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CN109510923A - 摄像模组及其感光组件 - Google Patents

摄像模组及其感光组件 Download PDF

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Publication number
CN109510923A
CN109510923A CN201710853859.0A CN201710853859A CN109510923A CN 109510923 A CN109510923 A CN 109510923A CN 201710853859 A CN201710853859 A CN 201710853859A CN 109510923 A CN109510923 A CN 109510923A
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China
Prior art keywords
photosensitive
arc surface
packaging body
sensitive chip
assembly according
Prior art date
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Pending
Application number
CN201710853859.0A
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English (en)
Inventor
申成哲
冯军
朱淑敏
张升云
帅文华
唐东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
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Publication date
Application filed by Nanchang OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to CN201710853859.0A priority Critical patent/CN109510923A/zh
Priority to US16/132,379 priority patent/US10750072B2/en
Publication of CN109510923A publication Critical patent/CN109510923A/zh
Pending legal-status Critical Current

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    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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    • H04—ELECTRIC COMMUNICATION TECHNIQUE
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    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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Abstract

本发明涉及一种摄像模组及其感光组件，感光组件包括线路板、感光芯片及封装体，感光芯片连接于线路板上，封装体封装成型于线路板，封装体形成一通孔，通孔与感光芯片相对以提供感光芯片的光线通路，通孔的内侧面包括第一弧面、连接面及第二弧面，第一弧面与第二弧面分别与连接面的两端连接。该感光组件将封装体的内侧面的上下两端均设置为弧面，有利于封装体的成型模具脱模，避免模具脱模过程中对封装体造成损伤。

Description

摄像模组及其感光组件
技术领域
本发明涉及摄像模组领域，特别是涉及一种摄像模组及其感光组件。
背景技术
随着各种智能设备的快速发展，集成有摄像模组的智能设备在提高成像质量的同时，也越来越向轻薄化方向发展。而提高成像质量意味着电子元器件的规格不断增大、数量不断增多，极大程度上影响成像质量的感光芯片的面积的也不断增大，因此造成摄像模组的组装难度不断增大，其整体尺寸也不断增大，因此摄像模组的轻薄化受到了极大限制，进而限制了设有该摄像模组的智能设备的体积。
通常，在制作摄像模组时，会先分别制成线路板、感光芯片等，再将感光芯片胶粘在线路板上，然后再通过封装体对线路板、感光芯片等进行封装。传统制作封装体的方式主要为注塑成型工艺，成型模具容易在脱模的过程中影响封装体顶面上翘，从而影响摄像模组的成像质量。
发明内容
本发明旨在提供一种高质量的摄像模组及其感光组件。
一种感光组件，包括：
线路板；
感光芯片，连接于所述线路板上；以及
封装体，封装成型于所述线路板，所述封装体形成一通孔，所述通孔与所述感光芯片相对以提供所述感光芯片的光线通路，所述通孔的内侧面包括第一弧面、连接面及第二弧面，所述第一弧面与所述第二弧面分别与所述连接面的两端连接。
上述的感光组件，封装体的内侧面的上下两端均设置为弧面，有利于封装体的成型模具脱模，避免模具脱模过程中对封装体造成损伤。
在其中一个实施例中，所述感光芯片包括感光区及围绕所述感光区的非感光区，所述封装体同时封装在所述非感光区上，所述封装体包括远离所述感光芯片的顶面，所述第一弧面远离所述连接面的一端与所述非感光区连接，所述第二弧面远离所述连接面的一端与所述顶面连接。
封装体延伸至感光芯片的非感光区上，使得感光芯片通过模塑的方式固定在线路板上，这不仅加强了感光芯片与线路板之间连接的牢固性，还增大了封装体的封装面积，提高了封装体与线路板及感光芯片之间连接的牢固性。
在其中一个实施例中，所述第一弧面为内凹弧面，所述第二弧面为外凸弧面。与垂直于感光芯片且经过第一弧面与非感光区连接的一端的内侧面相比，内凹的弧面能减小封装体的材料用量。与垂直于感光芯片且经过第一弧面远离非感光区的一端的内侧面相比，内凹的弧面能进一步增大封装体的封装面积，从而进一步提高封装体与感光芯片之间连接的牢固性。与垂直于感光芯片且经过第二弧面远离顶面的一端的内侧面相比，在粘结支架与封装体时，多余的粘结剂可以向内流动至弧面上，相对于垂直面，弧面结构对粘结剂的流动具有更大的阻力，可以降低粘结剂的流动速度，使得粘结剂沉积在弧面上。进一步的，弧面结构相对于斜面，具有更大的表面积，可以承载更多的粘结剂。如此，可以有效避免粘结剂流动至感光芯片的感光区上。
在其中一个实施例中，所述内凹弧面为圆弧面，所述内凹弧面的半径为20～200μm。上述内凹圆弧面半径的设置兼顾了封装体与感光芯片之间连接的牢固性和封装体的材料用量两方面的考虑。
在其中一个实施例中，所述内凹弧面的半径为50～150μm。
在其中一个实施例中，所述内凹弧面的半径为80～120μm。
在其中一个实施例中，所述外凸弧面为圆弧面，所述外凸弧面的半径为10～100μm。上述外凸圆弧面半径的设置兼顾了便于封装体脱模和减少封装体的材料用量两方面的考虑。
在其中一个实施例中，所述外凸弧面的半径为30～80μm。
在其中一个实施例中，所述外凸弧面的半径为40～60μm。
在其中一个实施例中，所述内侧面还包括连接所述第一弧面与所述第二弧面的连接面。连接面能够增强封装体的结构强度。
在其中一个实施例中，所述连接面与所述顶面垂直，或者，所述连接面与所述顶面之间的夹角为钝角。连接面垂直于顶面，能够增大封装体的结构强度。连接面与顶面间的夹角为钝角，更利于封装体成型模具脱模，还能减少入射光线经连接面反射至感光芯片感光区的反射光量，避免干扰成像效果，提高成像质量。
在其中一个实施例中，所述顶面与所述感光芯片远离所述线路板的一面之间的距离为200～300μm。封装体在感光芯片上的高度设计可以同时满足封装要求和感光组件的小型化设计。
在其中一个实施例中，还包括连接所述感光芯片与所述线路板的导线，所述封装体包覆所述导线。导线被封装体包裹，可以防止导线移动，同时，导线处于密封环境中，可以减少导线与空气中的水汽接触，延长导线的使用寿命。
一种摄像模组，包括：
上述的任一种感光组件；以及
镜头组件，设置于所述感光组件上，且正对于所述感光芯片。
由于感光组件更便于脱模，从而包括该感光组件的摄像模组的良率得以提高，生产成本得以降低。
附图说明
图1为本发明中感光组件的第一实施例的结构示意图；
图2为图1所示的感光组件中A处的局部放大图；
图3为本发明中感光组件的第二实施例的结构示意图；
图4为本发明中感光组件的第三实施例的结构示意图；
图5为图4所示的感光组件中B处的局部放大图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1及图2所示，一实施方式的感光组件102包括线路板200、感光芯片300及封装体400。其中，线路板200可以是陶瓷线路板等硬质电路板，也可以为软硬结合板或软板。当线路板200为软板时，可在线路板200远离感光芯片300的一侧设置补强板(图未示)，以提高线路板200的强度，从而提高该感光组件102的整体结构强度。感光芯片200连接于线路板200上。
封装体400封装成型于线路板200，封装体400形成一通孔410，通孔410与感光芯片300相对以提供感光芯片300的光线通路。通孔410的内侧面包括第一弧面412、连接面414及第二弧面416，第一弧面412与第二弧面416分别与连接面414的两端连接。
本实施方式的感光组件102将封装体400的内侧面的上下两端均设置为弧面，有利于封装体400的成型模具脱模，避免模具脱模过程中对封装体400造成损伤。
在本实施方式中，感光芯片300包括感光区310及围绕感光区310的非感光区320。感光区310主要由具有光敏特性的半导体材料制成，在光的照射下会产生化学变化，进而转化成电信号，由此实现光电信号的转变，最终完成成像。而非感光区320即使在光的照射下也不会产生化学变化。
封装体400同时封装在非感光区320上。封装体400包括远离感光芯片300的顶面420，第一弧面412远离连接面414的一端与非感光区320连接，第二弧面416远离连接面414的一端与顶面420连接。
对于本实施方式的感光组件102来说，封装体400延伸至感光芯片300上，使得感光芯片300通过模塑的方式固定在线路板200上，在形成封装体400的同时，完成了感光芯片300与线路板200的连接，加强了感光芯片300与线路板200之间连接的牢固性。
而且，相比于与感光芯片间隔设置的封装体，封装体400延伸至感光芯片300上，增大了封装体400的封装面积，提高了封装体400与线路板200及感光芯片300之间连接的牢固性。
进一步，在本实施方式中，非感光区320部分嵌设于封装体400内，使得整个感光区310都能用来感光，保证了感光组件102具有最大的感光面积。而且，与封装体400向内延伸覆盖全部的非感光区320相比，不仅能够减少封装体400的体积，还能预留出一部分非感光区320来接纳封装树脂等异物，以避免封装过程中封装树脂等异物流入感光区310而影响成像质量的风险。
当然，在其他实施方式中，如图3所示，封装体400也可以与感光芯片300间隔设置，也即封装体400仅封装在线路板200上，第一弧面412远离连接面414的一端与线路板200连接。
值得一提的是，封装体400通过模塑成型的方式形成于线路板200和感光芯片300上。例如，采用注塑机，通过嵌入成型工艺将线路板200和感光芯片300进行模塑形成封装体400。成型后的封装体400与线路板200和感光芯片300牢固相连，与传统通过胶层粘接的方式相比，封装体400与线路板200和感光芯片300之间的粘接力要大得多。具体地，采用注塑工艺形成封装体400的材料可为尼龙、LCP(Liquid Crystal Polymer，液晶高分子聚合物)或PP(Polypropylene，聚丙烯)等。本领域技术人员应当理解的是，前述可以选择的制造方式以及可以选择的材料，仅作为举例说明本发明的可以实施的方式，并不是本发明的限制。
在本实施方式中，第一弧面412为内凹圆弧面，第二弧面416为外凸圆弧面。也即，第一弧面412由通孔410的内侧面朝向封装体400的外侧面430凹陷形成，第二弧面416由通孔410的内侧面背向封装体400的外侧面430凸出形成。
与垂直于感光芯片300且经过第一弧面412与非感光区320连接的一端的内侧面418a(假想的内侧面)相比，内凹的圆弧面能减小封装体400的材料用量。与垂直于感光芯片300且经过第一弧面412远离非感光区320的一端的内侧面418b(假想的内侧面)相比，内凹的圆弧面能进一步增大封装体400的封装面积，从而进一步提高封装体400与感光芯片300之间连接的牢固性。与垂直于感光芯片300且经过第二弧面416远离顶面420的一端的内侧面418c(假想的内侧面)相比，在粘结支架与封装体400时，多余的粘结剂可以向内流动至弧面上，相对于垂直面，弧面结构对粘结剂的流动具有更大的阻力，可以降低粘结剂的流动速度，使得粘结剂沉积在弧面上。进一步的，弧面结构相对于斜面，具有更大的表面积，可以承载更多的粘结剂。如此，可以有效避免粘结剂流动至感光芯片300的感光区310上。
一实施例中，内凹圆弧面的半径R1为20～200μm。
一实施例中，内凹圆弧面的半径R1为50～150μm。
一实施例中，内凹圆弧面的半径R1为80～120μm。
内凹圆弧面的半径R1的设置兼顾了封装体400与感光芯片300之间连接的牢固性和封装体400材料用量两方面的考虑。若R1过大，第一弧面412几乎与感光芯片300远离线路板200的一侧重合，会加大封装体400注塑成型的难度，而且第一弧面412与感光区310之间的距离很小，难以保证感光区310不受异物污染，影响成像质量。若R1过小，则第一弧面412近乎垂直于感光芯片300，并没有减少封装体400的材料用量。
一实施例中，外凸圆弧面的半径R2为10～100μm。
一实施例中，外凸圆弧面的半径R2为30～80μm。
一实施例中，外凸圆弧面的半径R2为40～60μm。
外凸圆弧面半径R2的设置兼顾了便于封装体400脱模和减少封装体400材料用量两方面的考虑。若R2过大，第二弧面416几乎与顶面420共面，并没有减少封装体400的材料用量。若R2过小，第二弧面416近乎垂直于感光芯片300，不利于封装体400成型模具脱模。
一实施例中，如图2所示，第一弧面412与感光芯片300远离线路板200的一侧相切，第一弧面412与连接面414相切，第二弧面416与连接面414及顶面420均相切，以保证第一弧面412与感光芯片300平滑连接，第一弧面412与连接面414平滑连接，连接面414与第二弧面416平滑连接，第二弧面416与顶面420平滑连接，从而能进一步利于封装体400成型模具的脱模，避免成型模具在脱模过程中损伤封装体400。
一实施例中，如图1及图2所示，连接面414与顶面420垂直，这样设置能增强封装体400的结构强度。
一实施例中，如图4及图5所示，连接面414与顶面420之间的夹角为钝角。也即，连接面414朝向外侧面430倾斜。这样不仅更利于封装体400成型模具的脱模，还能减少入射光线经连接面414反射至感光芯片300感光区310的反射光量，避免干扰成像效果，提高成像质量。
一实施例中，顶面420平行于感光芯片300，顶面420与感光芯片300远离线路板200的一面之间的垂直距离H为200～300μm。封装体400相对于感光芯片300的垂直距离H(高度)既要考虑可以对感光芯片300或线路板200上的其他电子元件形成封装，又要考虑不会在高度方向增加摄像模组的体积。上述高度H设计可以同时满足封装要求和小型化设计。
一实施例中，感光组件102还包括连接感光芯片300与线路板200的导线500，封装体400包覆导线500。也即，导线500完全收容于封装体400内。其中，导线500可以为金线、铜线、铝线或者银线等。导线500被封装体400包裹，可以防止导线500移动，同时，导线500处于密封环境中，可以减少导线500与空气中的水汽接触，延长导线500的使用寿命。
本实施方式还提供了一种摄像模组，摄像模组包括前述的感光组件102，还包括镜头组件。镜头组件设置于感光组件102上，且正对于感光芯片300。
当需采用定焦镜头时，镜头组件包括镜头，镜头位于顶面420上；当需采用变焦镜头时，镜头组件包括镜头及套设在镜头上的音圈马达，音圈马达位于顶面420上。光线从镜头入射至感光芯片300的感光区310，感光芯片300将光信号转换成电信号。
该摄像模组由于其包括的感光组件102更为牢固，因此该摄像模组的牢固性也得以加强。由于其包括的感光组件102上的封装体400脱模的成功率更高，因此该摄像模组的生产成本也得以降低。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (13)

1.一种感光组件，其特征在于，包括：
线路板；
感光芯片，连接于所述线路板上；以及
封装体，封装成型于所述线路板，所述封装体形成一通孔，所述通孔与所述感光芯片相对以提供所述感光芯片的光线通路，所述通孔的内侧面包括第一弧面、连接面及第二弧面，所述第一弧面与所述第二弧面分别与所述连接面的两端连接。
2.根据权利要求1所述的感光组件，其特征在于，所述感光芯片包括感光区及围绕所述感光区的非感光区，所述封装体同时封装在所述非感光区上，所述封装体包括远离所述感光芯片的顶面，所述第一弧面远离所述连接面的一端与所述非感光区连接，所述第二弧面远离所述连接面的一端与所述顶面连接。
3.根据权利要求1或2所述的感光组件，其特征在于，所述第一弧面为内凹弧面，所述第二弧面为外凸弧面。
4.根据权利要求3所述的感光组件，其特征在于，所述内凹弧面为圆弧面，所述内凹弧面的半径为20～200μm。
5.根据权利要求4所述的感光组件，其特征在于，所述内凹弧面的半径为50～150μm。
6.根据权利要求4所述的感光组件，其特征在于，所述内凹圆弧面的半径为80～120μm。
7.根据权利要求3所述的感光组件，其特征在于，所述外凸弧面为圆弧面，所述外凸弧面的半径为10～100μm。
8.根据权利要求7所述的感光组件，其特征在于，所述外凸弧面的半径为30～80μm。
9.根据权利要求7所述的感光组件，其特征在于，所述外凸弧面的半径为40～60μm。
10.根据权利要求2所述感光组件，其特征在于，所述连接面与所述顶面垂直，或者，所述连接面与所述顶面之间的夹角为钝角。
11.根据权利要求2所述的感光组件，其特征在于，所述顶面与所述感光芯片远离所述线路板的一面之间的距离为200～300μm。
12.根据权利要求2所述的感光组件，其特征在于，还包括连接所述感光芯片与所述线路板的导线，所述封装体包覆所述导线。
13.一种摄像模组，其特征在于，包括：
如权利要求1-12任一项所述的感光组件；以及
镜头组件，安装于所述感光组件上，且位于所述感光芯片的感光路径上。
CN201710853859.0A 2017-09-15 2017-09-15 摄像模组及其感光组件 Pending CN109510923A (zh)

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