CN109422453A - The residual stress of glass substrate, which reduces method and residual stress, reduces device - Google Patents
The residual stress of glass substrate, which reduces method and residual stress, reduces device Download PDFInfo
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- CN109422453A CN109422453A CN201810729492.6A CN201810729492A CN109422453A CN 109422453 A CN109422453 A CN 109422453A CN 201810729492 A CN201810729492 A CN 201810729492A CN 109422453 A CN109422453 A CN 109422453A
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- glass substrate
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- Surface Treatment Of Glass (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
A kind of residual stress of glass substrate reduces the residual stress reduction device of method and glass substrate, can reduce the residual stress of the integrally formed glass substrate of the material low with heat resistances such as resins.In addition, even for usually occurring damaged glass substrate in dozens of minutes due to high residual stress also residual stress can be reduced before there is breakage.The residual stress of glass substrate (G) reduces method and has the partial scan laser facula (S) high to the residual stress of glass substrate (G) to reduce the laser scanning step of residual stress.
Description
Technical field
The residual stress for reducing method and glass substrate the present invention relates to the residual stress of glass substrate reduces device.
Background technique
In order to which glass substrate is cut to product size, score line is formed on the glass substrate using break bar, later, is passed through
Curved glass substrate and along score line breaking glass substrate (for example, referring to patent document 1).
But the stress due to applying when the power and cutting of the application of break bar sword, score line leave residual stress.Therefore,
It is easy the crackle that nature generates horizontal direction on the surface of glass substrate, also, with time going by, due to moisture etc., is split
Line further growth.
Additionally, it is known that improving glass substrate by carrying out fusing rounding to the end face of glass substrate (edge) irradiation laser
End face strength technology (for example, referring to patent document 2).In the fusing rounding, the blind crack of substrate edges is eliminated, is mentioned
High end face strength.
But in the method, residual stress is generated near melting end.In addition, due to residual stress, substrate crushing
Possibility increases.Specifically, a possibility that internal flaw is grown at any time, it is damaged due to subsequent scar a possibility that liter
Height, it is sometimes damaged in dozens of minutes when residual stress is larger.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 6-144875 bulletin
Patent document 2: No. 5245819 bulletins of Japanese Patent No.
Summary of the invention
The technical problems to be solved by the invention
In view of problem above, there is the method for the residual stress at the edge for reducing glass substrate according to prior art exploitation.Example
Such as, it in the method for residual stress for reducing glass substrate, is cooled down at a slow speed after warming.Specifically, firstly, by whole
A glass substrate is heated uniformly to the temperature of glass transition temperature or more, then, is kept certain time, finally, cooling down at a slow speed
To room temperature.In general, the process that heating holding cools down at a slow speed needs the time of several hours or more.
In the method, have the advantages that almost remove the residual stress at the edge of glass substrate.In addition, also
Have the advantages that multiple glass substrates can be handled simultaneously in furnace.
But since entire substrate is heated to glass transition temperature or more, can not be applied to such as with it is resistance to resin
The integrally formed glass product of hot lower material.It is shown in FIG. 22 on glass substrate G and is formed with resin material
The glass product of P1, P2.
In addition, residual stress reduction processing needs to consume the time of several hours or more, therefore can not be residual in generation
Residual stress is reduced immediately after residue stress.Accordingly, it is difficult to be applied to go out in dozens of minutes due to higher residual stress
The existing damaged higher glass substrate of probability.
The first object of the present invention is that it is possible to reduce the integrally formed glass substrate of the material low with heat resistances such as resins
Residual stress.
The second object of the present invention is usually occur in dozens of minutes even for due to higher residual stress
Damaged glass substrate also can reduce residual stress before there is breakage.
For solving the means of technical problem
In the following, illustrating various ways as the means for solving technical problem.These modes can as needed and into
Row any combination.
The residual stress of glass substrate according to an aspect of the present invention reduces method and has following steps.
Part ◎ high to the residual stress of glass substrate carries out laser scanning to reduce the laser scanning of residual stress
Step.
In the method, since the high part of the residual stress of glass substrate is heated, can reduce with resin etc.
The residual stress of the integrally formed glass substrate of the low material of heat resistance.This is because be not to heat entire glass substrate, because
This resin etc. is difficult to the influence by heat.
In addition, in the method, if the area in the higher region of residual stress be not it is very big, can be at tens of points
Terminate residual stress reduction processing in clock, even for the glass for usually occurring breakage in dozens of minutes due to high residual stress
Glass substrate also can reduce residual stress before there is breakage.
" the high part of heating residual stress " is not heated portion of it is meant that existing in glass substrate.
" reduce residual stress " refers to, by residual stress be reduced to the growth of internal flaw at any time be inhibited and not by
Apply the degree that the glass substrate of external force is not broken up within the set time.
In laser scanning step, sweeping for multiple laser can also be carried out along the higher part of residual stress of glass substrate
It retouches.
According to this method, the time needed for shortening laser scanning step.
It, can also be along the laser scanning of part progress nearby of the end face of glass substrate in laser scanning step.
According to this method, the end face of glass substrate is nearby partially heated, integrally formed with resin etc. so as to reduce
Glass substrate end face residual stress.This is because be not that entire glass substrate is heated, thus resin etc. be difficult to by
The influence of heat.In addition, in the method, if the area in the higher region of residual stress be not it is very big, can be in number
Terminate residual stress reduction processing in ten minutes, it is damaged even for occurring due to high residual stress and usually in dozens of minutes
Glass substrate, also can occur it is damaged before reduce residual stress.
" part near end face " refers to corresponding to end face and its neighbouring part.
" part near heating end face " refers to partially exist at central side near than end face and be not heated portion of.
It, can also be along the laser scanning of part progress nearby of the end face of glass substrate in laser scanning step.
According to this method, the time required to shortening laser scanning step.
The residual stress of the glass substrate of another aspect according to the present invention reduces device and has laser aid.Laser aid
Laser scanning is carried out to the higher part of the residual stress of glass substrate, to reduce residual stress.
According to the device, the higher part of the residual stress of glass substrate is heated, therefore can reduce resistance to resin etc.
The residual stress of the integrally formed glass substrate of hot low material.This is because being not to heat entire glass substrate, therefore
Resin etc. is difficult to the influence by heat.In addition, according to the device, if the area in the higher region of residual stress is not very
Greatly, then it can terminate residual stress reduction processing in dozens of minutes, even for due to high residual stress and usually tens of
Occur damaged glass substrate in minute, also can reduce residual stress before appearance is damaged.
Laser aid can also carry out the scanning of multiple laser along the higher part of residual stress of glass substrate.
According to the device, the time needed for shortening laser scanning step.
Laser aid can also nearby part carries out laser scanning along the end face of glass substrate.
According to the device, the end face of glass substrate is nearby partially heated, so can reduce integrally formed with resin etc.
Glass substrate end face residual stress.This is because be not that entire glass substrate is heated, thus will not resin etc. bring
Heat affecting.Also, according to the device, if the area in the higher region of residual stress be not it is very big, can be at tens of points
Terminate residual stress reduction processing in clock, usually occurs damaged glass in dozens of minutes even for due to high residual stress
Substrate also can reduce residual stress before there is breakage.
Laser aid can nearby part carries out multiple laser scanning along the end face of glass substrate.
According to the device, the time required to shortening laser scanning.
Invention effect
In accordance with the invention it is possible to which the remnants for reducing the integrally formed glass substrate of the material low with heat resistances such as resins are answered
Power.This is because be not that entire glass substrate is heated, thus will not resin etc. bring heat affecting.Further, according to this hair
It is bright, if the area in the higher region of residual stress is not that very greatly, can terminate residual stress reduction in dozens of minutes
Processing can also occur even for usually occurring damaged glass substrate in dozens of minutes due to high residual stress
Residual stress is reduced before damaged.
Detailed description of the invention
Fig. 1 is the schematic diagram of the laser irradiation device of first embodiment of the invention.
Fig. 2 is the schematic diagram for showing the glass substrate of movement of laser facula.
Fig. 3 is the cross sectional photograph for being melted the glass substrate of rounding.
Fig. 4 is the curve for showing the variation of the phase delay from the end face for the glass substrate for being melted rounding towards medial side
Figure.
Fig. 5 is the diagrammatic top view for showing the part that the residual stress of glass substrate is got higher.
Fig. 6 is the constructed profile for showing the part that the residual stress of glass substrate is got higher.
Fig. 7 is the schematic diagram for showing the glass substrate of movement of laser facula.
Fig. 8 is for comparing before and after the processing in residual stress reduction from the end face for the glass substrate for being melted rounding towards centre
The curve graph of the variation of the phase delay of side.
Fig. 9 is for comparing before and after the processing in residual stress reduction from the end face for the glass substrate for being melted rounding towards centre
The curve graph of the variation of the phase delay of side.
Figure 10 is for comparing the end face from the glass substrate for being melted rounding before and after the processing in residual stress reduction
Between side phase delay variation curve graph.
Figure 11 is the simulation result for showing the asynchronous Temperature Distribution of scanning speed in residual stress reduction processing.
Figure 12 is the simulation result for showing the asynchronous Temperature Distribution of scanning speed in residual stress reduction processing.
Figure 13 is the diagrammatic top view for showing the variation of shape of laser facula S when implementing second embodiment.
Figure 14 is the diagrammatic top view for showing the variation of shape of laser facula S when implementing second embodiment.
Figure 15 is the diagrammatic top view for showing the variation of shape of laser facula S when implementing second embodiment.
Figure 16 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 17 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 18 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 19 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 20 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 21 is the schematic diagram for showing the glass substrate of movement of laser facula.
Figure 22 is the diagrammatic top view of the integrally formed existing glass product of the material low with heat resistance.
Description of symbols:
1: laser irradiation device；3: laser aid；5: transmission optical system；7: machine table；9: control unit；11: driving machine
Structure；13: workbench driving portion；15: laser oscillator；17: card for laser control unit；19: collector lens；20: end face；21: end face is attached
Near-end point；G: glass substrate；S: laser facula；Z: residual stress generating region.
Specific embodiment
1. first embodiment
(1) laser irradiation device
Fig. 1 shows the overall structure of the laser irradiation device 1 of an embodiment of the present invention.Fig. 1 is that the present invention first is real
Apply the schematic diagram of the laser irradiation device of mode.
Laser irradiation device 1 have reduce remnants and being heated the residual stress of glass substrate G high part
The function of stress.
Glass substrate G includes the part being only made of glass and is combined with made of the other materials such as resin in glass
Point.As the representative example of glass types, soda-lime glass used in display, instrument board etc., alkali-free glass can be enumerated, still
Type is not limited to these.The thickness of glass preferably exists specifically in 3mm hereinafter, for example in the range of 0.004~3mm
The range of 0.2~0.4mm.
Laser irradiation device 1 has laser aid 3.Laser aid 3 has for the laser to glass substrate G irradiation laser
Oscillator 15 and card for laser control unit 17.Card for laser control unit 17 can control the driving and laser power of laser oscillator 15.
Laser aid 3 has the transmission optical system 5 for transmitting laser to aftermentioned mechanical drive system side.Transmit light
System 5 is such as with collector lens 19, multiple reflecting mirrors (not shown), prism (not shown).
Laser irradiation device 1 has by moving the position of lens along optical axis direction to change the size of laser facula
Driving mechanism 11.
Laser irradiation device 1 has the machine table 7 of mounting glass substrate G.Effect of the machine table 7 in workbench driving portion 13
Lower movement.Workbench driving portion 13 has the mobile dress for moving machine table 7 in the horizontal direction relative to head (not shown)
Set (not shown).Mobile device is that have the well known mechanism of guide rail, motor etc..
Laser irradiation device 1 has control unit 9.Control unit 9 be with processor (such as CPU), storage device (such as
ROM, RAM, HDD, SSD etc.), the computer systems of various interfaces (such as A/D converter, D/A converter, communication interface etc.).
Control unit 9 by execute be stored in the program of storage unit (storage region part or all) corresponding to storage device come into
The various control work of row.
Control unit 9 can be both made of single processor, can also be by independent multiple processors for each control
It constitutes.
Control unit 9 can control card for laser control unit 17.Control unit 9 can control driving mechanism 11.Control unit 9 can control
Workbench driving portion 13.
Although not shown, but control unit 9 is connected with size, shape and the sensor of position of detection glass substrate G, for examining
Survey the sensor and switch and message input device of the state of each device.
(2) fusing rounding work
As the example for the processing for generating residual stress in glass substrate G, using Fig. 2~Fig. 4 to by glass substrate G's
The work that end face carries out fusing rounding is illustrated.Fig. 2 is the schematic diagram for showing the glass substrate of movement of laser facula.Fig. 3
It is that the cross sectional photograph for being melted the glass substrate that rounding is crossed is shown.Fig. 4 is the end shown from the glass substrate that rounding is crossed is melted
Face the curve graph of the variation of the phase delay (retardation) of medial side.
As shown in Fig. 2, laser is irradiated in part 21 near the end face of glass substrate G, further for glass substrate G
Scan laser facula S along the end face of glass substrate G 20.At this moment, laser facula S is set as to be located at from the end face of glass substrate G
20 deviate such as 10 μm~150 μm of position to (medial side) on the inside of substrate.
By carrying out the irradiation and scanning of laser facula S as described above, the end face of glass substrate G is nearby added part 21
Heat.Especially, by irradiating the laser of mid-infrared light, laser is transmitted through glass substrate G interior while being absorbed.Therefore, in glass
In the end face 20 of glass substrate G, the surface side for serving not only as coplanar laser illumination is heated, but also spreads the inside of glass substrate G
And back side is integrally relatively evenly heated.Therefore, the end face 20 of glass substrate G is outside with the central portion from substrate thickness
The mode of side expansion melts, as a result, as shown in figure 3, end face 20 is rounded.
It is above as a result, as shown in figure 4, part is (for example, 200 μm from end face 20 near the end face of glass substrate G
Region), phase delay (nm) increases.Phase delay is to have penetrated phase difference caused by the light of object, and be and institute in object
The proportional value of the stress being subject to.The phase delay increase for not being applied the object of external force refers to that residual stress increases.
(3) residual stress reduction is handled
Illustrated at the residual stress reduction nearby partially heated to the end face of glass substrate G using Fig. 5~Fig. 7
Reason.Fig. 5 is the diagrammatic top view for showing the part that residual stress increases in glass substrate.Fig. 6 is to show remnants in glass substrate
The constructed profile for the part that stress increases.Fig. 7 is the schematic diagram for showing the glass substrate of movement of laser facula.
As shown in fig. 7, the irradiation of part 21 swashs near the end face of glass substrate G for the glass substrate G in machine table 7
Light further scans the part 21 near the end face of glass substrate G laser facula S.Here nearby part 21 is right for end face
The residual stress generating region Z (hatched example areas) that Ying Yu has residual stress by melting rounding.
At this moment, laser facula S is set to smaller relative to glass substrate G, such as 4 μm~20mm or so size.By
This, the end face of glass substrate G is nearby heated part 21 by laser facula S.
It was found by the inventors of the present invention that the region for needing to become high temperature inhibits on edge in residual stress reduction processing
In the close limit in the direction of end face 20, to propose the present invention.Illustrate its foundation below.That is, by the scanning speed of laser facula S
Degree is set as temperature relatively slow and that glass substrate G is heated to glass transition temperature or more.As a result, becoming the region of high temperature on edge
It will not be expanded on the direction of end face 20, therefore, the effect for reducing residual stress improves.On the contrary, if scanning speed is set as
Comparatively fast, then output necessary to the temperature of glass transition temperature or more is heated to increase.When the laser facula S for exporting height is with very fast
Velocity scanning when, become the region of high temperature in the direction expansion along end face 20, as a result, under reducing the effect of residual stress
Drop.
Scanning speed is in 20mm/s or less, it is preferable that in 10mm/s hereinafter, it is highly preferred that less than 5mm/s.
It is above as a result, the end face of glass substrate G is nearby heated part 21 (in other words, residual stress generating region Z)
To more than glass transition temperature, as a result, residual stress reduces.
In the method, it (in other words, is not entire glass substrate G quilt that part 21, which is heated, near the end face of glass substrate G
Heating), so can reduce part 21 near the end face for the glass substrate G being integrally formed with low heat resistant material as resin
Residual stress.This is because resin etc. is difficult to the influence by heat.Further, if residual stress generating region Z
Area is not very greatly, then residual stress reduction processing can be completed in dozens of minutes, high remaining even for being typically due to
Stress and occur damaged glass substrate in dozens of minutes, also can occur it is damaged before reduce residual stress.
The type (wavelength) of laser is not particularly limited.
Necessary laser output is the output that glass substrate G can be heated to glass transition temperature or more.Therefore, it is using
For glass absorptivity lower laser when, need higher laser to export.
It should be noted that the heating part of glass substrate G temperature in glass transition temperature or so, it is virtually impossible to confirm
The deformation of heating part.When temperature when heating part is higher, heating part fusing, shape changes.Laser exports higher, heating part
Viscosity more decline, occur biggish deformation in a short time.According to the present invention, even if in laser output height, glass substrate G
Shape deform in the case where, residual stress also reduces.Wherein, it can allow for when applying the present invention to glass substrate G
The product that is restricted of deflection in when, it should set the upper limit of laser output, with prevent the viscosity of glass substrate G decline from
And deflection is more than permissible value.
For the heat input direction of glass substrate G, it is not particularly limited.Heat can be inputted from the surface of glass substrate G
Amount can also input heat from the back side, can also input heat from end face 20.
In said embodiment, residual stress reduction processing has been carried out after terminating to melt rounding, but can also be one
Fusing rounding and residual stress reduction processing are concurrently carried out on a glass substrate C.Specifically, by using two laser lights
Beam starts residual stress reduction processing in the way of fusing rounding work, carries out two kinds of processing simultaneously later.In such case
Under, shorten the disposed of in its entirety time.
It should be noted that multiple laser oscillators can be prepared in order to use multiple laser light beam, it can also be from one
Laser oscillator branch laser beam.
(4) experimental example
Illustrate that the residual stress based on laser scanning reduces the experimental example of processing using Fig. 8~Figure 10.Fig. 8~Figure 10 is
Glass substrate (alkali-free glasss that 200 μm of thickness) that rounding is crossed is melted before and after residual stress reduces processing for comparing
From end face to the curve graph of the variation of the phase delay of medial side.
The reduction processing of residual stress can use mid-infrared laser device (Er optical fiber laser), can also utilize far infrared
Laser (CO2Laser).The specification of Er optical fiber laser is 2.8 μm of wavelength, maximum output 10W, absorptivity about 30%, reality
The heat input on border is maximum 3W.CO2The specification of laser is 10.6 μm of wavelength, maximum output 250W, absorptivity about 80%,
Actual heat input is maximum 200W.
(4-1) first experimental example
In the fusing rounding of Fig. 8, Er optical fiber laser is used, and condition is 200 μm of spot size, 5W, 3mm/s.
In the residual stress reduction processing of Fig. 8, used Er optical fiber laser, and condition be spot size 2mm, 4W,
0.2mm/s。
From Fig. 8 it is known that the maximum value of residual stress is greatly reduced.
(4-2) second experimental example
In the fusing rounding of Fig. 9, Er optical fiber laser is used, and condition is 200 μm of spot size, 5W, 3mm/s.
In the residual stress reduction processing of Fig. 9, Er optical fiber laser is used, and will be melted under the above conditions
The substrate for changing rounding is heated under conditions of spot size 1mm, 3.5W, 1mm/s.From Fig. 9 it is known that residual stress
Maximum value reduces.
In any experimental example of Fig. 8, Fig. 9, before carrying out residual stress reduction processing, it is melted the glass that rounding is crossed
Substrate probability voluntarily broken within a few minutes~a few days is higher, in contrast, after carrying out residual stress reduction processing, i.e.,
Make to be crushed by one month.It should be noted that the power density of laser is adjusted in residual stress reduction processing,
To prevent shape after glass melting from changing.In other words, the shape for the glass substrate end face that rounding is crossed is melted in no change
In the case where shape, residual stress is reduced, reduces the probability that glass substrate is voluntarily crushed.
(4-3) third experimental example
In the fusing rounding of Figure 10, Er optical fiber laser is used, and condition is 200 μm of spot size, 5W, 3mm/s.
In the residual stress reduction processing of Figure 10, Er optical fiber laser is used, and will carry out under the above conditions
The substrate for melting rounding is heated under conditions of spot size 0.4mm, 4mm/s, laser export 4~6W.It is exported in laser
In the case where 4W, do not find that the residual stress generated in fusing rounding changes.This is because laser exports lower, glass
The temperature of glass substrate G is not above glass transition temperature.In the case where laser exports 5.5W, the maximum value of residual stress is only slightly
Decline.In addition, in fusing rounding the lower region of residual stress part, residual stress is substantially increased.6W is exported in laser
In the case where, laser output increases, as a result, glass substrate G fusing deformation.Even if being set laser output higher to glass
Substrate fusing deformation, the residual stress generated in fusing rounding heat residual in fusing rounding almost without decline in first time
The part in the lower region of residue stress, residual stress are substantially increased.
From Figure 10 it is known that in this experimental example, even if adjustment laser exports, residual stress reducing effect is relatively low.
(4-4) is investigated
As described above, the scanning speed in residual stress reduction processing is 0.2mm/s in the first experimental example, it is real second
Testing is 1mm/s in example, has obtained good result.Wherein, such as from the comparison of curve graph it is known that if scanning speed not
Fastly, then residual stress reducing effect declines.In third experimental example, scanning speed is set as faster 4mm/s, as a result, residual
Residue stress is almost without decline.As a result, in the laser scanning methods for taking present embodiment, it is preferable that scanning speed is slower.
Specifically, scanning speed is in 20mm/s or less, it is preferable that in 10mm/s hereinafter, being more preferably below 5mm/s.
Temperature simulation of the present inventor based on experiment and glass substrate, finds in residual stress reduction processing,
The region for needing to become high temperature inhibits in the close limit in the direction along end face 20, to propose the present invention.It is according to example
Such as it is illustrated by Figure 11 and Figure 12.Figure 11 and Figure 12 is to show the asynchronous temperature of scanning speed in residual stress reduction processing
Spend the simulation result of distribution.
The scanning speed that Figure 11 shows laser facula S is more slowly 0.2mm/s, the higher feelings of residual stress reducing effect
Condition.Scanning speed be set to it is relatively slow, therefore high-temperature portion (for example, region more than 300 DEG C) do not formed along end face it is longer
Length.
On the other hand, it is comparatively fast 20mm/s, the lower situation of residual stress reducing effect that Figure 12, which shows scanning speed,.Its
In, in order to be heated to the temperature with Figure 11 same degree, laser output is set as higher.Compared with Figure 11, height can be learnt
Warm portion forms long length along end face.
These are the result is that indicate one of the foundation of residual stress reducing effect decline when high-temperature portion is formed as longer along end face.
Further, the present inventor also carries out experiment described below, obtains the present invention.In reality described below
In testing, substitution scans the part 21 near end face laser facula S, will a little heat pre- timing in part 21 near end face
Between, to reduce the residual stress in the region being heated.Figure 13, Figure 14 and Figure 15 are shown when carrying out predetermined time heating
The diagrammatic top view of the change in shape of laser facula S.
Circular laser facula S100 and the longer ellipse on the direction orthogonal with end face 20 is shown in FIG. 13
The laser facula S101 of shape.Laser facula S102, S103 along the longer ellipse in end face 20 is shown in FIG. 14.In Figure 15
In show the entire end face 20 of covering and along the laser facula S104 of 20 longer shape of end face.When used laser facula S100,
When S101, S102, S103, if the output of adjustment laser and predetermined time for heating, reduce residual in heating region
Residue stress.Wherein, residual stress reducing effect is improved according to the sequence of S100 ≒ S101 > S102 > S103.When having used laser
When hot spot S104, even if the output of adjustment laser and predetermined time for heating, residual stress also do not decline.
In view of simulation result and experimental result illustrated above, the inventors found that at residual stress reduction
In reason, need to become close limit of the region inhibition in the direction along end face 20 of high temperature, to propose the present invention.
(5) first variation
In the first embodiment, the single beam scan process of the residual stress on one side of reduction glass substrate G is illustrated,
However, it is also possible to be swept simultaneously by the multiple beam that laser is irradiated in multiple places on part near the end face to glass substrate respectively
It retouches, while reducing the residual stress on multiple sides.
Figure 16~Figure 18 is used to be illustrated using such embodiment as first variation.Figure 16~Figure 18 be show it is sharp
The schematic diagram of the glass substrate of the movement of light hot spot.
As shown in figure 16, become residual stress generating region Z as part 21 near the end face on four sides of glass substrate G.
As shown in figure 17, four laser facula S scan four sides respectively.
As a result, as shown in figure 18, the residual stress of glass substrate G is reduced.In this case, with single beam scan process phase
Than shortening the processing time.It should be noted that the quantity of laser facula is also possible to 2,3 or 5 or more.
(6) second variations
In the first embodiment, glass substrate G is quadrangle and has multiple straight lines, still, for curve
Equilateral glass substrate G also can be using the present invention.
Figure 19~Figure 21 is used to be illustrated such embodiment as the second variation.Figure 19~Figure 21 be show it is sharp
The schematic diagram of the glass substrate of the movement of light hot spot.
As shown in figure 19, glass substrate G is round, is answered as part 21 near the end face of entire neighboring as remnants
Power generating region Z.
As shown in figure 20, four laser facula S are along the circumferential direction scanned respectively in four places of neighboring.?
Glass substrate G rotation can be made using as variation.
As a result, as shown in figure 21, the residual stress of glass substrate G is reduced.
It should be noted that the quantity of laser facula can also be 2,3 or 5 or more.In addition, for being formed with round hole
Part 21 becomes the case where residual stress generating region Z near the end face of the bore edges of glass substrate G, can also apply identical
Method.
2. other embodiment
More than, one embodiment of the present invention is illustrated, still, the present invention is not limited to above embodiment,
In the range of not departing from invention objective, there can be various changes.Especially, it can according to need in any combination this specification
The multiple embodiments and variation recorded.
It is can also be applied to the case where without dissolving rounding.
It is also possible to apply the invention to residual stress generating regions not near the end face of glass substrate G part and for example in
The case where entreating part.
Industrial utilizability
The residual stress that the present invention can be widely applied for glass substrate reduces the residual stress of method and glass substrate
Reduce device.
Claims (10)
1. a kind of residual stress of glass substrate reduces method, wherein have:
Laser scanning step, the part high to the residual stress of the glass substrate carry out laser scanning, answer to reduce remnants
Power.
2. the residual stress of glass substrate according to claim 1 reduces method, wherein
In the laser scanning step, multiple laser scanning is carried out along the high part of the residual stress of the glass substrate.
3. the residual stress of glass substrate according to claim 1 reduces method, wherein
In the laser scanning step, along the end face laser scanning of part progress nearby of the glass substrate.
4. the residual stress of glass substrate according to claim 3 reduces method, wherein
In the laser scanning step, along the end face multiple laser scanning of part progress nearby of the glass substrate.
5. the residual stress of glass substrate according to any one of claim 1 to 4 reduces method, wherein
In the laser scanning step, Er optical fiber laser or CO are used2Laser carries out laser scanning.
6. a kind of residual stress of glass substrate reduces device, wherein have:
Laser aid, the part high to the residual stress of the glass substrate carries out laser scanning, to reduce residual stress.
7. the residual stress of glass substrate according to claim 6 reduces device, wherein
The laser aid carries out multiple laser scanning along the high part of the residual stress of the glass substrate.
8. the residual stress of glass substrate according to claim 6 reduces device, wherein
The laser aid nearby partially carries out laser scanning along the end face of the glass substrate.
9. the residual stress of glass substrate according to claim 8 reduces device, wherein
The laser aid nearby partially carries out multiple laser scanning along the end face of the glass substrate.
10. the residual stress of glass substrate according to any one of claims 6 to 9 reduces device, wherein
The laser aid uses Er optical fiber laser or CO2Laser carries out laser scanning.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-167246 | 2017-08-31 | ||
| JP2017167246A JP6931919B2 (en) | 2017-08-31 | 2017-08-31 | Residual stress reduction method for glass substrate and residual stress reduction device for glass substrate |
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| Publication Number | Publication Date |
|---|---|
| CN109422453A true CN109422453A (en) | 2019-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810729492.6A Withdrawn CN109422453A (en) | 2017-08-31 | 2018-07-05 | The residual stress of glass substrate, which reduces method and residual stress, reduces device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6931919B2 (en) |
| KR (1) | KR20190024649A (en) |
| CN (1) | CN109422453A (en) |
| TW (1) | TW201912283A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115734952A (en) * | 2020-03-02 | 2023-03-03 | 西班牙高等科研理事会 | Method for modifying glass material |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190024649A (en) | 2019-03-08 |
| JP2019043801A (en) | 2019-03-22 |
| TW201912283A (en) | 2019-04-01 |
| JP6931919B2 (en) | 2021-09-08 |
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Application publication date: 20190305 |