CN109309011B - Columnar member mounting device and columnar member mounting method - Google Patents
Columnar member mounting device and columnar member mounting method Download PDFInfo
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- CN109309011B CN109309011B CN201810819880.3A CN201810819880A CN109309011B CN 109309011 B CN109309011 B CN 109309011B CN 201810819880 A CN201810819880 A CN 201810819880A CN 109309011 B CN109309011 B CN 109309011B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
Provided are a columnar member mounting device and a columnar member mounting method, which can mount a columnar member on a predetermined position of a substrate in a small amount. The columnar member mounting device 1 according to the present invention is a columnar member mounting device for mounting a columnar member 12 in a standing state at a predetermined position on a substrate 5, comprising: a columnar member transfer mask 21 disposed on the substrate 5 and having a plurality of mask openings 34 corresponding to predetermined positions of the substrate 5; a columnar member alignment squeegee 28 disposed above the columnar member transfer mask 21 and configured to transfer the columnar member 12 to the mask opening 34 while rotating and moving; and excitation devices 22 and 23 that apply vibration to the columnar member transfer mask 21 when the columnar member arraying brush blade 28 is driven. The columnar member mounting device 1 and the columnar member mounting method are characterized in that: the columnar members 12 are arranged and mounted on the substrate 5 by the columnar member arranging brush blade 28 while applying vibration to the columnar member transfer mask 21.
Description
Technical Field
The present invention relates to a columnar member mounting device and a columnar member mounting method.
Background
Conventionally, in electrically bonding a semiconductor substrate and a circuit substrate, a device has been widely known in which a plurality of Solder bumps (Solder bumps) formed on the semiconductor substrate are melted between the semiconductor substrate and the circuit substrate to bond them (see, for example, patent document 1). However, in patent document 1, when a semiconductor substrate and a circuit board are bonded using solder bumps as a bonding material, the solder bumps expand in the radial direction after being pressed, and the distance between adjacent solder bumps is shortened, so that the tendency of substrate mounting to be miniaturized cannot be met. Therefore, patent document 2 discloses a method of forming a copper pillar (Cu pillar) as a bonding material with a circuit board on a semiconductor substrate and forming a solder layer to bond the copper pillar to the circuit board. The copper pillar disclosed in patent document 2 is suitable for a miniaturized mounting operation because the diameter does not change when the semiconductor substrate and the circuit substrate are joined. However, since the copper pillar is formed by electroplating on the semiconductor substrate to have a pillar shape, it takes a lot of time and it is difficult to say that the copper pillar has good productivity. In addition, in recent years, a columnar member (conductor Pin) formed of a metal such as copper has been introduced into the industry as a bonding material instead of the copper pillar formed on the semiconductor substrate.
However, since the length of the columnar member (conductor pin) in the longitudinal direction is very long (large in aspect ratio) with respect to the diameter thereof, it is difficult to mount the columnar member on the semiconductor substrate. Patent document 3 discloses a method of mounting a columnar member on a semiconductor substrate. In the method of mounting a columnar member described in patent document 3, first, a Jig panel (Jig palette), a pin erecting Jig, and an insertion guide Jig are arranged in a stacked manner, the columnar member is dropped from above the insertion guide Jig, the Jig panel is vibrated, and the pin erecting Jig is slid between the Jig panel and the insertion guide Jig, thereby arranging the columnar member in the pin erecting Jig. The jig panel, the pin erecting jig, and the insertion guide jig are stacked and turned upside down, and the columnar member is joined to the printed wiring board while being erected.
[ Prior Art document ]
[ patent document 1 ] Japanese patent application laid-open No. 5-243232
[ patent document 2 ] Japanese patent application laid-open No. 2014-157906
[ patent document 3 ] Japanese patent application laid-open No. 2002-314291
However, in the method of mounting the columnar members described in patent document 3, since the columnar members are dropped into the pin holes by applying vibration to the jig panel, the vibration causes the columnar members to overlap each other or to be biased toward a part of the insertion guide jig, which makes it difficult to mount the columnar members at a predetermined position on the substrate.
In view of the above, it is an object of the present invention to provide a columnar member mounting apparatus and a columnar member mounting method that can mount a columnar member at a predetermined position on a substrate in a small amount.
Disclosure of Invention
【1】 The present invention provides a columnar member mounting apparatus for mounting a columnar member in a standing state on a predetermined position of a substrate, comprising: a Transfer Mask (Transfer Mask) disposed on the substrate and having a plurality of Mask openings corresponding to predetermined positions of the substrate; a Brush-scraper (Brush-Squeegee) for columnar member alignment disposed above the mask for columnar member transfer, and configured to transfer the columnar member to the mask opening while rotating and moving; and an excitation device configured to apply vibration to the columnar member transfer mask when the columnar member alignment brush blade is driven.
According to the columnar member mounting device of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arraying brush blade, the columnar member can be mounted on the predetermined position of the substrate without much or little vibration by applying the vibration to the columnar member transfer mask.
【2】 In the columnar member mounting device of the present invention, it is preferable that: the vibration excitation device is movable along the upper end surface of the columnar member transfer mask in conjunction with the movement of the columnar member arrangement brush blade.
In this way, by causing the vibration device to be interlocked with the movement of the columnar member-aligning squeegee, the columnar member transfer mask can be vibrated in the vicinity of the rotational position of the columnar member-aligning squeegee, and the columnar member can be mounted on a predetermined position of the substrate in a small amount.
【3】 In the columnar member mounting device of the present invention, it is preferable that: the exciting device is provided in plurality so as to sandwich the columnar member aligning squeegee in arrangement.
When a plurality of exciting devices are disposed in the vicinity of the columnar member arranging squeegee, it is possible to apply almost the same vibration to the columnar member arrangement target position of the columnar member transfer mask, and to efficiently mount the columnar member at a predetermined position on the substrate in a small amount.
【4】 In the columnar member mounting device of the present invention, it is preferable that: the vibration frequency of the vibration excitation device is 100 Hz-40 kHz.
Although the vibration frequency of the exciting device can be adjusted according to the size and shape of the columnar member, if the vibration frequency is appropriately adjusted within the range of 100Hz to 40kHz, the columnar member can be transferred to the columnar member transfer mask and appropriately vibrated, so that the columnar member can be mounted at a predetermined position on the substrate in a small amount.
【5】 In the columnar member mounting device of the present invention, it is preferable that: the vibration frequency of the vibration excitation device is 10 kHz-40 kHz.
As described above, although it is possible to transfer the columnar members to the substrate by applying vibration to the columnar members by appropriately adjusting the vibration frequency of the exciting device within the range of 100Hz to 40kHz, if the vibration frequency of the exciting device is further set within the range of 10kHz to 40kHz, the mounting yield of the columnar members can be increased by 80% or more, and the columnar members can be transferred to the substrate more efficiently.
【6】 In the columnar member mounting device of the present invention, it is preferable that: the amplitude of the vibration excitation device is set to be 0.1 to 10 μm.
Although the amplitude of the vibration of the exciting device can be adjusted according to the size and shape of the columnar member, if the amplitude is appropriately adjusted within the range of 0.1 μm to 10 μm, the columnar member can be mounted at a predetermined position on the substrate in a small amount without causing a jump or a vibration of the columnar member.
【7】 In the columnar member mounting device of the present invention, it is preferable that: the amplitude of the vibration excitation device is set to be 0.1 to 0.3 μm.
As described above, the amplitude of the vibration of the exciting device can be set to be in the range of 0.1 μm to 10 μm, and the vibration can be transferred to the substrate. But if the amplitude is too large, it may cause the columnar member to jump up to hit the columnar member transfer mask and cause damage to the columnar member and the columnar member transfer mask. Therefore, by setting the amplitude of the vibration of the excitation device to be in the range of 0.1 μm to 0.3 μm, damage to the columnar member and the columnar member transfer mask can be suppressed.
【8】 In the columnar member mounting device of the present invention, it is preferable that: the vibration excitation device is an ultrasonic vibration device, and the vibration excitation device has a vibration excitation section and includes: and an excitation section elevating mechanism section capable of adjusting a distance between the columnar member transfer mask and the excitation section to be in a range of 0mm to 1 mm.
By employing the ultrasonic vibration device as the excitation device, it is possible to apply vibration to the columnar member transfer mask regardless of whether or not the excitation portion is in contact with the columnar member transfer mask, and it is possible to apply appropriate vibration to the columnar member transfer mask by appropriately adjusting the distance between the columnar member transfer mask and the excitation portion to a range of 0mm to 1 mm.
【9】 In the columnar member mounting device of the present invention, it is preferable that: the vibration excitation device is an ultrasonic vibration device and has an excitation section, and the excitation section further has: and an elastic member that offsets the weight of the exciting section while keeping an end surface of the columnar member transfer mask in contact with the columnar member transfer mask.
The elastic member is a member that causes the exciting portion to be pulled upward, and is, for example, a spring or the like. By offsetting the weight of the exciting portion by the elastic member, the load due to the vibration of the exciting portion itself can be reduced, and the columnar member transfer mask can be stably vibrated at a predetermined frequency and amplitude.
【10】 In the columnar member mounting device of the present invention, it is preferable that: the brush scraper for columnar member arrangement comprises: a bundling linear member composed of a fine twisted assembly having conductivity and flexibility and moving on the surface of the columnar member transfer mask while rotating, wherein the bundling linear member applies 5g/cm to the columnar member transfer mask during the transfer operation of the columnar member2～10g/cm2The contact pressure of (a).
In this case, the columnar member can be prevented from being mixed between the columnar member transfer mask and the bundling linear member by the vibration of the columnar member transfer mask. Even if the columnar member is occasionally mixed between the mask for transferring the columnar member and the bundling linear member, the contact pressure pressed by the bundling linear member is 5g/cm2～10g/cm2Such a very small pressure makes it possible to transfer the columnar member in a good state without causing damage such as a wound or a dent. Further, since the bundled linear member has appropriate flexibility and is always in contact with the surface of the columnar member transfer mask that vibrates slightly, it is possible to suppress the columnar member from leaking to the outside.
【11】 A method for mounting a columnar member according to the present invention is a method for mounting a columnar member in a standing state on a predetermined position of a substrate, the method including: a printing step of disposing a solder printing mask on an upper end surface of the substrate and performing solder printing on a predetermined position of the substrate; and an alignment step of arranging a columnar member transfer mask above the substrate on which the solder is printed, providing the columnar member on the columnar member transfer mask, and aligning the columnar member at a predetermined position on the substrate on which the solder is printed by rotating and moving a columnar member alignment squeegee while applying vibration to the columnar member transfer mask.
According to the method for mounting a columnar member of the present invention, when the columnar member is transferred to the mask opening of the columnar member transfer mask by the columnar member arraying brush blade, the columnar member can be mounted on the predetermined position of the substrate in a small amount by applying vibration to the columnar member transfer mask.
Drawings
Fig. 1 is a plan view showing a general configuration of a columnar member mounting device 1 according to an embodiment.
Fig. 2 is an explanatory diagram of a solder printing process performed by the solder printing apparatus 2 used in the columnar member mounting apparatus 1 for the solder 35.
Fig. 3 is an explanatory diagram of a schematic configuration of the columnar member transfer unit 25 used in the columnar member mounting apparatus 1.
Fig. 4 is an explanatory diagram of the transfer operation of the columnar member 12 by the columnar member transfer portion 25 used in the columnar member mounting apparatus 1.
Fig. 5 is a perspective view showing an example of the substrate 5 on which a plurality of columnar members 12 are arranged and mounted according to the embodiment.
Fig. 6 is a plan view showing an example of the case where the substrate 5 in the embodiment is a wafer.
Fig. 7 is a flowchart illustrating the main steps of the columnar member mounting method according to the embodiment.
Fig. 8 is an explanatory view showing main steps of the columnar member mounting method according to the embodiment.
Fig. 9 is an explanatory diagram showing a schematic configuration of a columnar member mounting device 3A according to a second example.
Fig. 10 is a graph showing the relationship between the excitation frequency f and the mounting (transfer) yield of the columnar member 12 obtained through the experiment.
Fig. 11 is an explanatory diagram of an example of the evaluation result of the mounting yield.
Detailed Description
Hereinafter, a columnar member mounting device 1 according to an embodiment of the present invention and a columnar member mounting method using the columnar member mounting device 1 will be described with reference to fig. 1 to 8.
[ constitution and operation of columnar Member mounting device 1 ]
Fig. 1 is a plan view showing a general configuration of a columnar member mounting device 1 according to an embodiment. The columnar member mounting device 1 includes: a substrate Stocker (Stocker)4 that stores substrates 5 to be loaded with columnar members 12 (see fig. 3 and 4); a substrate transfer robot 7 that transfers the substrate 5 from the substrate stocker 4 to a Prealigner (Prealigner)6, and further transfers the substrate 5 from the Prealigner 6 to a Stage (Stage) 9; a solder printing device 2 for printing solder 35 (see fig. 2) on the substrate 5; and a columnar member transfer device 3 that transfers the columnar members 12 onto the substrate 5 on which the solder 35 is printed. Further, the columnar member mounting device 1 further includes: an inspection device 26 for inspecting the mounting state of the columnar member 12; and a cleaning device 20 for removing the excess solder 35 attached to the back surface of the solder printing mask 15.
The substrate 5 is a plate-like or film-like member for fixing electronic components and then performing wiring, and is mounted with electronic components such as integrated circuits, and also includes a wafer such as a silicon semiconductor substrate or a compound semiconductor substrate, a glass substrate, and the like. The solder 35 is used to join the columnar member 12 to the substrate 5, and the material of the columnar member 12 is copper, a copper-based alloy, or the like. The solder 35 is selected from a solder having a high adhesive component so that the transferred columnar member 12 does not move or fall.
The substrate stocker 4 is composed of a Load Port (Load Port) and an UnLoad Port (UnLoad Port) (sometimes referred to as a Load Port when the target substrate is a wafer), not shown, and the transfer robot 7 takes out the substrate 5 from the Load Port and transfers the substrate to the prealigner 6. When the substrate 5 is a wafer, the substrate 5 whose center of gravity position of the substrate 5 and Notch direction (Notch direction) formed on the outer periphery of the substrate 5 are corrected by the prealigner 6 is transferred to the stage 9, and then the transfer robot 7 is returned to the standby position. The substrate 5 placed on the stage 9 is sucked onto the stage 9 under reduced pressure, and the substrate 5 is pressed by the substrate correction device 8 to correct the warpage of the substrate. The stage 9 is adjusted in position in the Y-axis direction on the Y-axis guide 10, moved on the X-axis guide 11 with the substrate 5 placed thereon, and conveyed to a predetermined position of the solder printing apparatus 2. Here, the horizontal direction in fig. 1 is an X axis, the vertical direction is a Y axis, and the height direction (thickness direction) is a Z axis.
The stage 9 can move in the X-Y plane and the Z direction by an X-axis guide 11, a Y-axis guide 10, a Z Table (not shown), and a θ Table (not shown), and can convey the substrate 5 to below the solder printing apparatus 2 and the columnar member transfer apparatus 3. The stage 9 reciprocates along the X-axis guide rail 11 between the substrate correction device 8, the solder printing device 2, and the columnar member transfer device 3, and conveys the substrate 5 to each predetermined position.
After the stage 9 on which the substrate 5 is placed is moved along the X-axis guide rail 11 to a position below the solder printing apparatus 2, the solder 35 is printed on the substrate 5 using the solder printing mask 15. If the solder 35 has been previously printed on the substrate 5 elsewhere or in another process, the printing process may be skipped. The cleaning device 20 removes the excess solder 35 attached to the back surface of the solder printing mask 15 using a cleaning sheet or a roller containing a solvent. The cleaning device 20 may blow off or vacuum-suck the excess solder 35 attached to the back surface of the solder printing mask 15 by an air gun. The process of printing the solder 35 on the substrate 5 will be specifically described with reference to fig. 2. The substrate 5 printed with the solder 35 is moved along the X-axis guide rail 11 to below the columnar member transfer device 3 in a state of being placed on the stage 9.
The columnar member transfer device 3 includes an X-axis drive device 17, a Y-axis drive device 18, and a Z-axis drive device 19, and is capable of moving the columnar member transfer unit 25 in the X-axis direction, the Y-axis direction, and the Z-axis direction. Further, the Y-axis guide rail 10 and the X-axis guide rail 11 have a Z-axis and a θ -axis (not shown), and the substrate 5 is subjected to solder printing and mounting of the columnar members 12 by driving the Z-axis and the θ -axis in accordance with the positions of the mask opening 15a (see fig. 2) of the solder printing mask 15, the mask opening 34 (see fig. 3) of the columnar member transfer mask 21, and the metal electrodes 16 of the substrate 5.
The X-axis drive device 17 is provided with exciting devices 22 and 23 sandwiching the columnar member transfer portion 25 on both sides. The exciting devices 22 and 23 move in conjunction with the movement of the columnar member transfer portion 25, apply Z-direction vibration to the columnar member transfer mask 21, and transfer the columnar member 12 to the opening 34 of the columnar member transfer mask 21 in cooperation with a columnar member alignment brush blade 28 (see fig. 3) described later. The configuration and transfer operation of the columnar member transfer portion 25 will be described with reference to fig. 3 and 4.
The substrate 5 on which the columnar members 12 are mounted is transported to the inspection device 26 and inspected for the arrangement state of the columnar members 12 by an image recognition camera (not shown) after passing through the solder printing device 2 and the substrate correction device 8, and then discharged into a substrate stocker. The prealigner 6 is not routed on the return stroke.
[ printing of solder 35 ]
Fig. 2 is an explanatory diagram of a solder printing process performed by the solder printing apparatus 2 used in the columnar member mounting apparatus 1 for the solder 35. In the drawings, for example, each part is shown enlarged. A recess 5a is formed in the substrate 5 at a position where the columnar member 12 is to be mounted, and a metal electrode 16 is formed at the bottom of the recess 5 a. The printing squeegee 24 moves from the left side to the right side in the figure along the upper end surface of the solder printing mask 15. The printing squeegee 24 is made of a flexible resin material so as not to damage the surface of the solder printing mask 15. The solder printing mask 15 has an opening 15a formed therein corresponding to the position of the recess 5a of the substrate 5.
In fig. 2, the position of the leftmost mask opening 15a is defined as position (a), the position of the middle mask opening 15a is defined as position (b), and the position of the rightmost mask opening 15a is defined as position (c). The position (a) indicates the solder 35 after the squeegee 24 passes through the mask opening 15a, and at this time, the solder 35 does not leave the surface of the solder printing mask 15. And is contained in the recess 5a of the substrate 5 to be in contact with the metal electrode 16. The position (b) shows the state of the squeegee 24 before the solder 35 is printed on the substrate 5 through the mask opening 15 a.
The position (c) indicates a mask opening portion 15a for printing the next solder paste. After the squeegee operation is completed, the print mask 15 is detached, the solder paste 35 is separated from the mask opening portion 15a and transferred to the opening bottom of the substrate 5 and printing of the solder paste 35 is completed. Fig. 8(b) shows a state of the solder paste 35 after the printing is finished. At the position (c), a small amount of the residue of the solder paste 35 remaining at the time of the previous solder paste printing adheres to the inner peripheral surface of the mask opening portion 15 a. Therefore, when the excessive solder paste is larger than the reference amount, the excessive solder paste is cleaned and removed by the cleaning device 20.
[ constitution of columnar Member transfer section 25 and transfer operation ]
Fig. 3 is an explanatory diagram of a schematic configuration of the columnar member transfer unit 25 used in the columnar member mounting apparatus 1. The columnar member transfer section 25 has a rotatable columnar member alignment brush blade 28 attached to the X-axis drive device 17. The columnar member alignment brush scraper 28 has a linear member 31 embedded in a mounting portion 30 fixed to a scraper rotation driving device 29. The linear member 31 has a double structure (double concentric circles) in the radial direction of the rotation locus of the columnar member aligning squeegee 28, and is composed of an inner linear member 32 and an outer linear member 33. The inner binding linear member 32 and the outer binding linear member 33 are both: the brush has a divergent shape diverging from the mounting portion 30 toward the columnar member transfer mask 21. In fig. 3, the bundling wire-like members 31 are shown in a simplified manner.
The inner linear member 32 has a main function of guiding the columnar member 12 into the mask opening 34 of the columnar member transfer mask 21, and the outer linear member 33 has a main function of preventing the columnar member 12 from coming off the outer side of the columnar member alignment squeegee 28, that is, preventing the columnar member 12 from coming off the outer side of the outer linear member 33. The outer bundling linear members 33 also have a function of guiding the columnar members 12 located between the outer bundling linear members 32 and the inner bundling linear members 32 into the mask opening 34 and returning the columnar members into the inner bundling linear members 32. For example, if the columnar member 12 is introduced into the mask opening 34 by rotating the columnar member alignment brush-scraping plate 28 in the direction of the arrow, the columnar member 12 can be returned into the linear member 32 inside by rotating the columnar member alignment brush-scraping plate 28 in the direction opposite to the arrow.
The bundling linear member 31 is a fine twisted wire assembly having conductivity and flexibility, and moves in the X-axis direction and the Y-axis direction while rotating while sweeping the surface of the columnar member transfer mask 21, and during this time, guides the columnar member 12 into the mask opening 34. Therefore, it does not cause damage to the columnar member 12.
Further, since the bundling wire-like member 31 has conductivity, dust does not adhere by static electricity, and mounting with high cleanliness is possible. Although simplified in fig. 3, the outer bundling linear members 33 are arranged more densely than the inner bundling linear members 32.
A suction passage 40 penetrating in the thickness direction is provided in the stage 9 on which the substrate 5 is placed, and the suction passage 40 communicates with a vacuum suction passage 42 provided in the base 41 to vacuum-suck the substrate 5 to the stage 9.
The exciting devices 22 and 23 are disposed on both sides of the columnar member transfer portion 25. The excitation devices 22 and 23 each have an excitation portion 45, and the excitation portion 45 is in contact with the columnar member transfer mask 21. The excitation devices 22 and 23 further include an excitation section elevating mechanism section 46 for adjusting the distance between the columnar member transfer mask 21 and the excitation section 45 to be within a range of 0mm to 1 mm. The exciting devices 22 and 23 are ultrasonic vibration devices, and vibrate the columnar member transfer mask 21 when the columnar member 12 is transferred by the columnar member arrangement brush blade 28. If the exciting devices 22 and 23 are ultrasonic vibration devices, the columnar member transfer mask 21 can be vibrated when the distance between the exciting section 45 and the columnar member transfer mask 21 is less than 1 mm. Further, it is preferable that the vibration frequency of the exciting devices 22 and 23 (exciting section 45) is set to be in the range of 100Hz to 40kHz, and the amplitude is set to be 0.1 μm to 10 μm. By appropriately selecting the vibration conditions in this manner, the columnar members 12 can be mounted in a predetermined position on the substrate 5 in a small number of rows in cooperation with the columnar member-arranging squeegee 28. In addition to the ultrasonic vibration device, a mechanism that converts rotation of a motor into vibration, a mechanism that uses a cylinder to continuously operate, a magnetostrictive oscillator, a voice coil motor, or the like may be used as the excitation device.
The exciting devices 22 and 23 are attached to the X drive device 17, and can be moved in the Y axis direction by the Y drive device 18 in conjunction with the movement of the columnar member arraying brush blade 28. The distance between the exciting device 22 and the exciting device 23 is fixed. Further, the exciting devices 22 and 23 may be movable in the X-axis direction in synchronization with each other, or the exciting devices 22 and 23 may be movable in the X-axis direction independently of each other, and the distance between each of them and the columnar member arraying brush blade 28 may be kept constant. However, the moving range of the exciting devices 22 and 23 is set to be out of the range in which the columnar member 12 is mounted on the substrate 5. The transfer operation of the columnar member 12 will be described in further detail with reference to fig. 4.
Fig. 4 is an explanatory diagram of the transfer operation of the columnar member 12 by the columnar member transfer section 25. A part of the columnar member transfer part 25 is shown in a simplified manner. A plurality of metal electrodes 16 are formed on the substrate 5 mounted on the stage 9, and solder 35 is printed and applied on the upper end surfaces of the metal electrodes 16. A columnar member transfer mask 21 is disposed above the substrate 5. A plurality of columnar members 12 are randomly supplied from the columnar member passages 27 onto the upper end face of the columnar member transfer mask 21. The columnar members 12 are dropped by a fixed amount (or a fixed number) by a columnar member metering device (not shown) and supplied onto the columnar member transfer mask 21. The columnar member alignment squeegee 28 moves spirally while rotating along the upper end surface of the columnar member transfer mask 21, and moves the columnar member 12 to the mask opening 34 provided in the columnar member transfer mask 21 by sweeping the surface of the columnar member transfer mask 21 by the inner bundling linear members 32 and the outer bundling linear members 33. Since the solder 35 is applied to a predetermined position on the substrate 5, the position and posture of the columnar member 12 when the transfer is performed by the viscosity of the solder 35 are maintained.
The inner bundling linear members 32 and the outer bundling linear members 33 can be moved into the mask opening 34, and then the columnar members 12 can be slightly pressed downward so that the positions and postures of the columnar members 12 can be held by the solder 35. In order to achieve such an object, it is preferable to set the thickness of the columnar member transfer mask 21 to an appropriate value with respect to the length of the columnar member aligning squeegee 28 in the longitudinal direction. The solder 35 is preferably selected to have adhesive properties that can maintain its posture after the columnar member 12 is mounted on the substrate 5 and before the reflow step of curing the joint.
When the columnar member 12 is a cylindrical body, the size of the guide opening portion 36 on the side where the columnar member 12 is provided on the mask opening portion 34 provided on the columnar member transfer mask 21 is larger than the maximum diameter of the columnar member 12 and smaller than the length of the columnar member 12. The diameter of the mask opening 34 on the substrate 5 side is the size of the position specification hole 37 capable of specifying the position of the columnar member 12 within the application range of the solder paste 35. The guide opening portion 36 and the position regulation hole portion 37 are configured to be connected to each other by a taper hole. By providing the mask opening 34 with this shape, the columnar member 12 can be smoothly dropped into the mask opening 34 together with the effect of vibrating the columnar-member transfer mask 21, and can be accurately arranged and mounted at a predetermined position in the application range of the solder 35. The mask opening 34 is formed in a shape corresponding to the shape of the columnar member 12.
Fig. 5 is a perspective view showing an example of the substrate 5 on which the plurality of columnar members 12 are arranged and mounted. On the substrate 5, the columnar members 12 are arranged on the solder 35, that is, on predetermined positions on the metal electrodes 16. The columnar member 12 maintains its posture by the viscosity of the solder 35. Then, the arrangement state of the columnar members 12 is checked by the checking device 26 (refer to fig. 1), and discharged into the substrate stocker 4. The semiconductor substrate 5 on which the columnar member 12 is mounted is, for example, conveyed to a reflow apparatus, and the substrate 5 and the columnar member 12 are joined and fixed.
Fig. 6 is a plan view showing an example of a case where the substrate 5 is a wafer, in which fig. 6(a) is a plan view of the wafer 5, and fig. 6(b) is a partially enlarged view of an electrode forming region (semiconductor integrated circuit region) 51 surrounded by a broken line a in fig. 6 (a). The semiconductor integrated circuit 52 is surrounded on four sides by dicing lines 53 provided between a group of metal electrodes 16, and is diced in accordance with the dicing lines 53 to become individual semiconductor integrated circuit chips. The cutting procedure is as follows: the substrate (wafer) 5 on which the columnar member 12 is mounted is subjected to reflow by a reflow apparatus or is performed at the end of a mounting process.
The electrode 16 is a rewired electrode. The gap between the rewired electrodes 16 is approximately 50 to 400 μm. Fig. 6 is a diagram for explaining the arrangement of the electrodes 16 formed on the substrate (wafer) 5 and the electrode forming regions 51 in which the electrodes 16 are formed, and the size, distribution, and shape of the electrode forming regions 81 are shown to be different from those of the actual object and are not similar thereto.
The substrate (wafer) 5 has a diameter of 300mm, 200mm, or the like. The arrangement of the electrodes 16 formed on the polygonal electrode forming region 51 surrounded by the dotted line is referred to as an electrode Pattern (Pattern). The pattern of the mask opening portion 34 formed on the columnar member transfer mask 21 is similar to the electrode pattern formed on the substrate (wafer) 5.
[ mounting method of columnar Member ]
Next, a method of mounting the columnar member will be described with reference to fig. 7 and 8.
Fig. 7 is a flowchart illustrating a main process of the columnar member mounting method. Fig. 8 is an explanatory view of the main steps. First, the substrate 5 is set on the stage 9 from the substrate stocker 4 by the substrate transfer robot 7 (step S10). Next, after the substrate 5 is corrected by the substrate correcting device 8, the substrate 5 is conveyed to the solder printing device 2. Fig. 8(a) shows the substrate 5 after being transferred to the solder printing apparatus 2. A metal electrode 16 is formed on the bottom of the recess 5a provided on the substrate 5.
Next, the solder printing mask 15 is provided, and the solder 35 is printed on the substrate 5 by the solder printing apparatus 2 (step S20). Fig. 8(b) shows a state where the solder 35 is printed on the substrate 5. The solder 35 spreads on the metal electrode 16 by surface tension and fills into the concave portion 5 a. Next, the substrate 5 is conveyed to the columnar member transfer device 3, the columnar member transfer mask 21 is provided, a predetermined amount of the columnar members 12 is supplied onto the columnar member transfer mask 21, and the columnar member 12 is guided into the mask opening 34 of the columnar member transfer mask 21 by driving the columnar member arranging brush-scraper 28 while applying vibration to the columnar member transfer mask 21 by the vibration excitation devices 22 and 23, and is arranged on the metal electrode 16 (step S30).
Fig. 8(c) shows a state in which the columnar members 12 are arranged on the substrate 5. The solder 35 flows in the concave portion 5a to the bottom surface and the side surface of the columnar member 12 and supports the columnar member 12 by virtue of adhesion. After the columnar member arrangement, the substrate 5 is conveyed to the inspection device 26, and the arrangement state of the columnar members 12 is inspected (step S40). When the columnar members 12 are not arranged in large or small quantities (GO), the process proceeds to a reflow step after the columnar member mounting apparatus 1 removes the columnar members 12, and the columnar members 12 are fixed to the substrate 5 (step S50). Then, the substrate 5 on which the columnar members 12 are mounted is cleaned (step S60). After these steps, the substrate 5 on which the columnar member 12 is mounted is completed.
When the arrangement state of the columnar members 12 is checked (step S40) and it is determined that the number of the columnar members 12 is too large or too small (NG), the process proceeds to the reflow process (step S50) after the repair work (step S45) is performed. When the number of the columnar members 12 is too small, the columnar members 12 are added to the substrate 5, and when the number of the columnar members 12 is too large, the extra columnar members 12 are removed. In the inspection step (step S40), the substrate 5 having a yield equal to or higher than the predetermined yield of the columnar member mounting is directly transferred to the reflow step (step S50), and the substrate 5 having a yield lower than the predetermined yield is stored in advance in the positions where the number of the columnar members is too large and too small, and then is trimmed by another repair machine, and then is transferred to the reflow step after being turned around along the normal transfer route (step S50). Further, when the substrates 5 having a yield lower than the predetermined yield are continuously produced, the operation can be automatically stopped, and a command such as an Operator call can be issued. When the inspection process (step S40) is performed and NG is determined, the substrate 5 may be returned to the columnar member transfer device 3, and the alignment process may be performed (step S30). The columnar member mounting apparatus 1 may be connected to a repair device, a reflow device, and a cleaning device.
As described above, the columnar member mounting device 1 mounts the columnar member 12 at a predetermined position on the substrate 5, and includes: a columnar member transfer mask 21 disposed on the substrate 5 and having a plurality of mask openings 34 corresponding to predetermined positions of the substrate 5; a columnar member alignment squeegee 28 disposed above the columnar member transfer mask 21 and configured to transfer the columnar member 12 to the mask opening 34 while rotating and moving; and excitation devices 22 and 23 that apply vibration to the columnar member transfer mask 21 when the columnar member arraying brush blade 28 is driven.
According to the columnar member mounting device 1, when the columnar member 12 is transferred to the mask opening 34 of the columnar member transfer mask 21 by the columnar member arraying brush blade 28, the columnar member 12 can be mounted at a predetermined position on the substrate 5 without excess or deficiency by applying vibration to the columnar member transfer mask 21 by the vibration exciting devices 22 and 23.
The exciting devices 22 and 23 can move along the upper end surface of the columnar-member transfer mask 21 in conjunction with the movement of the columnar-member aligning squeegee 28. As described above, by interlocking the exciting devices 22 and 23 with the movement of the columnar member arranging squeegee 28, the columnar member transfer mask 21 can be vibrated in the vicinity of the rotational position of the columnar member arranging squeegee 28, and the columnar member 12 can be mounted on a predetermined position of the substrate 5 at a small amount.
The exciting devices 22 and 23 are disposed so as to sandwich the columnar member-aligning squeegee 28. By arranging the exciting devices 22 and 23 in the vicinity of the brush blade 28 for columnar member arrangement, it is possible to apply almost the same vibration to the position of the mask 21 for columnar member arrangement, and to mount the columnar member 12 at a predetermined position of the substrate 5 with high efficiency. The number of the exciting devices is not limited to 2, and 3 or 4 or more exciting devices may be arranged, or only 1 exciting device may be arranged.
The vibration frequencies of the exciting devices 22 and 23 used in the columnar member mounting device 1 are 100Hz to 40 kHz. Although the vibration frequency of the exciting devices 22 and 23 can be adjusted according to the size and shape of the columnar member 12, if the vibration frequency is appropriately adjusted within the range of 100Hz to 40kHz, the columnar member can be transferred to the columnar member transfer mask 21 and appropriately vibrated, so that the columnar member 12 can be mounted at a predetermined position on the substrate 5 at least in large number.
Further, by appropriately adjusting the amplitude of the vibration of the exciting devices 22 and 23 within the range of 0.1 μm to 10 μm, the columnar member 12 can be mounted at a predetermined position on the substrate 5 in a small amount while avoiding the occurrence of a jump or no vibration of the columnar member 12.
The exciting devices 22 and 23 used in the columnar member mounting device 1 are ultrasonic vibration devices, and the exciting devices 22 and 23 have an exciting section 45, and further have: and an excitation section elevating mechanism section 46 capable of adjusting the distance between the columnar member transfer mask 21 and the excitation section 45 to be within a range of 0mm to 1 mm. By using the ultrasonic vibration device as the excitation devices 22 and 23, it is possible to apply vibration to the columnar-member transfer mask 21 regardless of whether or not the excitation portion 45 comes into contact with the columnar-member transfer mask 21, and it is possible to apply appropriate vibration to the columnar-member transfer mask 21 by appropriately adjusting the distance between the columnar-member transfer mask 21 and the excitation portion 45 to be within the range of 0mm to 1 mm.
Further, the columnar member mounting method includes: a printing step (step S20) of disposing the solder-printing mask 15 on the upper end surface of the substrate 5 and printing the solder 35 on a predetermined position of the substrate 5; and an alignment step (step S30) of arranging the columnar member transfer mask 21 above the substrate 5 on which the solder 35 is printed, then providing the columnar members 12 on the columnar member transfer mask 21, and aligning the columnar members 12 at predetermined positions on the substrate 5 on which the solder 35 is printed by rotating and moving the columnar member alignment squeegee 28 while applying vibration to the columnar member transfer mask 21.
According to the columnar member mounting method, when the columnar member 12 is transferred to the mask opening 34 of the columnar member transfer mask 21 by the columnar member arraying brush blade 28, the columnar member 12 can be mounted on the predetermined position of the substrate 5 without much or little vibration by applying the vibration to the columnar member transfer mask 21.
In the case of the configuration of the columnar member transfer apparatus 3 described with reference to fig. 3, the configuration of the columnar member arraying brush blade 28 and the exciting devices 22 and 23 may be replaced. This will be explained as a second example with reference to fig. 9.
Fig. 9 is an explanatory diagram showing a schematic configuration of a columnar member mounting device 3A according to a second example. Differences from the first example (see fig. 3) will be described, and the same parts and components as those in fig. 3 are illustrated by the same reference numerals as those in fig. 3. As shown in fig. 9, the columnar-member-arraying brush blade 28 has a bundling-wire-like member 33 implanted in a mounting portion 30 fixed to the blade rotation drive device 29. The linear member 33 is formed along the rotation locus of the brush scraper 28 for arranging the columnar members. The bundling linear members 33 shown in fig. 9 correspond to the outer bundling linear members 33 shown in fig. 3, and the inner bundling linear members 32 are omitted. In addition, in fig. 9, a bundling wire-like member 33 is illustrated in a simplified manner.
The bundling linear member 33 is a fine twisted wire assembly having conductivity and flexibility, and moves in the X-axis direction and the Y-axis direction while rotating while sweeping the surface of the columnar member transfer mask 21, and during this time, the columnar member 12 is introduced into the mask opening 34. At this time, when the transfer operation of the columnar member 12 is performed, the bundled linear member 33 applies 5g/cm to the columnar member transfer mask 212～10g/cm2The contact pressure of (a).
In this manner, when the transfer operation of the columnar member 12 is performed, the bundled linear member 33 applies 5g/cm to the columnar member transfer mask 212～10g/cm2The vibration of the columnar member transfer mask 21 is not hindered by the contact pressure of (2). Furthermore, the columnar member 12 can be prevented from being mixed into the columnar member transfer mask21 and the bundling linear members 33, thereby preventing damage or deformation to the columnar members 12 and the columnar member transfer mask 21. Even if the columnar member 12 is accidentally mixed between the columnar member transfer mask 21 and the bundling linear member 33, the contact pressure by the bundling linear member 33 is 5g/cm2～10g/cm2Such a very small pressure makes it possible to transfer the columnar member 12 in a good state without causing damage such as a wound or a dent. Further, since the bundling linear member 33 has appropriate flexibility and is always in contact with the surface of the columnar member transfer mask 21 that vibrates slightly, it is possible to suppress the columnar member 12 from leaking to the outside.
As shown in fig. 9, the exciting devices 22 and 23 are disposed on both sides of the columnar member transfer portion 25. The excitation devices 22 and 23 each have an excitation portion 45, and an end surface 45a of the excitation portion 45 on the side of the columnar member transfer mask 21 is brought into contact with the columnar member transfer mask 21 to vibrate the columnar member transfer mask 21. The exciting section 45 includes a coil spring 55 as an example of an elastic member.
The force applied by the excitation section 45 to the columnar member transfer mask 21 is derived from the weight of the excitation section 45 and the pressing force of the excitation section elevating mechanism section 46. The coil spring 55 constantly keeps the end face 45a of the excitation portion 45 in contact with the columnar member transfer mask 21, and applies a force in a direction to cancel the own weight of the excitation portion 45 in synchronization with the vibration.
When the transfer operation of the columnar member 12 is performed, the load due to the vibration of the excitation portion 45 itself can be reduced by keeping the excitation portion 45 in contact with the columnar member transfer mask 21 at all times and offsetting the weight of the excitation portion 45 by the coil spring 55, so that the columnar member transfer mask 21 can be stably vibrated at a predetermined frequency and amplitude.
[ Experimental example ]
In the experiment, it was found that the exciting devices 22 and 23 (i.e., the mask 21 for transferring the columnar member) required to have the appropriate vibration frequency f and amplitude Z (half amplitude Z) for the mounting (transferring) work of the columnar member 120). Reference will be made to fig. 10, 11 in this regardThe description is given. In the experimental examples described below, the results of experiments were shown in which the columnar members 12 made of copper having a diameter of 150 μm and a length of 200 μm were mounted on the wafer 5 having a diameter of 200 mm.
In order to make the columnar member 12 vibrate so as to be able to shift, it is necessary to apply an acceleration greater than the gravitational acceleration G to the columnar member 12. That is, the mask 21 for transferring columnar member is lifted or lowered, and the mask 21 for transferring columnar member is held by the holder Z0(2πf)2Of the acceleration of (c). Once the acceleration value exceeds the gravitational acceleration G (9.8 m/sec)2) The columnar member 12 is separated from the columnar member transfer mask 21. That is, when the columnar member transfer mask 21 is turned from the rise to the fall or from the fall to the rise, the columnar member 12 jumps.
That is, when Z is satisfied0(2πf)2At > G, the columnar members 12 vibrate individually and are easily transferred into the mask opening portions 34. Z herein0Is the excitation frequency. Therefore, the acceleration applied to the mask 21 for transferring the columnar member receives the amplitude Z0And the excitation frequency f, once the amplitude Z is0Too large, vibrates at a lower excitation frequency f, and once the amplitude Z is too high0If too small, the vibration is induced at a high excitation frequency f. Whether the columnar member 12 is easily vibrated or not is not affected by the weight of the columnar member 12 itself.
Fig. 10 is a graph showing the relationship between the excitation frequency f and the mounting (transfer) yield of the columnar member 12 obtained through the experiment. In the figure, the horizontal axis represents the excitation frequency (kHz) and the vertical axis represents the mounting yield (%). In the experiment, the amplitude Z was measured0The mounting yield was measured with the excitation frequency f set at 0.15 μm to 0.3 μm for each of 0.01kHz, 0.1kHz, 1kHz, 10kHz, 20kHz and 40 kHz. The vibration application time at each excitation frequency is fixed. In the above acceleration calculation formula, the excitation frequency f is squared to have an influence, and therefore the mounting yield with respect to the excitation frequency f is measured. In addition, a mode in which the mounting yield is considered will be described with reference to fig. 11.
As shown in fig. 10, when the excitation frequency f is 1kHz or less, the mounting yield is 10% to 20%, and when the excitation frequency f exceeds 0.1kHz, the mounting yield increases sharply, 80% at 10kHz, 85% at 20kHz, and 90% at 40 kHz. It is conceivable that the mounting yield can be further improved by setting the excitation frequency f to 40kHz or more, but it is preferable to set the excitation frequency f to about 40kHz in consideration of the size of the excitation portion 45 and the amount of heat generation. In fig. 10, the mounting yield is shown to be at a low level when the excitation frequency f is 10kHz or less, but it has been confirmed that the mounting yield can be increased by increasing the excitation time.
When amplitude Z0The columnar members 12 can be transferred within a range of 0.1 μm to 10 μm. And if the amplitude Z is increased0The amount of bounce of the columnar member 12 becomes large to make the transfer easier. However, this is restricted (increased in size) by the conditions such as the output capability and rigidity of the exciting devices 22 and 23. In addition, since the column member transfer mask 21 and the column member 12 may be damaged or deformed if the amount of the rising of the column member 12 is excessively large, the amplitude Z is estimated from the experimental result0Preferably, the thickness is in the range of 0.1 to 0.3. mu.m.
Fig. 11 is an explanatory diagram of an example of the evaluation result of the mounting yield. As shown in fig. 11, the wafer 5 is an aggregate of semiconductor integrated circuits (semiconductor chips) 52. In the example shown in fig. 11, the number of semiconductor chips 52 is 89, and the number of failed semiconductor chips 52a is 10. Therefore, the mounting yield was 10/89 ═ 88.8 (%). In fig. 11, the number indicated in the frame of the semiconductor chip 52a that failed to be mounted represents the number of mounting failures on one semiconductor chip 52a (the number of the column-shaped members 12 that are too large or too small). In the experimental example, the number of the columnar members 12 mounted in one chip was 400. Therefore, the mounting yield represents the chip yield. The semiconductor chip 52a which has failed to be mounted is corrected too much or too little by the columnar member transfer device 3 or 3A, or by a repair device (not shown).
As described above, in the columnar member mounting device 1, by setting the vibration frequency (excitation frequency) f of the excitation devices 22 and 23 to 10kHz to 40kHz, the mounting yield of the columnar member 12 can be maintained at 80% or more, and the columnar member can be efficiently mounted on the substrate.
In the columnar member mounting apparatus 1, by setting the amplitude of the vibration of the exciting devices 22 and 23 to be in the range of 0.1 μm to 0.3 μm, not only the columnar member 12 can be efficiently transferred onto the substrate (wafer) 5, but also damage to the columnar member transfer mask 21 and the columnar member 12 can be suppressed.
The present invention is not limited to the above embodiments, and various modifications and improvements can be made to the present invention as long as the object of the present invention is achieved. For example, in the above embodiment, the vibration device 22 or 23 vibrates the columnar member transfer mask 21, but the columnar member 12 may be transferred by vibrating the columnar member arraying brush blade 28 by using the columnar member arraying brush blade 28 as a part of the vibration device. Further, the columnar member transfer mask 21 may be vibrated by the vibration of the columnar member alignment brush blade 28.
Description of the symbols
1 … columnar member mounting device; 2 … solder printing device; 3. 3a … columnar member transfer device; 5 … substrate (wafer); 9 … platform; 12 … a columnar member; 15 … mask for solder printing; 15a … mask opening part (mask for solder printing); 16 … metal electrodes; 21 … mask for transferring columnar member; 22. 23 … vibration exciting device; 25 … columnar member transfer section; 28 … brush scraper for arranging columnar members; 31. 32, 33 … bundling the linear members; 34 … mask opening parts (mask for transferring columnar member); 35 … solder; 45 … vibration exciting part; 45a … (of the excitation section) end face; 46 … vibration exciting part lifting mechanism part; 51 … spring.
Claims (8)
1. A columnar member mounting device for mounting a columnar member in a standing state on a predetermined position of a substrate, comprising:
a mask for transferring a columnar member, which is disposed on the substrate and has a plurality of mask openings corresponding to predetermined positions of the substrate;
a columnar member alignment squeegee disposed above the columnar member transfer mask and configured to transfer the columnar member to the mask opening while rotating and moving; and
an excitation device for applying vibration to the columnar member transfer mask when the columnar member arrangement brush blade is driven,
wherein the vibration exciting device is movable along the upper end surface of the columnar member transfer mask in conjunction with the movement of the columnar member arraying brush blade,
the vibration exciting device is configured in a plurality so as to sandwich the columnar member arrangement brush scraper in configuration,
the vibration frequency of the vibration excitation device is 100 Hz-40 kHz.
2. The columnar member mounting apparatus according to claim 1, wherein:
wherein the vibration frequency of the vibration excitation device is 10 kHz-40 kHz.
3. The columnar member-mounting device according to claim 1 or 2, wherein:
wherein the amplitude of the vibration excitation device is set to be 0.1 to 10 μm.
4. The columnar member-mounting device according to claim 3, wherein:
wherein the amplitude of the vibration excitation device is set to 0.1 to 0.3 μm.
5. The columnar member-mounting device according to claim 1 or 2, wherein:
wherein the excitation device is an ultrasonic vibration device, and the excitation device has an excitation section and includes: and an excitation section elevating mechanism section capable of adjusting a distance between the columnar member transfer mask and the excitation section to be in a range of 0mm to 1 mm.
6. The columnar member-mounting device according to claim 1 or 2, wherein:
wherein the vibration excitation device is an ultrasonic vibration device and is provided with a vibration excitation part,
the excitation section further includes: and an elastic member that offsets the weight of the exciting section while keeping an end surface of the columnar member transfer mask in contact with the columnar member transfer mask.
7. The columnar member-mounting device according to claim 1 or 2, wherein:
wherein the columnar member arraying brush scraping plate comprises: a bundling linear member composed of a fine twisted assembly having conductivity and flexibility and moving on the surface of the columnar member transfer mask while rotating,
the bundling linear member applies 5g/cm to the mask for transferring the columnar member during the transferring operation of the columnar member2～10g/cm2The contact pressure of (a).
8. A method for mounting a columnar member so that the columnar member stands on a predetermined position of a substrate, comprising:
a printing step of disposing a solder printing mask on an upper end surface of the substrate and performing solder printing on a predetermined position of the substrate; and
an arranging step of arranging a columnar member transfer mask above the substrate on which the solder is printed, then providing the columnar member on the columnar member transfer mask, and arranging the columnar member at a predetermined position on the substrate on which the solder is printed by rotating and moving a columnar member arranging squeegee while applying vibration to the columnar member transfer mask,
the vibration is applied by means of a vibration exciting device,
the vibration exciting device can move along the upper end surface of the columnar member transfer mask in linkage with the movement of the columnar member arrangement brush scraper,
the vibration exciting device is configured in a plurality so as to sandwich the columnar member arrangement brush scraper in configuration,
the vibration frequency of the vibration excitation device is 100 Hz-40 kHz.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017147208 | 2017-07-28 | ||
| JP2017-147208 | 2017-07-28 | ||
| JP2018091207A JP7041953B2 (en) | 2017-07-28 | 2018-05-10 | Column member mounting device and column member mounting method |
| JP2018-091207 | 2018-05-10 |
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| CN109309011A CN109309011A (en) | 2019-02-05 |
| CN109309011B true CN109309011B (en) | 2022-04-08 |
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| CN201810819880.3A Active CN109309011B (en) | 2017-07-28 | 2018-07-24 | Columnar member mounting device and columnar member mounting method |
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| KR (1) | KR102150528B1 (en) |
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| WO2023177347A1 (en) * | 2022-03-15 | 2023-09-21 | Capcon Holdings (Beijing) Limited | A system and method for placement of at least one conductor pin |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002164369A (en) * | 2000-11-28 | 2002-06-07 | Sony Corp | Semiconductor device and manufacturing method therefor |
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| JP2007157992A (en) * | 2005-12-05 | 2007-06-21 | Athlete Fa Kk | Method and apparatus for mounting conductive ball, and its controlling method |
| CN101422090A (en) * | 2006-04-26 | 2009-04-29 | 揖斐电株式会社 | Solder ball loading method and solder ball loading apparatus |
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| CN109309011A (en) | 2019-02-05 |
| KR102150528B1 (en) | 2020-09-01 |
| KR20190013551A (en) | 2019-02-11 |
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