CN109445041A - 25g光模块的加工工艺 - Google Patents
25g光模块的加工工艺 Download PDFInfo
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- CN109445041A CN109445041A CN201811258201.6A CN201811258201A CN109445041A CN 109445041 A CN109445041 A CN 109445041A CN 201811258201 A CN201811258201 A CN 201811258201A CN 109445041 A CN109445041 A CN 109445041A
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- optical module
- processing technology
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- 230000003287 optical effect Effects 0.000 title claims abstract description 62
- 238000012545 processing Methods 0.000 title claims abstract description 29
- 238000005516 engineering process Methods 0.000 title claims abstract description 23
- 238000009434 installation Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims description 42
- 239000000843 powder Substances 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 23
- 239000002270 dispersing agent Substances 0.000 claims description 19
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 11
- 239000011325 microbead Substances 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Inorganic materials O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 230000005684 electric field Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 3
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000481 breast Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2262—Oxides; Hydroxides of metals of manganese
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2268—Ferrous oxide (FeO)
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
组别 | 发射率 | 表观特征 |
组1 | 0.88 | 大量凹槽结构 |
组2 | 0.93 | 大量凹槽结构 |
组3 | 0.87 | 大量凹槽结构 |
组4 | 0.87 | 大量凹槽结构 |
组5 | 0.82 | 大量凹槽结构 |
组6 | 0.85 | 大量凹槽结构 |
组7 | 0.83 | 大量凹槽结构 |
组8 | 0.85 | 大量凹槽结构 |
组9 | 0.82 | 大量凹槽结构 |
组10 | 0.76 | 大量凹槽结构 |
对照组1 | 0.70 | 部分凹槽结构 |
对照组2 | 0.76 | 少量凹槽结构 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811258201.6A CN109445041B (zh) | 2018-10-26 | 2018-10-26 | 25g光模块的加工工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811258201.6A CN109445041B (zh) | 2018-10-26 | 2018-10-26 | 25g光模块的加工工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109445041A true CN109445041A (zh) | 2019-03-08 |
CN109445041B CN109445041B (zh) | 2020-04-24 |
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CN201811258201.6A Active CN109445041B (zh) | 2018-10-26 | 2018-10-26 | 25g光模块的加工工艺 |
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Country | Link |
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CN (1) | CN109445041B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2458750Y (zh) * | 2000-07-25 | 2001-11-07 | 富士康(昆山)电脑接插件有限公司 | 插座电连接器 |
JP3146030U (ja) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | 放熱フィンの構造およびその放熱フィンを使用した放熱モジュール |
CN205728532U (zh) * | 2016-06-30 | 2016-11-30 | 孔兵 | 一种行李箱防滑动装置 |
CN106443913A (zh) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | 一种光模块封装结构及光模块 |
CN207037164U (zh) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配(厦门)有限公司 | 一种光通信收发器 |
CN207675989U (zh) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | 一种用于高速长距离光模块的新型散热结构 |
-
2018
- 2018-10-26 CN CN201811258201.6A patent/CN109445041B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2458750Y (zh) * | 2000-07-25 | 2001-11-07 | 富士康(昆山)电脑接插件有限公司 | 插座电连接器 |
JP3146030U (ja) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | 放熱フィンの構造およびその放熱フィンを使用した放熱モジュール |
CN205728532U (zh) * | 2016-06-30 | 2016-11-30 | 孔兵 | 一种行李箱防滑动装置 |
CN106443913A (zh) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | 一种光模块封装结构及光模块 |
CN207037164U (zh) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配(厦门)有限公司 | 一种光通信收发器 |
CN207675989U (zh) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | 一种用于高速长距离光模块的新型散热结构 |
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CN109445041B (zh) | 2020-04-24 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Processing technology of 25g optical module Effective date of registration: 20220724 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2022980011166 |
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Date of cancellation: 20230810 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2022980011166 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Processing Technology of 25G Optical Module Effective date of registration: 20230817 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2023980052583 |
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