CN109333844A - A kind of silicon wafer sliver apparatus and wafer dicing system of processing - Google Patents
A kind of silicon wafer sliver apparatus and wafer dicing system of processing Download PDFInfo
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- CN109333844A CN109333844A CN201811222638.4A CN201811222638A CN109333844A CN 109333844 A CN109333844 A CN 109333844A CN 201811222638 A CN201811222638 A CN 201811222638A CN 109333844 A CN109333844 A CN 109333844A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 136
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 136
- 239000010703 silicon Substances 0.000 title claims abstract description 136
- 238000012545 processing Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 71
- 239000012634 fragment Substances 0.000 claims abstract description 43
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 39
- 230000007306 turnover Effects 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001429 stepping effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of silicon wafer sliver apparatus and wafer dicing systems of processing.Silicon wafer sliver apparatus includes pedestal, fixed sliver sucker, rotation sliver sucker, turnover mechanism, driving mechanism and component suction nozzle；The upper end of pedestal is arranged in rotation sliver sucker, is rotatablely connected close to the side of fixed sliver sucker and the upper end of pedestal；Turnover mechanism is mounted on pedestal, and is sequentially connected with rotation sliver sucker lower part, the overturning of turnover mechanism powered rotatable sliver sucker；Fixed sliver sucker is equipped with the hole location for running through it up and down, component suction nozzle is mounted at hole location, driving mechanism and component suction nozzle are sequentially connected, and component suction nozzle can be driven to move up the top for extending to hole location, or it is moved downward to the upper end that the upper end is not higher than hole location, and component suction nozzle can be driven to rotate horizontally.Advantage: can be realized the scribed effective fragment of silicon wafer, and can adjust the angle orientation of a pair of of fragment, is conducive to subsequent production and processes, improves subsequent production processing efficiency.
Description
Technical field
The present invention relates to silicon chip process technology field, in particular to a kind of silicon wafer sliver apparatus and wafer dicing processing system
System.
Background technique
It, can by the method welded again after cell piece sliver in the case where solar battery sheet generating efficiency is certain
To improve the generated output of component.The prior art generallys use laser beam for battery when carrying out the sliver of solar battery sheet
Then piece is broken it along scribing line position using mechanical force disconnected along the scribing line for carrying out certain depth to sliver position.The prior art goes out
Showed it is a variety of break sheet devices, respectively have superiority and inferiority, improve the whole efficiency of equipment, integrated by equipment and production line is always to pursue
Theme.
Currently, the silicon wafer of the prior art is generally square silicon wafer, there are chamferings on four sides.When silicon wafer transmits after sliver,
When especially with conveyer belt transmission, there are problems that direction disunity (chamfering orientation is inconsistent), needs to increase equipment progress
There is waste in equipment cost and on time cost, be unfavorable for subsequent efficient production and processing in the overturning in direction.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of silicon wafer sliver apparatus and wafer dicing systems of processing, effectively
The defect for overcoming the prior art.
The technical scheme to solve the above technical problems is that
A kind of silicon wafer sliver apparatus, including pedestal, fixed sliver sucker, rotation sliver sucker, turnover mechanism, driving are provided
Mechanism and component suction nozzle；
Above-mentioned fixed sliver sucker is horizontally arranged at the upper end side of above-mentioned pedestal；
The upper end other side of above-mentioned pedestal is arranged in above-mentioned rotation sliver sucker, close to the one of above-mentioned fixed sliver sucker
Side and the upper end of above-mentioned pedestal are rotatablely connected；
Above-mentioned turnover mechanism is mounted on above-mentioned pedestal, and is sequentially connected with above-mentioned rotation sliver sucker lower part, above-mentioned to turn over
Rotation mechanism can drive above-mentioned rotation sliver sucker to be flipped up to level and concordant with the top of above-mentioned rotation sliver sucker, or to
Lower tip tilt；
Above-mentioned fixed sliver sucker is equipped with the hole location for running through it up and down, and said suction nozzle component is mounted at above-mentioned hole location,
Above-mentioned driving mechanism is mounted on above-mentioned pedestal, and is sequentially connected with said suction nozzle component, and above-mentioned driving mechanism can drive above-mentioned
Component suction nozzle moves up the top for extending to above-mentioned hole location, or is moved downward to the upper end that the upper end is not higher than above-mentioned hole location, and
Said suction nozzle component level can be driven to rotate；
The upper surface of above-mentioned fixed sliver sucker and rotation sliver sucker is adsorption plane.
The beneficial effects of the present invention are: can be realized the scribed effective fragment of silicon wafer, and the angle of a pair of of fragment can be adjusted
Orientation is spent, is conducive to subsequent production and processes, improve subsequent production processing efficiency.
Based on the above technical solution, the present invention can also be improved as follows.
Further, above-mentioned pedestal includes bottom plate and two side plates, and above-mentioned floor level is arranged, and two above-mentioned side plates erect respectively
Directly the both ends of above-mentioned bottom plate upper end are set, and are parallel to each other, the both ends of above-mentioned fixed sliver sucker respectively with two above-mentioned sides
The side of plate upper end is connected and fixed, and above-mentioned rotation sliver sucker is arranged between the other side of two above-mentioned side plate upper ends, is leaned on
The both ends of the side of nearly above-mentioned fixed sliver sucker are rotatablely connected with two above-mentioned side plates respectively, above-mentioned turnover mechanism and above-mentioned drive
Motivation structure is separately fixed on above-mentioned bottom plate.
Beneficial effect using above-mentioned further scheme is that pedestal design is simple, is conducive to fixed sliver sucker and rotation sliver
The installation of sucker.
Further, above-mentioned turnover mechanism is cylinder, is fixed with bracket on above-mentioned pedestal, above-mentioned turnover mechanism is rotatably installed in
On above-mentioned bracket, the other side of telescopic rod and above-mentioned rotation sliver sucker lower part is sequentially connected.
Beneficial effect using above-mentioned further scheme is to be conducive to installation, easy to use.
Further, above-mentioned driving mechanism includes lifting body and rotating mechanism, and above-mentioned lifting body is mounted on above-mentioned pedestal
On, and it is located at the lower section of above-mentioned fixed sliver sucker, above-mentioned rotating mechanism is mounted on the driving end of above-mentioned lifting body, above-mentioned suction
Nozzle assembly is mounted on the driving end of above-mentioned rotating mechanism, and above-mentioned lifting body can drive above-mentioned rotating mechanism to drive said suction nozzle group
Part moves up the top for extending to above-mentioned hole location, or is moved downward to the upper end that the upper end is not higher than above-mentioned hole location, above-mentioned rotation
Mechanism can drive said suction nozzle component to rotate.
Beneficial effect using above-mentioned further scheme is that driving mechanism design is reasonable, easy for operation, simple, effectively
Realize component suction nozzle drive fragment silicon wafer gyrobearing adjust, be conducive to subsequent processing or transport.
Further, above-mentioned lifting body is slider cylinder.
Beneficial effect using above-mentioned further scheme is to stablize lifting conducive to entire component suction nozzle.
Further, above-mentioned rotating mechanism is oscillating cylinder.
Beneficial effect using above-mentioned further scheme is the rotation conducive to fragment silicon wafer.
Further, said suction nozzle component includes suction nozzle fixed frame and multiple suction nozzles, and said suction nozzle fixed frame is fixed on above-mentioned
The driving end of rotating mechanism, multiple said suction nozzles are uniformly embedded in the upper end end of said suction nozzle fixed frame.
Beneficial effect using above-mentioned further scheme is that component suction nozzle design is simple, is easily installed.
A kind of wafer dicing system of processing is also provided, including be separately mounted on work top laser scribing mould group, silicon
Piece shifts in mould group, silicon wafer feeding transmission module to be processed, fragment silicon slice charging transmission module and such as claim to any one
The silicon wafer sliver apparatus stated；Above-mentioned silicon wafer feeding transmission module to be processed is positioned close to the position of above-mentioned laser scribing mould group,
To transport silicon wafer to be processed to above-mentioned laser scribing mould group, above-mentioned silicon wafer transfer mould group is to draw above-mentioned laser scribing mould group
The silicon wafer that line is completed is transported at above-mentioned silicon wafer sliver apparatus, and a pair of of fragment that above-mentioned silicon wafer sliver apparatus sliver is completed turns
It moves at above-mentioned fragment silicon slice charging transmission module.
Beneficial effect is: the design of wafer dicing system of processing rationally, can efficiently accomplish scribing line, the sliver, fragment of cell piece
A series of productions, high production efficiency.
Further, above-mentioned silicon wafer transfer mould group includes the mechanical rocker arm and rotation drive device of " ten " font, above-mentioned machinery
Pivoted arm is horizontally disposed, and the end of each of which pivoted arm is equipped with sucker, and above-mentioned rotation drive device is mounted on above-mentioned two above-mentioned silicon
Between piece sliver apparatus, the middle part of driving end and above-mentioned mechanical rocker arm is sequentially connected, and above-mentioned mechanical rocker arm group is located at same
The sucker of two pivoted arm ends on straight line can turn to the top of two above-mentioned silicon wafer sliver apparatus, above-mentioned fragment silicon wafer respectively
Above the feed end of blanking transmission module and at above-mentioned laser scribing mould group.
Beneficial effect using above-mentioned further scheme is double-station processing, substantially increases processing efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of silicon wafer sliver apparatus of the invention；
Fig. 2 is the structural schematic diagram before the sliver of silicon wafer sliver apparatus of the invention；
Fig. 3 is the structural schematic diagram after the sliver of silicon wafer sliver apparatus of the invention；
Fig. 4 is the structural schematic diagram of driving mechanism in silicon wafer sliver apparatus of the invention；
Fig. 5 is the overlooking structure diagram of wafer dicing system of processing of the invention.
In attached drawing, parts list represented by the reference numerals are as follows:
1, pedestal, 2, fixed sliver sucker, 3, rotation sliver sucker, 4, turnover mechanism, 5, driving mechanism, 6, suction nozzle group
Part, 11, bottom plate, 12, side plate, 51, lifting body, 52, rotating mechanism, 61, suction nozzle fixed frame, 62, suction nozzle；
100, silicon wafer sliver apparatus, 200, laser scribing mould group, 210, rotation processing work platform, 300, silicon wafer transfer mould
Group, 400, silicon wafer feeding transmission module to be processed, 500, fragment silicon slice charging transmission module.
Specific embodiment
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the invention.
Embodiment one: as shown in Figures 1 to 4, the silicon wafer sliver apparatus of the present embodiment include pedestal 1, fixed sliver sucker 2,
Rotate sliver sucker 3, turnover mechanism 4, driving mechanism 5 and component suction nozzle 6；
Above-mentioned fixed sliver sucker 2 is horizontally arranged at the upper end side of above-mentioned pedestal 1；
The upper end other side of above-mentioned pedestal 1 is arranged in above-mentioned rotation sliver sucker 3, close to above-mentioned fixed sliver sucker 2
Side and above-mentioned pedestal 1 upper end be rotatablely connected；
Above-mentioned turnover mechanism 4 is mounted on above-mentioned pedestal 1, and is sequentially connected with above-mentioned 3 lower part of rotation sliver sucker, above-mentioned
Turnover mechanism 4 can drive above-mentioned rotation sliver sucker 3 to be flipped up the upper flat to level and with above-mentioned rotation sliver sucker 3
Together, or inclination is downwardly turned over；
Above-mentioned fixed sliver sucker 2 is equipped with the hole location for running through it up and down, and said suction nozzle component 6 is mounted on above-mentioned hole location
Place, above-mentioned driving mechanism 5 are mounted on above-mentioned pedestal 1, and are sequentially connected with said suction nozzle component 6, and above-mentioned driving mechanism 5 can drive
Dynamic said suction nozzle component 6 moves up the top for extending to above-mentioned hole location, or is moved downward to the upper end not higher than above-mentioned hole location
Upper end, and said suction nozzle component 6 can be driven to rotate horizontally；
The upper surface of above-mentioned fixed sliver sucker 2 and rotation sliver sucker 3 is adsorption plane.
In view of silicon wafer is generally rectangle, therefore, fixed sliver sucker 2 and rotation sliver sucker 3 are set as rectangle
Plate structure, the side long side of the two is close to each other, and forms sliver gap.
It should be understood that above-mentioned fixed sliver sucker 2, rotation sliver sucker 3 and component suction nozzle 6 distinguish external negative pressure
Device, to form negative pressure on the adsorption plane of fixed sliver sucker 2, rotation sliver sucker 3 and component suction nozzle 6.
Before sliver, fixed sliver sucker 2 and rotation sliver sucker 3 are horizontality, and the two upper surface is concordant, will in
Between scribed silicon wafer (square silicon wafer, four equal chamferings of right angle) lie in fixed sliver sucker 2 and rotation sliver sucker
3, it is overlapped so that scribing line position projects up and down with sliver gap, in next step, opens negative pressure device, fixed sliver sucker 2 and rotation
The adsorption plane of sliver sucker 3 generates negative pressure, and silicon wafer is tightly adsorbed, and in next step, the driving rotation sliver sucker 3 of turnover mechanism 4 turns over
Turn inclination, be converted into two fragments so that the silicon wafer for pulling line be broken along scribing line, next, control negative pressure device operation cancellation is solid
Determine the negative pressure of 2 adsorption plane of sliver sucker, meanwhile, negative pressure is generated at component suction nozzle 6, so that point of rotation 3 upper surface of sliver sucker
Piece is adsorbed on component suction nozzle 6, and in next step, the operation driving component suction nozzle 6 of driving mechanism 5 rises, and drives point adsorbed thereon
Piece rises to 3 top of rotation sliver sucker, and synchronous, driving mechanism 5 drives component suction nozzle 6 to rotate horizontally 180 °, so that suction nozzle group
180 ° of the fragment adsorbed on part 6 while rotation, so that its chamfering orientation changes, the chamfering for reaching two fragments is in its same side
Purpose, after adjustment, driving mechanism 5 drives component suction nozzle 6 to be lowered back to place, finally, manipulator is by two chamfering sides
The consistent slicing synchronization in position is transferred to next processing link or transit link, it is ensured that fragment direction is unified, promotes following process
Efficiently carry out.
The present invention uses above-mentioned scheme, and the rotation of silicon wafer is carried out after the completion of sliver, silicon is completed on breaking sheet devices
Piece it is in the same direction, without increasing special slewing, convenient for integrated, save time and equipment cost.
Preferably, above-mentioned pedestal 1 includes bottom plate 11 and two side plates 12, above-mentioned bottom plate 11 is horizontally disposed, two above-mentioned sides
Plate 12 is vertically arranged in the both ends of above-mentioned 11 upper end of bottom plate respectively, and is parallel to each other, the both ends difference of above-mentioned fixed sliver sucker 2
It is connected and fixed with the side of two above-mentioned 12 upper ends of side plate, above-mentioned rotation sliver sucker 3 is arranged two above-mentioned 12 upper ends of side plate
The other side between, the both ends close to the side of above-mentioned fixed sliver sucker 2 are rotatablely connected with two above-mentioned side plates 12 respectively,
Above-mentioned turnover mechanism 4 and above-mentioned driving mechanism 5 are separately fixed on above-mentioned bottom plate 11, and entire 1 structure design comparison of pedestal is simple,
It is highly convenient for the reasonable installation of fixed sliver sucker 2 and rotation sliver sucker 3.
Above-mentioned fixed sliver sucker 2 and the both ends for rotating sliver sucker 3 are respectively fixed with rectangular connecting plate, thus
It (fixes sliver sucker 2 with the connection of 1 upper end of pedestal respectively conducive to the two and rotates the connecting plate and base at 3 both ends of sliver sucker
Frame 1 connects, and will not reduce fixed sliver sucker 2 and rotate the normal use area and structure of sliver sucker 3).
Preferably, above-mentioned turnover mechanism 4 is fixed with branch on above-mentioned pedestal 1 specifically, can be twin shaft cylinder for cylinder
Frame, above-mentioned turnover mechanism 4 is rotatably installed on above-mentioned bracket, specifically, cylinder body is rotatably installed on bracket, the upper end is stretched
The other side of bar and above-mentioned 3 lower part of rotation sliver sucker is sequentially connected, and the telescopic rod and pedestal 1 of lower end are hinged, using it is simple,
It is convenient.
Certainly, above-mentioned turnover mechanism 4 is also possible to electric pushrod or hydraulic stem etc. with the structure or production with similar effect
Product.
In some embodiments, above-mentioned driving mechanism 5 includes lifting body 51 and rotating mechanism 52, above-mentioned lifting body 51
It is mounted on above-mentioned pedestal 1, and is located at the lower section of above-mentioned fixed sliver sucker 2, above-mentioned rotating mechanism 52 is mounted on above-mentioned jacking
The driving end of mechanism 51, said suction nozzle component 6 are mounted on the driving end of above-mentioned rotating mechanism 52, and above-mentioned lifting body 51 can drive
Above-mentioned rotating mechanism 52 drives said suction nozzle component 6 to move up the top for extending to above-mentioned hole location, or is moved downward to the upper end
Not higher than the upper end of above-mentioned hole location, above-mentioned rotating mechanism 52 can drive said suction nozzle component 6 to rotate, and pass through the ingenious of Liang Zhong mechanism
The different operation of lifting and the rotation of component suction nozzle 6 is realized in combination, and design comparison is reasonable, simple, convenient, practical.
Preferably, the rotation center of rotating mechanism 52 is far from silicon wafer scribing position (sliver gap), and it is optimal, it is drawn in silicon wafer
In the vertical direction of line, it is arranged between scribing line direction parallel center line and fragment edge.
The purpose being arranged in this way is that fragment silicon wafer is completed after 180 degree rotates and another fragment silicon wafer separates a spacing
From avoiding the stacking in silicon wafer transmit process and be adhered problem the silicon wafer hereinafter referred to as fragment silicon wafer of fragment (complete).
Preferably, above-mentioned lifting body 51 be slider cylinder, it is easy to use, it is of course also possible to be vertically arranged it is straight
Line guide rail (linear guides or ball screw assembly) can also be other structures or product with lift action.
Preferably, above-mentioned rotating mechanism 52 is oscillating cylinder, it is easy to use, naturally it is also possible to be motor or other have
The structure or product of same type effect.
Preferably, said suction nozzle component 6 includes suction nozzle fixed frame 61 and multiple suction nozzles 62, said suction nozzle fixed frame 61 is fixed
At the driving end of above-mentioned rotating mechanism 52, multiple said suction nozzles 62 are uniformly embedded in the upper end end of said suction nozzle fixed frame 61,
The upper end end of suction nozzle 62 is absorption end (face), and the external negative pressure device of each suction nozzle, the design of the component suction nozzle 6 is simple,
It installs more convenient, secured.
It should be understood that the side of 61 lower part of suction nozzle fixed frame is equipped with notch, indentation, there is equipped with gas-tpe fitting, multiple suctions
Mouth 62 is connected to gas-tpe fitting respectively, the external negative pressure device of the gas-tpe fitting, it is ensured that the good arrangement of pipeline guarantees whole equipment
Structure it is compact to design, beautiful.
Embodiment two: as shown in figure 5, the wafer dicing system of processing of the present embodiment, it is characterised in that: including installing respectively
Laser scribing mould group 200, silicon wafer on work top shift mould group 300, silicon wafer feeding transmission module 400 to be processed, fragment
Silicon wafer sliver apparatus 100 in silicon slice charging transmission module 500 and such as embodiment one；Above-mentioned silicon wafer feeding transmission module to be processed
400 are positioned close to the position of above-mentioned laser scribing mould group 200, to transport silicon to be processed to above-mentioned laser scribing mould group 200
Piece, above-mentioned silicon wafer transfer mould group 300 are split the silicon wafer of above-mentioned laser scribing mould group 200 scribing line completion is transported to above-mentioned silicon wafer
At sheet devices 100, and a pair of of fragment that above-mentioned 100 sliver of silicon wafer sliver apparatus is completed is transferred to above-mentioned fragment silicon slice charging and is passed
It send at mould group 500.
In production process, silicon wafer to be processed is sent to laser scribing mould group by silicon wafer feeding transmission module 400 to be processed
200, and laser scoring operations are completed in laser scribing mould group 200, mould group 300 is shifted via silicon wafer, is transferred to silicon wafer sliver
Device 100 is completed to break piece on it, or completes to break the operation of piece and fragment, shifts mould group 300 for fragment silicon wafer via silicon wafer
It is transferred to fragment silicon slice charging transmission module 500, fragment silicon wafer is sent to subsequent processing.
More specifically, silicon wafer feeding transmission module 400 and fragment silicon slice charging transmission module 500 to be processed may respectively be
The transmission modules such as belt transmission module, being also possible to other has mechanism or product with similar loading and unloading effect.
Above-mentioned laser scribing mould group 200 include rotation processing work platform 210 and laser (laser setting rotation process
210 top of workbench, is not shown in the figure), rotation processing work platform 210 is four table top workbench of " ten " font, including " ten " word
Shape workbench arm, wherein the fixed driving device in subordinate end (driving device is fixed on work top, and driving end is upward), is driving
Dynamic device drives lower 90 degree of steppings rotation (ensuring each workbench can gradually rotate to the scanning lens of laser),
" ten " font workbench arm free end has set up sucker mould group, for adsorbing silicon wafer.When " ten " font workbench arm rotates,
Free end is respectively successively in upper material position (close to 400 discharge end of silicon wafer feeding transmission module to be processed), position of taking pictures, laser scribing position
It is stopped with lower material position, is respectively completed silicon wafer feeding to be processed, takes pictures, laser scribing and scribing line silicon slice charging.
As a preferred solution, above-mentioned silicon wafer transfer mould group 300 includes that the mechanical rocker arm of " ten " font and rotation are driven
Dynamic device, above-mentioned mechanical rocker arm is horizontally disposed, and the end of each of which pivoted arm is equipped with sucker, and (sucker suction downwards, is used for
Adsorb and shift sliver silicon wafer or fragment silicon wafer), there are two above-mentioned silicon wafer sliver apparatus 100 is set, and be spaced be mounted on it is above-mentioned
On the work top of 200 side of laser scribing mould group, above-mentioned rotation drive device is mounted on two above-mentioned silicon wafer sliver apparatus 100
Between, the middle part of driving end and above-mentioned mechanical rocker arm is sequentially connected, be located on the same line two of above-mentioned mechanical rocker arm
The sucker of pivoted arm end can turn to the top of two above-mentioned silicon wafer sliver apparatus 100, the transmission of above-mentioned fragment silicon slice charging respectively
Rotation drive device drives reciprocal 90 degree of mechanical rocker arm above the feed end of mould group 500 and at above-mentioned laser scribing mould group 200
Rotation, so as to which the silicon wafer finished of crossing on rotation processing work platform 210 is transferred to silicon wafer sliver apparatus 100；Specifically,
Two 100 spacing parallel arranging of silicon wafer sliver apparatus distributions, two suckers at a wherein pivoted arm both ends of " ten " font mechanical rocker arm
Mould group can be respectively moved to simultaneously at two silicon wafer sliver apparatus 100, meanwhile, in addition a pivoted arm both ends are respectively moved to just
Above the lower material position of rotation processing work platform 210 and the feed end of silicon wafer transmission module 500 of laser scribing mould group 200.In this way,
Two silicon wafer sliver apparatus 100 are passed with the lower material position and fragment silicon slice charging of the rotation processing work platform of laser scribing mould group 200
The starting point of mould group 500 is sent to be arranged in " ten " font direction, the above position is located at the lower section of pivoted arm, and pivoted arm is at reciprocal 90 degree
When rotation, the sucker (referred to as one group of sucker) of the two of them pivoted arm end on same straight line can be respectively completed from laser scribing
The lower material position of line mould group 200 is filled to 100 transferring silicon chip of silicon wafer sliver apparatus, and by the silicon wafer for completing fragment from silicon wafer sliver
100 transfer to fragment silicon slice charging transmission module 500 is set, meanwhile, the suction of other two pivoted arm end on same straight line
Disk (referred to as another group of sucker) is completed the transfer from the lower material position of laser scribing mould group 200 to another silicon wafer sliver apparatus 100 and is drawn
Line silicon wafer, and the transfer by fragment silicon wafer from silicon wafer sliver apparatus 100 to fragment silicon slice charging transmission module 500, one group of sucker
When completing the transfer from the lower material position of laser scribing mould group 200 to a silicon wafer sliver apparatus 100, another group of sucker completes fragment
Transfer of the silicon wafer from silicon wafer sliver apparatus 100 to fragment silicon slice charging transmission module 500, and so on, two silicon wafer sliver dresses
It sets 100 sequentially to work, mould is shifted by the setting of two silicon wafer sliver apparatus 100 and the silicon wafer of " ten " font mechanical rocker arm
The setting of group 300, is sequentially completed the feeding, sliver and blanking to two silicon wafer sliver apparatus, and the alternating expression processing of double-station makes
It obtains silicon wafer transfer mould group 300 and is completed at the same time feeding and blanking to sliver apparatus 100, silicon wafer sliver apparatus 100 can be completed at the same time
Sliver and fragment, two silicon wafer sliver apparatus 100 sequentially complete sliver Fragmentation, and processing efficiency greatly improves.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of silicon wafer sliver apparatus, it is characterised in that: including pedestal (1), fixed sliver sucker (2), rotation sliver sucker
(3), turnover mechanism (4), driving mechanism (5) and component suction nozzle (6)；
The fixed sliver sucker (2) is horizontally arranged at the upper end side of the pedestal (1)；
Rotation sliver sucker (3) is arranged in the upper end other side of the pedestal (1), close to the fixed sliver sucker
(2) upper end of side and the pedestal (1) is rotatablely connected；
The turnover mechanism (4) is mounted on the pedestal (1), and is sequentially connected with the rotation sliver sucker (3) lower part, institute
State turnover mechanism (4) can drive rotation sliver sucker (3) be flipped up to level and with rotation sliver sucker (3)
Top is concordant, or downwardly turns over inclination；
The fixed sliver sucker (2) is equipped with the hole location for running through it up and down, and the component suction nozzle (6) is mounted on the hole location
Place, the driving mechanism (5) are mounted on the pedestal (1), and are sequentially connected with the component suction nozzle (6), the driving machine
Structure (5) can drive the component suction nozzle (6) to move up the top for extending to the hole location, or be moved downward to the upper end and be not higher than
The upper end of the hole location, and the component suction nozzle (6) can be driven to rotate horizontally；
The fixed sliver sucker (2) and the upper surface for rotating sliver sucker (3) are adsorption plane.
2. a kind of silicon wafer sliver apparatus according to claim 1, it is characterised in that: the pedestal (1) includes bottom plate (11)
With two side plates (12), the bottom plate (11) is horizontally disposed, and two side plates (12) are vertically arranged in the bottom plate respectively
(11) both ends of upper end, and being parallel to each other, the both ends of the fixed sliver sucker (2) respectively with two side plate (12) upper ends
Side be connected and fixed, rotation sliver sucker (3) is arranged between the other side of two side plate (12) upper ends, leans on
The both ends of the side of the nearly fixed sliver sucker (2) are rotatablely connected with two side plates (12) respectively, the turnover mechanism
(4) it is separately fixed on the bottom plate (11) with the driving mechanism (5).
3. a kind of silicon wafer sliver apparatus according to claim 1, it is characterised in that: the turnover mechanism (4) is cylinder, institute
It states and is fixed with bracket on pedestal (1), the turnover mechanism (4) is rotatablely installed telescopic rod and the rotation on the bracket
The other side of sliver sucker (3) lower part is sequentially connected.
4. a kind of silicon wafer sliver apparatus according to any one of claims 1 to 3, it is characterised in that: the driving mechanism (5)
Including lifting body (51) and rotating mechanism (52), the lifting body (51) is mounted on the pedestal (1), and is located at described
The lower section of fixed sliver sucker (2), the rotating mechanism (52) are mounted on the driving end of the lifting body (51), the suction nozzle
Component (6) is mounted on the driving end of the rotating mechanism (52), and the lifting body (51) can drive the rotating mechanism (52)
It drives the component suction nozzle (6) to move up the top for extending to the hole location, or is moved downward to the upper end not higher than the hole
The upper end of position, the rotating mechanism (52) can drive the component suction nozzle (6) to rotate.
5. a kind of silicon wafer sliver apparatus according to claim 4, it is characterised in that: the lifting body (51) is slide unit gas
Cylinder.
6. a kind of silicon wafer sliver apparatus according to claim 4, it is characterised in that: the rotating mechanism (52) is to swing gas
Cylinder.
7. a kind of silicon wafer sliver apparatus according to claim 4, it is characterised in that: the component suction nozzle (6) includes suction nozzle
Fixed frame (61) and multiple suction nozzles (62), the suction nozzle fixed frame (61) is fixed on the driving end of the rotating mechanism (52), more
A suction nozzle (62) is uniformly embedded in the upper end end of the suction nozzle fixed frame (61).
8. a kind of wafer dicing system of processing, it is characterised in that: including the laser scribing mould group being separately mounted on work top
(200), silicon wafer shifts mould group (300), silicon wafer feeding transmission module (400) to be processed, fragment silicon slice charging transmission module (500)
With silicon wafer sliver apparatus (100) as described in any one of claim 1 to 7；The silicon wafer feeding transmission module (400) to be processed
It is positioned close to the position of the laser scribing mould group (200), to transport silicon to be processed to the laser scribing mould group (200)
Piece, silicon wafer transfer mould group (300) are transported to the silicon to the silicon wafer for completing the laser scribing mould group (200) scribing line
At piece sliver apparatus (100), and a pair of of fragment that silicon wafer sliver apparatus (100) sliver is completed is transferred to the fragment silicon
At piece blanking transmission module (500).
9. a kind of wafer dicing system of processing according to claim 8, it is characterised in that: the silicon wafer shifts mould group
(300) including the mechanical rocker arm and rotation drive device of " ten " font, the mechanical rocker arm is horizontally disposed, the end of each of which pivoted arm
Portion is equipped with sucker, there are two the silicon wafer sliver apparatus (100) sets, and is spaced and is mounted on the laser scribing mould group (200)
On the work top of side, the rotation drive device is mounted between two silicon wafer sliver apparatus (100), drives end
It is sequentially connected with the middle part of the mechanical rocker arm, the sucker for two pivoted arm ends that the mechanical rocker arm is located on the same line
Can turn to respectively the tops of two silicon wafer sliver apparatus (100), the fragment silicon slice charging transmission module (500) into
Expect above end and at the laser scribing mould group (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811222638.4A CN109333844B (en) | 2018-10-19 | 2018-10-19 | Silicon wafer splitting device and silicon wafer scribing processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811222638.4A CN109333844B (en) | 2018-10-19 | 2018-10-19 | Silicon wafer splitting device and silicon wafer scribing processing system |
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| Publication Number | Publication Date |
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| CN109333844A true CN109333844A (en) | 2019-02-15 |
| CN109333844B CN109333844B (en) | 2024-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811222638.4A Active CN109333844B (en) | 2018-10-19 | 2018-10-19 | Silicon wafer splitting device and silicon wafer scribing processing system |
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| Country | Link |
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| CN110091441A (en) * | 2019-04-29 | 2019-08-06 | 上海理工大学 | Lift semiconductor crystal wafer cleavage device |
| CN112405878A (en) * | 2020-09-30 | 2021-02-26 | 青岛铭青机电有限公司 | Automatic board breaking device for ceramic chip products |
| CN114347280A (en) * | 2022-01-11 | 2022-04-15 | 武汉三工新能源科技有限公司 | Silicon wafer quarter splitting equipment and process |
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|---|---|
| CN109333844B (en) | 2024-01-05 |
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Address after: No. 88 Jiulonghu Street, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430223 Patentee after: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Country or region after: China Address before: No.5, 2nd huashiyuan Road, Donghu New Technology Development Zone, Wuhan, Hubei 430223 Patentee before: WUHAN DR LASER TECHNOLOGY Co.,Ltd. Country or region before: China |