CN109465567A - A kind of brazing active solder for diamond abrasive tool - Google Patents
A kind of brazing active solder for diamond abrasive tool Download PDFInfo
- Publication number
- CN109465567A CN109465567A CN201811633067.3A CN201811633067A CN109465567A CN 109465567 A CN109465567 A CN 109465567A CN 201811633067 A CN201811633067 A CN 201811633067A CN 109465567 A CN109465567 A CN 109465567A
- Authority
- CN
- China
- Prior art keywords
- active solder
- soldering
- solder
- abrasive tool
- diamond abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 98
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 53
- 239000010432 diamond Substances 0.000 title claims abstract description 53
- 238000005219 brazing Methods 0.000 title abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 43
- 230000008018 melting Effects 0.000 claims abstract description 43
- 238000005476 soldering Methods 0.000 claims abstract description 41
- 239000011701 zinc Substances 0.000 claims abstract description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 21
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 21
- 239000000956 alloy Substances 0.000 claims abstract description 21
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 21
- 239000011651 chromium Substances 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 21
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010936 titanium Substances 0.000 claims abstract description 20
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 20
- 239000002994 raw material Substances 0.000 claims abstract description 13
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims abstract description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910000906 Bronze Inorganic materials 0.000 claims description 8
- 238000003723 Smelting Methods 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 239000010974 bronze Substances 0.000 claims description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 16
- 229910002804 graphite Inorganic materials 0.000 abstract description 13
- 239000010439 graphite Substances 0.000 abstract description 13
- 229910000831 Steel Inorganic materials 0.000 abstract description 11
- 239000010959 steel Substances 0.000 abstract description 11
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005266 casting Methods 0.000 abstract description 9
- 239000007791 liquid phase Substances 0.000 abstract description 9
- 229910052748 manganese Inorganic materials 0.000 abstract description 9
- 239000011572 manganese Substances 0.000 abstract description 9
- 239000011159 matrix material Substances 0.000 abstract description 9
- 239000004615 ingredient Substances 0.000 abstract description 8
- 239000000945 filler Substances 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- RYGMFSIKBFXOCR-AHCXROLUSA-N copper-60 Chemical compound [60Cu] RYGMFSIKBFXOCR-AHCXROLUSA-N 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- XUDNJARNPKNDSJ-UHFFFAOYSA-N [Ti].[Cu].[Zn] Chemical compound [Ti].[Cu].[Zn] XUDNJARNPKNDSJ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001092 metal group alloy Inorganic materials 0.000 abstract description 2
- 238000005452 bending Methods 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 12
- 238000010008 shearing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BLOIXGFLXPCOGW-UHFFFAOYSA-N [Ti].[Sn] Chemical compound [Ti].[Sn] BLOIXGFLXPCOGW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-NJFSPNSNSA-N copper-66 Chemical compound [66Cu] RYGMFSIKBFXOCR-NJFSPNSNSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Ceramic Products (AREA)
Abstract
The present invention provides a kind of diamond abrasive tool soldering active solder, which contains the component of following mass percent: copper 60% ~ 72%, zinc 15% ~ 21%, titanium 6% ~ 9%, manganese 2% ~ 6%, silicon 2% ~ 3%, chromium 1% ~ 2%, zirconium 0.3% ~ 0.7%；Concrete technology includes: to add raw materials into vacuum arc melting furnace cold-crucible bottom, pulsed arc melting, and electrode current is 190 ~ 220A, melting next time is carried out after being cooled to room temperature, melt back 4 ~ 7 times until ingot casting ingredient is uniform；Active solder alloy of the invention, compound addition manganese, silicon, chromium, zirconium on the basis of copper zinc titanium active solder, gained brazing filler metal alloy intensity is high and fusing point is low, it can be obtained complete liquid phase at 800 DEG C, form diamond in conjunction with strong metallurgical with matrix, bond strength is high, and the joint bending stiffness of active solder soldering graphite/No. 45 steel can reach 360MPa.
Description
Technical field
The invention belongs to technical field of soldering materials, and in particular to a kind of diamond abrasive tool soldering active solder.
Background technique
Traditional Diamond Tool Matrix is lower to the package power of diamond, diamond is difficult to out sword or easy to fall off.
It is higher and higher to the service performance requirement of diamond tool with the development of materials industry, however diamond tool
There is also many difficult points for welding, and such as: common metal and alloy are difficult to soak on its surface；The linear expansion coefficient of diamond is lower than one
As metal material, easily formation thermal stress；Diamond is carbonized under high temperature, and brazing temperature is restricted.
Soldering tech is applied to diamond tool production thus, and domestic and foreign scholars carry out numerous studies discovery, using work
Property brazing material, be remarkably improved solder in the wetability of diamond surface, form the metallurgical bonding between solder and diamond, obtain
Obtain superior service performance.
Soldering diamond active solder alloy mainly has Ni-based, copper-based, silver-based three classes at present.Wherein nickel-based solder soldering temperature
Degree is higher, and diamond is easy to appear thermal damage；Silver-base solder and copper base solder brazing temperature are lower, but silver-base solder cost compared with
Height, copper base solder is relative to nickel-based solder and silver-base solder, and cost is relatively low, and joint performance is close with silver-base solder, saves significantly
About cost.Chinese patent CN101913036B discloses brazed diamond tool copper and tin titanium solder, which can be
800 DEG C or less obtain complete liquid phase, and being brazed graphite and No. 45 steel shearing strength of joint using the active solder is 301.4MPa.In
State patent CN101913036A discloses a kind of CuZnTi solder for soldering diamond tool, and the patent brazing filler metal fusing point is lower, stone
Ink is high with matrix metallurgical bonding intensity, is brazed graphite using the active solder and No. 45 steel shearing strength of joint reach
309.3MPa.Copper base solder mainly has copper and tin titanium solder, copper-zinc solder etc. at present, but such solder can be made due to the addition of tin
Alloy becomes fragile, and is unfavorable for the use of diamond tool.
Summary of the invention
To solve the above problems, the present invention provides a kind of diamond abrasive tool soldering active solder, it can increase and be brazed
Diamond and substrate combinating strength in journey improve wetability, and fusing point is lower.
To achieve the goals above, the technical solution adopted by the present invention are as follows:
A kind of diamond abrasive tool soldering active solder, it is characterised in that: soldering active solder includes: 60% by mass percentage ~
72% bronze medal, 15% ~ 21% zinc, 6% ~ 9% titanium, 2% ~ 6% manganese, 2% ~ 3% silicon, 1% ~ 2% chromium and 0.3% ~ 0.7% zirconium.
Further, the copper, zinc, titanium, manganese, silicon, chromium and zirconium are pure metal.
Further, the soldering active solder includes: 62% ~ 72% bronze medal, 17% ~ 21% zinc, 7% ~ 9% by mass percentage
Titanium, 3% ~ 6% manganese, 2% ~ 3% silicon, 1% ~ 2% chromium and 0.4% ~ 0.7% zirconium.
Further, the soldering active solder includes: 62% ~ 70% bronze medal, 17% ~ 20% zinc, 7% ~ 8% by mass percentage
Titanium, 3% ~ 5% manganese, 2.5% ~ 3% silicon, 1.5% ~ 2% chromium and 0.4% ~ 0.6% zirconium.
Further, the soldering active solder includes: 64% ~ 68% bronze medal, 17% ~ 18% zinc, 7.5% ~ 8% by mass percentage
Titanium, 3% ~ 4% manganese, 2% ~ 3% silicon, 1.5% ~ 2% chromium and 0.4% ~ 0.5% zirconium.
Further, soldering active solder is prepared according to the following steps:
Step 1: mass percent each raw material to be added to the bottom of vacuum arc melting furnace cold-crucible；
Step 2: the vacuum degree of pulsed arc melting is 2.5x10 with the raw material in pulsed arc melting step one-3Pa~5x10-3Pa, electrode current are 190 ~ 220A, and each smelting time is 2 ~ 5min, and melting obtains alloy solution；
Step 3: the alloy solution in step 2 is cooled to room temperature, repeats step 2 and carry out melting next time, melt back
It is 4 ~ 7 times, so cooling that be brazed active solder.
Further, it is also passed through pure argon in the furnace chamber of vacuum arc melting furnace and carries out melting protection.
Active solder of the invention mainly contains copper, zinc, titanium, on the basis of copper zinc titanium active solder compound addition manganese,
Silicon, chromium, zirconium, gained brazing filler metal alloy fusing point is low, can be obtained complete liquid phase at 800 DEG C, and intensity is high, active solder welds stone
The shearing force of ink/No. 45 steel can reach 360MPa, and when soldering forms diamond in conjunction with strong metallurgical with matrix, bond strength
Height is high to diamond holding power.
The present invention is the characteristic principle based on following each elements and be selected as solder prepares raw material: zinc can reduce
Copper alloy fusing point, zinc and copper can form intensity and the good solid solution of plasticity, have the function that solution strengthening, but alloy Zn content
It will form the brittlement phases such as β, γ after certain value, in tissue；Titanium is active element, can form compound with carbon, be formed secured
Metallurgical bonding；Manganese can be improved elevated temperature strength, improve wetability, and can reduce fusing point；Silicon can reduce brazing filler metal fusing point, prevent
The evaporation of manganese improves wetability；Wetability can be improved with carbide former in chromium or zirconium, form firm connection.
The invention has the benefit that
1, a kind of diamond abrasive tool of the invention soldering active solder, zinc is added in copper base solder, improves intensity；Simultaneously
Active element titanium, silicon, chromium, zirconium are added, can make to form strong metallurgical combination between diamond, solder, matrix, further increase strong
Degree；Manganese element is added, wetability can be improved, and reduce fusing point, improves comprehensive performance, to obtain and diamond tool performance
It is required that the solder to match；Solder plasticity is good, and the shapes such as in blocks, powder, simple process can be processed；
2, vacuum arc melting furnace is the ideal equipment for preparing reactive alloys solder, but common furnace body uses the copper of Forced water cooling
The method of crucible, it is uneven to will cause each regional part of melting ingot casting, and it is uniform that the present invention by melt back can get ingredient
Ingot casting.
Detailed description of the invention
Fig. 1 is diamond/active solder scanning electron microscope (SEM) photograph.
Wherein, each label in figure are as follows: A, diamond；B, diamond/active solder interface；C, active solder.
Specific embodiment
In order to which those skilled in the art better understood when technical solution provided by the present invention, below with reference to specific
Embodiment income illustrates.
Embodiment 1
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 66%, zinc 18%, titanium 7.5%, manganese
4%, silicon 2.5%, chromium 1.5%, zirconium 0.5%.
Soldering active solder the preparation method comprises the following steps: add raw materials into vacuum arc melting furnace cold-crucible bottom, pulse electricity
Arc melting, vacuum degree 2.5x10-3Pa, electrode current 190A, each smelting time are 3min, are carried out down after being cooled to room temperature
Melting once, a kind of melt back 5 times diamond abrasive tool preparations that are brazed active solder uniform, described up to ingot casting ingredient
Method, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 810 DEG C or less；In active solder of the invention
Characterization in, due to soldering diamond particles be difficult quantify diamond and matrix soldering bond strength.And graphite and diamond
Element be all carbon, so, with matrix pricker soldering graphite be shearing sample, quantify carbon and matrix bond strength, and then prove
The bond strength of matrix and diamond particles.Specifically using active solder manufactured in the present embodiment as raw material, active solder pricker is prepared
Graphite shear sample is welded, and measures the shear strength of active solder the soldering graphite and No. 45 steel of the present embodiment, the active solder
Graphite/No. 45 steel shearing strength of joint is brazed up to 369.2MPa.
Fig. 1 is diamond/active solder scanning electron microscopic picture of the present embodiment, and a-quadrant is diamond regions, B area
For diamond/active solder interface area, the region C is active solder area；It can be seen from the figure that diamond is smooth complete, do not have
Generate apparent thermal damage's phenomenon.And the interface cohesion between diamond and active solder is good.
Embodiment 2
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 66%, zinc 18%, titanium 7.5%, manganese
4%, silicon 2.5%, chromium 1.5%, zirconium 0.5%.
It is brazed the preparation method of active solder, concrete technology includes the following steps: to add raw materials into vacuum arc melting furnace
Cold-crucible bottom, pulsed arc melting, vacuum degree 5x10-3Pa, electrode current 220A, each smelting time are 5min,
Melting next time, a kind of melt back 7 times diamond abrasive tool use uniform, described up to ingot casting ingredient are carried out after being cooled to room temperature
It is brazed the preparation method of active solder, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 800 DEG C or less；Active solder soldering graphite/
No. 45 steel shearing strength of joint are up to 371.7MPa.
Embodiment 3
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 72%, zinc 15%, titanium 6%, manganese 3%,
Silicon 2%, chromium 1.5%, zirconium 0.5%.
Active solder preparation method, specifically comprises the processes of: add raw materials into vacuum arc melting furnace cold-crucible bottom, pulse
Electric arc melting, vacuum degree 3x10-3Pa, electrode current 200A, each smelting time are 4min, are carried out down after being cooled to room temperature
Melting once, a kind of melt back 5 times diamond abrasive tool preparations that are brazed active solder uniform, described up to ingot casting ingredient
Method, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 820 DEG C or less；Active solder soldering graphite/
No. 45 steel shearing strength of joint are up to 362.1MPa.
Embodiment 4
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 72%, zinc 15%, titanium 6%, manganese 3%,
Silicon 2%, chromium 1.5%, zirconium 0.5%.
It is brazed active solder preparation method, concrete technology includes the following steps: to add raw materials into vacuum arc melting furnace water
Cold crucible bottom, pulsed arc melting, vacuum degree 5x10-3Pa, electrode current 210A, each smelting time is 5min, cold
But to melting next time is carried out after room temperature, melt back 6 times until a kind of uniform, the described diamond abrasive tool pricker of ingot casting ingredient
The preparation method of active solder is welded, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 810 DEG C or less；Active solder soldering graphite/
No. 45 steel shearing strength of joint are up to 365.5MPa.
Embodiment 5
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 60%, zinc 21%, titanium 9%, manganese
5.5%, silicon 2%, chromium 2%, zirconium 0.5%.
Soldering active solder the preparation method comprises the following steps: add raw materials into vacuum arc melting furnace cold-crucible bottom, pulse electricity
Arc melting, vacuum degree 3x10-3Pa, electrode current 220A, each smelting time are 3min, are carried out after being cooled to room temperature next
Secondary melting, a kind of melt back 5 times diamond abrasive tool preparation sides that are brazed active solder uniform, described up to ingot casting ingredient
Method, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 830 DEG C or less；Active solder soldering graphite/
No. 45 steel shearing strength of joint are up to 370.1MPa.
Embodiment 6
The active solder alloy of the present embodiment, consists of the following mass percentage components: copper 60%, zinc 21%, titanium 9%, manganese
5.5%, silicon 2%, chromium 2%, zirconium 0.5%.
Soldering active solder the preparation method comprises the following steps: add raw materials into vacuum arc melting furnace cold-crucible bottom, pulse electricity
Arc melting, vacuum degree 2.5x10-3Pa, electrode current 220A, each smelting time are 5min, are carried out down after being cooled to room temperature
Melting once, a kind of melt back 5 times diamond abrasive tool preparations that are brazed active solder uniform, described up to ingot casting ingredient
Method, environment is straight argon gas shielded in the furnace chamber of vacuum arc melting furnace.
The active solder alloy of the present embodiment can be obtained complete liquid phase at 810 DEG C or less；Active solder soldering graphite/
No. 45 steel shearing strength of joint are up to 368.3MPa.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
The present invention will not be limited to the embodiments shown herein, and is to fit to special with principles disclosed herein and novelty
The consistent widest scope of point.
Claims (7)
1. a kind of diamond abrasive tool soldering active solder, it is characterised in that: be brazed active solder includes: by mass percentage
60% ~ 72% bronze medal, 15% ~ 21% zinc, 6% ~ 9% titanium, 2% ~ 6% manganese, 2% ~ 3% silicon, 1% ~ 2% chromium and 0.3% ~ 0.7% zirconium.
2. a kind of diamond abrasive tool according to claim 1 soldering active solder, it is characterised in that: the copper, zinc,
Titanium, manganese, silicon, chromium and zirconium are pure metal.
3. a kind of diamond abrasive tool according to claim 1 soldering active solder, it is characterised in that: the soldering activity
Solder include: by mass percentage 62% ~ 72% bronze medal, 17% ~ 21% zinc, 7% ~ 9% titanium, 3% ~ 6% manganese, 2% ~ 3% silicon, 1% ~ 2% chromium and
0.4% ~ 0.7% zirconium.
4. a kind of diamond abrasive tool according to claim 1 soldering active solder, it is characterised in that: the soldering activity
Solder includes: 62% ~ 70% bronze medal, 17% ~ 20% zinc, 7% ~ 8% titanium, 3% ~ 5% manganese, 2.5% ~ 3% silicon, 1.5% ~ 2% chromium by mass percentage
With 0.4% ~ 0.6% zirconium.
5. a kind of diamond abrasive tool according to claim 1 soldering active solder, it is characterised in that: the soldering activity
Solder includes: 64% ~ 68% bronze medal, 17% ~ 18% zinc, 7.5% ~ 8% titanium, 3% ~ 4% manganese, 2% ~ 3% silicon, 1.5% ~ 2% chromium by mass percentage
With 0.4% ~ 0.5% zirconium.
6. a kind of diamond abrasive tool according to claim 1 soldering active solder, it is characterised in that: soldering active solder
It prepares according to the following steps:
Step 1: mass percent each raw material to be added to the bottom of vacuum arc melting furnace cold-crucible；
Step 2: the vacuum degree of pulsed arc melting is 2.5x10 with the raw material in pulsed arc melting step one-3Pa~5x10- 3Pa, electrode current are 190 ~ 220A, and each smelting time is 2 ~ 5min, and melting obtains alloy solution；
Step 3: the alloy solution in step 2 is cooled to room temperature, repeats step 2 and carry out melting next time, melt back
It is 4 ~ 7 times, so cooling that be brazed active solder.
7. a kind of diamond abrasive tool according to claim 6 soldering active solder, it is characterised in that: vacuum arc melting
It is also passed through pure argon in the furnace chamber of furnace and carries out melting protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633067.3A CN109465567A (en) | 2018-12-29 | 2018-12-29 | A kind of brazing active solder for diamond abrasive tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633067.3A CN109465567A (en) | 2018-12-29 | 2018-12-29 | A kind of brazing active solder for diamond abrasive tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109465567A true CN109465567A (en) | 2019-03-15 |
Family
ID=65677411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811633067.3A Pending CN109465567A (en) | 2018-12-29 | 2018-12-29 | A kind of brazing active solder for diamond abrasive tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109465567A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427834A (en) * | 2020-11-04 | 2021-03-02 | 湖南盛华源材料科技有限公司 | Novel alloy brazing filler metal and preparation method thereof |
| CN112475667A (en) * | 2020-11-13 | 2021-03-12 | 娄底市安地亚斯电子陶瓷有限公司 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
| CN115255372A (en) * | 2022-08-31 | 2022-11-01 | 河南机电职业学院 | Powder making device for alloy powder and application of powder making device in preparation of copper-based solder |
| CN116944610A (en) * | 2023-09-19 | 2023-10-27 | 东北大学 | A method and application of preparing diamond double-sided copper-clad substrate using brazing process |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | Copper-Zinc-Titanium Filler for Brazing Diamond Tools |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN102909489A (en) * | 2012-10-30 | 2013-02-06 | 江苏科技大学 | Quenching solder for connecting hard alloy and steel as well as preparation method and connecting method of same |
| JP2018023987A (en) * | 2016-08-09 | 2018-02-15 | 株式会社日本スペリア社 | Jointing method |
| CN107738040A (en) * | 2017-10-18 | 2018-02-27 | 镇江市锶达合金材料有限公司 | A kind of welding material and its manufacture method |
| CN107815619A (en) * | 2017-11-20 | 2018-03-20 | 北京航空航天大学 | A kind of Ti Zr Cu Co M systems solder alloy and preparation method thereof |
| CN107931885A (en) * | 2017-10-23 | 2018-04-20 | 中国科学院宁波材料技术与工程研究所 | A kind of Nd-Fe-B permanent magnet copper base brazing material and preparation method thereof |
| CN108188613A (en) * | 2017-11-28 | 2018-06-22 | 深圳市福摩索金属制品有限公司 | A kind of active solder and its preparation method and application |
-
2018
- 2018-12-29 CN CN201811633067.3A patent/CN109465567A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101913036A (en) * | 2010-09-08 | 2010-12-15 | 郑州机械研究所 | Copper-Zinc-Titanium Filler for Brazing Diamond Tools |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
| CN102909489A (en) * | 2012-10-30 | 2013-02-06 | 江苏科技大学 | Quenching solder for connecting hard alloy and steel as well as preparation method and connecting method of same |
| JP2018023987A (en) * | 2016-08-09 | 2018-02-15 | 株式会社日本スペリア社 | Jointing method |
| CN107738040A (en) * | 2017-10-18 | 2018-02-27 | 镇江市锶达合金材料有限公司 | A kind of welding material and its manufacture method |
| CN107931885A (en) * | 2017-10-23 | 2018-04-20 | 中国科学院宁波材料技术与工程研究所 | A kind of Nd-Fe-B permanent magnet copper base brazing material and preparation method thereof |
| CN107815619A (en) * | 2017-11-20 | 2018-03-20 | 北京航空航天大学 | A kind of Ti Zr Cu Co M systems solder alloy and preparation method thereof |
| CN108188613A (en) * | 2017-11-28 | 2018-06-22 | 深圳市福摩索金属制品有限公司 | A kind of active solder and its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 仝兴存: "《电子封装热管理先进材料》", 30 April 2016 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427834A (en) * | 2020-11-04 | 2021-03-02 | 湖南盛华源材料科技有限公司 | Novel alloy brazing filler metal and preparation method thereof |
| CN112475667A (en) * | 2020-11-13 | 2021-03-12 | 娄底市安地亚斯电子陶瓷有限公司 | Metal brazing active brazing filler metal for ceramic copper-clad substrate and manufacturing process thereof |
| CN115255372A (en) * | 2022-08-31 | 2022-11-01 | 河南机电职业学院 | Powder making device for alloy powder and application of powder making device in preparation of copper-based solder |
| CN115255372B (en) * | 2022-08-31 | 2024-01-02 | 河南机电职业学院 | Powder preparation device of alloy powder and application of powder preparation device in preparation of copper-based solder |
| CN116944610A (en) * | 2023-09-19 | 2023-10-27 | 东北大学 | A method and application of preparing diamond double-sided copper-clad substrate using brazing process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109465567A (en) | A kind of brazing active solder for diamond abrasive tool | |
| US7946467B2 (en) | Braze material and processes for making and using | |
| CN103358051B (en) | A kind of copper base solder and preparation method thereof | |
| CN114346519B (en) | A method of directly brazing TiAl alloy and Ti2AlNb alloy using high-entropy brazing filler metal foil | |
| CN110394522B (en) | Deformed nickel-based alloy and cast Ni3Brazing process of Al-based alloy | |
| CN102689109A (en) | High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal | |
| CN106392367A (en) | Solder for brazing red copper and graphite and brazing method | |
| CN103192195A (en) | Titanium alloy and stainless steel electron beam welding filler material, and preparation process and method thereof | |
| CN101954551A (en) | Brazing filler metal and process for welding molybdenum-copper alloy and Austenitic stainless steel | |
| CN114055012A (en) | A kind of multicomponent copper-based alloy brazing filler metal containing rare earth element, preparation method and brazing method thereof | |
| CN115106680B (en) | Preparation method and brazing method of rare earth Nd-doped multi-element nickel-based alloy brazing filler metal | |
| CN103240544B (en) | High-temperature brazing filler metal for soldering C/C and C/SiC composite materials and preparation methods thereof | |
| CN110524082B (en) | A method for rapid wetting of carbon fibers in ceramic matrix composites with Fe as active element | |
| CN103170764B (en) | Brazing filler alloy powder and preparation method thereof | |
| CN113478040A (en) | Active brazing method for improving performance of graphite/copper dissimilar material joint | |
| CN105965176B (en) | For soldering tungsten-copper alloy and the Ni base chilling solders and soldering processes of stainless steel | |
| CN101920410B (en) | Copper-palladium based high-temperature brazing filler metal for brazing Si3N4 ceramic and Cf/SiC composite material | |
| CN102485698A (en) | Connection method of brass and silicon carbide ceramic, and connected piece | |
| CN101920408A (en) | Palladium/cobalt-based high-temperature brazing filler for Cf/SiC composite material brazing | |
| CN107160059A (en) | A kind of preparation of Ni base solders for soldering Nb Ti high temperature alloys and method for welding | |
| CN111085796B (en) | Fe-based multielement active high-temperature brazing filler metal for carbon fiber reinforced ceramic matrix composite | |
| CN115229378A (en) | A kind of high-entropy alloy brazing filler metal and its preparation method and application | |
| CN106271209A (en) | For the high temperature Fe base solder of soldering 50Mo 50Re alloy and preparation method and soldering processes | |
| CN110576275A (en) | A kind of laser brazing in-situ reaction AgCuTiZr solder and preparation method thereof | |
| CN101920409B (en) | A palladium-copper-gold-based high-temperature solder for brazing of Cf/SiC composite materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190315 |
|
| RJ01 | Rejection of invention patent application after publication |