CN109493736B - Display panel and display device thereof - Google Patents
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- CN109493736B CN109493736B CN201811375486.1A CN201811375486A CN109493736B CN 109493736 B CN109493736 B CN 109493736B CN 201811375486 A CN201811375486 A CN 201811375486A CN 109493736 B CN109493736 B CN 109493736B
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000003292 glue Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims description 81
- 239000002184 metal Substances 0.000 claims description 35
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 description 31
- 239000000853 adhesive Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 230000006355 external stress Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009778 extrusion testing Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel and a display device thereof, relates to the technical field of display, and aims to improve the influence of a hole opening design on the packaging strength of a screen. Wherein, the display panel includes: the display panel comprises a first edge and a third edge which are oppositely arranged, and the vertical distance from the central point of the transparent area to the first edge is smaller than that from the central point of the transparent area to the third edge; the packaging ring is positioned in the packaging area and arranged around the transparent area, and the width of one side of the packaging ring, which is far away from the first edge, is smaller than the width of one side of the packaging ring, which is close to the first edge; and the packaging glue is filled in the packaging ring and used for bonding the first substrate and the second substrate. The display panel is suitable for the field of display devices.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a display panel and a display device thereof.
[ background of the invention ]
With the advent of the full-screen era, full-screen display equipment is pursued by users due to the high screen occupation ratio thereof, and has great market potential. At present, in order to achieve an ultra-thin design of the overall screen device, hardware such as a camera or an earphone can be embedded into a screen, and a hole opening design can be made in the screen.
However, the design of the opening increases the packaging difficulty of the screen and reduces the packaging strength of the screen.
Therefore, how to effectively improve and reduce the influence of the open hole design on the screen packaging strength is a technical problem to be solved in the field.
[ summary of the invention ]
In view of the above, embodiments of the present invention provide a display panel and a display device thereof, which are used to improve the influence of the opening design on the screen packaging strength.
An aspect of the present invention provides a display panel including:
a first substrate including a transparent region, an encapsulation region surrounding the transparent region, a display region surrounding the encapsulation region, and a non-display region surrounding the display region,
the display panel comprises a first edge and a third edge which are oppositely arranged, and the vertical distance from the central point of the transparent area to the first edge is smaller than the vertical distance from the central point of the transparent area to the third edge;
the packaging ring is positioned in the packaging area and arranged around the transparent area, and the width of one side, away from the first edge, of the packaging ring is smaller than the width of one side, close to the first edge, of the packaging ring;
a second substrate disposed opposite to the first substrate;
and the packaging glue is filled in the packaging ring and used for bonding the first substrate and the second substrate.
Optionally, the display panel includes N encapsulation rings, where N is greater than or equal to 2 and is a positive integer;
at least one of the encapsulation rings gradually increases in width in a direction from the third side to the first side.
Optionally, the distance between any two adjacent packaging rings is [ G-50, G +50], G is more than or equal to 150 μm and less than or equal to 250 μm.
Optionally, in the N packaging rings, an inner ring of the packaging ring adjacent to the transparent region coincides with an outer ring of the transparent region, wherein the average width of the N packaging rings is B1, and B1 is greater than or equal to 400 μm and less than or equal to 500 μm.
Optionally, in the N packaging rings, a distance between an inner ring of the packaging ring adjacent to the transparent region and an outer ring of the transparent region is C, and C is greater than or equal to 50 μm and less than or equal to 100 μm.
Optionally, the average widths of the N package rings are all B2, and B2 is greater than or equal to 340 μm and less than or equal to 440 μm.
Optionally, the display panel further includes an active layer disposed on the first substrate, a gate metal layer, a data line layer, and a capacitor substrate metal layer;
the packaging area further comprises a packaging metal layer, and the orthographic projection of at least part of the packaging metal layer on the plane of the first substrate is overlapped with the orthographic projection of the packaging glue on the plane of the first substrate.
Optionally, a power signal line layer is also included,
the packaging metal layer and the power signal line layer are arranged on the same layer, wherein the power signal line layer and the grid metal layer are arranged on the same layer.
Optionally, the display panel further comprises a reference voltage signal line layer,
the packaging metal layer and the reference voltage signal line layer are arranged on the same layer, wherein the reference voltage signal line layer and the capacitor substrate metal layer are arranged on the same layer.
Optionally, the package metal layer and the data line layer are disposed on the same layer.
Optionally, in a direction parallel to the display panel, the transparent area is circular, the radius of the circular transparent area is R, and R is greater than or equal to 1mm and less than or equal to 2 mm.
Optionally, a vertical distance from a center point of the circular transparent area to the first edge is L1, and L1 is greater than or equal to 3mm and less than or equal to 5 mm.
The invention also provides a display device which comprises the display panel related to the previous aspect.
Any one of the above technical solutions has the following beneficial effects:
in the embodiment of the invention, the package surrounding the transparent area (the opening area) is in an asymmetric structure, that is, the shorter the vertical distance from the central point of the transparent area (the opening area) to the side edge is, the larger the width of the package ring along the same direction is, and the width of the package glue is larger because the package glue is filled in the package ring. When the display panel is extruded or collided, the width of the packaging adhesive is larger, the crack resistance of the packaging adhesive is stronger, and the cracking of the packaging adhesive close to the side edge is improved or even avoided, so that the packaging strength of the transparent area is improved on one hand, and the display device in the display area is protected from being influenced by water vapor on the other hand.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is an enlarged schematic view of the location A of FIG. 1 according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view at the position BB' in FIG. 1 according to an embodiment of the present invention;
FIG. 4 is another enlarged schematic view of the embodiment of the present invention at position A in FIG. 1;
FIG. 5 is another enlarged schematic view of the embodiment of the present invention at position A in FIG. 1;
fig. 6 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 7 is an enlarged view of the position E in FIG. 5 according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 10 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 11 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, etc. may be used to describe the substrates in the embodiments of the present invention, these substrates should not be limited by these terms. These terms are only used to distinguish the substrates from each other. For example, the first substrate may also be referred to as a second substrate, and similarly, the second substrate may also be referred to as a first substrate, without departing from the scope of embodiments of the present invention.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the description of the embodiments of the present invention are used in the angle shown in the drawings, and should not be construed as limiting the embodiments of the present invention. In addition, in this context, it is also to be understood that when an element is referred to as being "on" or "under" another element, it can be directly formed on "or" under "the other element or be indirectly formed on" or "under" the other element through an intermediate element.
Before the technical solution of the present embodiment is explained in detail, the technical context of the present embodiment is briefly introduced:
with the advent of the full-screen era, some hardware originally arranged in the non-display area needs to be arranged in the display area, such as a camera or a receiver, and the like, and in this case, a transparent area needs to be arranged in the display area, wherein the transparent area can be understood as an opening area. For open area packaging, a packaging adhesive is typically applied to the outside of the package.
However, the package strength around the open area is reduced by the influence of the position, shape and size of the open hole in the display area. Illustratively, when the distance from the central point of the opening region to the side edge of the display panel is unequal, after the display panel is subjected to external stress, the stress on the closer packaging adhesive is larger, and a serious person may generate cracks or fissures, so that water vapor and oxygen enter the display device in the display region to damage the display device.
In order to solve the above problems, the inventor designs the following technical solutions:
fig. 1, fig. 2 and fig. 3 show a display panel, wherein fig. 1 is a schematic structural diagram of the display panel according to an embodiment of the present invention, fig. 2 is an enlarged schematic diagram of a position a in fig. 1 according to an embodiment of the present invention, fig. 3 is a cross-sectional diagram of a position BB' in fig. 1 according to an embodiment of the present invention, and the display panel 100 includes a first substrate 1, wherein the first substrate 1 includes a transparent region 11, an encapsulation region 12 surrounding the transparent region 11, a display region 13 surrounding the encapsulation region 12, and a non-display region 14 surrounding the display region 13. Illustratively, the transparent region 11 may be a region where a camera is disposed, but those skilled in the art should understand that the position of the transparent region and the disposed hardware or device are not particularly limited in this embodiment, and the specific case may refer to a specific product.
With continued reference to fig. 1, the display panel 100 includes a first side 21 and a third side 23 disposed opposite to each other, a vertical distance from a center point O of the transparent region 11 to the first side 21 is L1, and a vertical distance from the center point O of the transparent region 11 to the third side 23 is L3, where L1 is less than L3, i.e., L1 < L3. It should be noted that the specific structure of the display panel 100 is not particularly limited in this embodiment, and may be, for example, a rounded rectangle, a rectangle, an irregular rectangle, or the like, and the specific structure of the display panel 100 may be determined according to a specific product.
Referring to fig. 2, the display panel 100 further includes a package ring 121, the package ring 121 is located in the package region 12 and disposed around the transparent region 11, a width of the package ring 121 away from the first edge 21 is K3, and a width of the package ring 121 near the first edge 21 is K1, where K3 is less than K1, i.e., K3 < K1.
It can be understood by the present embodiment that the encapsulation ring 121 surrounding the transparent region 11 (the opening region) exhibits an asymmetric structure, in other words, the shorter the vertical distance (e.g., L1) of the center point O of the transparent region (the opening region) near the side (e.g., the first side 21) is, the larger the width (e.g., K1) of the encapsulation ring 121 along the same direction is, and conversely, the larger the vertical distance (e.g., L3) of the center point O of the transparent region (the opening region) away from the side (e.g., the third side 23) is, the smaller the width (e.g., K3) of the encapsulation ring 121 along the same direction is.
As shown in fig. 3, the display panel 100 further includes a second substrate 2 disposed opposite to the first substrate 1. The display panel 100 further includes a packaging adhesive (not shown), the packaging adhesive is filled in the packaging ring 121, and the packaging adhesive is used for bonding the first substrate 1 and the second substrate 2. It should be noted that the encapsulation ring 121 in this embodiment may be understood as an area filled with the encapsulation glue, that is, the width of the encapsulation ring is large, which means the width of the encapsulation glue is large.
In the prior art, the width of the encapsulation ring (encapsulation adhesive) surrounding the transparent area is consistent, and the encapsulation adhesive near the side edge of the display panel is prone to crack or crack, which causes the display area of the display panel to be affected. In the technical scheme provided by the embodiment, the width of the packaging adhesive closer to the side edge of the display panel is larger, so that the crack resistance of the packaging adhesive is improved, and the display device in the display panel is protected.
In this embodiment, the package surrounding the transparent region (the opening region) is an asymmetric structure, that is, the shorter the vertical distance from the center point of the transparent region (the opening region) to the side edge is, the larger the width of the package ring along the same direction is, and the package adhesive is filled in the package ring, so that the width of the package adhesive is larger here. When the display panel is extruded or collided, the width of the packaging adhesive is larger, the crack resistance of the packaging adhesive is stronger, and the cracking of the packaging adhesive close to the side edge is improved or even avoided, so that the packaging strength of the transparent area is improved on one hand, and the display device in the display area is protected from the influence of water vapor and oxygen on the other hand. Compared with the technical scheme that the width of the packaging adhesive around the transparent area is consistent in the prior art, the packaging strength can be improved, and the crack resistance can be improved.
The bonding process of the first substrate 1 and the second substrate 2 using the encapsulation adhesive will be briefly described as follows:
in this embodiment, a fusion bonding packaging process can be adopted, i.e., the laser spot is favorable for heating the packaging adhesive to melt the packaging adhesive into liquid, so that the first substrate 1 and the second substrate 2 are bonded together, and the display device in the display area is prevented from being invaded by external water vapor and oxygen. The package adhesive in this embodiment can be understood as a glass cement (Frit) material, which contains a laser-absorbing pigment, and the Frit material changes to a molten state after absorbing light, thereby achieving a good adhesive effect and a good sealing effect.
Further, the shape of the transparent region 11 in the present embodiment can be various, and for example, in a direction parallel to the display panel 100, the shape of the transparent region 11 can be a circle, and the radius of the circular transparent region is R (not shown in the figure), where R is greater than or equal to 1mm and less than or equal to 2 mm. The present embodiment allows for a screen ratio with the radius R of the transparent area set between 1mm and 2 mm. In addition, because the shape of the transparent area is round, sharp corners are avoided in the packaging process according to the self characteristics of the round shape, the packaging process is simplified, and the packaging effect is improved.
Still further, with continued reference to FIG. 1, the vertical distance from the center point O of the circular transparent area to the first edge 21 is L1, wherein L1 is 3mm ≦ 5 mm.
In one embodiment, as shown in fig. 4, which is another enlarged schematic view of the position a in fig. 1 according to an embodiment of the present invention, the display panel 100 includes N encapsulation rings 121, N ≧ 2 and a positive integer, and a width of at least one of the encapsulation rings 121 gradually increases along a direction from the third side to the first side (as shown by an arrow in fig. 4). Preferably, in this embodiment, each of the encapsulation rings has a width gradually increasing along a direction from the third side to the first side. Illustratively, taking two encapsulation rings as shown in fig. 4 as an example, a first encapsulation ring 1211 is adjacent to the transparent region 11, and a second encapsulation ring 1212 is outside. The width of the first encapsulation ring 1211 near the first edge is H2, the width of the first encapsulation ring 1211 away from the first edge is H1, and the width between the width H2 and the width H1 is H5, where as can be clearly seen from fig. 4, the width H2 is greater than the width H5 and the width H5 is greater than the width H1 along the direction from the third edge to the first edge; similarly, in the second package ring 1212, the width near the first edge is H4, the width far from the first edge is H3, the width between the width H4 and the width H3 is H6, and the width H4 is greater than the width H6 and the width H6 is greater than the width H3 in the direction from the third edge to the first edge.
For the same package ring, the width of the package ring can be understood as the length of the shortest line segment passing through a certain point on the package ring, and taking the point X in the second package ring 1212 as an example, the length of the shortest line segment passing through the point X is H6, so the width at the point X is H6. Further, since the width in the direction from the third side to the first side is gradually increased, the minimum width of the encapsulation ring exists at a position far from the first side, and as exemplarily shown in fig. 4, the first encapsulation ring 1211 shows the position of H1, and the second encapsulation ring 1212 shows the position of H3.
It should be noted that, in the present embodiment, the widths of the first encapsulation ring 1211 and the second encapsulation ring 1212 are not particularly limited, and taking the width of the first encapsulation ring 1211 on the side close to the first edge as an example, although the width H4 of the second encapsulation ring 1212 shown in fig. 4 is greater than the width H2 of the first encapsulation ring 1211, actually, H4 may be smaller than H2 or equal to H2, and specific data may be determined according to specific products, as long as the width of the same encapsulation ring close to the first edge is greater than the width of the same encapsulation ring far from the first edge.
If the display panel is subjected to external stress, such as collision or extrusion, stress is likely to accumulate around the opening region, and the packaging adhesive at the position is subjected to large stress, cracks or cracks are likely to be generated from the inner edge of the transparent region 11 to the outer side, so that moisture and oxygen enter the display device in the display region, and the display device is damaged. In the present embodiment, the N encapsulation rings 121 are disposed around the transparent region, so that a multi-layer protection effect can be achieved, and if the encapsulation ring abutting against the transparent region 11 is broken, the encapsulation ring on the outer side is protected, thereby preventing the display device in the display region from being damaged by water and oxygen. And because the width of the outer packaging ring is larger than that of the inner packaging ring, the crack resistance of the outer packaging ring is higher, so that the side edge is prevented from being cracked when being impacted by the outer side, and the display device of the display area is protected.
With continued reference to FIG. 4, a horizontal line is drawn parallel to the first edge through the transparent region O, and the display region above and adjacent to the first edge is referred to as Area1, while the display region below is referred to as Area 2.
If the display panel is subjected to an external impact, in one case, when the first encapsulation ring 1211 is damaged by a crack or a fissure, since the display panel is provided with N encapsulation rings surrounding the transparent region, as long as one of the second to nth encapsulation rings is not damaged, the display device in the display region is protected. In another case, during a ball drop test or an extrusion test, the Area1 is stressed more and the damage risk is larger because of being close to the first edge, and the Area2 is stressed less because of being far away from the first edge, that is, the encapsulation glue close to the first edge is easily damaged.
It should be noted that fig. 4 exemplarily shows two encapsulation rings, and the number of the specific encapsulation rings may be determined according to the specific product.
In one embodiment, with continued reference to FIG. 4, the spacing at any location between two adjacent package rings is [ G-50, G +50], where G is 150 μm ≦ 250 μm. The "interval at any position" between two adjacent package rings can be regarded as a circular ring composed of two concentric circles, and is understood as an exemplary difference between the radius ZO of the outer circular ring and the radius WO of the inner circular ring, W is any point in the inner circular ring, and similarly Z is any point in the outer circular ring, as shown in fig. 4. In the embodiment, because the distance between any position of the two packaging rings is the same, in the packaging process, the technical measurement is convenient, the packaging is simplified, and the preparation efficiency is improved.
Illustratively, there are a plurality of ways for the transparent region to be encapsulated, and the present embodiment exemplarily proposes the following two settings:
first, as shown in fig. 5, which is another enlarged schematic diagram of the position a in fig. 1 according to an embodiment of the present invention, the inner circle of the package ring 1211 adjacent to the transparent region 11 of the N package rings coincides with the outer circle of the transparent region 11, and the average width of the N package rings is B1 (not shown in the figure), where B1 is 400 μm ≦ 500 μm. It is understood that the "average width of the encapsulating ring" is the ratio of the area of the encapsulating ring to the average circumference of the encapsulating ring. "average circumference of the encapsulation ring" is understood to mean the sum of the outer circumference and the inner circumference of the encapsulation ring. Illustratively, taking the first encapsulation ring 1211 as an example, the average width B1 of the first encapsulation ring is the area of the encapsulation ring except for the average perimeter.
It should be noted that the first encapsulation ring 1211 surrounds the transparent region 11, and the second encapsulation ring 1212 surrounds the first encapsulation ring 1211, so that the radius of any position of the second encapsulation ring 1212 is larger than that of any position of the first encapsulation ring 1211, and therefore, in order to keep the average widths of the N encapsulation rings close to or the same, it is necessary that the minimum encapsulation width of the second encapsulation ring 1212 is smaller than the minimum encapsulation width of the first encapsulation ring 1211. The understanding of "minimum package width" is given above in relation to the description.
In this embodiment, since the distance between the transparent region and the encapsulation ring is zero, in order to ensure the encapsulation strength, the average width of the encapsulation adhesive needs to be increased, but the larger average width increases the proportion of the encapsulation region, and reduces the proportion of the screen. The average width B1 of each encapsulation ring was between 400 μm and 500 μm after the inventors compromise the encapsulation strength and the screen ratio.
Secondly, as shown in fig. 6 and 7, fig. 6 is another schematic structural diagram of the display panel provided in the embodiment of the present invention, fig. 7 is an enlarged schematic diagram of the position E in fig. 6 provided in the embodiment of the present invention, and a distance between an inner circle of the package ring 121 adjacent to the transparent region 11 and an outer circle of the transparent region among the N package rings is C, where C is greater than or equal to 50 μm and less than or equal to 100 μm. In the embodiment, a certain distance exists between the transparent area and the packaging ring, the transparent area and the packaging ring are not obstructed, and the area of the transparent area is ensured.
Furthermore, the average width of the N package rings 121 is B2 (not shown), wherein B2 is 340 μm ≦ 440 μm. The "average width of the encapsulating ring" in this embodiment is understood to be the ratio of the area of the encapsulating ring to the circumference of the encapsulating ring. Of course, the larger the average width of the encapsulating ring, the higher the encapsulating strength thereof, but it may decrease the screen ratio of the display panel. After the inventor considers the packaging strength and the screen occupation ratio, the average width B2 of the packaging ring is set between 340 mu m and 440 mu m, thereby ensuring the packaging strength and improving the screen occupation ratio.
In addition, as can be seen from the above embodiments, since the transparent region and the adjacent encapsulation ring have a certain distance therebetween, the average width of the encapsulation ring can be set smaller after the encapsulation strength and the screen ratio are both considered.
The following briefly introduces the film layer where the package metal layer is located:
first, briefly describing the structure of the display panel, as shown in fig. 8, which is another schematic structural diagram of the display panel provided in the embodiment of the present invention, the display panel 100 may be an organic light emitting display panel, where the organic light emitting display panel includes a plurality of display devices 6, and each display device 6 includes an anode RE, a light emitting layer 61, and a cathode 63. The display panel 100 further includes an active layer 31, a Gate metal layer Gate, a Data line layer Data, and a capacitor substrate metal layer 32 disposed on the first substrate 1.
As shown in fig. 9, which is another schematic structural diagram of the display panel according to the embodiment of the present invention, the encapsulation region 12 further includes an encapsulation metal layer 4, and an orthogonal projection of at least a portion of the encapsulation metal layer 4 on the plane of the first substrate 1 overlaps with an orthogonal projection of the encapsulation adhesive (not shown) on the plane of the first substrate 1.
It should be noted that, since the encapsulation ring is filled with the encapsulation glue, an orthogonal projection of the encapsulation glue on the plane of the first substrate can be understood as an exemplary orthogonal projection of the encapsulation ring on the plane of the first substrate as shown in fig. 9.
In the embodiment, the packaging metal layer 4 is arranged in the packaging area 12, and in the packaging process, because the packaging metal layer 4 can reflect the laser spot, the reflected laser spot can be irradiated on the packaging adhesive again, so that the irradiation temperature is increased, the absorption capacity of the packaging adhesive on the laser is promoted, a more ideal melting effect is achieved, and the packaging effect is further improved.
In an alternative embodiment, continuing with fig. 9, the package metal layer 4 is layered with the Data line layer Data. In this embodiment, the package metal layer 4 and the Data line layer Data are disposed on the same layer, so that the thickness of the film layer can be reduced, the preparation process can be reduced, and the efficiency can be improved.
In another alternative implementation, as shown in fig. 10, which is another schematic structural diagram of the display panel provided in the embodiment of the present invention, the display panel 100 further includes a power signal line layer PVDD. The package metal layer 4 and the power signal line layer PVDD are arranged on the same layer, and the power signal line layer PVDD and the Gate metal layer Gate are arranged on the same layer. In this embodiment, the three films of the package metal layer 4, the power signal line layer PVDD and the Gate metal layer Gate are arranged on the same layer, so that the thickness of the film can be reduced on one hand, the display panel is lighter and thinner, the preparation processes are reduced on the other hand, and the working efficiency is effectively improved.
In another alternative implementation, as shown in fig. 11, which is another schematic structural diagram of the display panel provided in the embodiment of the present invention, the display panel 100 further includes a reference voltage signal line layer Ref. The package metal layer 4 and the reference voltage signal line layer Ref are disposed on the same layer, wherein the reference voltage signal line layer Ref and the capacitor substrate metal layer 32 are disposed on the same layer. In this embodiment, the three films of the package metal layer 4, the power signal line layer PVDD and the Gate metal layer Gate are arranged on the same layer, so that the thickness of the film can be reduced on one hand, the display panel is lighter and thinner, the preparation processes are reduced on the other hand, and the working efficiency is effectively improved.
In this embodiment, as shown in fig. 12, which is a schematic structural diagram of a display device according to an embodiment of the present invention, the display device 500 includes the display panel 100 according to the above embodiment. The display device 500 includes the display panel 100 described above. It should be noted that fig. 12 illustrates a mobile phone as an example of the display device, but the display device 500 is not limited to a mobile phone, and specifically, the display device may include, but is not limited to, any electronic device having a display function, such as a Personal Computer (PC), a Personal Digital Assistant (PDA), a wireless handheld device, a Tablet Computer (Tablet Computer), an MP4 player, or a television.
In the embodiment of the invention, the package surrounding the transparent area (the opening area) is in an asymmetric structure, that is, the shorter the vertical distance from the central point of the transparent area (the opening area) to the side edge is, the larger the width of the package ring along the same direction is, and the width of the package glue is larger because the package glue is filled in the package ring. When the display panel is extruded or collided, the width of the packaging adhesive is larger, the crack resistance of the packaging adhesive is stronger, and the cracking of the packaging adhesive close to the side edge is improved or even avoided, so that the packaging strength of the transparent area is improved on one hand, and the display device in the display area is protected from the influence of water vapor and oxygen on the other hand.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (13)
1. A display panel, comprising:
a first substrate including a transparent region, an encapsulation region surrounding the transparent region, a display region surrounding the encapsulation region, and a non-display region surrounding the display region,
the display panel comprises a first edge and a third edge which are oppositely arranged, and the vertical distance from the central point of the transparent area to the first edge is smaller than the vertical distance from the central point of the transparent area to the third edge;
the packaging ring is positioned in the packaging area and arranged around the transparent area, and the width of one side, away from the first edge, of the packaging ring is smaller than the width of one side, close to the first edge, of the packaging ring;
a second substrate disposed opposite to the first substrate;
and the packaging glue is filled in the packaging ring and used for bonding the first substrate and the second substrate.
2. The display panel of claim 1, comprising N encapsulation rings, N ≧ 2 and a positive integer;
at least one of the encapsulation rings gradually increases in width in a direction from the third side to the first side.
3. The display panel of claim 2, wherein the distance between any two adjacent package rings is [ G-50, G +50], 150 μm ≦ G ≦ 250 μm.
4. The display panel according to claim 2,
and in the N packaging rings, the inner ring of the packaging ring adjacent to the transparent area is superposed with the outer ring of the transparent area, wherein the average width of the N packaging rings is B1, and B1 is more than or equal to 400 microns and less than or equal to 500 microns.
5. The display panel according to claim 2,
and in the N packaging rings, the distance between the inner ring of the packaging ring adjacent to the transparent area and the outer ring of the transparent area is C, and C is more than or equal to 50 mu m and less than or equal to 100 mu m.
6. The display panel according to claim 5,
the average width of the N packaging rings is B2, and B2 is more than or equal to 340 mu m and less than or equal to 440 mu m.
7. The display panel of claim 1, further comprising an active layer disposed on the first substrate, a gate metal layer, a data line layer, and a capacitor substrate metal layer;
the packaging area further comprises a packaging metal layer, and the orthographic projection of at least part of the packaging metal layer on the plane of the first substrate is overlapped with the orthographic projection of the packaging glue on the plane of the first substrate.
8. The display panel according to claim 7, further comprising a power signal line layer,
the packaging metal layer and the power signal line layer are arranged on the same layer, wherein the power signal line layer and the grid metal layer are arranged on the same layer.
9. The display panel of claim 7, further comprising a reference voltage signal line layer,
the packaging metal layer and the reference voltage signal line layer are arranged on the same layer, wherein the reference voltage signal line layer and the capacitor substrate metal layer are arranged on the same layer.
10. The display panel of claim 7, wherein the encapsulation metal layer is disposed on a same layer as the data line layer.
11. The display panel according to claim 1, wherein the transparent region has a circular shape in a direction parallel to the display panel, the circular transparent region has a radius of R, and R is 1mm ≦ R ≦ 2 mm.
12. The display panel of claim 11, wherein the vertical distance from the center point of the circular transparent area to the first edge is L1, 3mm ≦ L1 ≦ 5 mm.
13. A display device characterized by comprising the display panel according to any one of claims 1 to 12.
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| CN201811375486.1A CN109493736B (en) | 2018-11-19 | 2018-11-19 | Display panel and display device thereof |
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| CN112396956A (en) * | 2020-11-05 | 2021-02-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113870704B (en) * | 2021-09-27 | 2023-06-02 | 上海天马微电子有限公司 | Display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004101674A (en) * | 2002-09-06 | 2004-04-02 | Hitachi Displays Ltd | Liquid crystal display |
| JP2008058715A (en) * | 2006-08-31 | 2008-03-13 | Optrex Corp | Liquid crystal display panel |
| KR100824531B1 (en) * | 2006-11-10 | 2008-04-22 | 삼성에스디아이 주식회사 | Organic electroluminescent display and manufacturing method |
| JP2014099592A (en) * | 2012-09-10 | 2014-05-29 | Tree Frog Developments Inc | Housing for encasing object having thin profile |
| KR102256566B1 (en) * | 2013-12-18 | 2021-05-27 | 삼성디스플레이 주식회사 | Curved display device and method of manufacturing the same |
| CN204271142U (en) * | 2014-12-22 | 2015-04-15 | 昆山国显光电有限公司 | OLED module packaging structure |
| CN104749806B (en) * | 2015-04-13 | 2016-03-02 | 京东方科技集团股份有限公司 | A kind of array base palte, display panel and display device |
| KR102388846B1 (en) * | 2015-10-05 | 2022-04-20 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| KR102320938B1 (en) * | 2017-03-20 | 2021-11-03 | 삼성디스플레이 주식회사 | Display device |
| CN106972008B (en) * | 2017-05-15 | 2019-06-18 | 上海天马有机发光显示技术有限公司 | Organic electroluminescent display panel and display device |
| CN207123683U (en) * | 2017-09-20 | 2018-03-20 | 信利半导体有限公司 | One kind full screen display panel |
| CN108011051B (en) * | 2017-11-30 | 2019-08-13 | 武汉天马微电子有限公司 | Organic light-emitting display panel and display device thereof |
| CN108538899B (en) * | 2018-05-04 | 2020-07-24 | 云谷（固安）科技有限公司 | Display panel and display screen |
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