CN109449096B - Method for identifying and detecting wafer chip - Google Patents
Method for identifying and detecting wafer chip Download PDFInfo
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- CN109449096B CN109449096B CN201811325439.6A CN201811325439A CN109449096B CN 109449096 B CN109449096 B CN 109449096B CN 201811325439 A CN201811325439 A CN 201811325439A CN 109449096 B CN109449096 B CN 109449096B
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- 238000001514 detection method Methods 0.000 claims abstract description 38
- 230000005856 abnormality Effects 0.000 claims abstract description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 32
- 238000007689 inspection Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The invention discloses a method for identifying and detecting wafer chips, which comprises the following steps: identifying the wafer, namely scanning the ID of the wafer, identifying the type of the wafer, and loading a corresponding setting level and a wafer Map; a detection step, dividing each kind of wafer into m × n areas, shooting the m × n areas in sequence, identifying a detection chip in each area, comparing with a Map, and detecting whether the chip exists at the position where the chip should exist; if the chip exists, the chip is normal; if the chip does not exist, detecting whether the position is a white pinhole, and if the position is not the white pinhole, indicating that the position is normal; if a white pinhole exists, the abnormality is shown; repeating the detection steps of the regions until the chips of all the regions are detected; and a feedback step, integrating the detection results of the m-n areas into an actual Map, and feeding back the results to the server. The invention can improve the recognition and detection rate of the wafer chip, improve the production efficiency and accurately check whether the abnormal condition exists in the process of taking the chip.
Description
Technical Field
The invention relates to the field of image recognition, in particular to a method for recognizing and detecting wafer chips for industry.
Background
The chips on one wafer are small in size and huge in quantity, and a visual system and an image recognition technology cannot be used for quality inspection. In the process of generating the wafer, one process is to carry out quality detection on the chip on the wafer, generate a Map according to the position of the chip, and in the next process, take away all qualified chips according to the Map and leave a white trace on a wafer soft film. After that, it is necessary to check the wafer that has been taken to verify whether there is an abnormal situation in the previous taking process. Since the wafer is a flexible film and is strained during the inspection process to deform, it is difficult to accurately position the chip according to the Map.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide an industrial wafer chip identifying and detecting method which can improve the wafer chip identifying and detecting rate, improve the production efficiency and accurately check whether abnormal conditions exist in the process of taking the wafer chip.
In order to solve the above technical problem, the present invention provides a method for identifying and detecting a die chip, comprising the following steps: identifying the wafer, namely scanning the ID of the wafer, identifying the type of the wafer, loading a corresponding setting gear and a wafer Map, and starting a camera to shoot; if the setting file exists, the shooting positioning chip carries out position calibration; if no setting file exists, manually positioning and calibrating according to the real-time image, and creating the setting file; a detection step, dividing each kind of wafer into m × n areas, shooting the m × n areas in sequence, identifying a detection chip in each area, comparing with a Map, and detecting whether the chip exists at the position where the chip should exist; if the chip exists, the chip is normal; if the chip does not exist, detecting whether the position is a white pinhole, and if the position is not the white pinhole, indicating that the position is normal; if a white pinhole exists, the abnormality is shown; when detecting the next area of the wafer, repeating the detection steps until all the chips in the m x n areas are detected; and a feedback step, integrating the detection results of the m-n areas into an actual Map, and feeding back the results to the server.
The method for identifying and detecting the wafer chip has the advantages that the scheme is designed by utilizing the characteristic that white traces can be left on the soft film at the bottom of the wafer when the chip is taken, the scheme is used for detecting whether unqualified chips are all reserved on the soft film, the method can automatically detect the chip and the white pinhole traces and check by comparing a Map, can be compatible with a plurality of mainstream brand cameras, can complete a series of work of measurement, detection, positioning and the like, improves the identification and detection rate of the wafer chip and the production efficiency, and can accurately check whether abnormal conditions exist in the process of taking the chip by the method.
Preferably, the creating a profile step includes: the software will detect the new type of die; converting the pixel size into an actual size by using a calibration module, and manually adjusting the position of a machine table once to enable the motion axis of the machine table to be parallel to the X axis of the image; adjusting the machine table to a first positioning chip, and using a straightening calibration module to carry out first straightening calibration; recording the position data of the positioning chip, and creating a positioning chip template; adjusting the machine table to a second positioning chip, and using a straightening calibration module to perform second straightening calibration; measuring X, Y axial direction spacing distance between chips by using a chip spacing measuring module, recording data, and creating a chip template; adjusting the machine to a first detection position, recording the row and column number of the chip in the detection area, and distributing the detection area according to the row and column number and the total row number of the detection area; the machine and the software generate a setting file according to the recorded data and the template information.
Preferably, the straightening calibration step comprises: the machine station walks to the first positioning chip according to the recorded coordinates; the software detects the positioning chip, calculates the coordinate and deflection angle and then sends the coordinate and deflection angle to the machine table; the machine platform adjusts the rotating shaft according to the data; the software detects the first positioning chip again and calculates the position data after straightening; the machine station walks to a second positioning chip according to the recorded coordinates; the software detects the positioning chip, calculates the coordinate and deflection angle and then sends the coordinate and deflection angle to the machine table; the machine station performs secondary straightening according to the coordinate information of the two positioning chips; the machine returns to the position of the first positioning chip; detecting and positioning the chip by software, calculating coordinate data and sending the coordinate data to the machine table; the machine station compares the current coordinate with the coordinate in the setting file; after the coordinate offset is calculated, the machine adjusts the position to make the position of the first positioning chip consistent with the set gear; and returning to the first detection position after the straightening is finished.
Drawings
FIG. 1 is a general flow chart of the method of identifying and inspecting die chips in accordance with the present invention;
FIG. 2 is a flowchart of the step of creating a profile in the present invention;
FIG. 3 is a flow chart of the position calibration procedure of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Referring to fig. 1-3, a method for identifying and inspecting die chips includes the steps of:
and identifying the wafer, namely scanning the ID (such as a two-dimensional code) of the wafer to be tested by using a code scanner after the machine starts to work, so as to identify the type of the wafer. After obtaining the wafer type information, loading a corresponding setting file and a Map generated in the previous process, and starting a camera to shoot; if the setting file exists, the shooting positioning chip carries out position calibration; if no setting gear exists, manual operation is needed, the positioning block is positioned according to a real-time image acquired by the camera, position calibration is performed manually, a detection template of the chip and the positioning block is generated, the spacing distance between the chips is detected and calculated, the obtained results are stored as the setting gear applicable to the type of wafer, data are sent to a machine table, and the setting gear is created to start the subsequent shooting detection work. Different types of wafers have different sizes, and the camera starts to acquire images according to the correspondingly set area. The objects to be identified on each image are: positioning block, chip, white trace.
A detection step, dividing each kind of wafer into m × n areas, shooting the m × n areas in sequence, identifying a detection chip in each area, comparing with a Map, wherein different shooting areas correspond to different parts of the Map, and detecting whether the chip exists at the position where the chip should exist; if the chip exists, the chip is normal; if the chip does not exist, detecting whether the position is a white pinhole, and if the position is not the white pinhole, indicating that the position is normal; if the white pinhole exists, the unqualified chip corresponding to the white pinhole is taken away, and the position is abnormal; when detecting the next area of the wafer, repeating the detection steps until all the chips in the m x n areas are detected;
and a feedback step, integrating the detection results of the m × n areas into an actual Map after the m × n areas of the wafer are detected, and feeding back the results to the server.
Wherein the step of creating the profile comprises:
the software detects a new type of wafer, sends row and column information obtained by reading the corresponding Map to the machine table, opens a real-time image of the software, manually adjusts a rotating shaft of the equipment, and performs preliminary straightening operation;
converting the pixel size into an actual size by using a calibration module, and manually adjusting the position of a machine table once to enable the motion axis of the machine table to be parallel to the X axis of the image;
manually adjusting an xy motion axis of a machine table, adjusting the machine table to a first positioning chip, enabling the first positioning chip in a real-time image to be in the center of the image, entering a straightening calibration module to determine the first positioning chip as the center, sending the position information of the chip to the machine table by software, adjusting a rotating shaft by the machine table according to angle information, performing first straightening calibration by using a straightening calibration module, recording the current machine table coordinate, establishing a template of the positioning chip after the position is adjusted, then detecting the positioning chip again and sending data;
manually adjusting the x axis of the machine table, adjusting the machine table to the position of the last positioning chip (namely, the second positioning chip) in the same row, detecting and calculating coordinate angle data, and performing secondary straightening calibration by using a straightening calibration module; and the machine moves to the first positioning chip, the software detects again and sends the position information of the first chip to the machine, and the machine records the position information of the chip.
After straightening, adjusting the visual field to a proper position, measuring X, Y axial direction spacing distance between chips by using a chip spacing measuring module, recording data, sending distance information to a machine table, and manually creating a chip template;
manually adjusting the xy motion axis of the machine table, adjusting the machine table to a first detection position, recording the row number and the column number of the chip in the detection area, distributing the detection area according to the row number and the column number of the detection area and the total row number, and confirming the final partition mode; the machine and the software generate a setting file according to the recorded data and the template information, namely, the information such as the coordinates, the intervals, the row and column numbers, the detection positions and the like of the machine are stored as the setting file of the equipment. And storing the setting information of the module, such as the search frame, the image coordinates and the like, as a setting file of the software.
The straightening calibration step comprises the following steps:
the software sends the wafer type and the row and column data corresponding to the Map to the machine, after production is started, the machine moves to a first positioning chip according to the recorded coordinates (related information is called by the wafer type), the software detects the positioning chip, and the coordinates and the deflection angle are calculated and then sent to the machine; the machine platform adjusts the rotating shaft for the first time according to the coordinate and the angle information.
After the machine is adjusted, the software detects the first positioning chip again and calculates the position data after straightening;
the machine station walks to a second positioning chip according to the recorded coordinates; and the software detects the positioning chip, calculates the coordinate and the deflection angle and then sends the coordinate and the deflection angle to the machine. And the machine platform calculates the rotation offset according to the coordinate information of the two positioning chips at the moment, adjusts the rotating shaft and straightens for the second time.
The machine returns to the position of the first positioning chip; the software sends the position information of the first positioning chip detected after straightening to the machine station, the machine station compares the current coordinate with the coordinate in the setting file, and after calculating the coordinate offset, the machine station adjusts the xy axis according to the information and the position of the first positioning chip in the setting file, so that the position of the first positioning chip is consistent with the setting file; and returning to the first detection position after the straightening is finished.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (2)
1. A method of identifying and testing die chips, comprising the steps of:
identifying the wafer, namely scanning the ID of the wafer, identifying the type of the wafer, loading a corresponding setting gear and a wafer Map, and starting a camera to shoot; if the setting file exists, the shooting positioning chip carries out position calibration; if no setting file exists, manually positioning and calibrating according to the real-time image, and creating the setting file;
a detection step, dividing each kind of wafer into m × n areas, shooting the m × n areas in sequence, identifying a detection chip in each area, comparing with a Map, and detecting whether the chip exists at the position where the chip should exist; if the chip exists, the chip is normal; if the chip does not exist, detecting whether the position is a white pinhole, and if the position is not the white pinhole, indicating that the position is normal; if a white pinhole exists, the abnormality is shown; when detecting the next area of the wafer, repeating the detection steps until all the chips in the m x n areas are detected;
a feedback step, integrating the detection results of the m × n areas into an actual Map after the m × n areas of the wafer are detected, feeding back the results to the server,
the setting file is prepared according to the following steps:
the software will detect the new type of die; converting the pixel size into an actual size by using a calibration module, and manually adjusting the position of a machine table once to enable the motion axis of the machine table to be parallel to the X axis of the image;
adjusting the machine table to a first positioning chip, and using a straightening calibration module to carry out first straightening calibration; recording the position data of the positioning chip, and creating a positioning chip template;
adjusting the machine table to a second positioning chip, and using a straightening calibration module to perform second straightening calibration; measuring X, Y axial direction spacing distance between chips by using a chip spacing measuring module, recording data, and creating a chip template;
adjusting the machine to a first detection position, recording the row and column number of the chip in the detection area, and distributing the detection area according to the row and column number and the total row number of the detection area;
the machine and the software generate a setting file according to the recorded data and the template information.
2. Method of identifying and testing die chips according to claim 1, characterized in that: the straightening calibration step comprises the following steps:
the machine station walks to the first positioning chip according to the recorded coordinates; the software detects the positioning chip, calculates the coordinate and deflection angle and then sends the coordinate and deflection angle to the machine table; the machine platform adjusts the rotating shaft according to the data; the software detects the first positioning chip again and calculates the position data after straightening; the machine station walks to a second positioning chip according to the recorded coordinates; the software detects the positioning chip, calculates the coordinate and deflection angle and then sends the coordinate and deflection angle to the machine table; the machine station performs secondary straightening according to the coordinate information of the two positioning chips; the machine returns to the position of the first positioning chip; detecting and positioning the chip by software, calculating coordinate data and sending the coordinate data to the machine table; the machine station compares the current coordinate with the coordinate in the setting file; after the coordinate offset is calculated, the machine adjusts the position to make the position of the first positioning chip consistent with the set gear; and returning to the first detection position after the straightening is finished.
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| CN105374726A (en) * | 2015-10-22 | 2016-03-02 | 北京同方微电子有限公司 | Positioning method for packaging and picking up chips |
| CN108352308A (en) * | 2016-01-28 | 2018-07-31 | 雅马哈发动机株式会社 | Die pick-up equipment |
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- 2018-11-08 CN CN201811325439.6A patent/CN109449096B/en active Active
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