CN109492741A - A kind of electronics module and electronic device - Google Patents
A kind of electronics module and electronic device Download PDFInfo
- Publication number
- CN109492741A CN109492741A CN201811420243.5A CN201811420243A CN109492741A CN 109492741 A CN109492741 A CN 109492741A CN 201811420243 A CN201811420243 A CN 201811420243A CN 109492741 A CN109492741 A CN 109492741A
- Authority
- CN
- China
- Prior art keywords
- line pattern
- electronics module
- transmission line
- pattern
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The embodiment of the invention discloses a kind of electronics module and electronic devices.The electronics module includes: at least one layer of substrate layer being stacked and at least one layer of conductive layer, and conductive layer includes coil pattern and transmission line pattern；Without being electrically connected between coil pattern and transmission line pattern, transmission line pattern is used at least two electronic components being electrically connected in electronic device.The installation effectiveness and integrated level of electronic device can be improved in the technical solution of the embodiment of the present invention.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of electronics module and electronic devices.
Background technique
With the development of wireless communication technique and mobile terminal, wireless near field communication NFC (Near Field
Communication) and wireless charging (Wireless Charging) function is more and more integrated into mobile phone, plate electricity
In the electronic devices such as brain.
NFC technique is derived from radio frequency discrimination RFID technology (Radio Frequency Identify Detection), realizes
Point-to-point short-range communication.It is widely used in the fields such as wireless payment, data transmission.The effect of wireless charging is instead
Preceding traditional wired charging mode realizes more convenient and fast move mode charging, i.e., can charge without charging cable.
When assembling to electronic devices such as mobile terminals, it will to be first used for wireless near field communication and/or wireless charging
Coil module group assembling be connected on motherboard, then by other elements, such as microphone and loudspeaker etc., assembly and connection to host
On plate, installation steps are more, and installation effectiveness is lower.
Summary of the invention
The embodiment of the present invention provides a kind of electronics module and electronic device, to improve the installation effectiveness of electronic device and integrated
Degree.
The embodiment of the invention provides a kind of electronics modules, comprising:
At least one layer of substrate layer and at least one layer of conductive layer being stacked, conductive layer include coil pattern and transmission line chart
Case；
Without being electrically connected between coil pattern and transmission line pattern, transmission line pattern is for being electrically connected in electronic device at least
Two electronic components.
Further, coil pattern includes following at least one: wireless charging electric wire circular pattern and close range wireless communication line
Circular pattern.
Further, the number of plies of conductive layer is multilayer, substrate layer and the alternately laminated setting of conductive layer.
Further, at least partly transmission line pattern and at least partly coil pattern is located at same conductive layer,
It is located at the peripheral region of coil pattern positioned at the transmission line pattern of same conductive layer.
Further, conductive layer further includes shielding line pattern, and shielding line pattern and transmission line pattern are located at same conductive layer
And/or different conductive layers, shielding line pattern are located at around transmission line pattern.
Further, electronics module further includes insulating layer, insulating layer conductive layer on the outermost side far from substrate layer one
Side.
Further, electronics module further includes antifreeze plate, positioned at the outside for all conductive layers for being provided with coil pattern.
Further, substrate layer is flexible substrate layer, and substrate layer includes following at least one materials: polyimides, liquid crystal
High molecular polymer and polyethylene terephthalate.
Further, the end of transmission line pattern is provided with golden finger or electric connector, is used for connecting electronic component.
Second aspect, the embodiment of the invention also provides a kind of electronic devices, comprising: at least two electronic components, and
The electronics module that any embodiment of that present invention provides,
It is electrically connected between at least two electronic components by transmission line pattern.
Further, electronic component is provided with slot,
Electronic component includes following at least one: antenna, motherboard, microphone, loudspeaker, key, camera, flash lamp and
Charging interface.
Further, which includes following at least one: mobile phone, tablet computer, laptop and intelligence can
Wearable device.
Electronics module in the technical solution of the embodiment of the present invention includes at least one layer of substrate layer being stacked and at least
One layer of conductive layer, conductive layer include coil pattern and transmission line pattern；Without being electrically connected between coil pattern and transmission line pattern, pass
Defeated line pattern is used at least two electronic components being electrically connected in electronic device, so as to pass through biography between at least two electronic components
Defeated line pattern electrical connection, replaces the winding displacement or cable of discrete setting in the prior art, to improve the packaging efficiency of the electronic device
And integrated level, reduce the complexity of discrete route distribution in electronic device.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of electronics module provided in an embodiment of the present invention；
Fig. 2 is a kind of the schematic diagram of the section structure in electronics module direction AA ' along Fig. 1 provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of electronic device provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram of the section structure in another electronics module provided in an embodiment of the present invention direction AA ' along Fig. 1；
Fig. 5 is the schematic diagram of the section structure in another electronics module provided in an embodiment of the present invention direction AA ' along Fig. 1；
Fig. 6 is the schematic diagram of the section structure in another electronics module provided in an embodiment of the present invention direction AA ' along Fig. 1；
Fig. 7 is the schematic diagram of the section structure in another electronics module provided in an embodiment of the present invention direction AA ' along Fig. 1；
Fig. 8 is the structural schematic diagram of another electronic device provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The embodiment of the present invention provides a kind of electronics module.Fig. 1 is a kind of knot of electronics module provided in an embodiment of the present invention
Structure schematic diagram.Fig. 2 is a kind of the schematic diagram of the section structure in electronics module direction AA ' along Fig. 1 provided in an embodiment of the present invention.Knot
It closes shown in Fig. 1 and Fig. 2, which includes: at least one layer of substrate layer 110 being stacked and at least one layer of conductive layer
120, conductive layer 120 includes coil pattern 121 and transmission line pattern 122；Nothing between coil pattern 121 and transmission line pattern 122
Electrical connection, transmission line pattern 122 are used at least two electronic components being electrically connected in electronic device.
Wherein, which, which adopts, is made from an insulative material.The substrate layer 110 can be rigid base material layer, may include
Following at least one materials: phenolic resin, epoxy resin, paper base, glass cloth and synthetic fibers.Fig. 2 illustratively draws electronics
Mould group 100 includes the case where one layer of substrate layer 110 and one layer of conductive layer 120.The conductive layer 120 can be metal layer.The conduction
Layer 120 may include following at least one materials: copper, aluminium, tin and silver.The production method of coil pattern and transmission line pattern can be borrowed
Help sputter, vapor deposition, plating, chemical plating, coating, version printing concave/convex, wire mark, yellow light process (exposure lithography), pad pasting,
The modes such as transfer, laser carving are realized.Optionally, coil pattern 121 includes following at least one: wireless charging
(Wirelesscharging) coil pattern and close range wireless communication (Near Field Communication, NFC) coil
Pattern.It includes wireless charging electric wire circular pattern 1211 and close range wireless communication that Fig. 1 and Fig. 2, which illustratively draws coil pattern 121,
The case where coil pattern 1212, wherein wireless charging electric wire circular pattern 1211 is located at close range wireless communication coil pattern 1212
It is internal.Wireless charging electric wire circular pattern 1211 and close range wireless communication coil pattern 1212 can be helical form, single-turn circular coil
Shape can be round or rectangle, the embodiment of the present invention for coil pattern shape without limitation.
It should be noted that Fig. 3 is a kind of structural schematic diagram of electronic device provided in an embodiment of the present invention, this at least two
A electronic component 200 and electronics module 100 can be each other discrete element, need to be carried out assembly and connection, with
To complete electronic device 10.If the electronic device 10 is provided with wireless charging electric wire circular pattern, which can pass through
Wireless charging electric wire circular pattern carries out electric energy transmission, which can be wireless charger or power device.If the electronics
Device 10 is provided with close range wireless communication coil pattern, then the electronic device 10 can pass through close range wireless communication coil pattern
Carry out NFC communication.Optionally, which includes following at least one: mobile phone, tablet computer, laptop, intelligence
Wearable device, charging pile and electric car.At least two electronic component 200 passes through telecommunications needed for transmission line pattern transmission
Number, such as may include following at least one: control signal, detection signal and supply voltage.By in the electronic device
Transmission line pattern 122 is set in electronics module, replaces the winding displacement or cable of discrete setting in the prior art, to connect electronics dress
The packaging efficiency and integrated level of the electronic device can be improved at least two discrete electronic components in setting, and reduces electronics dress
The complexity of discrete route distribution in setting.
Electronics module in the technical solution of the present embodiment includes at least one layer of substrate layer being stacked and at least one layer
Conductive layer, conductive layer include coil pattern and transmission line pattern；Without being electrically connected between coil pattern and transmission line pattern, transmission line
Pattern is used at least two electronic components being electrically connected in electronic device, so as to pass through transmission line between at least two electronic components
Pattern electrical connection, replaces the winding displacement or cable of discrete setting in the prior art, to improve the packaging efficiency sum aggregate of the electronic device
Cheng Du reduces the complexity of discrete route distribution in electronic device.
Optionally, on the basis of the above embodiments, Fig. 4 is another electronics module provided in an embodiment of the present invention along figure
The number of plies of the schematic diagram of the section structure in the direction AA ' in 1, conductive layer 120 is multilayer, and substrate layer 110 and conductive layer 120 are alternately laminated
Setting.
Wherein, Fig. 4 illustratively draws the feelings that electronics module 100 includes one layer of substrate layer 110 and two conductive layers 120
Condition.Coil pattern in different conductive layers can be electrically connected by least one of via hole, blind hole and buried via hole mode
(being not drawn into figure).Coil pattern in different conductive layers can be different, and the embodiment of the present invention is to the circuit diagram in each conductive layer
Case is without limitation.Optionally, the number of plies of substrate layer 110 is less than the number of plies of conductive layer 120, specifically, the number of plies ratio of substrate layer 110
The number of plies of conductive layer 120 is one layer few, to make full use of substrate layer.
Optionally, on the basis of the above embodiments, Fig. 5 is another electronics module provided in an embodiment of the present invention along figure
The schematic diagram of the section structure in the direction AA ' in 1, with continued reference to shown in Fig. 2, Fig. 4 and Fig. 5, at least partly transmission line pattern 122 with extremely
Small part coil pattern 121 is located at same conductive layer 120, and the transmission line pattern 122 positioned at same conductive layer 120 is located at circuit diagram
The peripheral region of case 121.
Wherein, Fig. 2 illustratively draws transmission line pattern 122 and coil pattern 121 is located at the feelings of same conductive layer 120
Condition.Fig. 4 and Fig. 5 illustratively draws the case where transmission line pattern 122 is located at same conductive layer 120 with coil sections pattern 121.
By being arranged transmission line pattern 122 and at least partly coil pattern 121 in same conductive layer 120, electronics module can be reduced
Along the thickness perpendicular to substrate layer direction.Optionally, the conductive layer for being provided with transmission line pattern 122 is provided with coil pattern.
The transmission line pattern 122 for being located at same conductive layer 120 is arranged in the peripheral region of coil pattern 121, it can be to avoid circuit diagram
Signal interference between case and transmission line pattern.
Optionally, on the basis of the above embodiments, Fig. 6 is another electronics module provided in an embodiment of the present invention along figure
The schematic diagram of the section structure in the direction AA ' in 1, transmission line pattern 122 can be located at different conductive layers 120 from coil pattern 121, keep away
Exempt from the area in the section for being parallel to substrate layer of increase electronics module.
Optionally, on the basis of the above embodiments, Fig. 7 is another electronics module provided in an embodiment of the present invention along figure
The schematic diagram of the section structure in the direction AA ' in 1, a part of transmission line pattern 122 are located at different conductive layers from coil pattern 121
120, another part transmission line pattern 122 and coil sections pattern 121 are located at same conductive layer 120.It can be as needed to transmission
The position of line pattern is configured, and to meet assembling demand, and reduces the volume of electronics module as far as possible.
The embodiment of the present invention provides another electronics module.On the basis of the above embodiments, conductive referring to fig. 4 to Fig. 7
Layer 120 further includes shielding line pattern 123, and shielding line pattern 123 and transmission line pattern 122 are located at same conductive layer 120 and/or not
With conductive layer 120, shields line pattern 123 and be located at around transmission line pattern 122.
Wherein, Fig. 4 illustratively draws shielding line pattern 123 and from transmission line pattern 122 is located at different conductive layers 120
Situation.Fig. 5 and Fig. 6 illustratively draws shielding line pattern 123 and fractional transmission line pattern 122 is located at same conductive layer, and another
A part of transmission line pattern 122 is located at different conductive layers 120.The shielding line pattern 123 can reduce in transmission line pattern 122
The leakage of the signal of transmission, and avoid the interference of the signal transmitted in outer bound pair transmission line pattern 122.Optionally, it is provided with
Shielding line pattern and/or the conductive layer of transmission line pattern are provided with coil pattern, with reduce as far as possible electronics module along perpendicular to
The thickness in substrate layer direction.The shielding line pattern 123 can be grounded.
Optionally, on the basis of the above embodiments, with continued reference to Fig. 2, Fig. 4 to Fig. 7, electronics module 100 further includes exhausted
Edge layer 130, side of the conductive layer 120 far from substrate layer 110 on the outermost side of insulating layer 130.
Wherein, which can cover coil pattern, transmission line pattern and shield line pattern, and covering coil pattern,
Transmission line pattern and the gap between shielding line pattern.Insulating layer 130 may include following at least one: graphite linings and covering
Film (coverlay), can prevent conductive layer is exposed to be oxidized in air.It can be by printing technology, in outermost conduction
Side (i.e. on the outermost side conductive layer exposed on extraneous surface) of the layer 120 far from substrate layer 110 forms graphite linings.
Optionally, on the basis of the above embodiments, with continued reference to Fig. 2, Fig. 4 to Fig. 7, electronics module 100 further include every
Magnetic sheet 140, positioned at the outside for all conductive layers 120 for being provided with coil pattern 121, i.e., antifreeze plate 140 is not between being provided with
Between the conductive layer 120 of coil pattern 121.The antifreeze plate is to be stacked with substrate layer, conductive layer and insulating layer.The antifreeze plate
140 can be attached on outermost layer by adhesive, which can be insulating layer or substrate layer.The antifreeze plate can be located at electronics
The outside of mould group.The adhesive may include following at least one: glue and double-sided adhesive.If the coil pattern of the electronic device is
Transmitting terminal, the antifreeze plate 140 can enhance the magnetic field strength of electronics module, while magnetic convergence effect with higher；If the electricity
The coil pattern of sub-device is receiving end, can prevent other metallic conductors from interfering the decaying in magnetic field, play the work of metal isolation
With preventing energy dissipation, improve charge efficiency.
Optionally, substrate layer 110 is flexible substrate layer, and substrate layer 110 may include following at least one materials: polyamides is sub-
Amine, polymeric liquid crystal copolymer and polyethylene terephthalate.By using flexible substrate layer, so that electronics module has
Pliability, it is convenient to carry out assembly and connection at least two discrete electronic components.
Optionally, on the basis of the above embodiments, Fig. 8 is the knot of another electronic device provided in an embodiment of the present invention
Structure schematic diagram, in conjunction with shown in Fig. 1 and Fig. 8, the end of transmission line pattern 122 is provided with golden finger 1221 or electric connector, is used for
Connecting electronic component 200.The golden finger 1221 of transmission line pattern 122 can be inserted into the slot of electronic component 200, so that at least two
A electronic component 200 realizes assembly and connection by transmission line pattern 122.
Optionally, on the basis of the above embodiments, with continued reference to Fig. 8, coil pattern 121 may be provided with golden finger or electricity
Connector can be inserted into the slot of electronic component 200, so that coil pattern 121 and electronic component 200 realize assembly and connection.
The embodiment of the present invention provides a kind of electronic device.Referring to Fig. 3 or Fig. 8, which includes: at least two electricity
The electronics module 100 that subcomponent 200 and any embodiment of that present invention provide, wherein between at least two electronic components 200
It is electrically connected by transmission line pattern 122.
Wherein, optionally, which includes following at least one: antenna, microphone, loudspeaker, is pressed motherboard
Key, camera, flash lamp and charging interface.The electronic device 10 includes following at least one: mobile phone, tablet computer, notebook
Computer and intelligent wearable device.Wherein, the motherboard of the electronic device can be used for electronics module output AC voltage, or
Person receives the electric energy that electronics module generates, alternatively, the received radiofrequency signal of electronics module is obtained, alternatively, exporting to electronics module
Radiofrequency signal, and control the working condition of remaining at least one electronic component.
Electronic device provided in an embodiment of the present invention includes the electronics module in above-described embodiment, therefore the embodiment of the present invention
The electronic device of offer also has beneficial effect described in above-described embodiment, and details are not described herein again.
Optionally, on the basis of the above embodiments, continue to participate in Fig. 8, electronic component 200 is provided with slot (in figure not
Draw), match with the golden finger or electric connector being arranged in transmission line pattern 122.
Optionally, on the basis of the above embodiments, with continued reference to Fig. 8, which further includes shell 300, at least
Two electronic components 200 are located at 300 inside of shell and/or surface.Illustratively, motherboard is located at enclosure interior, microphone, loudspeaker
, key, camera, flash lamp and charging interface be located at surface of shell.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above embodiments to this
Invention is described in further detail, but the present invention is not limited to the above embodiments only, is not departing from present inventive concept
In the case of, it can also include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (12)
1. a kind of electronics module characterized by comprising
At least one layer of substrate layer and at least one layer of conductive layer being stacked,
Wherein, the conductive layer includes coil pattern and transmission line pattern, between the coil pattern and the transmission line pattern
Without electrical connection, the transmission line pattern is used at least two electronic components being electrically connected in electronic device.
2. electronics module according to claim 1, which is characterized in that the coil pattern includes following at least one: nothing
Line charge electric wire circular pattern and close range wireless communication coil pattern.
3. electronics module according to claim 1, which is characterized in that the number of plies of the conductive layer is multilayer, the substrate
Layer and the alternately laminated setting of the conductive layer.
4. electronics module according to claim 3, which is characterized in that at least partly described transmission line pattern at least partly
The coil pattern is located at same conductive layer,
It is located at the peripheral region of the coil pattern positioned at the transmission line pattern of same conductive layer.
5. electronics module according to claim 1, which is characterized in that the conductive layer further includes shielding line pattern, described
Shielding line pattern and the transmission line pattern are located at same conductive layer and/or different conductive layers, and the shielding line pattern is located at institute
It states around transmission line pattern.
6. electronics module according to claim 1, which is characterized in that further include insulating layer, the insulating layer is located at outermost
Side of the conductive layer of side far from the substrate layer.
7. electronics module according to claim 6, which is characterized in that further include antifreeze plate, positioned at being provided with coil pattern
All conductive layers outside.
8. electronics module according to claim 1, which is characterized in that the substrate layer is flexible substrate layer, the substrate
Layer includes following at least one materials: polyimides, polymeric liquid crystal copolymer and polyethylene terephthalate.
9. electronics module according to claim 1, which is characterized in that the end of the transmission line pattern is provided with golden finger
Or electric connector, it is used for connecting electronic component.
10. a kind of electronic device characterized by comprising at least two electronic components and claim 1-9 are any described
Electronics module,
It is electrically connected between at least two electronic component by transmission line pattern.
11. electronic device according to claim 10, which is characterized in that the electronic component is provided with slot,
The electronic component includes following at least one: antenna, motherboard, microphone, loudspeaker, key, camera, flash lamp and
Charging interface.
12. electronic device according to claim 10, which is characterized in that the electronic device includes following at least one: hand
Machine, tablet computer, laptop and intelligent wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811420243.5A CN109492741A (en) | 2018-11-26 | 2018-11-26 | A kind of electronics module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811420243.5A CN109492741A (en) | 2018-11-26 | 2018-11-26 | A kind of electronics module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109492741A true CN109492741A (en) | 2019-03-19 |
Family
ID=65697667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811420243.5A Pending CN109492741A (en) | 2018-11-26 | 2018-11-26 | A kind of electronics module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109492741A (en) |
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| CN102037607A (en) * | 2008-05-22 | 2011-04-27 | 株式会社村田制作所 | Wireless IC device and method for manufacturing the same |
| CN204578186U (en) * | 2015-03-09 | 2015-08-19 | 正达国际光电股份有限公司 | Portable electronic device with wireless charging function and glass back cover structure thereof |
| CN104901399A (en) * | 2014-03-04 | 2015-09-09 | Lg伊诺特有限公司 | Wireless charging communication board and wireless charging communication device |
| CN204927513U (en) * | 2015-09-11 | 2015-12-30 | 深圳市佳沃通信技术有限公司 | Synthetic coil antenna |
| CN107046333A (en) * | 2016-02-05 | 2017-08-15 | 三星电机株式会社 | Coil module and the wireless power receiver using the coil module |
| CN107731495A (en) * | 2016-08-10 | 2018-02-23 | 三星电机株式会社 | Coil module |
-
2018
- 2018-11-26 CN CN201811420243.5A patent/CN109492741A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1476636A (en) * | 2001-10-15 | 2004-02-18 | ���µ�����ҵ��ʽ���� | module parts |
| CN102037607A (en) * | 2008-05-22 | 2011-04-27 | 株式会社村田制作所 | Wireless IC device and method for manufacturing the same |
| CN104901399A (en) * | 2014-03-04 | 2015-09-09 | Lg伊诺特有限公司 | Wireless charging communication board and wireless charging communication device |
| CN204578186U (en) * | 2015-03-09 | 2015-08-19 | 正达国际光电股份有限公司 | Portable electronic device with wireless charging function and glass back cover structure thereof |
| CN204927513U (en) * | 2015-09-11 | 2015-12-30 | 深圳市佳沃通信技术有限公司 | Synthetic coil antenna |
| CN107046333A (en) * | 2016-02-05 | 2017-08-15 | 三星电机株式会社 | Coil module and the wireless power receiver using the coil module |
| CN107731495A (en) * | 2016-08-10 | 2018-02-23 | 三星电机株式会社 | Coil module |
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Application publication date: 20190319 |
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