CN109439227A - A kind of Wireless charging coil covering glue film and preparation method thereof - Google Patents
A kind of Wireless charging coil covering glue film and preparation method thereof Download PDFInfo
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- CN109439227A CN109439227A CN201811452239.7A CN201811452239A CN109439227A CN 109439227 A CN109439227 A CN 109439227A CN 201811452239 A CN201811452239 A CN 201811452239A CN 109439227 A CN109439227 A CN 109439227A
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- wireless charging
- charging coil
- glue
- black
- layer
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- 239000003292 glue Substances 0.000 title claims description 253
- 238000002360 preparation method Methods 0.000 title claims description 50
- 239000010410 layer Substances 0.000 claims abstract description 137
- 239000000843 powder Substances 0.000 claims abstract description 29
- -1 polyethylene Polymers 0.000 claims abstract description 28
- 239000004698 Polyethylene Substances 0.000 claims abstract description 26
- 239000011241 protective layer Substances 0.000 claims abstract description 26
- 229920000573 polyethylene Polymers 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 239000002313 adhesive film Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000012790 adhesive layer Substances 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 16
- 239000003063 flame retardant Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000006229 carbon black Substances 0.000 claims description 9
- 239000003085 diluting agent Substances 0.000 claims description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 137
- 239000004642 Polyimide Substances 0.000 abstract description 21
- 229920001721 polyimide Polymers 0.000 abstract description 21
- 239000000975 dye Substances 0.000 abstract description 15
- 239000013039 cover film Substances 0.000 abstract description 8
- 239000002131 composite material Substances 0.000 abstract description 7
- 230000007423 decrease Effects 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract 1
- 239000002985 plastic film Substances 0.000 abstract 1
- 229920006255 plastic film Polymers 0.000 abstract 1
- 238000011049 filling Methods 0.000 description 95
- 239000000463 material Substances 0.000 description 48
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 30
- 239000004593 Epoxy Substances 0.000 description 28
- 239000000243 solution Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000000654 additive Substances 0.000 description 15
- 230000000996 additive effect Effects 0.000 description 15
- 239000000126 substance Substances 0.000 description 13
- 239000004952 Polyamide Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 239000012943 hotmelt Substances 0.000 description 12
- 229920002647 polyamide Polymers 0.000 description 12
- 239000011162 core material Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000004615 ingredient Substances 0.000 description 8
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 7
- 230000008676 import Effects 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 5
- 230000032683 aging Effects 0.000 description 5
- 230000002633 protecting effect Effects 0.000 description 5
- 238000012797 qualification Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 241001391944 Commicarpus scandens Species 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000002362 mulch Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- BCAARMUWIRURQS-UHFFFAOYSA-N dicalcium;oxocalcium;silicate Chemical compound [Ca+2].[Ca+2].[Ca]=O.[O-][Si]([O-])([O-])[O-] BCAARMUWIRURQS-UHFFFAOYSA-N 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 238000005213 imbibition Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 241001614291 Anoplistes Species 0.000 description 1
- 206010054949 Metaplasia Diseases 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920006266 Vinyl film Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
本发明提供了一种无线充电线圈覆盖胶膜，所述无线充电线圈覆盖胶膜包括载体层、黑胶层、保护层。其中，以所述黑胶层的总重量为100％计，其包括如下重量份的原料组分：55％～70％改性环氧树脂，5％～25％促进剂，5％～20％染料，5％～10％哑光粉。该黑胶层具有粘黏性，在使用过程中不需要增加其他粘贴剂，同时该黑胶层厚度可控，延展性良好，抗拉性能增强，可以有效避免制备得到的无线充电线圈覆盖胶膜发生涨缩导致其性能下降，因此制备得到无线充电线圈覆盖胶膜能够代替5μm黑色聚酰亚胺(PI)+5μm聚乙烯(AD)(或8μm黑PI+5μmAD)的复合膜结构。
The invention provides a wireless charging coil covering adhesive film, the wireless charging coil covering adhesive film includes a carrier layer, a black adhesive layer and a protective layer. Wherein, based on the total weight of the black rubber layer as 100%, it includes the following raw material components by weight: 55%-70% modified epoxy resin, 5%-25% accelerator, 5%-20% Dyes, 5% to 10% matte powder. The black rubber layer is sticky, and no other adhesives need to be added during use. At the same time, the thickness of the black rubber layer is controllable, the ductility is good, and the tensile strength is enhanced, which can effectively avoid the prepared wireless charging coil covering the plastic film. The expansion and contraction cause its performance to decline, so the prepared wireless charging coil cover film can replace the composite film structure of 5μm black polyimide (PI)+5μm polyethylene (AD) (or 8μm black PI+5μmAD).
Description
Technical field
The present invention relates to macromolecule membrane technical field more particularly to a kind of Wireless charging coil covering glue film and its preparations
Method.
Background technique
With the development of electronic technology, the electronic equipments such as mobile phone, tablet computer and camera have become people's daily life
In indispensable a part, requirement of the people for electronic equipment be also higher and higher.In order to meet the requirement of people, wireless charging
Power technology is gradually applied in electronic equipment, and wireless charging technology can transmit energy by electromagnetic wave, realizes wireless charging
Device improves the convenience of electronic equipment charging process to the wireless charging of electronic equipment.
Currently, wireless charger generallys use flexible circuit board, by installing wireless charging module on flexible circuit board,
To carry out wireless charging to equipment.The Wireless charging coil of mobile terminal wireless charging generally includes wire coil at present
Carrier polyimides (PI) film, the coil of PI film two sides, coil outer side covering PI insulator cover film.Wherein, PI is exhausted
The thickness of edge cover film is larger, occupies the thickness space of coil.Secondly, the preparation process of PI insulating film is sufficiently complex, usually
Layer of polyethylene (AD) film is covered on black PI film, and in coating process, external condition cleanliness, electrostatic are required,
It is harsher to design precision requirement, easily entrains the generation of dust and compound bubble；When production coating only due to bondline thickness
There is 5um, harshness is also required that equipment precision and external condition, because adhesive is too thin, equally in cure parameter and process temperature
It is also required when degree control very high.
Since the film preparation is more demanding, production technology is more difficult, and the universal performance of film for causing production to obtain is poor, packet
It is uncontrollable to include thickness, harmomegathus is bigger than normal, and poor ductility, tensile property is bad, and the country also fails to voluntarily be produced at present,
It needs from Japan and South Korea's import, preparation process is complicated, and production cost is excessively high, keeps the application of wireless charging limited.
Summary of the invention
The purpose of the present invention is to provide a kind of Wireless charging coils to cover glue film, solves wireless charging electric wire in the prior art
Circuit covering film needs to be added other adhesive and paste film forming to cause the problem of cover film effect difference, while solving polyamides Asia
The problem of amine film needs import.
For achieving the above object, The technical solution adopted by the invention is as follows:
A kind of Wireless charging coil covering glue film, the Wireless charging coil covering glue film include carrier layer, black glue layer, protect
Sheath；It wherein, is in terms of 100% by the total weight of the black glue layer comprising the raw material components of following parts by weight: 55%~70%
Modified epoxy, 5%~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
And a kind of preparation method of Wireless charging coil covering glue film, include the following steps:
Carrier layer is provided；
It is coated with black glue layer solution in the carrier layer, forms the black glue layer through 40~120 DEG C of bakings；
Deviate from the surface protective mulch of carrier layer in the black glue layer.
Compared with prior art, Wireless charging coil covering glue film of the present invention includes carrier layer, black glue layer, protection
Layer.Wherein, modified epoxy added by black glue layer has good toughness, while can be improved ductility, is drawing it
Toughness is kept during stretching, is not easy to break, and there is certain cementability, does not need in addition to add adhesive in overlay film
Material in coating process, can guarantee to be coated with that coplanar flat is smooth, and obtained black glue layer is not in harmomegathus phenomenon；It is added
Promotor be the shaping speed that can promote black glue layer, guarantee black glue layer solidification when speed it is uniform, it is not easy to aging.It is prepared into
The black glue layer arrived has viscous stickiness, can replace black polyamide completely, does not need to increase other in use viscous
Patch, while the black bondline thickness is controllable, ductility is good, tensile property enhancing, it is possible to prevente effectively from what is be prepared is wireless
Harmomegathus, which occurs, for charge coil covering glue film causes its performance to decline.The Wireless charging coil covering glue film being prepared can be complete
Instead of the structure of composite membrane of 5 μm of black polyamide (PI)+5um polyethylene (AD) (or the black PI+5umAD of 8um) in the prior art.
Meanwhile this Wireless charging coil covering glue film is in use, it is no longer necessary to the materials such as black polyamide film and polyethylene film
Material, efficiently solves the problems, such as that Kapton needs import.
The above-mentioned preparation method for Wireless charging coil covering glue film, it is only necessary to be coated in provided carrier layer black
Glue-line solution can form black glue layer through 40~120 DEG C of bakings, and deviate from the surface covering protection of carrier layer in the black glue layer
Layer.The preparation method reaches the preparation of black glue layer by control temperature, and simple process, condition is controllable, can guarantee to make
While standby obtained Wireless charging coil covering glue film keeps above-mentioned beneficial effect, imparting is described to be covered for Wireless charging coil
The excellent stability of lid glue film.In addition, this preparation method equipment requirement is low, it can be used for industrialized production.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the Wireless charging coil covering glue film that the embodiment of the present invention 1 provides.Wherein, each in figure
Attached drawing main mark: 1- carrier layer；2- black glue layer；3- protective layer.
Specific embodiment
To keep the purpose, technical solution and technical effect of the embodiment of the present invention clearer, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.In conjunction with the embodiment in the present invention, ordinary skill
Personnel's every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indication or suggestion relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more of the features.In the description of the present invention,
The meaning of " plurality " is two or more, unless otherwise specifically defined.
Present example provides a kind of Wireless charging coil covering glue film, and the Wireless charging coil covering glue film includes carrying
Body layer, black glue layer, protective layer；It wherein, is in terms of 100% by the total weight of the black glue layer comprising the raw material of following parts by weight
Component: 55%~70% modified epoxy, 5%~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
Specifically, the black glue layer includes the raw material components of following parts by weight: 55%~70% modified epoxy, 5%
~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.
Modified epoxy is to improve the property of epoxy resin by reacting organic solvent with resin.
Generally, modified obtained modified epoxy, can be improved the impact flexibility, heat resistance, flame resistance of material, can extend use
Phase and Storage period.
Preferably, above-mentioned modified epoxy includes the component of following parts by weight: 20%~30% epoxy resin, 40%~
60% diluent, 5%~10% fire retardant.Specifically, epoxide resin material has, density height, water resistant, anti-leakage is good, intensity is high
The advantages that, therefore, epoxide resin material is selected as the main material of filling glue, filling colloidality can be enable relatively stable,
In the preferred embodiment of the present invention, the preferred AS resin of resin.But ethoxyline resin antiflaming effect is poor, general anti-flammability ring
Oxygen resin is to pollute larger in preparation process with the resin containing fire-retardant group made from halogen, phosphorus monomer, is reacted more complex.
In order to improve the flame retardant property of epoxy resin, the filling glue being prepared is made to have better impact flexibility, heat resistance, flame resistance,
It extends using period and Storage period.Preferably, the additive amount of epoxy resin is 20%~30%, if increasing the addition of epoxy resin
Amount then will lead to filling glue and be difficult to solidify in subsequent preparation process, keeps the performance for filling glue poor；If reducing epoxy resin
Additive amount can then solidify in filling glue forming process and accelerate, colloid aging is caused not to be available.
Further, fire retardant is added in the epoxy resin, the ingredient of the preferred fire retardant of the present invention is Al (OH)3,
Relative density 2.42, Mohs' hardness 3.0.It has the characteristics that nontoxic, tasteless, good dispersion, whiteness are high, iron-content is low, is one
Kind of inorganic fire retardants, have it is fire-retardant, eliminate smoke, filling three zones, it is without secondary pollution in burning, when pyrolysis do not generate it is toxic and
Mordant gas simultaneously absorbs heat and releases water vapour, has fire-retardant self-extinguishment.
Following reaction generally occurs when aluminium hydroxide is as fire retardant:
The fire retardation of aluminium hydroxide derive from thirdly molecular crystalline water decomposition heat absorption principle, on the one hand, aluminium hydroxide by
Heat dehydration is decomposed, and caloric receptivity reaches 1967.2J/kg, can effectively inhibit the heating and thermal degradation of polymer.On the other hand, hydroxide
Aluminium decomposition, which releases a large amount of vapor, can dilute fuel gas, inhibit burning sprawling, the closelypacked bimorph crystal knot of aluminium hydroxide
Structure can capture the hydroxyl radical free radical for causing polymer combustion, break off chain reaction.Furthermore in polymer table after aluminium hydroxide dehydration
Face forms the fine and close three dichloroxide protective films of high temperature resistant, and isolation air prevents propagation of flame.High temperature resistant densification aluminum oxide is protected
Cuticula can also promote polymer carbonization, and adsorbent solid particle inhibits dense smoke to generate.By adding fire retardant in the epoxy,
The features such as improving the flame retardant property of epoxy resin, while being also able to maintain epoxy resin high temperature resistant, good mechanical strength.If filling out
It fills that flame retardant constituent in glue is excessively high, then can reduce the additive amount of other substances to a certain degree, wherein major to be the reduction of ring
The additive amount of oxygen resin causes to be difficult to solidify when filling glue formation；If reducing the additive amount of fire retardant, filling glue will lead to
Flame retardant effect is not further improved.
Further, the diluent is selected from organic solvent, for dissolving the epoxy resin.The organic solvent can be selected from
Aromatic organic solvent and alcohol organic solvent, preferred organic solvent be toluene and methanol, in a preferred embodiment of the invention,
The additive amount of the diluent preferably mixed solution of 20%~30% toluene and 20%~30% methanol, the addition of organic solvent can
Resin is promoted to be modified, while in later period heating process, organic solvent is easy to volatilize under high temperature action, it will not be to material
It impacts.
In a particular embodiment, the additive amount of the modified epoxy is 55%~70%.If modified epoxy
Adding too much, during following process, since the ingredient of resin is higher, resin excessively will lead to solid during hot briquetting
Change effect is bad, influences the molding for filling glue；If additive amount is very few, the filling glue poor toughness being prepared, tensile strength is low,
Embrittlement easily occurs in use process, service life is not grown.
Preferably, above-mentioned promotor includes the component of following parts by weight: 80%~90%, the modified epoxy, and 3%
~10% promotor.Wherein, modified epoxy is above-mentioned modified epoxy.Above-mentioned modified ring is added in the promotor
Oxygen resin is to make to fill in glue reaction process, reaction speed is equal to enable substance to be sufficiently mixed uniformly in stage and semi-finished product
It is even；If being directly individually added each substance, the production that material mixing is uneven, reacts will lead to when preparing finished product glue
Moral character can be poor.Specifically, adding the promotor is to accelerate the generation of filling glue to improve reaction efficiency.Specifically, institute
Stating promotor is epoxy resin promotor, is a kind of substance for accelerating hot-melt resin reaction rate.Further, the promotion
Agent preferably selects organic accelerator, and organic accelerator efficiency is high, improves the physical mechanical property of filling glue, and use is more wide
It is general.Main organic accelerator include 2-methylimidazole, 2- ethyl imidazol(e), 2-ethyl-4-methylimidazole, 2 isopropyl imidazole,
2- undecyl imidazole, 2- heptadecyl imidazole, 2- phenylimidazole, 2- phenyl -4-methylimidazole etc. are preferably implemented in the present invention
In example, the promotor preferably adds 2-methylimidazole.Promotor is added in filling glue material, hot melt can be greatly speeded up
Fill glue reaction, reduce fusion temperature, shorten fusing time, improve the physical mechanical property of hot-melt resin, chemical property and
The corresponding property such as appearance.
In a particular embodiment, the additive amount of the promotor is 5%~25%.If the additive amount of promotor is less,
When reaction molding, the solidified forming time for filling glue is lengthened, the reaction of long period, be will lead to colloidal substance and is easy aging, glue
Body cannot keep its good performance；If promotor additive amount is more, lead to molding filling glue poor toughness, tensile strength
Low, later period using effect is bad.
Preferably, above-mentioned dyestuff includes 30%~40% carbon black, 40%~60% diluent.Specifically, being made using carbon black
For a kind of dye substance of the preferred embodiment of the present invention.Since carbon black is a kind of light, loose and superfine black powder, as powder
Shape substance, surface area is very big, can be attached to material surface well with other material mixings.Of the invention preferred real
It applies in example, the selected particle size carbon black is≤2um.Particle size carbon black is more tiny, then light absorption degree is higher, then can be preferably
Show its blackness.Further, the selection type of the diluent is consistent with above-mentioned diluent, including aromatics organic solvent and
Alcohol organic solvent.In a preferred embodiment of the invention, the diluent preferably added is methanol.Since methanol is a kind of relatively simple
Alcohol organic solvent keep consistent with above-mentioned diluent in use, it can be ensured that fill glue and do not introduce excessive its
His impurity.
In a particular embodiment, the additive amount of the dyestuff is 5%~20%.If additive amount is very few, dye powder without
Method is sufficiently mixed with modified epoxy, and the uneven color that will lead to filling glue is even, keeps filling glue quality effect bad；If addition
Amount is excessive, then the filling glue being prepared can be caused to cannot keep good stretching due to reducing the content of other compositions
Intensity, flexibility are poor.
Specifically, the additive amount of the dumb light powder is 5%~10%.Preferably, above-mentioned dumb light powder includes following parts by weight
Component: 80%~90% modified epoxy, 5%~10% dumb light powder.Wherein, modified epoxy is above-mentioned preparation
It obtains.Since additive amount of the dumb light powder in filling glue is less, and dumb light powder partial size is small, more frivolous, if directly making an addition into
Product, which are filled, is easy mixing unevenly in glue, cause the glossiness for filling glue poor；Therefore, by first by dumb light powder and modified epoxy
Resin mixing is uniformly mixed in dumb light powder in filling glue, guarantees that molding filling glue color is excellent, color be in it is black dull,
Reflective black is not presented, keeps the product color more excellent.Meanwhile added dumb light powder property is stablized, and also further guarantees
The stability of filling glue.
Preferably, the black glue layer with a thickness of 5 μm~15 μm.Its thickness is controllable, during the reaction can be according to reality
Prepared by border demand, meet various demands.If bondline thickness is excessively thin, in the preparation process of later period Wireless charging coil entirety
In, it is easy to cause covering uneven, keeps product reliability poor；If bondline thickness is blocked up, the efficiency of product is influenced, is not used to
Production.
Specifically, providing the carrier layer, a substrate mainly is provided for black glue layer.Preferably, the carrier layer
With a thickness of 5 μm~50 μm.If support layer thickness is too thin, it be easy to cause damage during the preparation process, leads to film out-of-flatness, in turn
The performance for influencing Wireless charging coil covering glue film will lead to waste of material if support layer thickness is too thick during the preparation process, into
One step improves cost.
Preferably, the carrier layer can be PET release film, PE release film, OPP release film.Since carrier layer is to highly resistance
It draws hot melt black glue as support, therefore needs preferably as the material of carrier layer with high tensile, high impact-resistant, high tenacity
Etc. performances.In a preferred embodiment of the invention, selected carrier layer is PET release film.
Specifically, the protective layer is the surface for being covered on high tensile hot melt black glue and deviating from carrier layer, it is prepared into protection
The black glue layer arrived influences the property of glue-line to avoid glue-line dampness moisture absorption etc..Preferably, the protective layer thickness be 5 μm~
50μm.If protective layer thickness is excessively thin, it is easy to appear breakage when protecting to high tensile hot melt black glue surface, is protected
Effect is poor, and high tensile hot melt black glue is made to be easy to be damaged；If protective layer thickness is blocked up, cause material unrestrained during the preparation process
Take, further improves cost.Further preferably, the protective layer includes polyethylene film, polypropylene screen, polyester film, fitting paper.
Common solvent is not dissolved under selected protective layer room temperature, water imbibition is small, and electrical insulating property is excellent, therefore as protective film, can be to height
Tension hot melt black glue plays comprehensive protecting effect.
Wireless charging coil covering glue film of the present invention includes carrier layer, black glue layer, protective layer.Wherein, black glue layer
Added modified epoxy has good toughness, while can be improved ductility, it is made to keep tough during stretching
Property, be not easy to break, and have certain cementability, do not need in addition to add adhesive material in overlay film, coating process
In, it can guarantee that coating coplanar flat is smooth, obtained filling glue material is not in harmomegathus phenomenon；Added promotor is
It can promote the shaping speed of filling glue, guarantee that speed is uniform when filling gelling is solid, it is not easy to aging.The black glue layer being prepared
With viscous stickiness, black polyamide can be can replace completely, do not need to increase other alite pastes in use, simultaneously should
Black bondline thickness is controllable, and ductility is good, tensile property enhancing, it is possible to prevente effectively from harmomegathus, which occurs, for the film being prepared causes
The decline of its performance.The Wireless charging coil covering glue film being prepared can replace 5 μm of black polyamides Asias in the prior art completely
The structure of composite membrane of amine (PI)+5um polyethylene (AD) (or the black PI+5umAD of 8um).Meanwhile this Wireless charging coil covers glue film
In use, it is no longer necessary to which the materials such as black polyamide film and polyethylene film efficiently solve Kapton
The problem of needing import.
Correspondingly, the embodiment of the invention also provides the preparation methods of above-mentioned Wireless charging coil covering glue film, including such as
Lower step:
S01., carrier layer is provided；
S02. it is coated with black glue layer solution in the carrier layer, forms the black glue layer through 40~120 DEG C of bakings；
S03. deviate from the surface protective mulch of carrier layer in the black glue layer.
Specifically, the carrier layer preferred kind in above-mentioned steps S01 and thickness are as described above, in order to save length,
This is repeated no more.
In above-mentioned steps S02, the preferred kind and content of black glue layer solution are as described above, in order to save length, herein
It repeats no more.By black glue layer solution coating after in carrier layer, toasted through 40~120 DEG C, it is preferred that the method for the baking
It is to be toasted using tunnel type baking oven, tunnel oven is dry using long cabinet hot air circulation and far-infrared ray drying mode
A kind of dry baking oven, its main feature is that first, tunnel oven heating element is mounted on baking oven top, improves the thermal efficiency；Second, it dries
Case is furnished with electric control cabinet, and temperature digital-display control can specifically control in any temperature constant state substance heating process；Third, out
Material is cooled down using the purification wind of vertical laminar flow at mouthful, material is made to be in the dustless state of rigorous aseptic.Use tunnel type
Baking oven is primarily to the need required for prepared Wireless charging coil covering glue film high yield, high efficiency, high preparation
It asks.
Further, tunnel type baking oven is divided into six sections, it is each save temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C,
60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.Specific
In embodiment, the set temperature of tunnel type baking oven is 40~120 DEG C, dries high tensile at this temperature and heats black glue, Neng Gouchong
Code insurance card high tensile hot melt black glue solidifies at such a temperature and the good characteristic for keeping it intrinsic may be led if temperature is too low
Cause high tensile hot melt black glue solution that can not solidify very well at the beginning, in subsequent higher temperatures heating process, solidification is uneven, system
Standby obtained material flatness is bad, and effect is poor；If temperature is excessively high, since high tensile hot melt black glue is hot melt adhesive, in height
Fusing is easy to happen under the conditions of temperature, therefore when temperature is higher than 120 DEG C, high tensile hot melt black glue can cross high-performance hair due to temperature
It is raw to change, it is unfavorable for the use of subsequent Wireless charging coil covering glue film.
In a preferred embodiment of the invention, the air inlet wind frequency of tunnel type baking oven setting be followed successively by 25Hz, 20Hz, 20Hz,
20Hz,20Hz,25Hz；Air draft wind frequency is 35Hz.By cooperateing with the air inlet wind frequency and air draft wind frequency of tunnel type baking oven, make baking oven
Internal temperature is uniform, is conducive to preferably toast black glue layer.If wind frequency is excessive or too small, it can all lead to temperature in baking oven
Unevenly, influence will cause on the drying of black glue layer, is unfavorable for the formation of black glue layer.
The above-mentioned preparation method for Wireless charging coil covering glue film, it is only necessary to be coated in provided carrier layer high
Tension heats black glue solution, can form black glue layer through 40~120 DEG C of bakings, and the method toasted is using tunnel type baking oven
It is toasted, tunnel type baking oven is divided into six sections, and each temperature that saves sets gradually as 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C, 60
℃；Each section air inlet wind frequency sets gradually as 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.Pass through
Above-mentioned moderate baking temperature is set and into air draft wind frequency, to reach the preparation of Wireless charging coil covering glue film.
The preparation method simple process, condition is controllable, can guarantee that the Wireless charging coil being prepared covering glue film is protected
While holding above-mentioned beneficial effect, the stability excellent for Wireless charging coil covering glue film is assigned.In addition, this makes
Preparation Method equipment requirement is low, can be used for industrialized production.
Specifically, the first covering glue film, second cover film in flexible circuit board stacking include phase
To the carrier layer and protective layer of setting, and the black glue layer being arranged between the carrier layer and the protective layer.
Preferably, the black glue layer with a thickness of 5 μm~15 μm.Its thickness is controllable, during the reaction can be according to reality
Prepared by border demand, meet various demands.If bondline thickness is excessively thin, in the preparation process of later period Wireless charging coil entirety
In, it is easy to cause covering uneven, keeps product reliability poor；If bondline thickness is blocked up, the efficiency of product is influenced, is not used to
Production.
Specifically, the carrier layer, mainly provides a substrate for black glue layer.Preferably, the thickness of the carrier layer
It is 5 μm~50 μm.If support layer thickness is too thin, it be easy to cause damage during the preparation process, lead to film out-of-flatness and then influences
The performance of covering glue film will lead to waste of material if support layer thickness is too thick during the preparation process, further improve cost.
Preferably, the carrier layer can for PET release film, PE release film, OPP release film it is any.Due to carrier
Layer is to support to black glue as branch layer, therefore need preferably as the material of carrier layer with high tensile, high impact-resistant, high-ductility
The performances such as property.In a preferred embodiment of the invention, selected carrier layer is PET release film.
Specifically, the protective layer is the surface for being covered on black glue and deviating from carrier layer, to protect the black glue layer being prepared,
The property of black glue layer is influenced to avoid black glue layer dampness moisture absorption etc..Preferably, the protective layer thickness is 5 μm~50 μm.If
Protective layer thickness is excessively thin, then breakage is easy to appear when protecting to black glue layer surface, and protecting effect is poor, makes black glue layer
It is easy to be damaged；If protective layer thickness is blocked up, lead to waste of material during the preparation process, further improves cost.Into one
Preferably, the protective layer includes polyethylene film, polypropylene screen, polyester film, fitting paper to step.One is not dissolved under selected protective layer room temperature
As solvent, water imbibition is small, and electrical insulating property is excellent, therefore as protective film, comprehensive protecting effect can be played to black glue layer.
Above-mentioned first covering glue film, the second covering glue film include carrier layer, black glue layer and protective layer；Since black glue layer has
There is good toughness, therefore, the first covering glue film and the second covering glue film being prepared have good ductility, are not easy
It is crisp, be not easy to break during stretching；Simultaneously as black glue layer has good cementability, make preparing the first rubber cover
During film, the second covering glue film, does not need in addition to add adhesive material in overlay film, in coating process, can guarantee
Coating coplanar flat is smooth, and obtained the first covering glue film, the second covering glue film is not in harmomegathus phenomenon；It is added in black glue layer
Promotor can promote the shaping speed of black glue layer, guarantee speed during the first covering glue film, the second rubber cover film preparation
Uniformly, while black glue layer is directly to be coated, and the first covering glue film, the second covering film thickness being prepared are controllable, can
To replace the compound of 5 μm of black polyamide (PI)+5um polyethylene (AD) (or the black PI+5umAD of 8um) in the prior art completely
Membrane structure.Meanwhile the first covering glue film, the second covering glue film are in use, it is no longer necessary to black polyamide film and poly-
The materials such as vinyl film efficiently solve the problems, such as that Kapton needs import.
Correspondingly, the embodiment of the invention also provides the preparation method of above-mentioned first covering glue film, the second covering glue film, systems
Preparation Method is identical, includes the following steps:
S01., carrier layer is provided；
S02. it is coated with black glue layer solution in the carrier layer, forms the black glue layer through 40~120 DEG C of bakings；
S03. deviate from the surface protective mulch of carrier layer in the black glue layer.
Specifically, the carrier layer preferred kind in above-mentioned steps S01 and thickness are as described above, in order to save length,
This is repeated no more.
In above-mentioned steps S02, the preferred kind and content of black glue layer solution are as described above, in order to save length, herein
It repeats no more.By black glue layer solution coating after in carrier layer, toasted through 40~120 DEG C, it is preferred that the method for the baking
It is to be toasted using tunnel type baking oven, tunnel oven is dry using long cabinet hot air circulation and far-infrared ray drying mode
A kind of dry baking oven, its main feature is that first, tunnel oven heating element is mounted on baking oven top, improves the thermal efficiency；Second, it dries
Case is furnished with electric control cabinet, and temperature digital-display control can specifically control in any temperature constant state substance heating process；Third, out
Material is cooled down using the purification wind of vertical laminar flow at mouthful, material is made to be in the dustless state of rigorous aseptic.Use tunnel type
Baking oven is primarily to the demand required for prepared covering glue film high yield, high efficiency, high preparation.
Further, tunnel type baking oven is divided into six sections, it is each save temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C,
60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.Specific
In embodiment, the set temperature of tunnel type baking oven is 40~120 DEG C, dries black glue layer at this temperature, can fully ensure that black
Glue-line solidifies at such a temperature and the good characteristic for keeping it intrinsic may cause black glue layer solution one if temperature is too low
Start to solidify very well, in subsequent higher temperatures heating process, solidification is uneven, and the material flatness being prepared is bad,
Effect is poor；If temperature is excessively high, since the black glue layer is hot melt adhesive, it is easy to happen fusing under the high temperature conditions, therefore work as temperature
When higher than 120 DEG C, black glue layer can cross high-performance due to temperature and change, and be unfavorable for the use of subsequent covering glue film.
In a preferred embodiment of the invention, the air inlet wind frequency of tunnel type baking oven setting be followed successively by 25Hz, 20Hz, 20Hz,
20Hz,20Hz,25Hz；Air draft wind frequency is 35Hz.By cooperateing with the air inlet wind frequency and air draft wind frequency of tunnel type baking oven, make baking oven
Internal temperature is uniform, is conducive to preferably toast black glue layer.If wind frequency is excessive or too small, it can all lead to temperature in baking oven
Unevenly, influence will cause on the drying of black glue layer, is unfavorable for the formation of black glue layer.
The above-mentioned preparation method for being used to cover glue film, it is only necessary to black glue layer solution, warp are coated in provided carrier layer
40~120 DEG C of bakings can form black glue layer, and the method toasted is toasted using tunnel type baking oven, tunnel type baking oven
It is divided into six sections, it is 40 DEG C, 60 DEG C, 80 DEG C, 120 DEG C, 120 DEG C, 60 DEG C that each section temperature, which is set gradually,；Each section air inlet wind frequency is successively set
It is set to 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is 35Hz.By the way that above-mentioned moderate baking temperature is arranged
And into air draft wind frequency, to reach the preparation of covering glue film.
The preparation method simple process, condition is controllable, can guarantee that the covering glue film being prepared keeps above-mentioned beneficial to effect
While fruit, assign the covering glue film excellent stability.In addition, this preparation method equipment requirement is low, it can be used for industry
Metaplasia produces.
The embodiment of the present invention further provides for a kind of flexible circuit board for wireless charger, the flexible circuit board according to
The first Wireless charging coil covering glue film, screened film, substrate and the second Wireless charging coil that secondary stacking combines cover glue film.
Specifically, the first Wireless charging coil covering glue film, the second Wireless charging coil covering glue film are respectively set
It on the surface of the substrate, is protected for the surface to wiring board, to ensure that the performance of the flexible circuit board is stablized.
Preferably, the first Wireless charging coil covering glue film, the thickness of the second Wireless charging coil covering glue film are equal
It is 5 μm~50 μm.Since flexible circuit board is using more and more extensive, the requirement to its property is higher and higher, including right
The requirement of its thickness.In the prior art, cover film is generally the composite membrane that polyimides and polyethylene are formed, and most thin at present answers
Conjunction film is+5 μm of polyethylene (AD) of 5 μm of black polyamides (PI) (or 8 μm of black PI+5 μm of AD), while when preparing the composite membrane,
5 μm of black polyamide films are required to from external import, and during the preparation process, need to cover 5 μm of adhesive film polyethylene with
It forms viscosity to be engaged, therefore, the ultra-thin composite film thickness being typically prepared is not less than 10 μm.And in the present invention, institute
Covering glue film is stated, itself has cementability, does not need additionally to add bonding agent, therefore, the first wireless charging electric wire being prepared
Circuit covering glue film, the second Wireless charging coil covering glue film preferred thickness are 5 μm~50 μm, and thickness is controllable, while also can be obtained
More frivolous coating is conducive to making and using for flexible circuit board.
Preferably, the substrate includes: substrate, coil, magnetic core；Wherein, the coil tiling is incorporated in the substrate one
Surface, and the substrate corresponds to the part on the inside of the coil and offers through-hole, the magnetic core includes the first magnetic core and the second magnetic
Core, the first magnetic core stacking are incorporated in the surface that the substrate deviates from the coil, and second magnetic core passes through the through-hole
It is connect with first magnetic core.Meanwhile the size of second magnetic core and the through-hole is in the same size；And/or described first
The size of magnetic core is in the same size with the substrate.
Preferably, base material include but is not limited to copper foil base material (FCCL) can using the flexible copper foil as substrate
To be used to prepare three layers of traditional flexible board substrate (3L-FCCL), it can also be used to prepare two layers of flexible board substrate (2L-FCCL).As a result,
The flexible circuit board being prepared is more lightening, and has preferable flexible.Further, the substrate has line
Round line pattern, the spacing between route are not less than 10 μm.Route spacing is big, solves conventional flex circuits plate in use process
In since route spacing is too small lead to that resistance value is unstable, the big problem of fluctuation.
Preferably, the core material includes but is not limited to ferrite.Since ferrite has high resistivity, high dielectric property
And therefore higher magnetic conductivity in the use process of flexible circuit board, using ferrite as core material, can make to make
Standby obtained flexible circuit board has higher magnetic conductivity and dielectric properties, more excellent performance.
Specifically, the screened film is the interference in order to shield outer bound pair flexible circuit board internal magnetic field, to guarantee that this is soft
Property circuit board internal magnetic field stablize.In a preferred embodiment of the invention, the preferred graphite of the material of this screened film.
Preferably, the thickness of the flexible circuit board is not less than 10 μm.If the circuit board being prepared is too thin, will lead to
Product structure stability is poor, is easily damaged, and service life is short, while being also easy to influence the characteristic of circuit board, makes circuit board performance
Unstable, fluctuation is big, influence using.Preferably, which can be used in equipment such as wireless charger, display screen, switching screens
In.
Above-mentioned flexible circuit board plate stack gradually combination the first Wireless charging coil covering glue film, screened film, substrate and
Second Wireless charging coil covers glue film；First Wireless charging coil covers glue film, the second Wireless charging coil rubber cover
Film includes the carrier layer being oppositely arranged and protective layer, and the black glue being arranged between the carrier layer and the protective layer
Layer；It wherein, is in terms of 100% by the total weight of the black glue layer, the black glue layer includes the raw material components of following parts by weight: 55%
~70% modified epoxy, 5%~25% promotor, 5%~20% dyestuff, 5%~10% dumb light powder.Wherein, black glue layer
Added modified epoxy has good toughness, while can be improved ductility, it is made to keep tough during stretching
Property, be not easy to break, and have certain cementability, do not need in addition to add adhesive material in overlay film, coating process
In, it can guarantee that coating coplanar flat is smooth, obtained black glue layer material is not in harmomegathus phenomenon；Added promotor is
It can promote the shaping speed of black glue layer, guarantee that speed is uniform when the solidification of black glue layer, it is not easy to aging.The rubber cover being prepared
Film has viscous stickiness, can directly replace 5 μm of black polyamide (PI)+5um polyethylene (AD) (or black PI+ of 8um in the prior art
Structure of composite membrane 5umAD), while not needing to increase other alite pastes in use, it is possible to prevente effectively from being prepared
The first Wireless charging coil covering glue film, the second Wireless charging coil covering glue film blistering, corrugation, the bad effect such as modification occurs
Fruit and cause flexible circuit board performance decline the problem of.The flexible circuit plate thickness being prepared is controllable, and product stability is high, prolongs
Malleability is good, tensile property enhancing, is less likely to be damaged, and efficiently solves the problems, such as that Kapton needs import.
It is further elaborated below with reference to embodiment.
Figure of description 1 is please referred to, now Wireless charging coil provided by the invention covering glue film is illustrated.The nothing
It includes carrier layer 1, black glue layer 2, protective layer 3 that line charge electric coil, which covers glue film,.
Embodiment 1
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of the filling glue of the Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, by 55% modified epoxy, 15% promotor, 20% dyestuff, 10% dumb light powder into
Row is stirred processing, obtains the first mixed material, and the first mixed material is then placed in high speed disperser and carries out decentralized processing
Obtain the second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 5 μm of filling glue being arranged between the PET release film and the polyethylene film
Layer, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 15 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 15 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
Embodiment 2
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of filling glue for Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, by 66% modified epoxy, 20% promotor, 10% dyestuff, 10% dumb light powder into
Row is stirred processing, obtains the first mixed material, and the first mixed material is then placed in high speed disperser and carries out decentralized processing
Obtain the second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 8 μm of filling glue being arranged between the PET release film and the polyethylene film
Layer, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 18 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 18 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
Embodiment 3
Filling glue constituent content and preparation method for Wireless charging coil diaphragm.Wherein, it is used for Wireless charging coil
Described in the included weight ratio ingredient of the filling glue component table 1 as follows of diaphragm.Wherein, modified epoxy used includes group
Point: 30% Resin A S-60,30% toluene, 30% methanol, 10% aluminium hydroxide；Promotor used includes component: 90% modified ring
Oxygen resin, 10%2- methylimidazole.Dyestuff used includes component: 40% carbon black, 60% methanol.Dumb light powder used includes component:
90% modified epoxy, 10% dumb light powder.
The preparation method of filling glue for Wireless charging coil diaphragm: at normal temperatures and pressures, according to above-mentioned each ingredient
Composition and ratio weighs required substance respectively, and 60% modified epoxy, 15% promotor, 20% dyestuff, 5% dumb light powder are carried out
It is stirred processing, obtains the first mixed material, the first mixed material is then placed in high speed disperser progress decentralized processing and is obtained
Second mixed material；Second mixed material is filtered processing, obtains filling glue.
The Wireless charging coil diaphragm being further prepared, the Wireless charging coil diaphragm include 5 μ being oppositely arranged
M PET release film and 5 μm of polyethylene films, and 10 μm of fillings being arranged between the PET release film and the polyethylene film
Glue-line, the filling glue-line are the above-mentioned filling glue being prepared.
This is for Wireless charging coil diaphragm the preparation method comprises the following steps: offer PET release film, applies on the PET release film
Cloth fills sol solution, is filling glue-line by filling sol solution baking, deviates from the surface of PET release film in the filling glue-line
Cover polyethylene film；Wherein specific baking condition: be arranged tunnel type baking oven each section temperature be followed successively by 40 DEG C, 60 DEG C, 80 DEG C,
120℃,120℃,60℃；Each section air inlet wind frequency is followed successively by 25Hz, 20Hz, 20Hz, 20Hz, 20Hz, 25Hz；Air draft wind frequency is
35Hz。
The flexible circuit board of wireless charger is further prepared, the flexible circuit board is stacked gradually in conjunction with 20 μm
One Wireless charging coil diaphragm, 5 μm of graphite shielding films, 5 μm of substrates and 20 μm of second Wireless charging coil diaphragm, first nothing
Line charge electric coil diaphragm and and the second Wireless charging coil diaphragm include that above-mentioned filling glue is prepared.
The each component parts by weight of 1 Examples 1 to 3 of table match (%)
The filling glue that Wireless charging coil diaphragm is used for prepared by embodiment 1-3 is tested for the property, test method
As described below.
Coating obtained by above-described embodiment is tested, test method is as follows:
(1) the filling glue that above-described embodiment 1-3 is prepared glue thickness: is measured into its glue-line thickness with micron micrometer
Degree；
(2) tensile strength: the filling glue that above-described embodiment 1-3 is prepared is measured it with tensilon and is stretched by force
Degree；
(3) it is small that the filling glue that above-described embodiment 1-3 is prepared soldering resistance: is reacted 1 in 300 DEG C of tin furnace respectively
When, 2 hours, observation filling glue form；
(4) peel strength test: filling glue that above-described embodiment 1-3 is prepared being carried out with stainless steel be bonded, is used in combination
Tensilon is at the uniform velocity pullled, and measures the peel strength of its 1 hour and 2 hours respectively；
(5) glue overflow amount: the filling glue that above-described embodiment 1-3 is prepared is placed in metallographic microscope and observes its excessive glue
Amount.
As a result such as the following table 2:
The comparison for the filling colloidality energy that 2 embodiment 1-3 of table is prepared
Such as table 2, the filling glue that each embodiment 1-3 is prepared has carried out glue thickness, tensile strength, soldering resistance, stripping respectively
Analysis from 5 intensity, glue overflow amount performances.Wherein, professional standard provides: the thickness for the glue being prepared should be " 10 ± 2 μm "；
The test of soldering resistance is that 1 hour, 2 hours are reacted at 300 DEG C, and not blistering obtained glue is qualification；Peel strength is that will fill out
It fills glue and is carried out with stainless steel be bonded, and at the uniform velocity pullled with tensilon, pull 1 hour, 2 hours, obtained peel strength
>=0.8N/mm is qualification；Glue overflow amount is that the filling glue that will be prepared is observed in metallographic microscope, glue overflow amount≤
0.1mm is qualification.
Specifically, for fill glue glue thickness measurement analyze, wherein the filling glue that embodiment 1 is prepared with a thickness of
12μm；The filling glue that embodiment 2 is prepared is with a thickness of 12 μm；The filling glue that embodiment 3 is prepared is with a thickness of 11 μm.It can be with
Find out, compared with the bondline thickness of professional standard carries out, the preparation-obtained glue line material thickness of the present invention is moderate, meets row
The standard of industry, while being more favorable to the preparation applied to Wireless charging coil diaphragm, flexible circuit board.
Secondly, analyzing for the measurement for filling glue tensile strength, the filling glue tensile strength that embodiment 1 is prepared is
12N/mm；The filling glue tensile strength that embodiment 2 is prepared is 13.4N/mm；The filling glue that embodiment 3 is prepared stretches
Intensity is 15.47N/mm；Thus, preparation-obtained filling glue can keep toughness during stretching, it is not easy to quilt
It breaks；It can also be preferably applied for the preparation of Wireless charging coil diaphragm, flexible circuit board simultaneously.
Analysis can be carried out to filling glue soldering resistance, soldering resistance refers to reacts 1 hour, 2 hours at 300 DEG C, and what is obtained fills out
It is qualification that it is not blistering, which to fill glue,.Embodiment 1, embodiment 2, the preparation-obtained filling glue of embodiment 3 is anti-respectively at 300 DEG C
1 hour, 2 hours are answered, obtained filling glue is not blistering, qualified.Thus, it is possible to prove the resistance to weldering of preparation-obtained filling glue
Performance is good, in coating process, it is ensured that coating coplanar flat is smooth, and the filling glue material being prepared is not in harmomegathus
Phenomenon；It can also be preferably applied for the preparation of Wireless charging coil diaphragm, flexible circuit board simultaneously.
Filling glue peel strength is analyzed, " peel strength is that will fill glue and stainless steel progress to professional standard regulation
Bonding, and at the uniform velocity pullled with tensilon, 1 hour, 2 hours are pullled, obtained peel strength >=0.8N/mm is to close
Lattice ".According to the data of table 2, after pullling 1 hour, the preparation-obtained filling glue peel strength of embodiment 1 is 1N/mm；Implement
The preparation-obtained filling glue peel strength of example 2 is 1.34N/mm；The preparation-obtained filling glue peel strength of embodiment 3 is
1.12N/mm；After pullling 2 hours, the preparation-obtained filling glue peel strength of embodiment 1 is 1.1N/mm；Embodiment 2 is made
Standby obtained filling glue peel strength is 1.47N/mm；The preparation-obtained filling glue peel strength of embodiment 3 is 1.25N/mm；
After pullling 1 hour, 2 hours, embodiment 1-3 it is preparation-obtained filling glue peel strength >=0.8N/mm, meet mark
It is quasi-.It can be seen that preparation-obtained filling glue have very strong cementability, make the Wireless charging coil diaphragm being prepared,
Flexible circuit board function admirable.
Filling glue glue overflow amount is analyzed, the filling glue being prepared is observed in metallographic microscope, excessive glue
Amount≤0.1mm is qualification.The filling glue that embodiment 1-3 is prepared is observed in metallographic microscope respectively, is overflow
Glue amount is respectively 0.06mm, 0.03mm, 0.04mm, meets the standard of " glue overflow amount≤0.1mm " described in industry, makes to be prepared
Wireless charging coil diaphragm, flexible circuit board function admirable.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811452239.7A CN109439227A (en) | 2018-11-30 | 2018-11-30 | A kind of Wireless charging coil covering glue film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811452239.7A CN109439227A (en) | 2018-11-30 | 2018-11-30 | A kind of Wireless charging coil covering glue film and preparation method thereof |
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| CN109439227A true CN109439227A (en) | 2019-03-08 |
Family
ID=65554477
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| CN201811452239.7A Pending CN109439227A (en) | 2018-11-30 | 2018-11-30 | A kind of Wireless charging coil covering glue film and preparation method thereof |
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Cited By (1)
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| CN113276514A (en) * | 2021-04-26 | 2021-08-20 | 昆山联友昌电子有限公司 | Flame-retardant protective film for wireless charging coil |
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