CN109506804A - Flexible thermal mapping device for monitoring temperature - Google Patents
Flexible thermal mapping device for monitoring temperature Download PDFInfo
- Publication number
- CN109506804A CN109506804A CN201811638161.8A CN201811638161A CN109506804A CN 109506804 A CN109506804 A CN 109506804A CN 201811638161 A CN201811638161 A CN 201811638161A CN 109506804 A CN109506804 A CN 109506804A
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- China
- Prior art keywords
- temperature sensor
- temperature
- flexible thermal
- circuit board
- oxide semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B10/00—Instruments for taking body samples for diagnostic purposes; Other methods or instruments for diagnosis, e.g. for vaccination diagnosis, sex determination or ovulation-period determination; Throat striking implements
- A61B10/0012—Ovulation-period determination
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
- A61B5/015—By temperature mapping of body part
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/20—Clinical contact thermometers for use with humans or animals
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B10/00—Instruments for taking body samples for diagnostic purposes; Other methods or instruments for diagnosis, e.g. for vaccination diagnosis, sex determination or ovulation-period determination; Throat striking implements
- A61B10/0012—Ovulation-period determination
- A61B2010/0019—Ovulation-period determination based on measurement of temperature
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Surgery (AREA)
- General Health & Medical Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Engineering & Computer Science (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Pathology (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Biophysics (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
The invention relates to a flexible thermal plotting device for monitoring temperature, which comprises a circuit board, a temperature sensor and a P-type metal oxide semiconductor field effect transistor, wherein the temperature sensor and the P-type metal oxide semiconductor field effect transistor are arranged on the circuit board, the P-type metal oxide semiconductor field effect transistor and the temperature sensor are respectively arranged on the front side and the back side of the circuit board and are electrically connected, a first polymer film is arranged on the temperature sensor, and a second polymer film is arranged on the P-type metal oxide semiconductor field effect transistor, and belongs to the technical field of electronics. The object is to provide a form-fitting size and shape suitable for use on body parts and surfaces; wearable/connectable, additional wireless data acquisition and temperature profile recording; a flexible thermal mapping device for monitoring temperature that is recyclable and has a replaceable contact surface.
Description
Technical field
The present invention relates to a kind of heat distribution measuring systems and method for entire limited area.Specifically, of the invention
Using the micro-dimension of oldered array, temperature sensors of high precision and adjoint orderly transistor array determine the bending in restriction
The system and method for heat distribution on region, two of them array are all fixed on flexible circuit board.
Background technique
The flexibility temperature sensor and sensor array of the prior art include the device using various flexible materials and circuit.
For example, a kind of conductive polymer membrane arranged on the board surface is disclosed in United States Patent (USP) US8,783,948B2, wherein one
Conducting polymer film is connected to electrode to measure the thermotonus property of conductive polymer membrane.In United States Patent (USP) US6,180,
867B1 discloses a kind of array of temperature sensor being made of pattern metal, such as resistance temperature detector (" RTD "), makes
Interconnection is routed with the film for being fixed to flexible circuit board.It discloses in United States Patent (USP) US8,097,926B2 using flexible circuit
Form sensing device array.
Flexibility temperature sensor is used as wearable system in health care industry at present, in the prior art, in the market
Most of wearable systems only there is the separated sensor for body temperature tracking, such single sensor or a small amount of single
Sensor cannot provide many health cares using required detailed and steady hot map information.
In addition current temperature sensing method is infrared (IR) thermal imaging, is had been widely used on visualization skin surface
Temperature model.However IR thermal imaging is related to the IR equipment of expensive and big part, such as camera, camera lens, calculating equipment, display screen
Deng.Therefore can just create at last the integrated wearable system based on IR thermal imaging be also it is difficult, especially when a
When people is mobile, the skin surface temperature of periodic measurement individual can be carried out continuously.
Another art methods penetrated for hot showing include being installed to multiple individual discrete resistance temperature sensors
On flexible circuit board in two-dimensional network, and temperature sensor is positioned to direct with individual's skin or other surfaces to be measured
Contact.By sharing row and column, the inside connection that two-dimensional network resistance temperature sensor array simplifies this system really is multiple
Polygamy.However, obstruction of this arrangement by the electrical crosstalk problem between its resistance temperature sensor.This electrical crosstalk generates not
Reliable temperature data, partly cause are resistor, adjacent column element, adjacent units and the array ruler of multiplexer
Very little influence.
The system and method for each prior art have the disadvantage, such as
Summary of the invention
The purpose of the present invention is being to solve existing flexible thermal mapping system and its device for monitoring temperature, lack
Enough temperature ranges, due to temperature sensor large scale and/or interval and lack discrete heat on relatively small region
Distribution or the practicability for lacking accuracy, system.And a kind of novel system or device are provided, for effectively determining cross
Comprehensive and repeatable flexible thermal mapping system and its device by heat distribution monitoring temperature in the bending region across restriction.
A kind of flexible thermal plotting board for monitoring temperature, the device includes circuit board, on circuit board
Temperature sensor and P type metal oxide semiconductor field effect transistor, the P type metal oxide semiconductor field-effect are brilliant
Body pipe is respectively arranged on the tow sides of circuit board with temperature sensor and is electrically connected, and it is poly- that the temperature sensor is equipped with first
Compound film, the P type metal oxide semiconductor field effect transistor are equipped with second polymer film.
Further, the circuit board is flexible circuit board.
Further, the temperature sensor is that there are two the silicon substrate positive temperature coefficients (PTC) of solder electroplated electrode for tool
Thermistor.
Further, the temperature sensor with 50 multiply 50 array arrangement, the spacing of temperature sensor is 2 millimeters
× 2 millimeters, the sensing region is 10 centimetres of 10 cm x.
Further, the P type metal oxide semiconductor field effect transistor includes gate electrode, source electrode and electric leakage
Pole, the gate electrode and circuit board electrical connection, the source electrode connect to power supply, the drain electrode and temperature sensor
Connection.
Further, the temperature sensor, P type metal oxide semiconductor field effect transistor and flexible circuit board
Between gap filling have heat-curable epoxy resin.
Further, the first polymer film encapsulates the temperature sensor, the second polymer film encapsulation
The P type metal oxide semiconductor field effect transistor, the first polymer film and second polymer film are 0.01 millimeter
Thick polyethylene terephthalate (PET) adhesive tape.
Beneficial effect by adopting the above technical scheme is:
1. conformal size and shape, to be suitable for physical feeling and surface；
2. wearable/can to connect, additional wireless data acquisition and temperature curve record；
3. can be recycled: replaceable contact surface.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the sensing region of hot plotting board；
Fig. 2 shows representative temperature-resistance characteristic of temperature sensor in hot plotting board；
Fig. 3 is the schematic diagram of single sense pixel；
Fig. 4 is the rough schematic view for illustrating the connection of sensor and MOSFET in array；
Fig. 5 is the schematic diagram for illustrating the position of sensitive zones and circuit；
Fig. 6 is the schematic diagram that 4 hot showing injection devices are combined into large-scale hot showing injection device by connecting cable by explanation；
Fig. 7 shows the system block diagram of hot showing jet device.
Specific embodiment
The contents of the present invention are further described below in conjunction with attached drawing and currently preferred specific embodiment.It is lifted
Example is served only for explaining the present invention, is not intended to limit the scope of the present invention.
As shown in fig. 1, the flexible thermal plotting board 100 includes circuit board 110, temperature sensor 120, p-type gold
Belong to oxide semiconductor field effect transistor (hereinafter referred to as MOSFET) 130, first polymer layer 140 and the second polymer layer
150, the circuit board 110 is flexible circuit board (abbreviation FPC flexible board), and temperature sensor 120 is fixed on FPC flexible board
110 one side, and MOSFET 130 is fixed to the other one side of FPC flexible board 110 by welding procedure, is additionally formed circuit system
The electronic building brick of system is fixed to the side MOSFET of flexible thermal plotting board 100.Circuit system is that controller or other equipment mention
For being communicated with MOSFET130 and temperature sensor 120 and controlling the function of MOSFET 130 and temperature sensor 120.Fig. 3's
Three temperature sensors 120 are shown in exemplary embodiment and three MOSFET 130 combine Fig. 1, it can be understood as any number
The temperature sensor 120 and MOSFET 130 of amount can be used together with flexible thermal plotting board 100, provide the temperature of identical quantity
It spends sensor 120 and uses MOSFET 130.As will be further understood, each MOSFET be located at substrate opposite side on
Temperature sensor pairing.Here, MOSFET is properly termed as relevant MOSFET or relevant temperature to the pairing of temperature sensor
Spend sensor.Each temperature sensor 120 includes two electrode (not shown in figure 1)s, passes through what is formed in the welding process
Two solder joints 160 electrically and mechanically arrive FPC flexible board 110.Each MOSFET 130 include three electrodes, gate electrode,
Source electrode and drain electrode (not shown in figure 1).Electrode also passes through three solder joints 170 electrical connection formed in the welding process and machine
Tool is connected to FPC flexible board 110.Use the mode filling temp sensor 120 and FPC flexible board of heat-curable epoxy resin 180
Gap between 110 and MOSFET 130 and FPC flexible board 110.Heat-curable epoxy resin 180 is improved temperature sensor
120 and MOSFET 130 is fixed to the mechanical support of flexible thermal plotting board 100 and the entirety of flexible thermal mapping cushion device 100
Structural intergrity.First polymer layer 140 are positioned to temperature sensor 120, and the second polymer layer 150 is positioned to cover
It is against damages with guard block to cover MOSFET 130.In an example, first polymer layer 140 and second polymer polymer
Layer 150 is made of black polyethylene terephthalate (PET) band of 0.01 millimeters thick.Preferably the thickness of band should be opposite
It is relatively thin so that thermal resistance minimizes and makes from will be by the heat transfer road for the target surface area that flexible thermal plotting board 100 measures
Diameter minimizes.
When it is implemented, an exemplary embodiment of flexible thermal plotting board 100 include 2500 temperature sensors and
Matched 2500 MOSFET, each MOSFET are arranged with 50 × 50 arrays.Sensor spacing is 2 millimeters × 2 millimeters, induction zone
Domain is 10 centimetres of 10 cm x, and general objective surface area is 100 square centimeters.2500 temperature in 100 square centimeters of regions pass
Sensor can provide the high-resolution of target area and high density hot showing is penetrated and the heat distribution of data rich.
As shown in Figure 2, which depict the allusion quotations of the Si temperature sensor used in the flexible thermal plotting board 100
Type temperature-resistance characteristic.As shown, this relationship is linear；Therefore, when the resistance of temperature sensor, simply
Calculating generate the temperature sensor location at temperature.In one example, Si temperature sensor is arranged to naked pipe form
Positive temperature coefficient (PTC) thermistor so that thermal resistance and heat conduction path minimize.PTC thermistor is a kind of temperature-sensitive electricity
Resistance, resistance increase with temperature and are increased.The intrinsic resistance and Si temperature sensor of Si temperature sensor and its size of electrode
It is related.The size for the exemplary Si temperature sensor being used together with flexible thermal mapping mattress system disclosed herein is 1.2 millimeters
Long, 0.7 mm wide and 0.2 millimeter of height, two electrode measurements are 0.2 millimeter × 0.3 millimeter and are spaced 0.6 millimeter.As shown in figure 1
It is shown.As shown in Fig. 2, the resistance of Si temperature sensor is at 25 DEG C about 1100 ohm.The sensitivity of Si temperature sensor is about
It is 9 ohm every degree Celsius.The precision of each Si temperature sensor be about ± 0.2 degree Celsius, this by calibration water-bath in into
Row test is confirmed.
As shown in Figure 3, P type metal oxide semiconductor field effect transistor 130 is p-type MOSFET.Pass through circuit system
It unites and sends signal to MOSFET, MOSFET " can be connected " and " shutdown ".When applying " low " signal on gate electrode, MOSFET
Conducting；When applying "high" signal to grid, MOSFET cut-off, the grid of each MOSFET is connected to public grid bus,
MOSFET is connected to circuit system by the public grid bus.MOSFET source is connected to low noise power supply, MOSFET drain electrode
It is connected to an electrode of associated temperature sensor.Another electrode of temperature sensor is connected to common bus, this is public total
Line is connected to circuit system.By opening and closing MOSFET, relevant temperature sensor can control.That is, if
" low " signal is sent to by public grid bus the grid of MOSFET, then relevant temperature sensor is connected.If passed through
Public grid bus sends "high" signal to the grid of MOSFET, then closes relevant temperature sensor.
As shown in Figure 4, MOSFET presses row tissue, wherein all rows collectively form MOSFET array.It is arranged in same a line
In the grid of MOSFET be connected to the common gate polar curve for extending and being connected to circuit system along the row.The source electrode of all MOSFET
It is connected to a common low noise power supply.The drain electrode of each MOSFET is connected to an electrode of associated temperature sensor.Temperature
Sensor arrangement is spent in column, wherein all column include array of temperature sensor jointly.For all temperature sensing in same row
Device, the temperature sensor electrode for being not attached to related MOSFET, which is connected to, extends along column and is connected to the public total of circuit system
Line.Each temperature sensor can individually be opened and closed by row-column scan method by circuit system.For example, (C1, R1)
Temperature sensor can be opened by providing " low " signal to C1 and R1, and other row and columns provide "high" signal to close
Every other array of temperature sensor.Therefore, resistance readings are collected from single temperature sensor and therefore prevents adjacent temperature
Electrical crosstalk between sensor, to obtain reliable temperature data.
As shown in Figure 5, control circuit and signal processing circuit are located at two neighboring edges of FPC flexible board, and
Array of temperature sensor is positioned along the rest part of FPC flexible board.In one example, the flexible thermal mapping described in Fig. 1
The size of cushion device is shown in FIG. 2.Fig. 5 is 11 centimetres of 11 cm x, and wherein the induction region of flexible thermal plotting board is 10
10 centimetres of cm x.
As shown in Figure 6, each flexible thermal plotting board is communicated with one another by connector 200 and a series of connecting cables.
Four flexible hot mapping pad equipment combine, and induction region are expanded to 20 centimetres of 20 centimetres of x, in 400 square centimeters of area
10,000 temperature sensors are shared in domain.
As shown in Figure 7, foregoing flexible thermal plotting board includes array of temperature sensor and MOSFET array.Spirit
Hot mapping pad equipment living further includes a series of decoders, a series of multiplexers, low-noise amplifier, memory and low noise
Acoustic-electric source.Decoder and multiplexer realize row-column scan method, for reading the resistance of each temperature sensor.Decoding
Device and multiplexer are controlled by the row switching signal and column switching signal that send from master board respectively.Low noise power supply is temperature
Degree sensor provides stable bias voltage, in order to resistance measurement.Temperature sensor signal is amplified to by low-noise amplifier
Reasonable range, so as to receive and handle data.Memory stores the calibration data of each temperature sensor.It was calibrating
Each temperature sensor is recorded in journey in the resistance of several temperature spots and is stored in memory.The data of the storage are used for soft
According to the measurement resistance calculations temperature value of each sensor during the operation of the hot mapping cushion device of property.Master control borad is surveyed by flexible thermal
Cable connection at the connector of figure cushion device corner is to flexible thermal mapping cushion device.Master board includes control unit and data
Transmission unit.Row switching signal and column switching signal are sent flexible thermal mapped device by control unit, and receives and come from low noise
The temperature sensor signal of acoustic amplifier is simultaneously digitized.Data transmission unit is sent temperature data to by USB cable
Computer to be further processed, such as determines the heat distribution of sensing region.
Flexible thermal plotting board described in this programme can should apply to many industries.For example, flexible thermal mapping dress
It sets and can be used for monitoring hypothermia, such as monitor the temperature of patient in intensive care unit or emergency ward, for having been subjected to
It is close drowned or be exposed to extremely cold patient.Flexible hot mapping mattress system can also be used in finishing operations monitoring and prediction apoplexy is restored
Progress.
Flexible flexible thermal plotting board can also be used in fertility auxiliary.Because progesterone will lead to basis during female ovulation
Body temperature increases (" BBT "), it is desirable that the women of pregnancy can monitor body using flexible thermal mapping mattress system every morning
Temperature.During ovulation, the BBT of women will be slightly above women, and in the ovulation last stage, (typically at least 0.3 degrees Fahrenheit/0.17 is Celsius
Degree).Body temperature rises the omen correlation that also can be used as apoplexy.This correlation be found in two main stroke groups-ischemics and
Hemorrhagic.The monitoring of flexible thermal mapping mattress system can be used by nutritional deficiency, diabetic neuropathy is pregnant, and is exposed to a huge sum of money
Belong to and is known as the phenomenon that burning foot syndrome (" BFS ") caused by chemotherapy.Likewise it is possible to use flexible thermal mapping mattress system
Cold foot syndrome caused by monitoring can be oppressed by spinal nerve root.
The flexible thermal plotting board can also be used in wearable electronic.In order to preferably monitor hypertension, the heart
Popular name for, cancer, chronic respiratory disease, diabetes and mental disease and the elderly is monitored when extreme cold.
Flexible thermal plotting board is in addition to medical application described in this programme, it may also be used for military, industry and science are answered
With.For example, continuing to monitor body during prolonged outdoor training and the active service of army personnel as a kind of wearable device
Temperature, to avoid being exposed to the sun under heatstroke under hot climate and cold climate and frostbite.During circuit board fabrication, it can make
Small pin defect or the exception between the thousands of components in electronic component are searched with flexible thermal plotting board.It can also make
It is analyzed with flexible thermal plotting board for electronic equipment can be consumed or the system collection of any system with tiny electronic component
At power optimization.Using different application program and software, the marginal testing between thousands of electronic components can analyze,
The balance of heat management and Arrhenius model.
In scientific research, such as life science can be proved using flexible thermal plotting board in Food Science, is changed
The metabolic mechanism of the researchs such as, biological food and reaction are assumed.In electronic technology, flexible thermal plotting board can be used
Detect the transient temperature variation in tiny area.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811638161.8A CN109506804A (en) | 2018-12-29 | 2018-12-29 | Flexible thermal mapping device for monitoring temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811638161.8A CN109506804A (en) | 2018-12-29 | 2018-12-29 | Flexible thermal mapping device for monitoring temperature |
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| CN109506804A true CN109506804A (en) | 2019-03-22 |
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| CN201811638161.8A Pending CN109506804A (en) | 2018-12-29 | 2018-12-29 | Flexible thermal mapping device for monitoring temperature |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110584620A (en) * | 2019-09-09 | 2019-12-20 | 深圳创达云睿智能科技有限公司 | Wearable device |
| CN110584622A (en) * | 2019-09-09 | 2019-12-20 | 深圳创达云睿智能科技有限公司 | Wearable device |
| WO2023026116A1 (en) * | 2021-08-26 | 2023-03-02 | Ap Infosense Limited | Hand temperature monitoring device for chinese medicine diagnosis and treatment |
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Application publication date: 20190322 |