CN109493748B - Display module, display device and manufacturing method of display module - Google Patents
Display module, display device and manufacturing method of display module Download PDFInfo
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- CN109493748B CN109493748B CN201910007958.6A CN201910007958A CN109493748B CN 109493748 B CN109493748 B CN 109493748B CN 201910007958 A CN201910007958 A CN 201910007958A CN 109493748 B CN109493748 B CN 109493748B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
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Abstract
The invention relates to a display module, which comprises an OLED panel and a heat dissipation film positioned on the back of the OLED panel, wherein the OLED panel can be reversely bent to be connected with a flexible circuit board positioned on one side of the heat dissipation film far away from the OLED panel, one side of the heat dissipation film far away from the OLED panel is provided with a bonding adhesive layer, the bonding adhesive layer is composed of a plurality of sub bonding adhesive layers arranged at intervals, and the bonding adhesive layer can deform to absorb the force generated when the flexible circuit board is pressed on the OLED panel. The invention also relates to a manufacturing method of the display device and the display module. The setting of the bonding glue layer that the sub-bonding glue layer that a plurality of intervals set up constitutes, the easy deformation of bonding glue layer absorbs most pressfitting energy through the deformation of bonding glue layer to reduce the energy of transmitting for the heat dissipation membrane, reduce the deformation of heat dissipation membrane, effectively, reliably improve AMOLED mould seal bad phenomenon.
Description
Technical Field
The invention relates to the technical field of display product manufacturing, in particular to a display module, a display device and a manufacturing method of the display module.
Background
Compared with the conventional liquid crystal display used by most mobile phones, an Active-matrix organic light emitting diode (AMOLED) has a wider viewing angle, a higher refresh rate and a thinner size, and has become the first choice for pets and flagship products in intelligent waves. However, due to the factors of module assembly, the FPC (flexible printed circuit) needs to be folded and pressed, and after the FPC is laminated, the AMOLED is easily deformed at the pressed part of the FPC device region due to the good flexibility of the AMOLED, so that a poor stamping phenomenon can be found under strong light.
Disclosure of Invention
In order to solve the technical problems, the invention provides a display module, a display device and a manufacturing method of the display module, which solve the problem that the pressing part of a flexible circuit board is easy to deform so as to cause poor stamping.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a display module assembly, includes the OLED panel and is located the radiating film at the OLED panel back, the OLED panel can reverse buckle, with and be located the radiating film is kept away from the flexible line way board of one side of OLED panel is connected, the radiating film is kept away from the one side of OLED panel sets up the bonding glue film, the sub-bonding glue film that the bonding glue film set up by a plurality of intervals constitutes, just the bonding glue film can warp in order to absorb, at the flexible line way board crimping in the power that produces when on the OLED panel.
Furthermore, the sub-bonding glue layers are of strip structures, and the sub-bonding glue layers are arranged side by side.
Furthermore, the sub-bonding glue layers are of block structures, and a plurality of sub-bonding glue layers are distributed in an array mode to form a grid shape.
Furthermore, the sub-bonding glue layer comprises a first connecting surface connected with the heat dissipation film and a second connecting surface arranged opposite to the first connecting surface, and the area of the first connecting surface is smaller than that of the second connecting surface.
Furthermore, the sub-bonding adhesive layer is linearly connected with the heat dissipation film, and the second connection surface is of a planar structure.
Furthermore, a supporting layer with a plane structure is arranged on the bonding glue layer.
The invention also provides a display device, which comprises the display module, wherein the bonding adhesive layer is also provided with a supporting layer with a planar structure, and the display device further comprises:
the flexible circuit board is correspondingly arranged on the supporting layer, and one end of the flexible circuit board is electrically connected with the bent OLED panel;
the cover plate is arranged on one surface, far away from the heat dissipation film, of the OLED panel.
Furthermore, the OLED panel comprises a first area, a second area and a bendable area located between the first area and the second area, the heat dissipation film is arranged on the first area, the second area is electrically connected with the flexible circuit board, and a gasket is arranged between the heat dissipation film and the second area.
The display device of the embodiment absorbs most of the pressing energy through the deformation of the adhesive layer 4 by utilizing the energy conservation principle, so that the thickness and the hardness of the heat dissipation film 5 are not changed, the attachment yield of the heat dissipation film 5 is ensured, and the poor AMOLED die stamping phenomenon is effectively improved.
The invention also provides a manufacturing method of the display module, which is used for manufacturing the display module and comprises the following steps,
forming an OLED panel;
forming a heat dissipation film on the OLED panel;
forming a bonding glue layer consisting of sub bonding glue layers arranged at intervals on the heat dissipation film;
and forming a supporting layer on the adhesive glue layer.
Further, a bonding adhesive layer formed by sub bonding adhesive layers arranged at intervals is formed on the heat dissipation film, and the method includes the following steps:
a plurality of sub-bonding glue layers which are arranged side by side and form a strip-shaped structure;
or a plurality of sub-bonding glue layers which form a block structure and are distributed in an array mode to form a grid mode.
Furthermore, the sub-bonding glue layer comprises a first connecting surface connected with the heat dissipation film and a second connecting surface arranged opposite to the first connecting surface, and the area of the first connecting surface is smaller than that of the second connecting surface.
The invention has the beneficial effects that: the setting of the bonding glue layer that the sub-bonding glue layer that a plurality of intervals set up constitutes, the easy deformation of bonding glue layer absorbs most pressfitting energy through the deformation of bonding glue layer to reduce the energy of transmitting for the heat dissipation membrane, reduce the deformation of heat dissipation membrane, effectively, reliably improve AMOLED mould seal bad phenomenon.
Drawings
FIG. 1 is a schematic diagram of a display module according to the prior art;
FIG. 2 is a schematic diagram illustrating a state of generating a poor impression in the prior art;
FIG. 3 is a schematic diagram of a display module according to an embodiment of the invention;
FIG. 4 is a schematic diagram illustrating a state of a display module after a flexible printed circuit board is assembled and pressed and a bonding adhesive layer is deformed according to an embodiment of the invention;
FIG. 5 is a schematic view of a bonding layer before compression deformation according to an embodiment of the present invention;
FIG. 6 is a schematic view showing a state in which a bonding adhesive layer is deformed under compression in an embodiment of the present invention;
FIG. 7 is a schematic view of a bonding layer after compression deformation according to an embodiment of the present invention;
FIG. 8 is a first schematic view of a bonding layer structure according to an embodiment of the invention;
fig. 9 is a schematic diagram of a second adhesive layer structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Due to the factors of module assembly, the FPC (flexible circuit board) needs to be folded reversely for pressing, after the FPC is pressed, the AMOLED is easy to deform at the pressing position of the FPC device region due to the good flexibility of the AMOLED, and a phenomenon of poor stamping can be found under strong light, as shown in fig. 1 and 2, an arrow is a force application direction, stress is applied to the flexible circuit board 1, the connecting layer 2 between the flexible circuit board 1 and the heat dissipation film 3 deforms, so that the heat dissipation film 3 and a corresponding region of the display panel 4 connected with the heat dissipation film 3 also deform, and the region 100 is a region where poor stamping occurs.
The method for improving the poor AMOLED die stamping mainly comprises the steps of increasing the thickness of a copper foil in a SCF (heat dissipation film) and the hardness of foam, and increasing the thickness and the variety of a display module by the method; however, when the curvature of the display module 3D COVER (COVER plate) is small, the flexibility of the SCF is reduced due to the increase in the copper foil thickness and the foam hardness, and the SCF is not easily deformed to be bonded during 3D bonding, resulting in the occurrence of defects such as bonding bubbles.
In view of the above problems, as shown in fig. 3 to 9, the present embodiment provides a display module including an OLED panel 6 and a heat dissipation film 5 located at the back of the OLED panel 6, wherein the OLED panel 6 can be reversely bent to connect with a flexible printed circuit board 2 located at one side of the heat dissipation film 5 away from the OLED panel 6, one side of the heat dissipation film 5 away from the OLED panel 6 is provided with a bonding adhesive layer 4, the bonding adhesive layer 4 is composed of a plurality of sub bonding adhesive layers 41 arranged at intervals, and the bonding adhesive layer 4 can be deformed to absorb the force generated when the flexible printed circuit board 2 is pressed on the OLED panel 6.
Fig. 4 is a schematic view showing a state of the display module after the flexible printed circuit board 2 is assembled and pressed and the adhesive layer 4 is deformed; fig. 5-7 are schematic views showing the adhesive layer 4 before, during and after compression deformation; the adhesive glue layer 4 formed by the sub adhesive glue layers 41 arranged at intervals is strong in flowability and easy to deform, an arrow 10 in fig. 3 indicates a force application direction, the flexible circuit board is pressed by a pressure head and other components 1 to press the flexible circuit board and the OLED panel, and the total pressing energy J is decomposed into energy J1 absorbed by the adhesive glue layer 4 and deformation energy J2 transmitted to the heat dissipation film 5 by adopting an energy conservation principle; most of the pressing energy is absorbed by the deformation of the bonding glue layer 4, so that the energy transmitted to the heat dissipation film 5 is reduced, and the deformation of the heat dissipation film 5 is reduced, as can be seen from fig. 4 and 7, after the deformation of the bonding glue layer 4, the sub bonding glue layers 41 arranged at intervals are connected together in a deformation manner, the first connecting surface of the bonding glue layer 4 and the heat dissipation film 5 is a plane, the second connecting surface, opposite to the first connecting surface, on the bonding glue layer 4 is a plane, the energy transmitted to the heat dissipation film 5 is small, and is absorbed by the foam and the grid glue of the heat dissipation film 5, so that the effect of improving the poor AMOLED die printing is achieved.
In this embodiment, the sub-adhesive layers 41 are arranged at intervals to ensure the fluidity and the air release during the pressing process, so that the adhesive layer 4 is easily deformed to enhance the ability of the adhesive layer 4 to absorb impact energy.
The specific structural form of the sub-bonding adhesive layer 41 can be various, as long as a plurality of sub-bonding adhesive layers 41 are arranged at intervals, and the deformation of the adhesive layer 4 is easy to bond.
In another embodiment of this embodiment, the sub-adhesive layers 41 are block structures, and a plurality of the sub-adhesive layers 41 are distributed in a grid pattern, as shown in fig. 9.
In this embodiment, the sub-adhesive layer 41 includes a first connection surface connected to the heat dissipation film 5 and a second connection surface opposite to the first connection surface, and the area of the first connection surface is smaller than that of the second connection surface.
The area of the first connecting surface is smaller than that of the second connecting surface, so that the sub adhesive layer 41 is easily deformed when being pressed.
In this embodiment, the sub-adhesive layer 41 is preferably connected to the heat dissipation film 5 linearly, and the second connection surface is a planar structure, for example, the cross-sectional shape of the sub-adhesive layer 4 is a semicircle, but not limited thereto.
In this embodiment, the adhesive layer 4 is further provided with a support layer 3 having a planar structure.
Due to the flexible characteristic of the flexible circuit board 2, the supporting layer 3 is used for supporting the flexible circuit board 2, so that the flexible circuit board 2 is ensured to be in a planar state, and the flexible circuit board 2 is prevented from generating defects.
The invention also provides a display device, which comprises the display module, wherein the adhesive layer 4 is also provided with a supporting layer 3 with a planar structure, and the display device further comprises:
the flexible circuit board 2 is correspondingly arranged on the supporting layer 3, and one end of the flexible circuit board 2 is electrically connected with the bent OLED panel 6;
and the cover plate 8 is arranged on one surface, far away from the heat dissipation film 5, of the OLED panel 6.
The arrangement of the bonding glue layer 4 formed by the sub bonding glue layers 41 arranged at intervals and the easy deformation of the bonding glue layer 4 press the flexible circuit board 2, the pressing energy is J, the bonding glue layer 4 absorbs energy flowing and deforming in the pressing process, so that most of the pressing energy J1 is absorbed, little part of residual energy is transmitted to the heat dissipation film 5 to generate small deformation, and is absorbed by foam and grid glue of the heat dissipation film 5, and the effect of improving the AMOLED poor die printing is achieved.
In this embodiment, an optical adhesive layer 7 is disposed between the cover plate 8 and the OLED panel 6, and the optical adhesive layer 7 is used to connect the OLED panel and the cover plate 8 together.
In this embodiment, the OLED panel 6 includes a first region, a second region, and a bendable region located between the first region and the second region, the heat dissipation film 5 is disposed on the first region, the second region is electrically connected to the flexible circuit board 2, and a gasket 9 is disposed between the heat dissipation film 5 and the second region. The gasket 9 plays a supporting role, and meanwhile, the phenomenon that the bendable region of the OLED panel 6 is bent excessively and is damaged is prevented.
The display device may be: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back board, and has application value in the fields of AR (Augmented Reality)/VR (Virtual Reality) and the like in the future.
The invention also provides a manufacturing method of the display module, which is used for manufacturing the display module and comprises the following steps,
forming an OLED panel;
forming a heat dissipation film on the OLED panel;
forming a bonding glue layer consisting of sub bonding glue layers arranged at intervals on the heat dissipation film;
and forming a supporting layer on the adhesive glue layer.
The specific structural form of the bonding adhesive layer may be various, and the corresponding manufacturing method of the bonding adhesive layer is various, in an embodiment of this embodiment, a bonding adhesive layer formed by sub bonding adhesive layers arranged at intervals is formed on the heat dissipation film, and specifically includes:
a plurality of sub-bonding glue layers which are arranged side by side and form a strip-shaped structure;
in another embodiment of this embodiment, the forming of the adhesive layer on the heat dissipation film, which is formed by the sub adhesive layers arranged at intervals, specifically includes: a plurality of the sub-bonding glue layers which form a block structure and are distributed in an array mode to form a grid mode.
In this embodiment, the sub-adhesive layer includes a first connection surface connected to the heat dissipation film and a second connection surface opposite to the first connection surface, and an area of the first connection surface is smaller than an area of the second connection surface.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (11)
1. The utility model provides a display module assembly, includes the OLED panel and is located the radiating film at the OLED panel back, the OLED panel can reverse buckle, with and be located the radiating film is kept away from the flexible line way board of one side of OLED panel is connected, its characterized in that, the radiating film is kept away from the one side of OLED panel sets up the bonding glue film, the bonding glue film comprises the sub-bonding glue film that a plurality of intervals set up, just the bonding glue film can warp in order to absorb, at the flexible line way board crimping in the power that produces when on the OLED panel.
2. The display module according to claim 1, wherein the sub-adhesive layers are in a stripe structure, and a plurality of the sub-adhesive layers are arranged side by side.
3. The display module according to claim 1, wherein the sub-adhesive layers are block-shaped structures, and a plurality of the sub-adhesive layers are distributed in a grid-like manner.
4. The display module according to claim 1, wherein the sub adhesive layer comprises a first connecting surface connected to the heat dissipating film and a second connecting surface opposite to the first connecting surface, and the area of the first connecting surface is smaller than that of the second connecting surface.
5. The display module according to claim 4, wherein the sub adhesive layer is connected to the heat dissipation film in a linear manner, and the second connection surface is a planar structure.
6. The display module assembly according to claim 1, wherein a support layer having a planar structure is further disposed on the adhesive layer.
7. A display device, comprising the display module set of any one of claims 1 to 6, wherein a support layer with a planar structure is further disposed on the adhesive layer, and further comprising:
the flexible circuit board is correspondingly arranged on the supporting layer, and one end of the flexible circuit board is electrically connected with the bent OLED panel;
the cover plate is arranged on one surface, far away from the heat dissipation film, of the OLED panel.
8. The display device according to claim 7, wherein the OLED panel comprises a first region, a second region, and a bendable region between the first region and the second region, the heat dissipation film is disposed on the first region, the second region is electrically connected to the flexible wiring board, and a spacer is disposed between the heat dissipation film and the second region.
9. A method for manufacturing a display module according to any one of claims 1 to 6, comprising the steps of,
forming an OLED panel;
forming a heat dissipation film on the OLED panel;
forming a bonding glue layer consisting of sub bonding glue layers arranged at intervals on the heat dissipation film;
and forming a supporting layer on the adhesive glue layer.
10. The method of claim 9, wherein forming the adhesive layer on the heat dissipation film, the adhesive layer comprising sub adhesive layers spaced apart from each other, comprises:
a plurality of sub-bonding glue layers which are arranged side by side and form a strip-shaped structure;
or a plurality of sub-bonding glue layers which form a block structure and are distributed in an array mode to form a grid mode.
11. The method of claim 9, wherein the sub-adhesive layer includes a first connecting surface connected to the heat dissipation film and a second connecting surface opposite to the first connecting surface, and the area of the first connecting surface is smaller than that of the second connecting surface.
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| CN201910007958.6A CN109493748B (en) | 2019-01-04 | 2019-01-04 | Display module, display device and manufacturing method of display module |
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| CN201910007958.6A CN109493748B (en) | 2019-01-04 | 2019-01-04 | Display module, display device and manufacturing method of display module |
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| CN110212002B (en) * | 2019-06-13 | 2022-05-13 | 京东方科技集团股份有限公司 | Display back plate, display panel and display device |
| WO2021030971A1 (en) * | 2019-08-16 | 2021-02-25 | 京东方科技集团股份有限公司 | Display apparatus and preparation method therefor, and electronic device |
| CN111182775A (en) * | 2020-03-10 | 2020-05-19 | 昆山工研院新型平板显示技术中心有限公司 | Display screen |
| CN111402728B (en) * | 2020-03-24 | 2022-05-31 | 京东方科技集团股份有限公司 | Bent gasket component, flexible OLED module and OLED equipment |
| CN113570975A (en) * | 2020-04-29 | 2021-10-29 | 深圳市柔宇科技有限公司 | Panel assembly and electronic equipment |
| CN114122303A (en) * | 2021-11-26 | 2022-03-01 | 深圳市深科达智能装备股份有限公司 | Attaching process of radiating fin and panel |
| CN115620638A (en) * | 2022-08-24 | 2023-01-17 | 京东方科技集团股份有限公司 | Display module and display device |
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