CN109429432A - A kind of PCB consent board machining process - Google Patents
A kind of PCB consent board machining process Download PDFInfo
- Publication number
- CN109429432A CN109429432A CN201710754263.5A CN201710754263A CN109429432A CN 109429432 A CN109429432 A CN 109429432A CN 201710754263 A CN201710754263 A CN 201710754263A CN 109429432 A CN109429432 A CN 109429432A
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- CN
- China
- Prior art keywords
- parts
- consent
- pcb
- oil
- machining process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention relates to a kind of PCB consent board machining process, and for manufacturing pcb board, when green oil prints, which is mixed by special jack oil and welding resistance face oil according to the mass ratio of 1:1 pcb board.Special jack oleoresin content is high, does not have developability, consent can guarantee the plumpness of ink in hole, and the developability of welding resistance face oil is strong, and resin content is low, occur to do over again when consent is bad；When special jack oil and welding resistance face oil are carried out 1:1 proportion consent, both it can guarantee the resin content of new rabbet ink, while also having met the developability of new consent oil, in the condition for the plumpness for guaranteeing consent, occur it is bad do over again, not will lead to scrapping for pcb board.
Description
Technical field
The present invention relates to a kind of PCB consent board machining process, belong to pcb board manufacturing field.
Background technique
With the development of mounting technology, it is desirable that the windowing of pcb board single side is used for patch, plug oil is required in hole, when guaranteeing patch
Tin sweat(ing) will not fall to formation tin poor short circuit on component by being penetrated into other one side in hole.
In the fabrication process, there are two types of common rabbet ink modes: the first is pcb board, uses special jack ink
Carry out consent；Second to use welding resistance face oil, even plug band prints.
The advantage of the first ink plugging is that ink can gorge completely in hole, and disadvantage is when discovery has bad, and pcb board is not
It can do over again, because consent oil has no idea to do over again in hole, PCB be caused to scrap.
Second of welding resistance face oil even do over again for appearance is bad by plug band print advantage, and ink can do over again completely in hole, but
The disadvantage is that cavity is more in consent hole, ink is shunk too many after drying, and ink plumpness is inadequate in hole.
It is therefore desirable to design a kind of PCB consent board machining process, to overcome the above problem.
Summary of the invention
It is an object of the invention to overcome the defect of the prior art, a kind of PCB consent board machining process, PCB plug are provided
It easily does over again when occurring bad when hole, while guaranteeing ink plumpness requirement in consent.
The present invention is implemented as follows:
The present invention provides a kind of PCB consent board machining process, for manufacturing pcb board, which is characterized in that pcb board is printed in green oil
When, which is mixed by special jack oil and welding resistance face oil according to the mass ratio of 1:1.
Further, the special jack oil includes following parts by weight of component: 25-40 parts of epoxy resin, glycidol class
10-15 parts of reactive diluent, 3-5 parts of latent curing agent, 0.5-1.5 parts of imidazole type curing accelerator, inorganic particle 45-60
Part.
Further, the inorganic particle is made of micron silica powder and nanometer grade silica powder.
Further, welding resistance face oil includes following parts by weight of component: 35-65 parts of hyperbranched resin；Reactive diluent
20-35 parts；10-20 parts of inorganic filler；0-15 parts of pigment；0-6 parts of function additive；2-5 parts of photoinitiator.
Further, the inorganic filler is at least one of calcium carbonate, kaolin, talcum powder.
Further, the function additive is at least one of defoaming agent, levelling agent, antioxidant, dispersing agent.
Further, pcb board first carries out exposure process, then carries out developing procedure after green oil printing, after developing procedure
Increase empty exposure process.
The invention has the following advantages:
When green oil prints, which is mixed by special jack oil and welding resistance face oil according to the mass ratio of 1:1 pcb board,
Special jack oleoresin content is high, does not have developability, consent can guarantee the plumpness of ink in hole, the developability of welding resistance face oil
By force, resin content is low, occurs to do over again when consent is bad；It is filled in special jack oil and welding resistance face oil are carried out 1:1 proportion
Kong Shi both can guarantee the resin content of new rabbet ink, while also meet the developability of new consent oil, guarantee the full of consent
The condition of degree, appearance is bad to do over again, and not will lead to scrapping for pcb board.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's all other embodiment obtained without making creative work belongs to what the present invention protected
Range.
The embodiment of the present invention provides a kind of PCB consent board machining process, for manufacturing pcb board, which is characterized in that pcb board
In green oil printing, which is mixed by special jack oil and welding resistance face oil according to the mass ratio of 1:1.
In the preferred embodiment, the special jack oil includes following parts by weight of component: 25-40 parts of epoxy resin, contracting
10-15 parts of water glycerols reactive diluent, 3-5 parts of latent curing agent, 0.5-1.5 parts of imidazole type curing accelerator, inorganic powder
45-60 parts of body.Wherein, the inorganic particle is made of micron silica powder and nanometer grade silica powder.It is described
Special jack oil is prepared by mentioned component, with high-fire resistance, high-insulativity, low-k and low viscosity thixotroping
Property stablize.
Further, welding resistance face oil includes following parts by weight of component: 35-65 parts of hyperbranched resin；Reactive diluent
20-35 parts；10-20 parts of inorganic filler；0-15 parts of pigment；0-6 parts of function additive；2-5 parts of photoinitiator.Wherein, described inorganic
Filler is at least one of calcium carbonate, kaolin, talcum powder.The function additive be defoaming agent, levelling agent, antioxidant,
At least one of dispersing agent.Welding resistance face oil is prepared by mentioned component, not only has good curing performance,
Curing rate is fast, but also there is extremely strong heat resistance, excellent weatherability, while the hyperbranched resin can also form densification
Polymer film, the coating formed have excellent weatherability, heat-resisting quantity and splendid resistance to acid and alkali.
Pcb board when green oil prints, the green oil by special jack oil and welding resistance face oil according to the mass ratio mixing of 1:1 and
At special jack oleoresin content is high, does not have developability, consent can guarantee the plumpness of ink in hole, the development of welding resistance face oil
Property is strong, and resin content is low, occurs to do over again when consent is bad；Special jack oil and welding resistance face oil are being subjected to 1:1 proportion
When consent, the resin content of new rabbet ink both can guarantee, while also having met the developability of new consent oil, guaranteeing the full of consent
The condition of full scale, appearance is bad to do over again, and not will lead to scrapping for pcb board.
Further, pcb board first carries out exposure process, then carries out developing procedure after green oil printing, after developing procedure
Increase empty exposure process.
Further, use the aqueous sodium carbonate that concentration is 1%-2% as developer solution, the temperature of developer solution in developing procedure
It is 30 DEG C -40 DEG C.High-pressure sodium lamp or Iodine gallium light are all made of as light source in exposure process and empty exposure process.
In exposure process, to check whether the mylar of exposure frame and instrument bezel are clean before starting exposure, if
Completely electrostatic preventive cloth wiped clean should not used then to open the power switch of exposure machine in time, then open vacuum button selection exposure
Program can allow exposure machine " sky expose " five times before not starting formally to expose, and the effect of " sky exposes " is to enable the machine to enter saturation
Working condition, so that ultraviolet exposure lamp energy is entered normal range (NR).If the not energy of " sky exposes " Exposing Lamp
Optimal working condition may not entered.Pcb board will be made to go wrong in exposure.Exposure machine enters optimum Working,
Before being aligned with photographic film, to check whether negative quality is qualified.Check whether medicine face has pin hole and exposure on negative
Part, it is whether consistent with the figure of pcb board because this will check that photograph negative can be to avoid because of some unnecessary reasons
Pcb board is set to do over again or scrap.
In developing procedure, development operation carries out in developing machine, controls temperature, transmission speed, the spray pressure of developer solution
The photographic parameters such as power can obtain better development effect.It in the preferred embodiment, the use of concentration is 1%- in developing procedure
2% aqueous sodium carbonate is 30 DEG C -40 DEG C as developer solution, the temperature of developer solution.Development is that the development of the part of shading is molten
Liquid removes the welding resistance on pad.Before formal development, developing machine is heated up, solution is made to reach predetermined temperature, to reach
Optimal development effect.Three parts of developing machine point: first segment is spray section, mainly utilizes high-pressure injection natrium carbonicum calcinatum,
It is dissolved down the solder resist not being exposed；Second segment is washing section, is to be washed using high-pressure pump first, first by residual solution water
Wash clean is thoroughly cleaned subsequently into circulating water wash；Third section is blowing section, respectively has an air knife to be mainly before and after blowing section
Plank is dried up with hot wind, then has the temperature of blowing section is higher plank can also be dried.
Increase empty exposure process after the completion of developing procedure, keeps ink pellet surface progress in the hole of opening one side window position tentatively solid
Change, then upon thermal curing, printing ink solvent can uniformly volatilize to hole both sides in hole, rather than all to opening one side window position
Hole face volatilization would not occur since the solvent in hole uniformly volatilizees to aperture two sides because all excessively to aperture one side
The ink that volatilization is formed remains on the pad in aperture, can solve ink or printing ink solvent remains on the pad in aperture this and asks
Topic, to improve production efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of PCB consent board machining process, for manufacturing pcb board, which is characterized in that pcb board is when green oil prints, the green oil
It is mixed by special jack oil and welding resistance face oil according to the mass ratio of 1:1.
2. PCB consent board machining process as described in claim 1, it is characterised in that: the special jack oil includes following heavy
Amount part component: 25-40 parts of epoxy resin, 10-15 parts of glycidol class reactive diluent, 3-5 parts of latent curing agent, imidazoles
0.5-1.5 parts of type curing accelerator, 45-60 parts of inorganic particle.
3. PCB consent board machining process as claimed in claim 2, it is characterised in that: the inorganic particle is by micron order dioxy
SiClx powder and nanometer grade silica powder composition.
4. PCB consent board machining process as described in claim 1, it is characterised in that: welding resistance face oil includes following weight
Part component: 35-65 parts of hyperbranched resin；20-35 parts of reactive diluent；10-20 parts of inorganic filler；0-15 parts of pigment；Function helps
0-6 parts of agent；2-5 parts of photoinitiator.
5. PCB consent board machining process as claimed in claim 4, it is characterised in that: the inorganic filler is calcium carbonate, kaolinite
At least one of soil, talcum powder.
6. PCB consent board machining process as claimed in claim 4, it is characterised in that: the function additive is defoaming agent, levelling
At least one of agent, antioxidant, dispersing agent.
7. PCB consent board machining process as described in claim 1, it is characterised in that: pcb board first carries out after green oil printing
Then exposure process carries out developing procedure, increases empty exposure process after developing procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710754263.5A CN109429432B (en) | 2017-08-29 | 2017-08-29 | PCB (printed circuit board) plugging plate processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710754263.5A CN109429432B (en) | 2017-08-29 | 2017-08-29 | PCB (printed circuit board) plugging plate processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109429432A true CN109429432A (en) | 2019-03-05 |
| CN109429432B CN109429432B (en) | 2021-09-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710754263.5A Active CN109429432B (en) | 2017-08-29 | 2017-08-29 | PCB (printed circuit board) plugging plate processing technology |
Country Status (1)
| Country | Link |
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| CN (1) | CN109429432B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110944456A (en) * | 2019-12-16 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board solder mask process |
| CN111132473A (en) * | 2019-12-27 | 2020-05-08 | 重庆秦嵩科技有限公司 | PCB assembly processing technology |
| CN114666986A (en) * | 2022-03-24 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Hole plugging method for through hole of PCB and PCB preparation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110944456A (en) * | 2019-12-16 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board solder mask process |
| CN111132473A (en) * | 2019-12-27 | 2020-05-08 | 重庆秦嵩科技有限公司 | PCB assembly processing technology |
| CN114666986A (en) * | 2022-03-24 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Hole plugging method for through hole of PCB and PCB preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109429432B (en) | 2021-09-10 |
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Address after: 432900 Chengnan Industrial Park, Xiaochang Development Zone, Xiaogan City, Hubei Province Patentee after: Hubei Longteng Electronic Technology Co.,Ltd. Address before: 432900 Chengnan Industrial Park, Xiaochang Development Zone, Xiaogan City, Hubei Province Patentee before: LONGTENG ELECTRONICS TECHNOLOGY CO.,LTD. |