CN109459827B - Photoelectric module air tightness assembling method - Google Patents
Photoelectric module air tightness assembling method Download PDFInfo
- Publication number
- CN109459827B CN109459827B CN201811271310.1A CN201811271310A CN109459827B CN 109459827 B CN109459827 B CN 109459827B CN 201811271310 A CN201811271310 A CN 201811271310A CN 109459827 B CN109459827 B CN 109459827B
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- welding
- metal adapter
- metallized
- shaped groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000013307 optical fiber Substances 0.000 claims abstract description 117
- 238000003466 welding Methods 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000003292 glue Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 24
- 230000008878 coupling Effects 0.000 claims description 20
- 238000010168 coupling process Methods 0.000 claims description 20
- 238000005859 coupling reaction Methods 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 230000008018 melting Effects 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 10
- 230000005693 optoelectronics Effects 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 9
- 230000004907 flux Effects 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 239000011247 coating layer Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000833 kovar Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000013035 low temperature curing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4237—Welding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses an airtight assembly method of a photoelectric module, which comprises a metalized optical fiber welding process, an optical fiber metal adapter and shell optical fiber interface design, a multi-path optical fiber high-precision wire arrangement positioning process, an optical fiber array and light source and receiver high-precision alignment post-fixing process, a metal adapter and shell airtight welding process, temperature gradients of all processes, an assembly flow design and the like. Different from the traditional glue sealing process, the invention ensures the air tightness of the module by using the welding process, and takes the metallized optical fiber as a signal transmission medium, thereby facilitating the air tightness assembly of the module. And the optical fiber metal adapter and the optical fiber interface on the side wall of the shell are designed, so that the optical fiber metal adapter and the optical fiber interface are conveniently connected with the optical fiber and the shell in an airtight manner. And designing a process temperature gradient and an assembly sequence to ensure the air-tight assembly of the photoelectric module. The air tightness and reliability requirements of the aerospace device can be met.
Description
Technical Field
The invention belongs to the technical field of photoelectric device manufacturing, and particularly relates to a photoelectric module air tightness assembling method.
Background
In modern information networks, optical transmission has a dominant position in the fields of information transmission, signal processing and the like due to the advantages of large capacity, small volume, light weight, long transmission distance, good stability, low power consumption, strong anti-interference capability and the like. As the core of optical transmission, the multichannel transceiving integrated photoelectric module has very wide application prospect in many aspects such as high-speed high-broadband data transmission, signal processing, optical fiber communication, automatic control, computers and the like.
The existing developed photoelectric transceiving module products are packaged by adopting a glue sealing process, but the long-term and stable air tightness of the products cannot be ensured due to the influence of environmental factors such as temperature, water vapor and the like in the glue sealing process. Therefore, a truly airtight product has not yet been developed. Because the aerospace military field has extremely high requirements on product reliability, particularly air tightness, in the aspects of reliability and the like, the existing photoelectric module cannot meet the application of high-end weapons, aerospace equipment and key weapon models. Therefore, a hermetic assembly process of the photovoltaic module is urgently sought.
Disclosure of Invention
In order to solve the problems, the invention provides an air-tight assembling method of a photoelectric module, which realizes the air-tight connection between an optical fiber and the side wall of a tube seat and can ensure that a product meets the air-tight requirement of an aerospace device.
In order to achieve the above purpose, the method for assembling the photoelectric module in an airtight manner comprises the following steps:
step 3, penetrating the metallized optical fiber through an optical fiber interface on the side wall of the tube seat;
step 5, electrifying the VCSEL laser, coupling the light of the VCSEL laser into the metallized optical fiber, and then measuring the real-time power of the light led out by the metallized optical fiber;
and 8, welding the cover plate of the photoelectric module to the tube seat.
Further, adhering the light source and the receiver to an AlN heat dissipation plate, adhering the AlN heat dissipation plate to a module substrate, and using insulating glue as an adhesive, wherein the curing temperature of the insulating glue is 150 ℃ and the temperature of the insulating glue is 300 ℃; the LTCC ceramic substrate is adhered to the tube seat, heat-conducting glue is used as an adhesive, the curing temperature of the heat-conducting glue is 150 ℃, and the temperature resistance is 210 ℃; the metal adapter is welded on the metallized optical fiber, the melting point of the used welding flux is more than 250 ℃, the welding temperature is 310 ℃, and the welding time is 20 s; the metallized optical fiber and the V-shaped groove and the LTCC ceramic substrate are fixed by adopting low-temperature cured polyimide as an adhesive, wherein the curing temperature of the low-temperature cured polyimide is 160 ℃, and the temperature resistance of the low-temperature cured polyimide is 334 ℃; when the metal adapter and the optical fiber interface are welded, the used welding flux is the welding flux with the melting point less than 170 ℃, the welding temperature is 200 ℃, and the welding time is 20 s.
Further, before step 3, the end faces of the V-shaped groove coupled with the laser or the receiver and the metalized optical fiber are ground, so that the included angle between the end faces of the V-shaped groove and the metalized optical fiber and the horizontal plane is 45-60 degrees.
Furthermore, after the V-shaped groove opposite to the light source and the detector and the end face of the metalized optical fiber are ground, a layer of reflecting film is plated on the end face of the metalized optical fiber.
Further, in step 1, the metal adapter is a step shaft, a plurality of step holes matched with the metal adapter are formed in the optical fiber interface, and when the metal adapter extends into the step holes, the metal adapter is in clearance fit with the step holes.
Further, the coating layer of the metallized optical fiber is gold or nickel.
Further, in step 6, the position of the V-shaped groove is adjusted by using a multi-axis micro-displacement platform.
Further, in step 8, the cover plate of the photovoltaic module is welded to the stem by laser seam welding or parallel seam welding.
Compared with the prior art, the invention has at least the following beneficial technical effects:
1) the welding process is used for realizing the air tightness assembly of the photoelectric module, and the air tightness and the reliability of the product can be stably ensured for a long time.
2) And the metalized optical fiber is used as a signal transmission medium, so that the airtight assembly of the photoelectric module is facilitated. Simultaneous design metal adapter
And a tube seat interface which is convenient for the air tight connection between the optical fiber and the tube seat.
3) The process temperature gradient and the assembly sequence are designed, and the process temperature of each procedure is ensured to be from high to low without mutual interference. And the air tightness assembly of the photoelectric module is ensured.
Drawings
FIG. 1 is a process flow diagram of a hermetic photovoltaic module;
FIG. 2 is a schematic view of a hermetically sealed optoelectronic module metallized optical fiber and metal adapter;
FIG. 3 is a schematic view of an airtight optoelectronic module socket and sidewall interface;
FIG. 4 is a schematic view of the hermetic mating connection of the optical fiber of the optoelectronic module to the tube seat;
FIG. 5 is a process flow diagram of a hermetic photovoltaic module;
FIG. 6a is a schematic view of the positioning of the optical fiber array of the hermetic optoelectronic module;
FIG. 6b is a left side view of FIG. 6 a;
FIG. 6c is a top view of FIG. 6 a;
FIG. 7 is a schematic view of a hermetically sealed optoelectronic module metallized optical fiber and metal adapter;
FIG. 8 is an exploded view of FIG. 7;
FIG. 9 is a schematic view of an airtight optoelectronic module socket and sidewall interface;
in the drawings: 1-metallized optical fiber, 2-metal adapter, 3-fixing plate, 4-V-shaped groove, 5-tube seat, 6-solder ring, 7-LTCC ceramic substrate, 8-kovar tube, 9-kovar welding frame, 10-glass cover plate and 11-optical fiber interface.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The following respectively describes a process for the airtight assembly of a single-channel photovoltaic module and a process for the airtight assembly of multiple-channel photovoltaic modules.
Referring to fig. 1, the method for hermetically assembling a single-channel photovoltaic module includes the following steps:
processing a plurality of V type grooves 4 that arrange in proper order on a piece of glass according to the optical fiber diameter, weld metal adapter to metallized optical fiber 1 on one end, the other end demetalization of metallized optical fiber 1 becomes bare fiber, arrange bare fiber in the V type groove in a word, metallized optical fiber 1 in every V type groove to cover a glass's fixed plate 3 above V type groove 4, through the distance of anchor clamps centre gripping adjustment V type groove and metal adapter according to the design requirement, fix optic fibre in the V type groove through the bonding agent.
And 2, grinding the end faces of the V-shaped groove and the optical fiber which are integrally coupled with the laser and the receiver to enable the included angle between the end faces and the horizontal plane to be 45 degrees. The reflecting film is plated on the end face of the optical fiber opposite to the light source or the detector, so that light is coupled into the optical fiber through a 45-degree reflecting surface, and the coupling efficiency of the module is improved.
And 3, enabling the optical fiber to penetrate through the optical fiber interface on the side wall of the tube seat from inside to outside or from outside to inside, arranging a Kovar tube 8 on the side wall of the tube seat 5, arranging a Kovar welding frame 9 on the tube seat 5, arranging one end of the V-shaped optical fiber 4 in the horizontal direction in the tube seat, sleeving a welding material ring 6 which is processed according to the designed size on the metal adapter 2, and tightly matching the stepped metal adapter 2 with the stepped optical fiber interface 11 on the side wall of the tube seat 5.
And step 4, fixing the V-shaped groove 4 on a fixture, fixing the fixture on a multi-shaft micro-displacement platform, and fixing the displacement platform and the tube seat 5 on the anti-vibration optical platform.
And 5, electrifying the VCSEL laser to work, coupling the light of the VCSEL laser into the optical fiber, coupling the tail end of the optical fiber into a laser power meter through a clamp, and carrying out real-time power measurement on the light led out by the optical fiber by using the laser power meter.
And 7, after the alignment is successful, fixing the V-shaped groove on the LTCC ceramic substrate, and enabling the optical fiber interface 11 on the side wall of the metal adapter 2 and the tube seat 5 to realize air-tight connection through welding.
And 8, welding the cover plate of the photoelectric module to the tube seat 5 through parallel seam welding or laser welding to realize the air-tight packaging of the photoelectric module.
Referring to fig. 5, the air-tight assembling method of the multi-path photoelectric transceiving integrated module comprises the following steps:
the technological method for the air-tight assembly of the multi-path photoelectric transceiving integrated module is shown in figure 5,
Processing a glass V-shaped groove according to the distance between the VCSEL chip array and the PD chip array and the fiber diameter of the metallized optical fiber 1, welding a metal adapter to the metallized optical fiber 1, demetallizing the other end of the metallized optical fiber 1 to form a bare optical fiber, clamping the bare optical fiber in the V-shaped groove, covering a glass fixing plate 3 above the V-shaped groove, adjusting the distance from the V-shaped groove to the metal adapter according to design requirements, and fixing the optical fiber in the V-shaped groove 4 through an adhesive.
And 2, grinding the end face of the V-shaped groove 4 and the metalized optical fiber 1 to enable the end face to form an angle of 45 degrees. The end face of the metallized optical fiber 1 is coated with a reflecting film, so that light is coupled into the optical fiber through a 45-degree reflecting surface.
And 3, the optical fiber array penetrates through the optical fiber interface on the side wall of the tube seat from inside to outside, one end of the V-shaped groove is arranged in the tube seat, the metal adapter 2 is sleeved with the welding material ring 6 which is processed according to the design size, and the step-shaped metal adapter 2 is tightly matched with the step-shaped optical fiber interface 11 fixed on the side wall of the tube seat.
And step 4, fixing the V-shaped groove 4 through a fixture, fixing the fixture on a multi-shaft micro-displacement platform, and fixing the displacement platform and the tube seat on the anti-vibration optical platform.
And 5, electrifying the VCSEL to work, coupling light into the optical fibers, respectively coupling at least two optical fibers on the outermost side of the optical fiber array into a laser power meter through a clamp in the optical fiber array corresponding to the VCSEL, and carrying out real-time power measurement on light guided out by the optical fibers by the laser power meter.
And 6, adjusting the position of the V-shaped groove 4 through the multi-axis micro-displacement platform, observing a real-time measured value of the laser power meter, and considering the ratio of the measured value to the optical power output by the VCSEL as the coupling efficiency, wherein when the coupling efficiency of the two optical fibers is more than 50%, the alignment is initially successful. If the coupling efficiency is always less than 50%, the product is regarded as waste, and new raw materials are selected from the step 1 for reassembly.
For the optical fiber corresponding to the PD, a laser is coupled to the optical fiber, and the feedback signal of the PD is monitored and the displacement stage is finely adjusted.
When the optical fiber coupling efficiency corresponding to the VCSEL is more than 50% and the feedback signals of all PDs are normal, the alignment is finally successful.
And 7, after the alignment is successful, fixing the V-shaped groove on the substrate, and welding to realize the air-tight connection of the metal adapter and the optical fiber interface on the side wall of the tube seat.
And 8, welding the cover plate of the photoelectric module to the tube seat through parallel seam welding or laser welding to realize the air-tight packaging of the photoelectric module.
The process steps of the airtight assembly of the single-path or multi-path photoelectric transceiving integrated module are as follows:
and the metalized optical fiber is used as a signal transmission medium, so that the optical fiber and the tube seat can be conveniently welded, and the photoelectric module can be conveniently hermetically packaged. The metal coating layer of the optical fiber can be nickel, gold and other metals and a multi-layer combination thereof, and the thickness of the metal coating layer is more than or equal to 20 micrometers. The fiber metallization process may be evaporation, sputtering, chemical vapor deposition, electroplating, electroless plating, molecular beam epitaxy, etc.
The metal adapter and the tube seat side wall optical fiber interface are concave-convex on the structure, wherein the metal adapter is in a convex structure, and the tube seat side wall interface is in a concave structure, so that the metal adapter and the tube seat side wall optical fiber interface are conveniently matched and hermetically connected with an optical fiber and the tube seat. When the metal adapter is matched with the side wall interface of the tube seat, the optical fiber pigtail penetrates through the side wall interface of the tube seat from inside to outside or from outside to inside, and the metal adapter is matched with the interface of the tube seat on the inner side of the side wall of the tube seat. The module tube seat can be a metal tube seat, a ceramic tube seat or a metal-ceramic tube seat. The metal adapter can be an adapter corresponding to each optical fiber, or an integral adapter corresponding to multiple optical fibers. The related interfaces on the side wall of the tube seat can be an interface corresponding to each optical fiber respectively, or an interface corresponding to a plurality of optical fibers integrally.
Hermetic bonding of metallized fiber to metal adapter using solder having a melting point greater than 250 deg.C, such as AuSn20The melting point of the solder is 280 ℃, the welding temperature is 310 ℃, and the time is 20 s. And (3) carrying out air-tight connection on the metal adapter and the tube seat interface by using a welding flux with the melting point not more than 170 ℃, wherein the melting point is 170 ℃, the welding temperature is 200 ℃, and the time is 20 s. The melting point and the processing sequence of the solder are fully considered when the solder is selected, and the process temperature gradient of the whole module processing is ensured to be from high to low.
The multi-path optical fiber high-precision wire arranging and positioning process uses cuboid quartz glass to etch a V-shaped groove, the groove etching precision is less than or equal to 0.5 micron, low-temperature curing polyimide is used as an optical fiber fixing adhesive, the curing temperature of the adhesive is 160 ℃, the adhesive can resist the high temperature of 334 ℃ and is greater than the melting point of a welding flux used when a metal adapter and a tube seat are welded, and therefore the process sequence of alignment and air-tight packaging is guaranteed. And the optical fiber port and the V-shaped groove which are opposite to the module light source and the detector are ground as a whole, and the integral angle of the optical fiber and the V-shaped groove is 45-60 degrees so as to ensure the coupling efficiency of the module light source and the optical fiber.
The multi-channel optical fiber high-precision alignment fixing process uses a multi-shaft micro-displacement platform to be matched with a tool fixture to align optical fibers, a module light source and a detector, uses low-temperature curing polyimide as a fixing adhesive to integrally fix the aligned optical fibers and a V-shaped groove on a ceramic substrate, has the curing temperature of 160 ℃, can resist the high temperature of 334 ℃, is higher than the melting point of a welding flux used when a metal adapter and a tube seat are welded, and ensures the process sequence of alignment first and air-tight packaging later.
And designing a process temperature gradient and an assembly sequence to ensure the air-tight assembly of the photoelectric module. The specific process temperature gradient and assembly sequence are as follows:
the light source and the receiver are adhered to the AlN heat dissipation plate, insulating glue is used as an adhesive, and the curing temperature is 150 ℃ and the temperature is 300 ℃;
the AlN heat dissipation plate is adhered to the module substrate, insulating glue is used as an adhesive, and the curing temperature is 150 ℃ and the temperature is 300 ℃;
the module substrate is adhered to the tube seat, heat-conducting glue is used as an adhesive, and the module substrate is cured at the temperature of 150 ℃ and resists the temperature of 210 ℃;
the metal adapter is soldered to the metallized optical fiber, and the solder can be AuSn20Alloy and other welding materials with the melting point of more than 250 ℃, the welding temperature is 310 ℃, the welding time is 20s, and the welding mode can be reflow welding, gas shielded welding and other welding processes;
fixing the optical fiber in a V-shaped groove, using low-temperature cured polyimide as an adhesive, wherein the curing temperature is 160 ℃, and the temperature is 334 ℃;
the V-shaped groove is fixed on the module substrate, low-temperature curing polyimide is used as an adhesive, and the curing temperature is 160 ℃ and the temperature is 334 ℃;
the metal adapter and the optical fiber interface on the side wall of the tube seat are welded together to realize air-tight connection, the used welding materials can be indium alloy and other welding materials with the melting point of less than 170 ℃, the welding temperature is 200 ℃, the welding time is 20s, and the welding mode can be reflow welding, gas shielded welding and other welding processes.
The invention realizes the airtight packaging of the photoelectric module by using the metalized optical fiber as the conducting optical fiber, performing structural design on the tube seat interface and the metal adapter, using a welding process instead of a glue sealing process, and designing a reasonable process temperature gradient and an assembly sequence. The invention relates to a process method for the airtight assembly of a photoelectric module, which can ensure that a product meets the requirements of airtightness and reliability of aerospace devices and meets the harsh working environments of moisture resistance, vibration resistance, mechanical impact resistance, thermal cycle resistance and the like.
The above description is provided for further details of the present invention with reference to specific preferred embodiments, and it should not be considered that the present invention is limited to the specific preferred embodiments, and that several methods for hermetically packaging photovoltaic modules can be devised without departing from the spirit of the present invention, and all of the methods should be considered as falling within the scope of the patent protection defined by the claims of the present invention.
Claims (7)
1. A method for hermetically assembling a photovoltaic module, comprising the steps of:
step 1, preparing an AlN heat dissipation plate, a tube seat (5) and a metal adapter (2), adhering a VCSEL laser and a receiver to the AlN heat dissipation plate, adhering the AlN heat dissipation plate to an LTCC ceramic substrate, and adhering the LTCC ceramic substrate to the tube seat (5);
step 2, welding the metal adapter (2) to one end of the metallized optical fiber (1), and demetallizing the other end of the metallized optical fiber (1) into a bare optical fiber; manufacturing a V-shaped groove (4), putting bare optical fibers into the V-shaped groove (4), covering a fixing plate (3) on the V-shaped groove (4), adjusting the distance between the V-shaped groove (4) and the metal adapter (2) to a designed value, and fixing the optical fibers in the V-shaped groove (4);
step 3, enabling the metallized optical fiber (1) to penetrate through an optical fiber interface (11) on the side wall of the tube seat (5);
step 4, placing the V-shaped groove (4) and the tube seat (5) on an optical platform;
step 5, energizing the VCSEL laser, coupling the light of the VCSEL laser into the metallized optical fiber (1), coupling the tail end of the optical fiber into a laser power meter through a clamp, and then carrying out real-time power measurement on the light led out from the metallized optical fiber (1) by using laser power;
step 6, adjusting the position of the V-shaped groove (4), observing a real-time measured value of a laser power meter, determining the ratio of the measured value to the optical power output by the VCSEL laser as the coupling efficiency, when the coupling efficiency is more than 50%, successfully aligning, performing step 7, and if the alignment cannot be successfully aligned all the time, performing step 1 and restarting the assembly;
step 7, fixing the V-shaped groove (4) on the LTCC ceramic substrate, and welding the metal adapter (2) and the optical fiber interface (11) on the side wall of the tube seat;
step 8, welding the cover plate of the photoelectric module to the tube seat (5);
in the step 1, adhering the VCSEL laser and the receiver to an AlN heat dissipation plate, adhering the AlN heat dissipation plate to a module substrate, and using an insulating glue as an adhesive, wherein the curing temperature of the insulating glue is 150 ℃ and the temperature of the insulating glue is 300 ℃;
the LTCC ceramic substrate is adhered to the tube seat (5), heat-conducting glue is used as an adhesive, the curing temperature of the heat-conducting glue is 150 ℃, and the temperature resistance is 210 ℃;
the metal adapter (2) is welded on the metallized optical fiber (1), the melting point of the used welding flux is more than 250 ℃, the welding temperature is 310 ℃, and the welding time is 20 s;
the metallized optical fiber (1) and the V-shaped groove (4) and the LTCC ceramic substrate are fixed by adopting low-temperature cured polyimide as an adhesive, wherein the curing temperature of the low-temperature cured polyimide is 160 ℃, and the temperature resistance is 334 ℃;
when the metal adapter (2) and the optical fiber interface (11) are welded, the used welding flux is the welding flux with the melting point less than 170 ℃, the welding temperature is 200 ℃, and the welding time is 20 s.
2. A hermetic assembly method of an optoelectronic module according to claim 1, characterized in that before step 3, the V-grooves (4) coupled to the VCSEL lasers or receivers and the end faces of the metallized fibers (1) are ground so that the angle between the end faces of the V-grooves (4) and the metallized fibers (1) and the horizontal plane is 45 ° to 60 °.
3. A hermetic assembly method of an optoelectronic module according to claim 2, characterized in that after grinding the V-grooves (4) opposite to the VCSEL lasers and receivers and the end face of the metallized fiber (1), a reflective film is coated on the end face of the metallized fiber (1).
4. The hermetic assembling method for the optoelectronic module according to claim 1, wherein in step 1, the metal adapter (2) is a stepped shaft, the optical fiber interface (11) is provided with a plurality of stepped holes (8) adapted to the metal adapter (2), and when the metal adapter (2) extends into the stepped holes (8), the metal adapter (2) and the stepped holes (8) are in clearance fit.
5. The hermetic assembly method of an optoelectronic module according to claim 1, wherein the coating layer of the metallized optical fiber (1) is gold or nickel.
6. The hermetic assembly method for photovoltaic modules according to claim 1, wherein in step 6, the position of the V-groove (4) is adjusted by using a multi-axis micro-displacement platform.
7. A method for the gastight assembly of a photovoltaic module according to claim 1, wherein in step 8 the cover plate of the photovoltaic module is welded to the stem (5) by laser seam welding or parallel seam welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811271310.1A CN109459827B (en) | 2018-10-29 | 2018-10-29 | Photoelectric module air tightness assembling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811271310.1A CN109459827B (en) | 2018-10-29 | 2018-10-29 | Photoelectric module air tightness assembling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109459827A CN109459827A (en) | 2019-03-12 |
| CN109459827B true CN109459827B (en) | 2021-02-02 |
Family
ID=65608757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811271310.1A Active CN109459827B (en) | 2018-10-29 | 2018-10-29 | Photoelectric module air tightness assembling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109459827B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110333583A (en) * | 2019-07-26 | 2019-10-15 | 西安微电子技术研究所 | A kind of optical-electric module tail optical fiber air-tight packaging structure and packaging method |
| CN114035276B (en) * | 2021-11-28 | 2022-11-15 | 湖南玖芯光电科技有限公司 | Automatic assembling mechanism for optical fiber array |
| CN115291340A (en) * | 2022-07-13 | 2022-11-04 | 广州奥鑫通讯设备有限公司 | Optical device for optical fiber gyroscope and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214774A (en) * | 2010-04-01 | 2011-10-12 | Lg伊诺特有限公司 | Light emitting device package and light unit having the same |
| CN103424813A (en) * | 2012-05-21 | 2013-12-04 | 鸿富锦精密工业（深圳）有限公司 | Light adaptor and light signal transmission device |
| CN103427333A (en) * | 2012-05-23 | 2013-12-04 | 光环科技股份有限公司 | Laser diode array crystal grain structure and packaging device thereof |
| CN104676324A (en) * | 2011-03-14 | 2015-06-03 | 英特明光能股份有限公司 | Light emitting device |
| CN104969368A (en) * | 2013-01-31 | 2015-10-07 | 克利公司 | Substrate-based surface mount device (SMD) light emitting assembly and method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103018854A (en) * | 2012-12-19 | 2013-04-03 | 武汉电信器件有限公司 | Accurate alignment fixing structure and alignment fixing method of optic fiber of photoelectron device |
| CN103018859A (en) * | 2013-01-08 | 2013-04-03 | 中国电子科技集团公司第四十四研究所 | Precise positioning and fixing structure for optical fiber coupling end |
| CN106654846A (en) * | 2015-11-04 | 2017-05-10 | 江苏飞格光电有限公司 | Semiconductor laser device packaging method |
| CN105281197A (en) * | 2015-11-11 | 2016-01-27 | 中国电子科技集团公司第四十四研究所 | Semiconductor light source packaging structure with high shock-resistant performance |
| CN205670204U (en) * | 2016-05-24 | 2016-11-02 | 深圳市中兴新地技术股份有限公司 | A kind of 45° angle fiber array for coupling with VCSEL chip |
| CN207946568U (en) * | 2018-03-16 | 2018-10-09 | 广东瑞谷光网通信股份有限公司 | A kind of light transmit-receive integrated component for supporting CSFP modules |
-
2018
- 2018-10-29 CN CN201811271310.1A patent/CN109459827B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214774A (en) * | 2010-04-01 | 2011-10-12 | Lg伊诺特有限公司 | Light emitting device package and light unit having the same |
| CN104676324A (en) * | 2011-03-14 | 2015-06-03 | 英特明光能股份有限公司 | Light emitting device |
| CN103424813A (en) * | 2012-05-21 | 2013-12-04 | 鸿富锦精密工业（深圳）有限公司 | Light adaptor and light signal transmission device |
| CN103427333A (en) * | 2012-05-23 | 2013-12-04 | 光环科技股份有限公司 | Laser diode array crystal grain structure and packaging device thereof |
| CN104969368A (en) * | 2013-01-31 | 2015-10-07 | 克利公司 | Substrate-based surface mount device (SMD) light emitting assembly and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109459827A (en) | 2019-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109459827B (en) | Photoelectric module air tightness assembling method | |
| US6907151B2 (en) | Optical coupling for a flip chip optoelectronic assembly | |
| US4222629A (en) | Fiber optic connector assembly | |
| EP0358592B1 (en) | Metallic bond for mounting of optical fibers to integrated optical chips | |
| US4591711A (en) | Transmitting and receiving device for optoelectronic communication systems, and method of making the device | |
| WO1994023318A1 (en) | Optical fiber array | |
| JP2005507503A (en) | Alignment hole in transparent substrate | |
| JP2514342B2 (en) | Optical fiber termination structure and manufacturing method thereof | |
| US20140099059A1 (en) | Compact optical package made with planar structures | |
| US9429496B2 (en) | Optical time domain reflectometer in a small form factor package | |
| CN110596829B (en) | Optical module with OTDR function | |
| CN211905787U (en) | Single-fiber bidirectional optical device structure | |
| CN113589454B (en) | Optical module hard connection implementation method and optical module | |
| CN217085337U (en) | Optical module | |
| CN112379490A (en) | Optical module | |
| JP2011099930A (en) | Optical transmitter-receiver | |
| CN111061019A (en) | Optical module | |
| US20070248301A1 (en) | Surface mount optical coupler, method of mounting the same, and method of producing the same | |
| Ambrosy et al. | Silicon motherboards for multichannel optical modules | |
| CN112987204B (en) | Adjustable passively-couplable multichannel optical transceiver component and airtight packaging method | |
| EP2753964B1 (en) | Hermetic small form factor optical device packaging for plastic optical fiber networks | |
| CN110828606A (en) | A kind of ceramic photoelectric coupler and its manufacturing method | |
| US9413464B2 (en) | Optoelectronic assembly for signal conversion | |
| US20040161208A1 (en) | Low cost optical module | |
| CN114245633A (en) | Airtight packaging structure of multichannel digital optical module and ceramic circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |