CN109378276B - Method for manufacturing electronic packaging module and electronic packaging module - Google Patents

Abstract

The invention discloses a manufacturing method and a structure of an electronic packaging module. The method comprises the following steps: providing a circuit substrate, the circuit substrate has an assembly plane and at least one ground pad, and a plurality of electronic devices are arranged on the assembly plane; forming at least a first molding body to cover part of the plurality of electronic components; forming a first shielding layer to cover the first molding body and contact the circuit substrate; forming a second molding body to cover the first molding a sealing body, the plurality of electronic components, and the assembly plane; removing a part of the first molding body and a part of the second molding body to expose a part of the first shielding layer; and forming a second shielding layer covering The first molding body and the second molding body are electrically connected to the first shielding layer. The present invention can completely protect electronic components from electromagnetic interference.

Description

Manufacturing method of electronic package module and electronic package module

This application is a part of the Chinese invention patent application of ASE Semiconductor Manufacturing Co., Ltd. (the application date is August 8, 2014, the application number is 201410389354.X, and the invention name is "Manufacturing method of electronic packaging module and electronic packaging module"). case application.

technical field

The invention relates to a manufacturing method and structure of an electronic packaging module, in particular to a manufacturing method and structure of an electronic packaging module using two-stage molding and using two-stage shielding.

Background technique

Currently, electronic packaging modules generally include a circuit board and a plurality of electronic components mounted on the circuit board. These electronic components are, for example, chip packages or passive components. In addition, most electronic packaging modules usually include a molding compound, which is used to encapsulate the above-mentioned electronic components to protect the electronic components.

Electronic components are becoming more and more complex, and users' demands for faster processing speed and smaller component sizes are also increasing. Today's electronic products are required to be light, thin and short, so that the distribution density of electronic components and circuits is too high, which increases some problems, such as electromagnetic interference (EMI). In particular, how to form a multi-block electromagnetic shielding structure on a circuit board where electronic components and circuits are densely distributed, that is, forming a plurality of electromagnetic shielding compartments, has become a requirement of existing communication products.

A well-known technique is to form a large-area molding block on a circuit board first, then dig a groove on the molding block, and then fill the groove with a metal material to form a compartment. However, in these manufacturing processes, the metal material filled in the groove cannot be evenly distributed in the groove due to the aspect ratio of the groove. For example, the metal material filled in the groove cannot contact the circuit substrate at the bottom of the groove, or has Pores, air gaps, etc. Therefore, the metal compartments formed in this way are prone to problems of poor electrical conductivity or uneven electrical conductivity, and the size of the metal compartments is limited by the aspect ratio of the trench, so it is difficult to reduce the size of the metal compartments.

In addition, US Patent Publication No. US2008/0055878 discloses an electronic component with an electromagnetic shielding structure, which does not have a shielding structure with a metal compartment, and the thickness of the electronic component is limited by the thickness of the molding material and is difficult to reduce .

SUMMARY OF THE INVENTION

The invention provides a manufacturing method of an electronic package module, which can form shielding by two-stage molding and two-stage plating without being limited by the aspect ratio of the shielding layer, and can completely protect the electromagnetic interference between electronic components.

A manufacturing method of an electronic packaging module, comprising the following steps: providing a circuit substrate, the circuit substrate has an assembly plane and at least one ground pad, a plurality of electronic components are arranged on the assembly plane; forming at least a first encapsulating body covering part electronic components; forming a first shielding layer, covering the first molding body and contacting the circuit substrate; forming a second molding body to cover the first molding body, the electronic components, and the assembly plane; removing part of the first molding body and part of it a second molding body to expose part of the first shielding layer; and forming a second shielding layer, covering the first molding body, the second molding body, and electrically connecting the first shielding layer.

An electronic packaging module structure, comprising: a circuit substrate, the circuit substrate has an assembly plane and a ground pad; electronic components are arranged on the assembly plane; a first molding body and a second molding body respectively cover a part of the electronic components; A shielding layer conformally covers the first molded body and is electrically connected to the ground pad, and the first molded body and the second molded body are isolated by the first shielding layer; and a second shielding layer covers the first molded body and electrically connected to the first shielding layer; wherein, the first shielding layer is fabricated before the second molding body is formed.

In order to further understand the technology, method and effect adopted by the present invention, please refer to the following detailed description and accompanying drawings of the present invention. It is believed that the features and characteristics of the present invention can be understood in depth and concretely. However, the attached The accompanying drawings and attachments are only provided for reference and description, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an electronic packaging module structure according to an embodiment of the present invention.

2 to 8 are schematic cross-sectional views of the electronic package module structure in FIG. 1 during the manufacturing process.

FIG. 9 is a flowchart of a method for manufacturing an electronic package module according to an embodiment of the present invention.

Among them, the reference numerals are described as follows:

Electronic package module structure 1

Circuit substrate 11

Assembly plane 111

ground pad 12

The first electronic component 131

Second electronic components 132, 132'

The first initial molded body 141'

The first molded body 141

first shielding layer 151

The second initial molded body 161'

The second molded body 161

The second shielding layer 171

sacrificial layer 181

Underfill 191

Mask 2

Steps S1 to S6

Detailed ways

The terms first, second, third, etc. may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the inventive concept.

Please refer to FIG. 1 . FIG. 1 is a schematic cross-sectional view of an electronic package module structure according to an embodiment of the present invention. An embodiment of the present invention provides an electronic packaging module structure 1, the electronic packaging module structure 1 includes a circuit substrate 11, a plurality of electronic components (eg, a first electronic component 131, a second electronic component 132, 132'), a first shielding layer 151 , the second shielding layer 171 , the first molding body 141 , and the second molding body 161 adjacent to the first molding body 141 . The circuit substrate 11 has an assembly plane 111 , and the assembly plane 111 includes a first area (not shown) and a second area (not shown). The circuit substrate 11 further includes a plurality of ground pads 12 , some of which are exposed on the assembly plane 111 of the circuit substrate 11 , and some of the ground pads 12 can be selectively disposed and exposed on the side of the circuit substrate 11 according to design requirements.

The first electronic component 131 is located in the first area of the assembly plane 111 , and the second electronic components 132 and 132 ′ are located in the second area of the assembly plane 111 . The first molded body 141 is located in the first area and covers the first electronic component 131 ; the second molded body 161 is located on the assembly plane 111 outside the molded body 141 . The first shielding layer 151 is electrically connected to the ground pad 12 of the circuit substrate 11 , and the first encapsulating body 141 and the second encapsulating body 161 are isolated by the first shielding layer 151 . The second shielding layer 171 is comprehensively formed above the circuit substrate 11 to cover the first encapsulating body 141 , the second encapsulating body 161 , the assembly plane 111 and part of the second electronic components, and is in direct contact with the first shielding layer 151. The second shielding layer 171 can also be directly electrically connected to the grounding pad 12 , even including the grounding pad 12 exposed on the side of the circuit substrate 11 . In other embodiments, the first electronic component may also be exposed from the first molding body 141 to directly contact the second shielding layer 171 .

In the above, the region corresponding to the formation of the first molded body is the first region, and the region corresponding to the formation of the second molded body is the second region, for the convenience of explanation and understanding, and is not intended to limit the interpretation of the first region and the second region. For example, the first molding body may also be a packaging material of an integrated circuit package (IC package). Therefore, if the second electronic component 132 ′ is an electronic component of an integrated circuit package (IC package), or semiconductor chips are stacked and mounted on the circuit substrate 11 by flip-chip bonding, and are not covered by the second molding body, Then the area where it is located may also be referred to as the first area.

The following will explain a method for manufacturing an electronic package module of the present invention through embodiments. Please refer to FIGS. 2 to 8 . FIGS. 2 to 8 are schematic cross-sectional views of the electronic package module structure in FIG. 1 during the manufacturing process.

As shown in FIG. 1 , first, a circuit substrate 11 is provided, and the circuit substrate 11 has an assembly plane 111 (eg, the upper surface of the circuit substrate 11 ). The assembly plane 111 includes a first area and a second area (not shown).

The circuit substrate 11 has a plurality of pre-set ground pads 12 and circuit layers (not shown). The ground pad 12 is made of conductive material and is electrically connected to a conductive circuit (not shown) or a ground plane (not shown). The ground pad 12 and the circuit layer are both located on the assembly plane 111 or embedded in the substrate, and the ground pad 12 is further exposed on the side of the circuit substrate 11 .

Next, the electronic components are mounted on the circuit substrate 11, and the assembling method can be performed by using Surface Mount Technology (SMT), but is not limited thereto.

Referring to FIG. 3 , next, a first initial molding body 141 ′ is provided in the first region to cover the first electronic element 131 . The first initial molding body 141 ′ is formed by, for example, performing a molding process on the first region with a molding material, and the first initial molding body 141 ′ covers the first electronic element 131 and the first region. A part of the assembly plane 111 around an electronic component 131 . It should be noted that, in this embodiment, after the step of providing the first initial molding body 141 ′ is completed, at least a part of the at least one ground pad 12 adjacent to the first electronic component 131 is exposed on the assembly plane 111 , while It is not covered by the first initial molding body 141'. The manufacturing process of the sealant of the present invention, for example, adopts injection molding, mold chase, over-molding process, transfer molding, and top-gate manufacturing process. molding), dispenser (dispenser). The materials used to form the molded body are, for example, epoxy resin, molding compound, epoxy molding compound (EMC), polyimide (PI), and phenolic resin (Phenolics). , silica gel or silicone resin (Silicones) and so on.

In addition, in the steps of the above-mentioned encapsulation manufacturing process, the underfill 191 can be provided at the same time to cover the exposed conductive pins of the second electronic component 132 ′, so as to protect these conductive pins and make these conductive pins and the subsequent formation of the conductive pins. A shielding layer 151 (FIG. 5) is electrically isolated.

Next, as shown in FIG. 4 , a sacrificial layer 181 is provided to cover part of the second electronic element 132 . For example, a sacrificial layer 181 coating process can be performed on the circuit substrate 11 through the mask 2 with a pattern design, and the sacrificial layer 181 is provided according to the pattern of the mask 2 to cover part of the second electronic element 132 and part of the assembly plane 111 . The sacrificial layer 181 is used to remove substances formed above the sacrificial layer 181 in subsequent manufacturing processes, and to protect a portion of the second electronic device 132 covered by the sacrificial layer 181 . The material of the sacrificial layer 181 may include acrylic glue or silicone. In another embodiment, the material of the sacrificial layer 181 may include an ink composed of a photocurable resin or a thermosetting resin, such as a liquid photosensitive ink, and can be easily removed by using an organic solvent, but not limited.

Then, the first shielding layer 151 is formed. The first shielding layer 151 can serve as a metal shield between different electronic components in a vertical direction, which means to isolate electromagnetic interference between adjacent electronic components. As shown in FIG. 5 , the first shielding layer 151 is formed on the entire surface and conformal to cover the first initial molding body 141 ′, the sacrificial layer 181 , the second electronic element 132 ′, the underfill 191 , and The plane 111 is partially assembled and contacts the ground pad 12 of the circuit substrate 11 to be electrically connected to the ground pad 12 . A method for forming the first shielding layer 151 is, for example, spray coating, electroplating, electroless plating, vapor deposition, or sputtering. Those skilled in the art can know that conformal means that the formed object has substantially the same shape as the outer contour of the object it covers. For the embodiment of FIG. 5 , that is, the outer contour of the first shielding layer 151 The outer contours of the first initial molding body 141 ′, the sacrificial layer 181 , and the second electronic component 132 ′ are the same.

Next, as shown in FIG. 6 , the sacrificial layer 181 is removed to remove the first shielding layer 151 overlying the sacrificial layer 181 and expose the second electronic element 132 . In this way, the electromagnetic interference between the electronic components 131, 132, 132' in the electronic package module structure 1 can be isolated.

For the method of forming the first shielding layer 151 with the patterned sacrificial layer 181 in the above-mentioned FIGS. 4-6 , a patterned mask may be used to cover the entire assembly plane, and then metal spraying (spray coating) and curing may be performed. And the first shielding layer 151 is formed.

Next, as shown in FIG. 7 , a second initial molding body 161 ′ is provided on the assembly plane 111 to cover the first initial molding body 141 ′, the second electronic components 132 , 132 ′, the first shielding layer 151 and part of the Assembly plane 111 . The first initial molding body 141' and the second initial molding body 161' are isolated from each other by the first shielding layer 151, that is, the first shielding layer 151 is embedded in the molding material. The second initial molding body 161 ′ is formed by, for example, a molding material for the entire assembly plane 111 through a molding process, such as overmolding, general transfer molding, injection molding, or cavity molding. The material of the second initial molding body 161 ′ can be the same as the material of the first initial molding body 141 ′, for example, epoxy resin or silicone.

Next, as shown in FIG. 8 , a part of the first initial molding body 141 ′ and a part of the second initial molding body 161 ′ are removed to expose a part of the first shielding layer 151 , and at the same time, the first molding body as shown in FIG. 1 is formed body 141 and the second molding body 161 . For example, grinding or laser trimming is used to remove part of the first initial molding body 141 ′ and part of the second initial molding body 161 ′, thereby reducing the overall height of the electronic packaging module structure 1 . The height of the first molding body 141 may be smaller than the height of the first initial molding body 141 ′, and the height of the second molding body 161 may be smaller than the height of the second initial molding body 161 ′. The upper surface may be aligned with the upper surface of the second molding body 161 . At the same time, a part of the first shielding layer 151 is also removed, and the unremoved first shielding layer 151 forms a shielding structure with a certain height between the electronic components 131 and 132 .

Next, a second shielding layer 171 is formed, as shown in FIG. 1 , in this embodiment, the second shielding layer 171 can be formed on the entire surface to cover the first molding body 141 , the second molding body 161 and the second molding The upper surface of the electronic component 132'. The second shielding layer 171 can completely cover the side of the circuit substrate 11 and is electrically connected to the ground pad 12 on the side. The manufacturing process of forming the second shielding layer can use common metal coating manufacturing processes such as spray coating, electroless plating, or sputtering, or can also use conductive adhesive tape. etc., but not limited to this.

The above-mentioned embodiments can be summarized as a manufacturing method of an electronic package module according to an embodiment of the present invention, please refer to FIG. 9 . Step S1, providing a circuit substrate, the circuit substrate has an assembly plane and a ground pad, and a plurality of electronic components are arranged on the assembly plane; Step S2, forming a first molding body to cover part of the electronic components; Step S3, forming a first shielding layer , cover the first molding body and contact the ground pad on the assembly plane; step S4, form a second molding body to cover the first molding body and the electronic components on the assembly plane that are not covered by the molding body; step S5, remove Part of the molded body is exposed and part of the first shielding layer is exposed; step S6, a second shielding layer is formed, covering the entire outer surface of the molded body and electrically connecting the first shielding layer.

In another embodiment, before the formation of the second shielding layer 171 , in the step of removing part of the first initial molding body 141 ′ and part of the second initial molding body 161 ′, the drop of different heights of the molding body is utilized The resulting area provides other electronic components or electronic modules for three-dimensional stacking and electrical connection. In detail, components with a higher height and lower height can be designed in one area in advance and components with a higher height can be designed in another area, so that the distance between the top of the subsequently formed molded body and the lower electronic component is longer than that of the other area. The distance between tall electronic components is greater, so more of the mold body can be removed over the lower height component area to form areas of the mold body with different heights. Conductive structures can be formed in the molded body of the lower-height component area according to the design to connect the electronic components, the ground pads 12 of the circuit substrate 11 or the circuit layer, or the circuit layout can be formed above the molded body, and then electrically connected to the stack For the electronic components or electronic modules placed thereon, the second shielding layer 171 is finally formed to be electrically connected to the ground pad 12 . Practical methods are, for example: forming a plurality of holes in the molding body, wherein each hole exposes a ground pad or an electrical connection terminal of an electronic component; forming a plurality of metal pillars in the holes, and forming a first metal pattern layer in the molding above the body and the metal pillars, wherein each metal pillar is electrically connected to the ground pad or the electrical connection terminal of the electronic component. Next, the electronic components or electronic modules are stacked on the molding body and electrically connected to the first metal pattern layer or the metal pillars. Afterwards, a molded body is formed to fully cover the top of the assembly plane, including the stacked electronic components or electronic modules, and the formed molded body.

In the present invention, the first shielding layer and the second shielding layer are respectively formed in two stages, and the metal shielding in the vertical direction is selectively formed between individual electronic components by using the two-stage molding. The metal shielding compartment formed by this method will not There is a problem of poor or uneven conduction caused by the aspect ratio of the known metal shielding compartment, and then with the second shielding layer on the top of the molded body, the electronic components can be completely protected from electromagnetic interference. In addition, by removing part of the molded body, the overall height of the electronic package module structure can be reduced at the same time. Furthermore, the electronic package module structure 1 can effectively utilize the height difference between electronic components to provide a structure capable of three-dimensional stacking. Thus the present invention can provide formfactors with smaller thicknesses.

The above descriptions are merely embodiments of the present invention, and are not intended to limit the scope of the patent protection of the present invention. Any person skilled in the art, without departing from the spirit and scope of the present invention, makes the equivalent replacement of the modification and modification, still within the scope of the patent protection of the present invention.

Claims (9)

1. a manufacturing method of an electronic package module, is characterized in that, comprises the following steps: A circuit substrate is provided, the circuit substrate has an assembly plane and at least one ground pad, and a plurality of electronic components are arranged on the assembly plane; forming at least one first molding body to cover part of the plurality of electronic components; forming a first shielding layer covering the first molding body and contacting the circuit substrate; forming a second molding body to cover the first molding body, the plurality of electronic components, and the assembling plane; removing part of the second molded body; forming a second shielding layer covering the first molding body and the second molding body; and A portion of the first shielding layer is removed. 2 . The method for manufacturing an electronic package module as claimed in claim 1 , wherein the method for forming the first shielding layer comprises: covering the entire assembly plane with a patterned shield, and then performing metal spraying and curing. 3 . 3. The method for manufacturing an electronic package module as claimed in claim 1, wherein the method for forming the first shielding layer comprises: providing a sacrificial layer covering a portion of the plurality of electronic components; conformally forming the first shielding layer to cover the first molding body, the sacrificial layer, and electrically connect one of the at least one ground pad; and Remove the sacrificial layer. 4. The method for manufacturing an electronic package module as claimed in claim 1, further comprising removing a portion of the first molding body. 5. An electronic packaging module, characterized in that the electronic packaging module comprises: a circuit substrate, the circuit substrate has an assembly plane; at least one electronic component disposed on the assembly plane; A first molding body and a second molding body respectively cover part of the electronic component; A first shielding layer surrounds the first molded body, and the first molded body is isolated from the second molded body by the first shielding layer; and A second shielding layer covers the first molding body and the second molding body and is electrically connected to the first shielding layer. 6. The electronic package module of claim 5, wherein the circuit substrate has a plurality of ground pads, and the first shielding layer is electrically connected to one of the plurality of ground pads. 7. An electronic packaging module, characterized in that the electronic packaging module comprises: a circuit substrate, the circuit substrate has an assembly plane; at least one electronic component disposed on the assembly plane; a first molding encapsulates part of the electronic component; a first shielding layer conformally covers the first molding body; and A second molding body covers the first molding body and the first shielding layer, and exposes a part of the first shielding layer. 8. The electronic packaging module of claim 7, further comprising a second shielding layer covering the first molding body. 9 . The electronic packaging module of claim 8 , wherein the second shielding layer covers the first shielding layer of the second molding body and is connected to the first shielding layer exposed to the second molding body. 10 .

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