CN109417591A - Optical image acquisition device and electronic equipment - Google Patents
Optical image acquisition device and electronic equipment Download PDFInfo
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- CN109417591A CN109417591A CN201880001746.0A CN201880001746A CN109417591A CN 109417591 A CN109417591 A CN 109417591A CN 201880001746 A CN201880001746 A CN 201880001746A CN 109417591 A CN109417591 A CN 109417591A
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- image acquisition
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Image Input (AREA)
- Studio Devices (AREA)
Abstract
The embodiment of the present application discloses a kind of optical image acquisition device and electronic equipment.The optical image acquisition device includes: lens assembly, including at least one camera lens；Multiple sensors are set to below the lens assembly, wherein each sensor in the multiple sensor according to a part of optical signal that the lens assembly converges for being imaged respectively.The technical solution of the embodiment of the present application is able to ascend the performance of optical image acquisition product.
Description
Technical field
The invention relates to information technology fields, and more particularly, to a kind of optical image acquisition device and
Electronic equipment.
Background technique
With the high speed development of terminal industry, biological identification technology is increasingly paid attention to by people, more easily under screen
Biometrics identification technology, such as the functionization of the lower fingerprint identification technology of screen have become needed for masses.
Shielding lower biometrics identification technology is that living things feature recognition mould group is set under display screen, is adopted by optical imagery
Collection is realized and shields lower living things feature recognition.It is higher and higher to the requirement for shielding lower living things feature recognition with the development of end product,
Such as, it is desirable that identification region it is increasing, correspondingly, the requirement to optical image acquisition product is also higher and higher.
Therefore, how the performance of improving optical Image Acquisition product, become a technical problem urgently to be resolved.
Summary of the invention
The embodiment of the present application provides a kind of optical image acquisition device and electronic equipment, is able to ascend optical image acquisition
The performance of product.
In a first aspect, providing a kind of optical image acquisition device, comprising: lens assembly, including at least one camera lens；It is more
A sensor is set to below the lens assembly, wherein each sensor in the multiple sensor is for basis respectively
A part of optical signal of the lens assembly convergence is imaged.
The technical solution of the embodiment of the present application is believed according to a part of light of lens assembly convergence respectively by multiple sensors
It number is imaged, can splice to obtain the image of high quality, so as to the performance of improving optical Image Acquisition product.
In some possible implementations, the quantity phase of the quantity of the camera lens in the lens assembly and the sensor
Together, the multiple sensor is corresponding with a plurality of lenses, and each sensor in the multiple sensor is used for respectively according to correspondence
Camera lens convergence optical signal be imaged.
In some possible implementations, the quantity of the camera lens in the lens assembly is 1 or is less than the sensing
The quantity of device.
In some possible implementations, the optical image acquisition device further include: substrate, plurality of sensor
It is set on the substrate；Electrical connection module, for being electrically connected the substrate and the multiple sensor.
In some possible implementations, the substrate include in package substrate, Rigid Flex or soft board at least
It is a kind of.
In some possible implementations, the electrical connection module includes bonding wire.
In some possible implementations, the multiple sensor is multiple sensors, a base in a chip
Multiple sensors in multiple chips on the multiple sensors or multiple substrates in multiple chips on plate.
In some possible implementations, the splicing distance between the multiple sensor is less than 2mm.
In some possible implementations, the lens assembly further include: lens barrel, for fixing the camera lens；Microscope base,
It is used to support the lens barrel.
In some possible implementations, the lens assembly is the lens assembly of lens barrel and microscope base integral type.
In some possible implementations, the lens assembly is the lens assembly of lens barrel and microscope base separate type.
In some possible implementations, the lens barrel is through type lens barrel or screw thread focusing type lens barrel.
In some possible implementations, the lens assembly further include: filtering assembly, be set to the lens barrel or
In the microscope base.
In some possible implementations, the optical image acquisition device further include: processor, for described more
The image of a sensor imaging is spliced.
In some possible implementations, the optical image acquisition device is set to below display screen.
Second aspect provides a kind of electronic equipment, comprising: display screen and any of first aspect or first aspect can
Optical image acquisition device in the implementation of energy, wherein the optical image acquisition device is set under the display screen
Side.
Detailed description of the invention
Fig. 1 is the floor map for the electronic equipment that the application can be applicable in.
Fig. 2 is partial cutaway schematic view of the electronic equipment shown in FIG. 1 along A '-A '.
Fig. 3 is the schematic diagram of the optical image acquisition device of the application one embodiment.
Fig. 4 is the multisensor of the embodiment of the present application and the schematic diagram of single-sensor imaging contrast.
Fig. 5 to Fig. 7 is the schematic diagram of the multisensor implementation of the embodiment of the present application.
Fig. 8 is the schematic diagram of the optical image acquisition device of the application another embodiment.
Specific embodiment
Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.
The technical solution of the embodiment of the present application can be applied to various electronic equipments, for example, smart phone, laptop,
The portable or mobiles such as tablet computer, game station calculate equipment and electronic databank, automobile, ATM (automatic teller machine)
Other electronic equipments such as (Automated Teller Machine, ATM), but the embodiment of the present application does not limit this.
The technical solution of the embodiment of the present application can be used for shielding lower optical image acquisition, for example, shielding lower living things feature recognition
Or shield lower concealed pick-up head function etc., wherein living things feature recognition, can also be special for other biological other than fingerprint recognition
Sign identification, for example, vivo identification etc., the embodiment of the present application does not also limit this.The skill of the embodiment of the present application in order to facilitate understanding
Art scheme is first below introduced biometrics identification technology under shielding.
As electronic equipment steps into comprehensive screen epoch, what electronic equipment front physical characteristics collecting region was shielded comprehensively is squeezed
Pressure, thus shield under (Under-display or Under-screen) biometrics identification technology more and more attention has been paid to.Under screen
Biometrics identification technology, which refers to, is mounted on living things feature recognition mould group (such as fingerprint recognition mould group) below display screen, thus
It realizes and carries out living things feature recognition operation in the display area of display screen, do not need in electronic equipment front in addition to display area
Region be arranged physical characteristics collecting region.
Shield lower biometrics identification technology carried out using the light returned from the top surface of equipment display component fingerprint incude with
Other inductive operations.The light of the return carries the information of the object (such as finger) contacted with the top surface, by acquiring and detecting
The light of the return realizes the particular optical sensor module being located at below display screen.The design of optical sensor module can be logical
It crosses and is configured to acquire and detect the optical element of the light returned properly to realize desired optical imagery.
Figures 1 and 2 show that shield the schematic diagram for the electronic equipment 100 that lower biometrics identification technology can be applicable in, wherein
Fig. 1 is the front schematic view of electronic equipment 100, and Fig. 2 is that electronic equipment 100 shown in FIG. 1 shows along the cut-away section structure of A '-A '
It is intended to.
As depicted in figs. 1 and 2, electronic equipment 100 may include display screen 120 and living things feature recognition mould group 140,
In, the display screen 120 has display area 102, and the display screen 120 is arranged in the living things feature recognition mould group 140
Lower section.
The display screen 120 can be self light emitting display panel, use with self luminous display unit as display picture
Element.For example display screen 120 can be Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen
Or micro-led (Micro-LED) display screen.In other alternate embodiments, the display screen 120 may be
Liquid crystal display (Liquid Crystal Display, LCD) or other passive light emitting displays, the embodiment of the present application is to this
With no restrictions.
On the other hand, the display screen 120 is specially touching display screen, can not only carry out picture and show, can be with
Touch or the pressing operation for detecting user, to provide a personal-machine interactive interface for user.For example, in a kind of embodiment
In, the electronic equipment 100 may include touch sensor, and the touch sensor can be specially touch panel (Touch
Panel, TP), it can be set on 120 surface of display screen, partially can also integrate or be monolithically integrated into the display
Inside screen 120, to form the touching display screen.
The living things feature recognition mould group 140 can be specially optical bio feature identification mould group, such as optical finger print mould
Group is mainly used for acquiring the biological information (such as information in fingerprint) of user.In the embodiment of the present application, the life
Object feature identification mould group 140 can be arranged at the regional area of 120 lower section of display screen, so that the biology is special
The physical characteristics collecting region (or induction region) 130 of sign identification mould group 140 is at least partially disposed at the display of the display screen 120
Region 102.
As one embodiment, the living things feature recognition mould group 140 can be specifically included with optical sensor array
Optical bio feature sensor, such as optical fingerprint sensor；The optical sensor array includes multiple optical sensor units, and
The region of the optical sensor array corresponds to the physical characteristics collecting region 130 of the living things feature recognition mould group 140.Such as
Shown in Fig. 1, the physical characteristics collecting region 130 is located among the display area 102 of the display screen 120, therefore, Yong Hu
It needs to be unlocked the electronic equipment 100 or when other biological signature verification, it is only necessary to press finger in place
In the physical characteristics collecting region 130 of the display screen 120, biological characteristic input operation can be realized.Due to biological characteristic
Acquisition testing can realize inside the display area 102 of the display screen 120,100 nothing of electronic equipment using the above structure
The special reserved space in its front is needed to be arranged fingerprint key (such as Home key), thus can be using screen scheme comprehensively.Therefore, institute
The display area 102 for stating display screen 120 can extend substantially to the entire front of the electronic equipment 100.
By taking the display screen 120 is using OLED display screen as an example, the luminescent layer of the display screen 120 has the embodiment of the present application
There is the OLED display unit array in array arrangement, the living things feature recognition mould group 140 can use the OLED and show
The OLED display unit (i.e. OLED light source) that screen 120 is located at the physical characteristics collecting region 130 is known as biological characteristic detection
Other excitation light source.Of course it is to be understood that the living things feature recognition mould group 140 can also adopt in other substitution implementations
Optical signal for carrying out biological characteristic detection identification is provided with built-in light source or external light source.In this case, light
Learning image collecting device not only can be adapted for such as OLED display screen self light emitting display panel, and it is aobvious to can be applicable to non-spontaneous light
Display screen, such as liquid crystal display or other passive light emitting displays.Also, the light of the living things feature recognition mould group 140
Learning induction arrays is specially optical detector (Photo detector) array (or for photodetector array, photosensitive unit battle array
Column) comprising it is multiple in array distribution optical detector/photosensitive units, the optical detector/photosensitive unit can be used as
The upper optical sensor unit.
When finger touch, press or close to (for ease of description, referred to collectively herein as pressing) in the biology spy
When levying pickup area 130, in finger reflection and shape occur for the light that the display unit in the physical characteristics collecting region 130 issues
At reflected light, wherein the reflected light can carry the biological information of user's finger.For example, the light is by user hand
After referring to that the fingerprint on surface reflects, since the wrinkle ridge of finger print and the reflected light of line paddy are different, reflected light
Portable belt has the finger print information of user.The reflected light returns to the display screen 120 and by living things feature recognition mould below
The photodetector array of group 140 receives and is converted to corresponding electric signal, i.e. biological characteristic detects signal.The electronics is set
Standby 100 can obtain the biological information of user based on biological characteristic detection signal, and can be with further progress
Biometric matches verifying, to complete the authentication of active user in order to confirm whether it has permission and set to the electronics
Standby 100 carry out corresponding operation.
In other alternate embodiments, the living things feature recognition mould group 140 also be can be set under the display screen 120
The larger or whole region of side, so that the physical characteristics collecting region 130 is expanded to bigger region or entire described
The entire display area 102 of display screen 120, and then realize full frame living things feature recognition.Correspondingly, component shown in Fig. 1 and Fig. 2
Size should not be construed as the restriction to the embodiment of the present application.
It should be understood that the electronic equipment 100 further includes cover sheet 110, the cover board in specific implementation
110 can be specially transparent cover plate, such as glass cover-plate or sapphire cover board, be located at the top of the display screen 120 simultaneously
The front of the electronic equipment 100 is covered, and 110 surface of the cover sheet is also provided with protective layer.Therefore, the application
In embodiment, so-called finger, which presses the display screen 120, can actually refer to finger pressing above the display screen 120
Cover board 110 or the covering cover board 110 protective layer.
On the other hand, the lower section of the living things feature recognition mould group 140 is also provided with circuit board 150, such as soft
Circuit board (Flexible Printed Circuit, FPC), the living things feature recognition mould group 140 can pass through pad solder
It is realized and its of other peripheral circuits or the electronic equipment 100 to the circuit board 150, and by the circuit board 150
The electrical interconnection and signal transmission of his element.For example, the living things feature recognition mould group 140 can pass through the circuit board 150
Receive the control signal of the processing unit of the electronic equipment 100, and can also be by the circuit board 150 by the biology
Feature detection signal is exported to the processing unit of the electronic equipment 100 or control unit etc..
Due to factors such as space and image quality, to the optical image acquisition system in living things feature recognition mould group 140
Design requirement it is higher and higher.The embodiment of the present application provides a kind of improved optical image acquisition scheme, can be used for larger
The living things feature recognition (as escribed above full frame living things feature recognition) of image area and other need optical image acquisition
In.The technical solution of the embodiment of the present application described below can be used for improving Fig. 1 and technical solution shown in Fig. 2, example
Such as, it can be used for improving living things feature recognition mould group 140 therein.The product department for not referring to or being not described in detail in being described below
Part can referring to fig. 1 and fig. 2 in scheme associated description, for sake of simplicity, repeating no more.
Fig. 3 shows the schematic diagram of the optical image acquisition device 300 of the application one embodiment.
The optical image acquisition device 300 can be set below display screen.
As shown in figure 3, optical image acquisition device 300 may include:
Lens assembly 310, including at least one camera lens；
Multiple sensors 320 are set to below the lens assembly, wherein each sensing in the multiple sensor
Device according to a part of optical signal that the lens assembly converges for being imaged respectively.
In the embodiment of the present application, it is imaged using multiple sensors, wherein each sensor is respectively according to the mirror
A part of optical signal of head assembly convergence is imaged.Optionally, the optical signal of multiple sensor sensings can partly overlap,
That is, the image of multiple sensor imagings can partly overlap.
In this way, the image that multiple sensors can be imaged is spliced to obtain complete image.Relative to only with one
The scheme that sensor is imaged, the picture quality that the technical solution of the embodiment of the present application obtains is higher, so as to promote light
Learn the performance of Image Acquisition product.
For biggish identification region, biggish image area is needed.Image area is positively correlated with visual field size.It obtains
Visual field greatly is obtained, may be needed again sufficiently large camera lens overall length (Total tracking length, TTL), and it is consumer at present
Equipment, the spaces such as electronics such as mobile phone are limited, so being difficult to go to obtain bigger image area by expanding TTL.It is this
In the case of the image that is truncated to would have to intercept some marginal zones, these marginal zones are often distorted very big, and brightness is very low
Region, subsequent recognizer are difficult to handle.That is, in lens imaging image obtained, the image of intermediate region
Quality is often best, more bigger toward marginal distortion, and brightness is lower, more difficult.Benefit using multiple sensors is only to take often
The image of the best intermediate region of a sensor mass, in this way splicing are obtained can get well with the picture quality of original same size
It is more.As shown in figure 4, comparison single-sensor interception graph region (on the left of Fig. 4) splices screenshot with multisensor at same TTL
Area (on the right side of Fig. 4), it can clearly be seen that the distortion of the latter is much smaller, and brightness absolute value is much larger.
Therefore, the technical solution of the embodiment of the present application, by multiple sensors respectively according to one of lens assembly convergence
Spectroscopic signal is imaged, and can splice to obtain the image of high quality, so as to the performance of improving optical Image Acquisition product.
In the present embodiment, at least one camera lens of the lens assembly 310 can be lens (Lens) or lens group；
As a kind of alternative embodiment, at least one described camera lens can also be one or more optical path modulation devices, the optical path tune
Device processed can be specially optical collimator or microwell array, be mainly used for for light being collimated to the sensor 320 of lower section, and
The biggish light of incident angle is isolated so that the sensing light of the induction arrays of the sensor 320 below the optical path modulation device limits
Make the optical signal in substantially vertical incidence.As a kind of specific embodiment, when the quantity of the sensor 320 is for two or more
When a, the lens assembly 310 also may include two or more optical path modulation devices, wherein each optical path modulation device respectively corresponds
In a sensor 320, and the top of its corresponding sensor 320 is set or is fitted in the top of the sensor 320.
In present specification, when the lens assembly 310 is using above-mentioned optical path modulation device, the optical path modulation device carries out light
It collimates and high angle scattered light is isolated it can be appreciated that converging to optical signal, in other words, about institute in present specification
It states lens assembly 310 convergence of optical signal is not limited to use the optical signal prosessing mode of plus lens, can also include to light
The mode of line collimation.
In addition, the optical image acquisition of large area may be implemented in the technical solution of the embodiment of the present application, so as to knowledge
Other region is extended to the full frame of bigger region even display screen, can not design guide pressing structure, Jin Erti on screen in this way
It rises blind by performance.
Optionally, the quantity of the camera lens in the lens assembly 310 can be identical as the quantity of the sensor 320, institute
State that multiple sensors 320 are corresponding with a plurality of lenses, each sensor 320 in the multiple sensor 320 is for basis respectively
The optical signal of corresponding camera lens convergence is imaged.
In the present embodiment, the quantity of sensor is matched with number of shots.Each sensor is respectively according to corresponding camera lens
The optical signal of convergence is imaged.
Optionally, the quantity of the camera lens in the lens assembly be 1 or less than the sensor quantity.Namely
It says, number of shots can also be different from the quantity of sensor.For example, multiple sensors can be covered with a macro lens, alternatively,
A small amount of camera lens covers multiple sensors.
Optionally, as shown in figure 3, the optical image acquisition device 300 further include:
Substrate 330, plurality of sensor 320 are set on the substrate 330；
Electrical connection module 340, for being electrically connected the substrate 330 and the multiple sensor 320.
Substrate 330 can use various types of substrates, for example, the substrate 330 may include package substrate, soft or hard knot
At least one of plywood or soft board.
Electrical connection module 340 is for realizing being electrically connected between the substrate 330 and the multiple sensor 320.For example,
The electrical connection module 340 can be bonding wire, can use different-diameter, different wire rods such as gold thread, copper wire and all kinds of conjunctions
Gold thread etc..The structure of electrical connection can also may be implemented in the electrical connection module 340 using other.
Splicing distance between the multiple sensor 320 is less than preset distance, for example, 2mm.
Optionally, the multiple sensor 320 can be multiple sensors, multiple on a substrate in chip
Multiple sensors in multiple chips on multiple sensors or multiple substrates in chip.
By taking two sensors splice as an example, Fig. 5-Fig. 7 respectively illustrates above-mentioned three kinds of connecting methods.Top in Fig. 5-Fig. 7
For top view, lower section is side view, wherein lens assembly 310 is not shown.
As shown in figure 5, two sensors 320 can be two sensors in a chip 350.Chip 350 is set to
On substrate 330, chip 350 includes two sensors 320.The 350 settable lens assembly 310 in top of chip, wherein two sensings
Device 320 may be disposed in the optical signal convergence region of the lens assembly 310 of top, to detect the lens assembly 310 of top respectively
A part of optical signal of convergence, to be imaged.Two sensors 320 are connect by electrical connection module 340 with substrate 330, with
The image of each self-test is sent to subsequent processor to carry out image mosaic.The implementation is chip (wafer/die)
Grade, that is, realize multiple sensors on a single die, the detection circuit of multiple sensors integrates on a single die, and can be with
Subsequent process circuit is conveyed information to by common electrical connection module.
As shown in fig. 6, two sensors 320 can be two sensings in two chips 350 on a substrate 330
Device.Two chips 350 are set on substrate 330, and each chip 350 includes a sensor 320.Each chip 350 leads to respectively
Electrical connection module 340 is crossed to connect with substrate 330.The 350 settable lens assembly 310 in top of chip, wherein two sensors 320
It may be disposed in the optical signal convergence region of lens assembly 310, to detect a part that the lens assembly 310 of top converges respectively
Optical signal, to be imaged.Two sensors 320 are connect by electrical connection module 340 with substrate 330 respectively, by each self-test
The image of survey is sent to subsequent processor to carry out image mosaic.The implementation be chip on board (Chips on Board,
COB)/package level, that is, realize a sensor, Duo Gechuan respectively on each chip in multiple chips on one substrate
Sensor conveys information to subsequent process circuit by corresponding electrical connection module on different chips, and respectively.
As shown in fig. 7, two sensors 320 can be two sensings in two chips 350 on two substrates 330
Device.Two chips 350 are respectively arranged on different substrates 330, and each chip 350 includes a sensor 320.Each chip
350 are connect by electrical connection module 340 with substrate 330 respectively.The 350 settable lens assembly 310 in top of chip, wherein two
Sensor 320 may be disposed in the optical signal convergence region of lens assembly 310, be converged with detecting the lens assembly 310 of top respectively
Poly- a part of optical signal, to be imaged.Two sensors 320 are connect by electrical connection module 340 with substrate 330 respectively,
The image of each self-test is sent to subsequent processor to carry out image mosaic.Wherein, each substrate 330 can connect
Device end matching connects.The implementation is mould group grade, that is, realizes one respectively on each chip in multiple chips on different substrate
A sensor, multiple sensors are on different chips, and after being conveyed information to respectively by corresponding electrical connection module
Continuous processing circuit.
It should be understood that above-mentioned various implementations can also be combined with each other.For example, after multiple sensors realize chip-scale splicing
It can also splice again with COB grades of other sensors realization or mould group grade, the embodiment of the present application does not limit this.
It should also be understood that two sensors shown in Fig. 5-Fig. 7 are merely illustrative, corresponding connecting method be can extend to more
A sensor should not be construed as the restriction to the embodiment of the present application.
The lens assembly 310 can also include lens barrel and microscope base other than camera lens.Lens barrel is for fixing the camera lens；
Microscope base is used to support the lens barrel.
Optionally, the lens assembly is the lens assembly of lens barrel and microscope base integral type.Alternatively, the lens assembly is mirror
The lens assembly of cylinder and microscope base separate type.
Optionally, the lens barrel is through type lens barrel or screw thread focusing type lens barrel.
Fig. 8 is an example using screw thread focusing type lens barrel.In Fig. 8, screw thread focusing type lens barrel 820 and 830 spiral shell of microscope base
Line connection.In this way, can by adjusting the height of screw thread focusing type lens barrel 820 come realize adjustment camera lens 810 and chip layer 840 it
Between distance, to realize the imaging of desired image.Wherein, it is focused, is may be implemented flexibly using screw thread focusing type lens barrel
Accurately focusing, reduces the requirement to processing technology.In Fig. 8, substrate layer 850 and chip layer 840 can be real using the application
The technical solution of example offer is applied, for example, can realize the splicing of multiple sensors using set-up mode shown in Fig. 5-Fig. 7.
Optionally, the lens assembly 310 can also include:
Filtering assembly is set in the lens barrel or the microscope base.
Filtering assembly can be used for filtering undesirable optical signal, further promote image quality.
For example, filtering assembly can be used for filtering out environment light, such as near infrared light and partial feux rouges.For example, the mankind
Finger wavelength lower than 580nm light energy in major part, if filtering assembly can be designed as wavelength-filtered from
580nm can then greatly reduce influence of the environment light to the optical detection in fingerprint induction to infrared light.
Filtering assembly can be set in any position between camera lens to sensor, the embodiment of the present application to this and it is unlimited
It is fixed.
Optionally, the optical image acquisition device 300 can also include:
Processor, the image for the multiple sensor to be imaged splice.
Processor is spliced according to the image that the multiple sensor 320 is imaged, and obtains the image of a splicing, in turn
Ranks are combined into the image of entire cog region, final to obtain required image.
The embodiment of the present application also provides a kind of electronic equipment, which may include display screen and this above-mentioned Shen
Please embodiment optical image acquisition device, wherein the optical image acquisition device is set to below the display screen.
The electronic equipment can be any electronic equipment with display screen.
Display screen can use the display screen in above description, such as OLED display screen or other display screens, display screen
Related description can be with reference to the description as described in display screen in above description, for sake of simplicity, details are not described herein.
Optionally, the display screen is organic light-emitting diode (OLED) display screen, and the luminescent layer of the display screen includes multiple having
Machine LED source, wherein when the optical image acquisition system is living creature characteristic recognition system, the biological characteristic
Identifying system is using at least partly excitation light source of the organic light-emitting diode light source as living things feature recognition.
It should be understood that the specific example in the embodiment of the present application is intended merely to that those skilled in the art is helped to more fully understand
The embodiment of the present application, rather than limit the range of the embodiment of the present application.
It should be understood that the term used in the embodiment of the present application and the appended claims is only merely for the specific reality of description
The purpose for applying example, is not intended to be limiting the embodiment of the present application.For example, being made in the embodiment of the present application and the appended claims
The "an" of singular, " above-mentioned " and "the" are also intended to including most forms, unless context clearly shows that other
Meaning.
Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure
Member can be realized with electronic hardware, computer software, or a combination of the two, can in order to clearly demonstrate hardware and software
Interchangeability generally describes each exemplary composition and step according to function in the above description.These functions are actually
It is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technician
Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed
Scope of the present application.
In several embodiments provided herein, it should be understood that disclosed system, device can pass through it
Its mode is realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the unit, only
Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be tied
Another system is closed or is desirably integrated into, or some features can be ignored or not executed.In addition, shown or discussed phase
Mutually between coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING or communication of device or unit
Connection is also possible to electricity, mechanical or other form connections.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit
The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple
In network unit.Some or all of unit therein can be selected to realize the embodiment of the present application scheme according to the actual needs
Purpose.
It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit
It is that each unit physically exists alone, is also possible to two or more units and is integrated in one unit.It is above-mentioned integrated
Unit both can take the form of hardware realization, can also realize in the form of software functional units.
If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product
When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially
The all or part of the part that contributes to existing technology or the technical solution can be in the form of software products in other words
It embodies, which is stored in a storage medium, including some instructions are used so that a computer
Equipment (can be personal computer, server or the network equipment etc.) executes the complete of each embodiment the method for the application
Portion or part steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey
The medium of sequence code.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can readily occur in various equivalent modifications or replace
It changes, these modifications or substitutions should all cover within the scope of protection of this application.Therefore, the protection scope of the application should be with right
It is required that protection scope subject to.
Claims (16)
1. a kind of optical image acquisition device characterized by comprising
Lens assembly, including at least one camera lens；
Multiple sensors are set to below the lens assembly, wherein each sensor in the multiple sensor is for dividing
It is not imaged according to a part of optical signal that the lens assembly converges.
2. optical image acquisition device according to claim 1, which is characterized in that the number of the camera lens in the lens assembly
Amount is identical as the quantity of the sensor, and the multiple sensor is corresponding with a plurality of lenses, each of the multiple sensor
Sensor according to the optical signal that corresponding camera lens converges for being imaged respectively.
3. optical image acquisition device according to claim 1, which is characterized in that the number of the camera lens in the lens assembly
Amount for 1 or less than the sensor quantity.
4. optical image acquisition device according to any one of claim 1 to 3, which is characterized in that the optical imagery
Acquisition device further include:
Substrate, plurality of sensor are set on the substrate；
Electrical connection module, for being electrically connected the substrate and the multiple sensor.
5. optical image acquisition device according to claim 4, which is characterized in that the substrate includes package substrate, soft
Harden at least one of plywood or soft board.
6. optical image acquisition device according to claim 4 or 5, which is characterized in that the electrical connection module includes weldering
Line.
7. optical image acquisition device according to any one of claim 1 to 6, which is characterized in that the multiple sensing
Device is multiple sensors in a chip, on multiple sensors or multiple substrates in multiple chips on a substrate
Multiple chips in multiple sensors.
8. optical image acquisition device according to any one of claim 1 to 7, which is characterized in that the multiple sensing
Splicing distance between device is less than 2mm.
9. optical image acquisition device according to any one of claim 1 to 8, which is characterized in that the lens assembly
Further include:
Lens barrel, for fixing the camera lens；
Microscope base is used to support the lens barrel.
10. optical image acquisition device according to claim 9, which is characterized in that the lens assembly is lens barrel and mirror
The lens assembly of seat integral type.
11. optical image acquisition device according to claim 9, which is characterized in that the lens assembly is lens barrel and mirror
The lens assembly of seat separate type.
12. optical image acquisition device according to claim 11, which is characterized in that the lens barrel be through type lens barrel or
Person's screw thread focusing type lens barrel.
13. the optical image acquisition device according to any one of claim 9 to 12, which is characterized in that the lens group
Part further include:
Filtering assembly is set in the lens barrel or the microscope base.
14. optical image acquisition device according to any one of claim 1 to 13, which is characterized in that the optical picture
As acquisition device further include:
Processor, the image for the multiple sensor to be imaged splice.
15. according to claim 1 to optical image acquisition device described in any one of 14, which is characterized in that the optical picture
As acquisition device is set to below display screen.
16. a kind of electronic equipment characterized by comprising display screen and
According to claim 1 to optical image acquisition device described in any one of 15, wherein the optical image acquisition device
It is set to below the display screen.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/107347 WO2020061748A1 (en) | 2018-09-25 | 2018-09-25 | Optical image capturing device and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109417591A true CN109417591A (en) | 2019-03-01 |
Family
ID=65462640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880001746.0A Pending CN109417591A (en) | 2018-09-25 | 2018-09-25 | Optical image acquisition device and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109417591A (en) |
| WO (1) | WO2020061748A1 (en) |
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| CN112055134A (en) * | 2019-06-05 | 2020-12-08 | 上海耕岩智能科技有限公司 | Image acquisition device and electronic equipment |
| US11356583B2 (en) | 2019-06-05 | 2022-06-07 | Shanghai Harvest Intelligence Technology Co., Ltd. | Image capturing apparatus, electronic equipment and terminal |
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Also Published As
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| WO2020061748A1 (en) | 2020-04-02 |
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Application publication date: 20190301 |