | |
| JP5671923B2 (en) | Release agent composition, release film and adhesive film using the same | |
| CN105859767A (en) | Normal pressure synthetic method for polyphenyl cyclic siloxane containing three vinyl groups | |
| JP3922785B2 (en) | Optical semiconductor insulation coating protective agent | |
| CN109517200A (en) | A kind of heat-proof silica gel protective film | |
| JP2015117348A (en) | Adsorption film | |
| Pan et al. | Synthesis of a boron-containing adhesion promoter for improving the adhesion of addition-cure silicone rubber to PPA | |
| CN105820366A (en) | Surface layer modified nano polyimide film and preparation method thereof | |
| CN115678419B (en) | A kind of quaternary ammonium salt antibacterial and water-repellent organic-inorganic hybrid coating and its synthesis method | |
| JP2014221877A (en) | Heat-resistant pasting sheet | |
| Kausar | Adhesion, morphology, and heat resistance properties of polyurethane coated poly (methyl methacrylate)/fullerene-C60 composite films | |
| CN103232707A (en) | Curable silicon rubber composition as well as cured product and coating curing method thereof | |
| CN109627473B (en) | Preparation process of enhanced organic silicon composite sheet with surface tack removal function | |
| CN115612444A (en) | Adhesive for silicone protective film attached to curved glass, preparation method thereof, and adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190326 |
|
| WD01 | Invention patent application deemed withdrawn after publication |