CN109449186B - OLED display substrate mother board, manufacturing method thereof and OLED display device - Google Patents
OLED display substrate mother board, manufacturing method thereof and OLED display device Download PDFInfo
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- CN109449186B CN109449186B CN201811303031.9A CN201811303031A CN109449186B CN 109449186 B CN109449186 B CN 109449186B CN 201811303031 A CN201811303031 A CN 201811303031A CN 109449186 B CN109449186 B CN 109449186B
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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Abstract
本发明提供一种OLED显示基板母板及其制作方法、和OLED显示装置，所述OLED显示基板母板包括多个阵列排布的显示区域，所述方法包括：在所述显示区域内形成阳极之前，在相邻显示区域之间形成阻挡结构。本发明提供的OLED显示基板母板及其制作方法、和OLED显示装置，能够解决银颗粒对其他显示基板造成不良影响，降低OLED显示装置生产良率的问题。
The present invention provides an OLED display substrate mother board, a manufacturing method thereof, and an OLED display device. The OLED display substrate mother board includes a plurality of display areas arranged in an array, and the method includes: forming an anode in the display area Previously, barrier structures were formed between adjacent display areas. The OLED display substrate mother board and the manufacturing method thereof, and the OLED display device provided by the present invention can solve the problem that silver particles cause adverse effects on other display substrates and reduce the production yield of the OLED display device.
Description
Technical Field
The invention relates to the technical field of display, in particular to an OLED display substrate motherboard, a manufacturing method thereof and an OLED display device.
Background
Since an Organic Light-emitting Diode (OLED for short) has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and extremely high response speed, the OLED technology is gradually popularized in the display fields of mobile phone screens, television display screens, medical monitoring instruments, and the like, and has gained wide attention.
In the prior art, silver particles are generated in the anode etching process of manufacturing the flexible circuit board, and the silver particles are easily washed onto the adjacent OLED display substrate, so that the defects of liquid crystal boxes (cells) in other OLED display substrates are caused, and the production yield of the OLED display device is reduced.
Disclosure of Invention
The embodiment of the invention provides an OLED display substrate motherboard, a manufacturing method thereof and an OLED display device, and aims to solve the problem that silver particles in an anode etching process are washed to other OLED display substrates, so that the production yield of the OLED display device is reduced.
In order to solve the above technical problems, the present invention provides the following technical solutions:
in a first aspect, an embodiment of the present invention provides a method for manufacturing a motherboard of an OLED display substrate, where the motherboard of the OLED display substrate includes a plurality of display areas arranged in an array, and before an anode is formed in the display areas, a blocking structure is formed between adjacent display areas.
Further, the forming of the barrier structure between adjacent display regions includes:
and forming one layer of functional film layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas by a one-time composition process.
Further, the forming of the barrier structure between adjacent display regions includes:
and forming a flat layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas through a one-time composition process.
Further, the forming of the flat layer of the motherboard of the OLED display substrate and the barrier structure between adjacent display areas by a one-step patterning process includes:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention area corresponding to the display area and the blocking area and a photoresist removal area corresponding to other areas, wherein the blocking area is positioned between adjacent display areas;
after developing, the photoresist in the photoresist removing area is removed;
etching off the flat material layer in the photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
Further, the forming of the flat layer of the motherboard of the OLED display substrate by the one-step patterning process and the forming of the barrier structure between adjacent display regions includes:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention region, a first photoresist removal region corresponding to the blocking region and a second photoresist removal region corresponding to other regions, wherein the photoresist retention region comprises a first region corresponding to the display region and a second region corresponding to the extension region, and the extension region extends from the display region to other display regions and surrounds the blocking region;
after development, the photoresist in the first photoresist removing region and the second photoresist removing region is removed;
etching off the flat material layer of the first photoresist removing area and the second photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
Further, after forming the anode layer, the method further comprises:
and forming an organic layer covering the display area and the barrier structure so that the upper surface of the organic layer is a flat surface.
In a second aspect, an embodiment of the present invention further provides an OLED display substrate motherboard, where the OLED display substrate motherboard includes a plurality of display regions arranged in an array, and includes a flat layer on a substrate and located in the display regions, and a blocking structure located between adjacent display regions.
Further, the OLED display substrate motherboard also comprises a cutting area located between adjacent display areas, and the blocking structure is located in the cutting area.
In a third aspect, an embodiment of the present invention further provides an OLED display substrate, where the OLED display substrate is formed by cutting the above-mentioned OLED display substrate motherboard.
In a fourth aspect, embodiments of the present invention further provide an OLED display device, including the OLED display substrate described above.
According to the technical scheme provided by the invention, the barrier structure is formed between the adjacent display areas, so that the flushed silver particles can be prevented from entering the display areas of other display substrates in the anode etching process, and the problems that the silver particles cause adverse effects on other display substrates and the production yield of an OLED display device is reduced can be solved. Therefore, the technical scheme provided by the invention can avoid the adverse effect of the silver particles on other display substrates and ensure the production yield of the OLED display device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic diagram of a motherboard of an OLED display substrate in the prior art;
fig. 2 is a schematic diagram of a motherboard of an OLED display substrate according to an embodiment of the present invention;
fig. 3 is a schematic diagram of another OLED display substrate motherboard according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the motherboard of the OLED display substrate in the prior art, as shown in fig. 1, a plurality of display areas arranged in an array are relatively flat, so that silver particles generated in an anode etching process can enter other OLED display substrates without hindrance, and cause adverse effects on other OLED display substrates, resulting in a problem of reducing the yield of OLED display devices.
In order to solve the above problems, embodiments of the present invention provide an OLED display substrate motherboard, a manufacturing method thereof, and an OLED display device, which can prevent flushed silver particles from entering display areas of other display substrates during an anode etching process, so as to solve the problems that the silver particles cause adverse effects on other display substrates and the production yield of the OLED display device is reduced.
The embodiment of the invention provides a method for manufacturing a motherboard of an OLED display substrate, wherein the motherboard of the OLED display substrate comprises a plurality of display areas arranged in an array, and the method comprises the following steps:
before forming the anode in the display area, a barrier structure is formed between adjacent display areas.
In the embodiment, the blocking structure is formed between the adjacent display areas, so that the flushed silver particles can be blocked from entering the display areas of other display substrates in the anode etching process, the problem that the silver particles cause adverse effects on other display substrates and the production yield of the OLED display device is reduced can be solved. Therefore, the technical scheme provided by the invention can avoid the adverse effect of the silver particles on other display substrates and ensure the production yield of the OLED display device.
The OLED display substrate motherboard can be a flexible display substrate motherboard or a rigid display substrate motherboard. When the display substrate motherboard is a flexible display substrate motherboard, the substrate adopts a flexible substrate, such as a polyimide film; when the display substrate motherboard is a rigid display substrate motherboard, the substrate is a rigid substrate, such as a quartz substrate or a glass substrate.
The display area forms an anode in the subsequent manufacturing process of the OLED display substrate motherboard.
Before the anode is formed, the OLED display substrate motherboard comprises a substrate base plate and at least one layer structure positioned on the substrate base plate, and the blocking structure can be arranged on any layer structure of the at least one layer structure and has the effect of blocking silver particles from entering other OLED display substrates. The blocking structure can be a convex block (as shown in fig. 2), so that silver particles are blocked from entering other OLED display substrates, and the effect of avoiding adverse effects of the silver particles on other OLED display substrates is achieved; the blocking structure may also be a groove (as shown in fig. 3, where the invisible portion of the recess is indicated by a dotted line), so as to accommodate silver particles that would otherwise enter other OLED display substrates, and also achieve the effect of preventing the silver particles from causing adverse effects on other OLED display substrates.
When the barrier structure is a stopper, the stopper may be additionally formed on the layer structure by deposition or the like after the layer structure is formed on the substrate; the stopper may be formed by the same patterning process while the layer structure is formed, and is not limited herein.
Similarly, when the barrier structure is a groove, the groove may be additionally formed on the layer structure by etching or the like after the layer structure is formed on the substrate; the groove may be formed by the same patterning process while the layer structure is formed, and is not limited herein.
In some optional embodiments, the forming of the barrier structure between adjacent display regions includes:
and forming one layer of functional film layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas by a one-time composition process.
Wherein the functional film layer is formed on the substrate before the anode is formed. The functional film layer formed at the same time can be a film layer directly contacted with the anode, and the blocking structure can be directly used for blocking silver particles (the groove is used for accommodating the silver particles/the stopper is used for blocking the silver particles). In addition, the functional film layer formed at the same time may also be a film layer which is not in direct contact with the anode, and then the other functional film layers between the anode and the functional film layer are correspondingly changed in structure due to the blocking structure (a groove is covered and formed, the groove takes the other functional film layers as the groove bottom, a block is covered and formed, and the block takes the other functional film layers as the surface), and the effect of blocking silver particles from entering the other OLED display substrates can also be achieved.
A layer of functional film layer and the blocking structure are formed simultaneously through a one-time composition process, the manufacturing time for additionally manufacturing the blocking structure at each time can be saved, and the manufacturing efficiency of the OLED display substrate motherboard is improved.
Further, the forming of the barrier structure between adjacent display regions includes:
and forming a flat layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas through a one-time composition process.
Namely, the functional film layer formed simultaneously with the barrier structure in the one-step composition process is a flat layer.
Taking the blocking structure as an example, in an optional specific embodiment, the forming of the flat layer of the motherboard of the OLED display substrate and the blocking structure between adjacent display regions by a one-step patterning process includes:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention area corresponding to the display area and the blocking area and a photoresist removal area corresponding to other areas, wherein the blocking area is positioned between adjacent display areas;
after developing, the photoresist in the photoresist removing area is removed;
etching off the flat material layer in the photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
The photoresist and the flat material layer in the photoresist removing area are removed, and the photoresist and the flat material layer in the photoresist retaining area are retained, so that a raised blocking structure is formed between the originally flat adjacent display areas, the raised blocking structure can block silver particles generated in the subsequent anode etching process, other OLED display substrates are protected from adverse effects of the silver particles, and the production yield of the OLED display device is ensured.
Taking the blocking structure as a groove as an example, in another optional embodiment, the forming a flat layer of the motherboard of the OLED display substrate by a one-step patterning process and forming the blocking structure between adjacent display regions includes:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention region, a first photoresist removal region corresponding to the blocking region and a second photoresist removal region corresponding to other regions, wherein the photoresist retention region comprises a first region corresponding to the display region and a second region corresponding to the extension region, and the extension region extends from the display region to other display regions and surrounds the blocking region;
after development, the photoresist in the first photoresist removing region and the second photoresist removing region is removed;
etching off the flat material layer of the first photoresist removing area and the second photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
The photoresist and the flat material layer in the photoresist retention region are retained by removing the photoresist and the flat material layer in the first photoresist removal region and the second photoresist removal region, so that a concave blocking structure is formed on the originally flat extension region, and the concave blocking structure can accommodate silver particles which are generated in the subsequent anode etching process and can enter other OLED display substrates from the flat extension region, protect the other OLED display substrates from the adverse effect of the silver particles, and ensure the production yield of the OLED display device.
In other alternative embodiments, after forming the anode layer, the method further includes:
and forming an organic layer covering the display area and the barrier structure so that the upper surface of the organic layer is a flat surface.
Specifically, in the case that the barrier structure is a groove, a photoresist (PR glue) may be filled in the groove before the organic layer is covered, and then the organic layer is covered on the display region and the barrier structure, so that the upper surface of the organic layer is a flat surface.
When the blocking structure is a stopper, the stopper can be removed in advance by etching, cutting and the like, and then the organic layer is covered on the display area and the blocking structure, so that the upper surface of the organic layer is a flat surface.
The organic layer with the flat upper surface is formed on the display area and the blocking structure, so that the subsequent influence on the manufacture of the OLED display substrate motherboard can be avoided, and the manufacture yield of the OLED display substrate motherboard is ensured.
The embodiment of the invention also provides an OLED display substrate motherboard which comprises a plurality of display areas arranged in an array manner, a flat layer which is arranged on the substrate and is positioned in the display areas, and a blocking structure which is positioned between the adjacent display areas.
In this embodiment, the blocking structure located between the adjacent display areas can block the washed silver particles from entering the display areas of other display substrates in the anode etching process, so that the problem that the silver particles cause adverse effects on other display substrates and the production yield of the OLED display device is reduced can be solved. Therefore, the technical scheme provided by the invention can avoid the adverse effect of the silver particles on other display substrates and ensure the production yield of the OLED display device.
The OLED display substrate motherboard can be a flexible display substrate motherboard or a rigid display substrate motherboard. When the display substrate motherboard is a flexible display substrate motherboard, the substrate adopts a flexible substrate, such as a polyimide film; when the display substrate motherboard is a rigid display substrate motherboard, the substrate is a rigid substrate, such as a quartz substrate or a glass substrate.
The display area forms an anode in the subsequent manufacturing process of the OLED display substrate motherboard.
Before the anode is formed, the OLED display substrate motherboard comprises a substrate base plate and at least one layer structure positioned on the substrate base plate, and the blocking structure can be arranged on any layer structure of the at least one layer structure and has the effect of blocking silver particles from entering other OLED display substrates. The blocking structure can be a convex block (as shown in fig. 2), so that silver particles are blocked from entering other OLED display substrates, and the effect of avoiding adverse effects of the silver particles on other OLED display substrates is achieved; the blocking structure may also be a groove (as shown in fig. 3, where the invisible portion of the recess is indicated by a dotted line), so as to accommodate silver particles that would otherwise enter other OLED display substrates, and also achieve the effect of preventing the silver particles from causing adverse effects on other OLED display substrates.
When the barrier structure is a stopper, the stopper may be additionally formed on the layer structure by deposition or the like after the layer structure is formed on the substrate; the stopper may be formed by a single patterning process while the layer structure is formed, which is not limited herein.
Similarly, when the barrier structure is a groove, the groove may be additionally formed on the layer structure by etching or the like after the layer structure is formed on the substrate; the groove may be formed by a single patterning process while the layer structure is formed, which is not limited herein.
In addition, in the case of forming the barrier structure through a single patterning process, the barrier structure may be formed simultaneously with one of the functional film layers of the motherboard of the OLED display substrate, where the functional film layer is formed on the substrate before the anode is formed.
The functional film layer formed at the same time can be a film layer directly contacted with the anode, and the blocking structure can be directly used for blocking silver particles (the groove is used for accommodating the silver particles/the stopper is used for blocking the silver particles). In addition, the functional film layer formed at the same time may also be a film layer which is not in direct contact with the anode, and then the other functional film layers between the anode and the functional film layer are correspondingly changed in structure due to the blocking structure (a groove is covered and formed, the groove takes the other functional film layers as the groove bottom, a block is covered and formed, and the block takes the other functional film layers as the surface), and the effect of blocking silver particles from entering the other OLED display substrates can also be achieved.
Further, the OLED display substrate motherboard also comprises a cutting area located between adjacent display areas, and the blocking structure is located in the cutting area.
The OLED display substrate is obtained by cutting the cutting area of the OLED display substrate motherboard by laser, the blocking structure is designed in the cutting area, the planarization treatment on the blocking structure is not required to be added in the manufacturing process of the OLED display substrate motherboard in order to avoid the influence of the blocking structure on the OLED display substrate, the blocking structure can be removed directly through the laser cutting area subsequently, and the manufacturing time of the OLED display substrate motherboard is saved.
The embodiment of the invention also provides an OLED display substrate which is formed by cutting the motherboard of the OLED display substrate.
The embodiment of the invention also provides an OLED display device which comprises the OLED display substrate. The OLED display device may be: the display device comprises a television, a display, a digital photo frame, a mobile phone, a tablet personal computer, a navigator and other products or components with display functions, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A method for manufacturing a motherboard of an OLED display substrate, the motherboard of the OLED display substrate comprises a plurality of display areas arranged in an array, and the method comprises the following steps:
before forming anodes in the display areas, forming a barrier structure between adjacent display areas, wherein the barrier structure is used for blocking flushed silver particles from entering the display areas of other display substrates in the anode etching process;
after forming the anode layer, the method further comprises:
forming an organic layer covering the display area and the barrier structure.
2. The method of claim 1, wherein forming a barrier between adjacent display regions comprises:
and forming one layer of functional film layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas by a one-time composition process.
3. The method of claim 2, wherein forming a barrier between adjacent display regions comprises:
and forming a flat layer of the OLED display substrate motherboard and a blocking structure positioned between adjacent display areas through a one-time composition process.
4. The method of claim 3, wherein the forming of the flat layer of the OLED display substrate motherboard and the barrier structure between adjacent display regions by a one-time patterning process comprises:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention area corresponding to the display area and the blocking area and a photoresist removal area corresponding to other areas, wherein the blocking area is positioned between adjacent display areas;
after developing, the photoresist in the photoresist removing area is removed;
etching off the flat material layer in the photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
5. The method of claim 3, wherein the forming a flat layer of the OLED display substrate motherboard and forming barrier structures between adjacent display regions by a one-time patterning process comprises:
forming a flat material layer, and coating photoresist on the flat material layer;
exposing the photoresist by using a mask plate to form a photoresist retention region, a first photoresist removal region corresponding to the blocking region and a second photoresist removal region corresponding to other regions, wherein the photoresist retention region comprises a first region corresponding to the display region and a second region corresponding to the extension region, and the extension region extends from the display region to other display regions and surrounds the blocking region;
after development, the photoresist in the first photoresist removing region and the second photoresist removing region is removed;
etching off the flat material layer of the first photoresist removing area and the second photoresist removing area;
and forming a flat layer in the display area, and forming a barrier structure in the barrier area.
6. The OLED display substrate motherboard comprises a plurality of display areas arranged in an array mode, and is characterized by comprising a flat layer, a blocking structure and an organic layer, wherein the flat layer is arranged on a substrate and positioned in the display areas, the blocking structure is positioned between the adjacent display areas, and the organic layer covers the display areas and the blocking structure.
7. The OLED display substrate motherboard of claim 6, further comprising a cut region between adjacent display regions, wherein the blocking structure is located in the cut region.
8. An OLED display substrate, characterized in that the OLED display substrate is cut from the mother substrate of the OLED display substrate as claimed in claim 6 or 7.
9. An OLED display device comprising the OLED display substrate of claim 8.
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| CN201811303031.9A CN109449186B (en) | 2018-11-02 | 2018-11-02 | OLED display substrate mother board, manufacturing method thereof and OLED display device |
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| CN110164953B (en) * | 2019-07-04 | 2022-06-10 | 京东方科技集团股份有限公司 | Display substrate mother board and preparation method thereof, display panel mother board and substrate preparation method |
| CN110796949B (en) * | 2019-11-08 | 2021-11-30 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof, mother board, display panel and display device |
| CN112466918B (en) * | 2020-11-24 | 2024-02-02 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
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|---|---|---|---|---|
| CN104658973A (en) * | 2015-02-28 | 2015-05-27 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method of array substrate and display device |
| CN104733474A (en) * | 2015-03-20 | 2015-06-24 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method and display device thereof |
| CN106409875A (en) * | 2016-11-11 | 2017-02-15 | 上海天马微电子有限公司 | Display panel, display panel mother board and manufacturing method thereof |
| CN108258147A (en) * | 2018-01-17 | 2018-07-06 | 京东方科技集团股份有限公司 | Oled substrate and its packaging method, display device |
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| CN102629585B (en) * | 2011-11-17 | 2014-07-23 | 京东方科技集团股份有限公司 | Display device, thin film transistor, array substrate and manufacturing method thereof |
| US20130146875A1 (en) * | 2011-12-13 | 2013-06-13 | Universal Display Corporation | Split electrode for organic devices |
| CN104269494B (en) * | 2014-09-15 | 2017-05-03 | 京东方科技集团股份有限公司 | Organic electroluminescent device, its manufacturing method, and display device |
| KR102430819B1 (en) * | 2015-08-19 | 2022-08-10 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method for manufacturing the same |
| KR102553910B1 (en) * | 2016-08-31 | 2023-07-07 | 엘지디스플레이 주식회사 | Display device and testing method thereof |
| KR102632615B1 (en) * | 2016-12-05 | 2024-02-02 | 삼성디스플레이 주식회사 | Display device |
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| CN104658973A (en) * | 2015-02-28 | 2015-05-27 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method of array substrate and display device |
| CN104733474A (en) * | 2015-03-20 | 2015-06-24 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method and display device thereof |
| CN106409875A (en) * | 2016-11-11 | 2017-02-15 | 上海天马微电子有限公司 | Display panel, display panel mother board and manufacturing method thereof |
| CN108258147A (en) * | 2018-01-17 | 2018-07-06 | 京东方科技集团股份有限公司 | Oled substrate and its packaging method, display device |
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